MEMS taping equipment cleaning device

Abstract

The utility model provides a cleaning device for micro electro mechanical system (MEMS) taping equipment, which relates to the technical field of production of MEMS products, and is characterized by comprising a carrier tape adsorption mechanism, a surface tape adsorption mechanism, a surface tape position correction mechanism and a negative pressure device, the carrier tape adsorption mechanism is communicated with the negative pressure device through a pipeline, the dough tape position correction mechanism is arranged on the side of the dough tape adsorption mechanism, and residual foreign matter and chippings can be removed in real time in the carrier tape and dough tape conveying process by introducing the carrier tape adsorption mechanism and the dough tape adsorption mechanism and combining vacuum adsorption force generated by the negative pressure device. According to the mode of cleaning while conveying, the cleaning efficiency is improved, the cleaning effect is remarkably enhanced, and the risk of product failure caused by foreign matter residues is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectromechanical system product production, and particularly relates to a cleaning device for a MEMS taping equipment. Background Art

[0002] In the manufacturing and packaging process of MEMS (Microelectromechanical System) products, taping is a crucial link, which ensures that products can be safely and efficiently transported to subsequent testing and assembly processes. However, existing taping technologies often face the problem of foreign matter contamination when dealing with carrier tapes and face tapes (i.e., the carrier films used for packaging MEMS products). These foreign matters may come from tiny particles in the production environment, debris adhered to the carrier tapes and face tapes during production or storage, and powders generated by internal equipment wear, etc.

[0003] Traditionally, to solve this problem, tape machines generally use compressed air blowing devices to clean the carrier tapes. Although this method attempts to blow foreign matters off the surface of the carrier tapes through high-pressure airflows, there are significant limitations in actual applications. First, the airflow disturbances generated during the blowing process can cause foreign matter particles to re-suspend and may deposit in other positions in the taping preparation area or inside the equipment, thus failing to achieve a true cleaning effect. Second, this method has poor cleaning effects on tiny particles and strongly adhesive foreign matters, and it is difficult to ensure the cleanliness of the taped products.

[0004] In addition, the face tapes also often face the risk of foreign matters due to a large amount of debris remaining in the area to be taped. These debris may come from residues during the manufacturing process of the face tapes, wear powders generated by friction with the positioning devices, etc. If not removed in time, it will directly affect the quality and reliability of the taped products.

[0005] Disadvantages of the Existing Technology

[0006] Limited cleaning effect: The compressed air blowing device cannot thoroughly remove tiny particles and strongly adhesive foreign matters on the carrier tapes and face tapes, resulting in a risk of foreign matter contamination for the taped products.

[0007] Foreign matter re-deposition: The airflow disturbances generated during the blowing process may cause foreign matter particles to re-suspend and deposit in the taping preparation area or inside the equipment, increasing the cleaning difficulty.

[0008] Increased equipment wear: If the face tape deviates during transmission, it may exacerbate the friction with the positioning device, generating more wear powders and further increasing the foreign matter risk. Summary of the Utility Model

[0009] In view of the deficiencies of the prior art, the utility model provides a cleaning device for a MEMS taping device to overcome the problems of poor cleaning effect, foreign matter redeposition, and increased equipment wear in the existing taping technology, so as to ensure the quality and reliability of MEMS products during the taping process.

[0010] To achieve the above objectives, the utility model is realized through the following technical solutions:

[0011] A cleaning device for a MEMS taping device, characterized in that it includes a carrier tape adsorption mechanism, a face tape adsorption mechanism, a face tape position correction mechanism, and a negative pressure device. The carrier tape adsorption mechanism is connected to the negative pressure device through a pipeline, the face tape adsorption mechanism is connected to the negative pressure device through a pipeline, and the face tape position correction mechanism is arranged on the side of the face tape adsorption mechanism.

[0012] The carrier tape adsorption mechanism includes an adsorption block and a cover plate. The adsorption block includes a carrier tape adsorption block body. On both sides of the lower surface of the carrier tape adsorption block body, bumps are symmetrically arranged. A carrier tape channel is arranged between the bumps on the lower surface of the carrier tape adsorption block body. Carrier tape cleaning adsorption holes are arranged above the carrier tape channel. A carrier tape pipeline connection hole communicating with the carrier tape cleaning adsorption holes is arranged on the upper side of the carrier tape adsorption block body. The cover plate is fixedly arranged on the lower side of the bumps.

[0013] The face tape adsorption mechanism includes a face tape adsorption block body. One end side of the face tape adsorption block body is provided with face tape cleaning adsorption holes. A face tape pipeline connection hole communicating with the face tape cleaning adsorption holes is arranged on the face tape adsorption block body.

[0014] In a preferred technical solution, a through hole is arranged on one side of the carrier tape adsorption block body. A slot is arranged on one side of the through hole. Fixing holes are arranged on both sides of the carrier tape adsorption block body corresponding to the slot.

[0015] In a preferred technical solution, a second face tape adsorption mechanism is arranged at the position corresponding to the face tape cleaning adsorption holes on the face tape adsorption mechanism. The second face tape adsorption mechanism includes a second face tape adsorption block body. One end side of the second face tape adsorption block body is provided with second face tape cleaning adsorption holes. A second face tape pipeline connection hole communicating with the second face tape cleaning adsorption holes is arranged on the second face tape adsorption block body. The second face tape pipeline connection hole is connected to the negative pressure device through a pipeline. A groove is arranged on the side of the second face tape adsorption block body where the second face tape cleaning adsorption holes are arranged. The outside of the face tape adsorption block body where the face tape cleaning adsorption holes are arranged is located inside the groove.

[0016] In a preferred technical solution, the face tape position correction mechanism includes a metal shaft. A plastic sliding sleeve is arranged on the outside of the metal shaft. Metal correction guide rings are respectively arranged at both ends of the outside of the plastic sliding sleeve.

[0017] Preferred technical solution: The carrier tape cleaning adsorption holes, the surface tape cleaning adsorption holes, and the second surface tape cleaning adsorption holes are all long holes.

[0018] The utility model provides a cleaning device for a MEMS taping equipment, which has the following beneficial effects:

[0019] Improve cleaning efficiency and effect: By introducing a carrier tape adsorption mechanism and a surface tape adsorption mechanism, combined with the vacuum adsorption force generated by a negative pressure device, foreign matters and debris remaining during the transmission of the carrier tape and the surface tape can be removed in real time. This method of cleaning while transmitting not only improves the cleaning efficiency but also significantly enhances the cleaning effect, effectively reducing the risk of product failure caused by foreign matter residue.

[0020] Reduce the risk of foreign matters: Especially for the problem of foreign matters that easily occur during the taping process in the latter stage of MEMS product testing, the device completes the cleaning of foreign matters on the carrier tape and the surface tape before taping, thereby significantly reducing the risk of quality problems and reliability decline of the product caused by foreign matter contamination.

[0021] Improve the reliability of product shipment: Through a strict cleaning process, the purity of MEMS products during the taping process is ensured, further improving the shipment quality and reliability of the products, which is conducive to maintaining the brand image and customer satisfaction.

[0022] In summary, the cleaning device for the MEMS taping equipment is remarkable in terms of improving cleaning efficiency, reducing the risk of foreign matters, enhancing the reliability of product shipment, simplifying the maintenance process, enhancing adaptability, and improving the level of production automation. Description of the drawings

[0023] Figure 1 It is a schematic structural diagram of Embodiment 1 of the utility model;

[0024] Figure 2 It is a schematic structural diagram of the adsorption block of the utility model;

[0025] Figure 3 It is a schematic structural diagram of the adsorption block of the utility model from another orientation;

[0026] Figure 4 It is a schematic structural diagram of the cover plate of the utility model;

[0027] Figure 5 It is a schematic structural diagram of the main body of the surface tape adsorption block of the utility model;

[0028] Figure 6 It is a schematic structural diagram of the surface tape position correction mechanism of the utility model;

[0029] Figure 7 It is a schematic structural diagram of Embodiment 2 of the utility model;

[0030] Figure 8 This is a schematic structural diagram of the second surface with an adsorption mechanism in the second embodiment of the present utility model.

[0031] In the figure: 1 - tape adsorption mechanism, 2 - surface adsorption mechanism, 3 - surface position correction mechanism, 4 - negative pressure device, 5 - pipeline, 6 - second surface adsorption mechanism, 11 - adsorption block, 12 - cover plate, 111 - tape adsorption block body, 112 - convex block, 113 - tape channel, 114 - tape cleaning adsorption hole, 115 - tape pipeline connection hole, 116 - through hole, 117 - slot, 118 - fixing hole, 21 - surface adsorption block body, 22 - surface cleaning adsorption hole, 23 - surface pipeline connection hole, 31 - metal shaft, 32 - plastic sliding sleeve, 33 - metal correction guide ring, 61 - second surface adsorption block body, 62 - second surface cleaning adsorption hole, 63 - second surface pipeline connection hole, 64 - groove, 100 - tape, 200 - surface. Specific embodiments

[0032] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0033] Embodiment 1

[0034] As Figure 1 shown, a cleaning device for a MEMS taping equipment includes a tape adsorption mechanism 1, a surface adsorption mechanism 2, a surface position correction mechanism 3 and a negative pressure device 4. The tape adsorption mechanism 1 is communicated with the negative pressure device 4 through a pipeline 5, the surface adsorption mechanism 2 is communicated with the negative pressure device 4 through a pipeline 5, and the surface position correction mechanism 3 is arranged on the side of the surface adsorption mechanism 2.

[0035] As Figure 2 , Figure 3 and Figure 4As shown in the figure, the carrier tape adsorption mechanism 1 includes an adsorption block 11 and a cover plate 12. The adsorption block 11 includes a carrier tape adsorption block body 111. On both sides of the lower surface of the carrier tape adsorption block body 111, bumps 112 are symmetrically arranged. Between the bumps 112 on the lower surface of the carrier tape adsorption block body 111, there is a carrier tape channel 113. Above the carrier tape channel 113, there are carrier tape cleaning adsorption holes 114. On the upper side of the carrier tape adsorption block body 111, there is a carrier tape pipeline connection hole 115 that communicates with the carrier tape cleaning adsorption holes 114. The cover plate 12 is fixedly arranged on the lower side of the bumps 112. On one side of the carrier tape adsorption block body 111, there is a through hole 116. On one side of the through hole 116, there is a slot 117. On the carrier tape adsorption block body 111 and at the positions corresponding to both sides of the slot 117, there are fixing holes 118.

[0036] As Figure 5 shown in the figure, the surface belt adsorption mechanism 2 includes a surface belt adsorption block body 21. At one end side of the surface belt adsorption block body 21, there are surface belt cleaning adsorption holes 22. On the surface belt adsorption block body 21, there is a surface belt pipeline connection hole 23 that communicates with the surface belt cleaning adsorption holes 22.

[0037] As Figure 6 shown in the figure, the surface belt position correction mechanism 3 includes a metal shaft 31. Outside the metal shaft 31, there is a plastic sliding sleeve 32. At both ends outside the plastic sliding sleeve 32, there are metal correction guide rings 33.

[0038] As Figure 2 and Figure 5 shown in the figure, the carrier tape cleaning adsorption holes 114 and the surface belt cleaning adsorption holes 22 are both long holes.

[0039] Embodiment 2

[0040] As Figure 7 and Figure 8 shown in the figure, on the basis of Embodiment 1, at the position corresponding to the surface belt cleaning adsorption holes 22 on the surface belt adsorption mechanism 2, there is a second surface belt adsorption mechanism 6. The second surface belt adsorption mechanism 6 includes a second surface belt adsorption block body 61. At one end side of the second surface belt adsorption block body 61, there are second surface belt cleaning adsorption holes 62. On the second surface belt adsorption block body 61, there is a second surface belt pipeline connection hole 63 that communicates with the second surface belt cleaning adsorption holes 62. The second surface belt pipeline connection hole 63 is connected to a negative pressure device 4 through a pipeline 5. On the second surface belt adsorption block body 61 and on the side where the second surface belt cleaning adsorption holes 62 are arranged, there is a groove 64. The outside of the surface belt adsorption block body 21 where the surface belt cleaning adsorption holes 22 are arranged is inside the groove 64. The second surface belt cleaning adsorption holes 62 are all long holes. Other structures are the same as those in Embodiment 1. This embodiment has a better cleaning effect on the surface belt.

[0041] The utility model is to connect a vacuum adsorption device during the process of carrier tape taping. During the transmission of the carrier tape, the carrier tape is cleaned, and the foreign matters adsorbed by the original carrier tape in vacuum are collected into a fixed collection box for regular cleaning.

[0042] The utility model is installed in the feeding part of the taping machine. Before the taping is completed, the foreign matter debris remaining on the carrier tape and the debris generated by the surface tape during the feeding process and the surrounding positioning device are respectively adsorbed in vacuum, so as to ensure that the taped products have no risk of failure due to foreign matters.

[0043] The carrier tape adsorption mechanism 1 is installed in the carrier tape feeding area (fixed on the surface of the taping machine) by means of compressed vacuum negative pressure. When the carrier tape is fed through the mechanism, the residual foreign matters on the carrier tape are cleaned by the vacuum negative pressure. The collected dust collection box can be regularly disassembled and cleaned. A set of dust suction mechanisms for the surface tape taping area is designed to complete the cleaning of foreign matters before taping. It can effectively solve the problems of MEMS products in the latter stage of testing taping, reduce the risk of foreign matters, and improve the shipment reliability of MEMS.

[0044] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cleaning device for a MEMS taping equipment, characterized in that: It includes a carrier tape adsorption mechanism (1), a surface tape adsorption mechanism (2), a surface tape position correction mechanism (3) and a negative pressure device (4). The carrier tape adsorption mechanism (1) is communicated with the negative pressure device (4) through a pipeline (5). The surface tape adsorption mechanism (2) is communicated with the negative pressure device (4) through a pipeline (5). The surface tape position correction mechanism (3) is arranged on the side of the surface tape adsorption mechanism (2). The carrier tape adsorption mechanism (1) includes an adsorption block (11) and a cover plate (12). The adsorption block (11) includes a carrier tape adsorption block body (111). On both sides of the lower surface of the carrier tape adsorption block body (111), bumps (112) are symmetrically arranged. A carrier tape channel (113) is arranged between the bumps (112) on the lower surface of the carrier tape adsorption block body (111). Carrier tape cleaning adsorption holes (114) are arranged above the carrier tape channel (113). A carrier tape pipeline connection hole (115) communicated with the carrier tape cleaning adsorption holes (114) is arranged on the upper side of the carrier tape adsorption block body (111). The cover plate (12) is fixedly arranged on the lower side of the bumps (112). The surface tape adsorption mechanism (2) includes a surface tape adsorption block body (21). A surface tape cleaning adsorption hole (22) is arranged on one end side of the surface tape adsorption block body (21). A surface tape pipeline connection hole (23) communicated with the surface tape cleaning adsorption hole (22) is arranged on the surface tape adsorption block body (21).

2. The cleaning device for a MEMS taping device according to claim 1, wherein: A through hole (116) is arranged on one side of the carrier tape adsorption block body (111). A slot (117) is arranged on one side of the through hole (116). Fixing holes (118) are arranged on both sides of the carrier tape adsorption block body (111) corresponding to the slot (117).

3. A cleaning device for a MEMS taping device according to claim 1, characterized in that: A second surface tape adsorption mechanism (6) is arranged at the position corresponding to the surface tape cleaning adsorption hole (22) on the surface tape adsorption mechanism (2). The second surface tape adsorption mechanism (6) includes a second surface tape adsorption block body (61). A second surface tape cleaning adsorption hole (62) is arranged on one end side of the second surface tape adsorption block body (61). A second surface tape pipeline connection hole (63) communicated with the second surface tape cleaning adsorption hole (62) is arranged on the second surface tape adsorption block body (61). The second surface tape pipeline connection hole (63) is communicated with the negative pressure device (4) through a pipeline (5). A groove (64) is arranged on one side of the second surface tape adsorption block body (61) where the second surface tape cleaning adsorption hole (62) is arranged. The outside of the surface tape adsorption block body (21) where the surface tape cleaning adsorption hole (22) is arranged is located inside the groove (64).

4. A cleaning device for a MEMS taping device according to claim 1, characterized in that: The surface tape position correction mechanism (3) includes a metal shaft (31). A plastic sliding sleeve (32) is arranged on the outside of the metal shaft (31). Metal correction guide rings (33) are respectively arranged at both ends of the outside of the plastic sliding sleeve (32).

5. The cleaning device for a MEMS taping device according to claim 3, wherein: The carrier tape cleaning adsorption holes (114), the surface tape cleaning adsorption holes (22) and the second surface tape cleaning adsorption holes (62) are all long holes.

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