Cold storage equipment

Abstract

The cold storage equipment comprises a box body, a door body, a drawer and a semiconductor refrigeration assembly, the door body is arranged at an opening of the box body, the door body has a first state for opening a cavity and a second state for closing the cavity, the drawer is arranged in the cavity in a push-pull mode, and the semiconductor refrigeration assembly is arranged in the cavity. The semiconductor refrigeration assembly comprises a semiconductor refrigeration element with a first end and a second end, the first end is connected with the drawer, the second end is in contact with the outside, the door body is in a first state, the semiconductor refrigeration element is powered on in the forward direction, the first end is a cold end, the second end is a hot end, the door body is in a second state and powered on in the reverse direction, the first end is a hot end, and the second end is a cold end. When the door body is opened, the semiconductor refrigeration element is powered on in the forward direction, the hot end is exposed in humid and hot air, the surface temperature of the hot end is higher than 0 DEG C, and the frost restraining effect can be achieved; when the door body is closed, reverse electrification is conducted, the hot end becomes the cold end, the temperature of the cold end is lower than the air temperature in the cavity, and directional frosting can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, in particular to a cold storage device. Background Art

[0002] The information provided in this section is only background information related to the present disclosure, and it is not necessarily prior art.

[0003] The set temperature of the cryogenic refrigerator compartment is usually lower than -30°C. When the refrigerator door is opened, the humid and hot air in the external environment may enter the cryogenic compartment, causing frosting and icing on the surfaces of components such as the inner liner and drawer of the compartment, affecting the refrigeration effect of the refrigerator. Summary of the Utility Model

[0004] The purpose of the utility model is to at least solve the problem of frosting and icing inside the cryogenic refrigerator. This purpose is achieved through the following technical solutions:

[0005] A first aspect of the utility model provides a cold storage device, comprising:

[0006] A box body having a chamber with an opening;

[0007] A door body provided at the opening, the door body having a first state of opening the chamber and a second state of closing the chamber;

[0008] A drawer slidably disposed in the chamber;

[0009] A semiconductor refrigeration component, including a semiconductor refrigeration element having a first end and a second end opposite to the first end. The first end is used to connect with the drawer, and the second end is used to contact the outside. When the door body is in the first state, the semiconductor refrigeration element is energized forward, the first end is the cold end, and the second end is the hot end. When the door body is in the second state, the semiconductor refrigeration element is energized reversely, the first end is the hot end, and the second end is the cold end.

[0010] The cold storage device of the utility model is provided with a semiconductor refrigeration element. The first end of the semiconductor refrigeration element is connected to the drawer, and the second end is in contact with the outside. When the refrigerator door is opened and the drawer is pulled out, the hot end of the semiconductor refrigeration element on the drawer is exposed to the humid and hot air and contacts the humid and hot air, which can reduce the possibility of frosting of the humid air and play a role in frost inhibition. When the refrigerator door is closed, the semiconductor refrigeration element is energized reversely, and its hot end becomes the cold end. The temperature of the cold end is lower than the air temperature in the chamber, and the surface of the cold end can be used as a cold surface for directional frosting, so that the frost can form on the surface of the cold end. Moreover, by intermittently energizing the semiconductor refrigeration element forward and reversely to switch the cold end and the hot end, the surface temperature can be increased, thereby melting the frost condensed on the cold surface and ensuring the refrigeration effect of the refrigerator.

[0011] In addition, the cold storage device according to the present utility model may further have the following additional technical features:

[0012] In some embodiments of the present utility model, the thermoelectric cooling module further includes a first plate body and a second plate body. The first plate body is connected to the first end, and the second plate body is connected to the second end. Both the first plate body and the second plate body are heat conducting plates.

[0013] In some embodiments of the present utility model, the heat conducting plate is a metal plate.

[0014] In some embodiments of the present utility model, a heat insulation layer is provided between the first plate body and the second plate body. The thermoelectric cooling element penetrates through the heat insulation layer. The heat insulation layer is used to isolate the heat exchange between the first plate body and the second plate body.

[0015] In some embodiments of the present utility model, a hydrophilic modification layer is provided on the surface of the second plate body.

[0016] In some embodiments of the present utility model, a mounting member is provided on the drawer, and the thermoelectric cooling module is mounted on the drawer through the mounting member.

[0017] In some embodiments of the present utility model, the mounting member includes a mounting groove. The mounting groove includes two parallel first groove edges and second groove edges that extend along the pushing and pulling direction of the drawer respectively. The thermoelectric cooling module is slidably disposed in the mounting groove along the first groove edge and the second groove edge.

[0018] In some embodiments of the present utility model, the mounting groove further includes a limiting groove edge. The limiting groove edge is connected to the outer ends of the first groove edge and the second groove edge. The limiting groove edge is used to limit the outward movement of the thermoelectric cooling module along the pushing and pulling direction of the drawer.

[0019] In some embodiments of the present utility model, a connecting member is further provided on the thermoelectric cooling module. One end of the connecting member is connected to the thermoelectric cooling module, and the other end is connected to the wall of the chamber.

[0020] In some embodiments of the present utility model, the connecting member includes a telescopic bracket. The telescopic bracket extends along the pushing and pulling direction of the drawer, and the telescopic bracket is configured to be telescopic along the pushing and pulling direction of the drawer. Description of the Drawings

[0021] By reading the following detailed description of the preferred embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present utility model. Moreover, throughout the drawings, the same reference numerals are used to denote the same components. In the drawings:

[0022] Figure 1 Schematically shows an installation schematic diagram of a semiconductor refrigeration component of a cold storage device according to an embodiment of the present utility model;

[0023] Figure 2 Schematically shows a partial structural schematic diagram of a semiconductor refrigeration component from a first perspective according to an embodiment of the present utility model;

[0024] Figure 3 Schematically shows a partial structural schematic diagram of a semiconductor refrigeration component from a second perspective according to an embodiment of the present utility model;

[0025] Figure 4 Schematically shows a structural schematic diagram of a semiconductor refrigeration component according to an embodiment of the present utility model;

[0026] Figure 5 Schematically shows a structural schematic diagram of a drawer of a cold storage device according to an embodiment of the present utility model.

[0027] The reference numerals are as follows:

[0028] 1, semiconductor refrigeration component; 11, semiconductor refrigeration element; 111, first end; 112, second end; 12, first plate body; 13, second plate body; 14, heat insulation layer; 15, AC power supply;

[0029] 2, drawer;

[0030] 3, mounting member; 31, mounting groove; 311, first groove edge; 312, second groove edge; 313, limiting groove edge;

[0031] 4, connecting member; 41, telescopic bracket. Detailed Embodiments

[0032] The following will describe the exemplary embodiments of the present disclosure in more detail with reference to the drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be completely conveyed to those skilled in the art.

[0033] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and thus specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the particular order described or illustrated, unless the order of performance is explicitly stated. It should also be understood that additional or alternative steps may be used.

[0034] Although the terms first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as "first", "second", and other numerical terms when used herein do not imply an order or sequence. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0035] For ease of description, spatial relative relationship terms may be used herein to describe the relationship of one element or feature shown in the figures to another element or feature, such as "inner", "outer", "inside", "outside", "below", "beneath", "above", "over", etc. Such spatial relative relationship terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "beneath" another element or feature will then be oriented "above" or "over" the other element or feature. Thus, the example term "below" may include both the above and below orientations.

[0036] The set temperature of the cryogenic refrigerator compartment is usually lower than -30°C. When storing items, for example, when putting items into the refrigerator or taking items out of the refrigerator, the door of the refrigerator needs to be opened. After the door of the refrigeration device is opened, the space inside the refrigerator is in communication with the external environment, and the humid and hot air in the external environment easily enters the refrigerator. Since the temperature inside the refrigerator is relatively low, the water vapor carried in the humid and hot air will sublime and frost on the inner wall of the refrigerator, resulting in a deterioration of the refrigeration effect of the refrigerator and affecting the storage of items.

[0037] In the prior art, the air-cooling technology is generally adopted for the frosting technology of refrigerators, and centralized defrosting is carried out at the evaporator. However, for deep-freezing refrigerators, the air flow temperature is low, and the saturated moisture content of the air is low, so a large amount of water vapor cannot be transferred to the evaporator, resulting in serious frosting on various components in the deep-freezing compartment, which affects the refrigeration effect of the refrigerator.

[0038] In view of this, the present embodiment provides a cold storage device, which aims to solve the above technical problems by setting a semiconductor refrigeration element 11. When the semiconductor refrigeration element 11 is energized forward, the hot end is exposed to the humid and hot air, which can play a role in frost inhibition. When the semiconductor refrigeration element 11 is energized reversely, the hot end is transformed into a cold end, and frost can be formed on the surface of the cold end. By intermittently energizing the semiconductor refrigeration element 11 in the forward and reverse directions to switch the hot and cold ends, the frost on the surface can be melted to ensure the refrigeration effect of the refrigerator.

[0039] As Figures 1 to 5 shown, according to the embodiment of the present invention, a cold storage device is proposed. The cold storage device is a deep-freezing refrigerator, which includes a box body, a door body, a drawer 2 and a semiconductor refrigeration assembly 1. Among them, a cavity with an opening at one end is formed inside the box body. The cavity is a deep-freezing compartment, and the preset temperature of the deep-freezing compartment is not higher than -40°C. The cavity has a storage space. Specifically, the cavity can be set as a cubic structure. In some possible examples, the cavity can also be a cylindrical or ellipsoidal structure, etc.

[0040] The door body is arranged at the opening. The door body has a first state of opening the cavity and a second state of closing the cavity. Specifically, the door body is hinged to the opening of the cavity through a rotating shaft, and the door body can completely close the opening of the cavity. The door body is made of heat-insulating material, which has the function of preventing the cold air inside the cavity from flowing out. When the door body is opened relative to the cavity through the rotating shaft, the door body is in the first state. When the door body is closed relative to the cavity through the rotating shaft, the door body is in the second state. In the case where the door body is in the second state, the door body seals the opening of the cavity to ensure that the cold air inside the cavity does not exchange heat with the outside air.

[0041] The cold storage device further includes a drawer 2. The drawer 2 is slidably arranged in the cavity, and the semiconductor refrigeration assembly 1 is arranged on the outer surface of the drawer 2. In this embodiment, the semiconductor refrigeration assembly 1 is arranged on both sides of the drawer 2, so that when the drawer 2 is pulled out, the semiconductor refrigeration assembly 1 is pulled out together. Its second end 112 is the hot end, and the second plate body 13 on the hot end side is exposed to the humid and hot air and contacts the humid and hot air. The surface temperature of the hot end is higher than 0°C, which can prevent the frosting of the wet air and play a role in frost inhibition.

[0042] The semiconductor refrigeration assembly 1 includes a semiconductor refrigeration element 11, which is a semiconductor refrigeration chip. The semiconductor refrigeration chip is connected to an AC power supply 15, and high-precision temperature control can be achieved through the control of the input current. The semiconductor refrigeration chip has a first end 111 and a second end 112 opposite to the first end 111. The first end 111 is used to be attached to the wall of the drawer 2, and the second end 112 is used to contact the outside. When the door body is in the first state, that is, when the refrigerator door body is opened, the semiconductor refrigeration chip is energized forward, the first end 111 is the cold end, and the second end 112 is the hot end. Its hot end is exposed to the humid and hot air and contacts the humid and hot air. The surface temperature of the hot end is higher than 0 °C, which can prevent the frosting of the humid air and play a role in frost inhibition. When the door body is in the second state, that is, when the refrigerator door body is closed, the semiconductor refrigeration chip is energized reversely, and its hot end is transformed into the cold end. That is to say, the first end 111 is transformed into the hot end, and the second end 112 is transformed into the cold end. The temperature of the cold end is lower than the air temperature in the chamber. The surface of the cold end can be used as a cold surface for directional frosting, so that the frost can be formed on the surface of the cold end. And by intermittently energizing the semiconductor refrigeration chip forward and reversely to switch the cold end and the hot end, the surface temperature is increased, so as to melt the frost condensed on the cold surface and ensure the refrigeration effect of the refrigerator.

[0043] In some embodiments of the present invention, the semiconductor refrigeration assembly 1 further includes a first plate body 12 and a second plate body 13. The first plate body 12 is connected to the first end 111, and the second plate body 13 is connected to the second end 112. Both the first plate body 12 and the second plate body 13 are heat-conducting plates.

[0044] Specifically, the first plate body 12 is arranged at the first end 111 and is attached to the surface of the first end 111. The second plate body 13 is arranged at the second end 112 and is attached to the surface of the second end 112. The shapes of the first plate body 12 and the second plate body 13 can be set as rectangles. In some possible examples, the shapes of the first plate body 12 and the second plate body 13 can also be circular or polygonal, etc. The first plate body 12 and the second plate body 13 are metal plates, and their materials can be set as metal materials with higher thermal conductivity such as aluminum, copper and their alloys, so as to improve the heat conduction efficiency of the semiconductor refrigeration chip.

[0045] In some embodiments of the present utility model, a heat insulation layer 14 is provided between the first plate body 12 and the second plate body 13. The semiconductor refrigeration element 11 is disposed through the heat insulation layer 14, and the heat insulation layer 14 is used to isolate the heat exchange between the first plate body 12 and the second plate body 13. A through hole is provided on the heat insulation layer 14, and the semiconductor refrigeration sheet is disposed in the through hole. Moreover, the first end 111 of the semiconductor refrigeration sheet is fixedly attached to the first plate body 12, and the second end 112 is fixedly attached to the second plate body 13, which is conducive to heat transfer. The heat insulation layer 14 is a porous material with the characteristics of being lightweight, loose, and porous, and can effectively block the transfer of heat flow, thereby playing a role in heat insulation. By providing the heat insulation layer 14 between the first plate body 12 and the second plate body 13, the heat exchange between the first plate body 12 and the second plate body 13 can be prevented.

[0046] In some embodiments of the present utility model, a hydrophilic modification layer is further provided on the surface of the second plate body 13. The hydrophilization treatment is carried out on the surface of the metal material. Specifically, the plasma spraying technology can be adopted. By spraying materials such as aluminate and zinc oxide on the surface of the metal material, the roughness of the surface of the metal material is increased, so as to increase the contact area between water molecules and the surface, and make the metal material show better hydrophilicity. In addition, the plasma spraying technology can also form a protective film on the surface of the metal material to improve its corrosion resistance. By providing the hydrophilic modification layer on the surface of the second plate body 13, the wettability and adhesion of the second plate body 13 can be improved, which is more conducive to the directional frosting on the surface of the second plate body 13.

[0047] In other embodiments, the semiconductor refrigeration assembly 1 can also be disposed at the bottom of the drawer 2, or at other positions in the chamber, such as the top of the chamber where frosting is more serious or at the air duct cover plate. In addition, the number of the semiconductor refrigeration assemblies 1 can also be increased according to the severity of frosting. For example, a plurality of semiconductor refrigeration sheets are provided at intervals on the heat insulation layer 14, and each semiconductor refrigeration sheet is connected in parallel to increase the temperature difference and improve the effect of frost inhibition and directional frosting.

[0048] In some embodiments of the present utility model, a mounting member 3 is provided on the drawer 2, and the semiconductor refrigeration assembly 1 is mounted on the drawer 2 through the mounting member 3. Specifically, the mounting member 3 includes a mounting groove 31. The mounting grooves 31 are respectively provided on both sides of the drawer 2. The mounting groove 31 includes two parallel first groove edges 311 and second groove edges 312. The lengths of the first groove edge 311 and the second groove edge 312 are the same, and the first groove edge 311 and the second groove edge 312 extend along the pushing and pulling direction of the drawer 2, as Figure 1As shown in the figure, the pushing and pulling direction of the drawer 2 is the X direction. The first groove edge 311 and the second groove edge 312 extend along the X direction, and the first groove edge 311 and the second groove edge 312 are arranged at intervals along the Y direction on the side wall of the drawer 2. The Y direction is perpendicular to the X direction. The semiconductor refrigeration component 1 is slidably arranged in the installation groove 31 along the first groove edge 311 and the second groove edge 312, which is convenient for the installation of the semiconductor refrigeration component 1.

[0049] In other embodiments, the first groove edge 311 and the second groove edge 312 can also be arranged to extend along the Y direction, so that the semiconductor refrigeration component 1 is slidably installed in the installation groove 31 along the Y direction.

[0050] In some embodiments of the present invention, the installation groove 31 further includes a limiting groove edge 313. The limiting groove edge 313 is connected to the outer ends of the first groove edge 311 and the second groove edge 312. The limiting groove edge 313 is used to limit the outward movement of the semiconductor refrigeration component 1 along the pushing and pulling direction of the drawer 2. Specifically, the limiting groove edge 313 extends along the Y direction. The limiting groove edge 313 can be arranged at one end of the first groove edge 311 and the second groove edge 312 close to the outside of the chamber and is connected to the first groove edge 311 and the second groove edge 312. In some possible examples, the limiting groove edge 313 can also be arranged at one end of the first groove edge 311 and the second groove edge 312 far from the outside of the chamber. When the semiconductor refrigeration component 1 is installed in the installation groove 31, the limiting groove edge 313 can limit the semiconductor refrigeration component 1 to ensure that the semiconductor refrigeration component 1 is installed in place.

[0051] In some embodiments of the present invention, a connecting member 4 is further arranged on the semiconductor refrigeration component 1. One end of the connecting member 4 is connected to the semiconductor refrigeration component 1, and the other end is connected to the chamber. The connecting member 4 is used to install the drawer 2 slidably on the wall of the chamber. Specifically, the connecting member 4 includes a telescopic bracket 41. One end of the telescopic bracket 41 is connected to the semiconductor refrigeration component 1, and the other end is connected to the chamber. The telescopic bracket 41 extends along the pushing and pulling direction of the drawer 2, that is, along the X direction. By setting the telescopic bracket 41, it is convenient to push and pull the drawer 2, and the pushing and pulling stroke of the drawer 2 can be limited in the X direction.

[0052] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A cold storage device, characterized in that, Comprising: A box body having a chamber with an opening; A door body provided at the opening, the door body having a first state of opening the chamber and a second state of closing the chamber; A drawer slidably disposed within the chamber; A semiconductor refrigeration assembly including a semiconductor refrigeration element having a first end and a second end opposite to the first end, the first end being connected to the drawer, and the second end being adapted to contact the outside. When the door body is in the first state, the semiconductor refrigeration element is energized forward, the first end is the cold end, and the second end is the hot end. When the door body is in the second state, the semiconductor refrigeration element is energized reversely, the first end is the hot end, and the second end is the cold end.

2. The cold storage device according to claim 1, characterized in that, The semiconductor refrigeration assembly further includes a first plate body and a second plate body, the first plate body being connected to the first end, and the second plate body being connected to the second end, both the first plate body and the second plate body being heat-conducting plates.

3. The cold storage device according to claim 2, characterized in that, The heat-conducting plate is a metal plate.

4. The cold storage device according to claim 2, wherein An insulating layer is provided between the first plate body and the second plate body, and the semiconductor refrigeration element penetrates through the insulating layer. The insulating layer is used to isolate the heat exchange between the first plate body and the second plate body.

5. The cold storage device according to claim 2, characterized in that, A hydrophilic modification layer is provided on the surface of the second plate body.

6. The cold storage device according to any one of claims 1 to 5, characterized in that, An installation member is provided on the drawer, and the semiconductor refrigeration assembly is installed on the drawer through the installation member.

7. The cold storage device according to claim 6, characterized in that, The installation member includes an installation groove, and the installation groove includes two parallel first groove sides and second groove sides respectively extending along the pushing and pulling direction of the drawer. The semiconductor refrigeration assembly is slidably disposed within the installation groove along the first groove side and the second groove side.

8. The cold storage device according to claim 7, characterized in that, The installation groove further includes a limiting groove side connected to the outer ends of the first groove side and the second groove side facing outward. The limiting groove side is used to limit the outward movement of the semiconductor refrigeration assembly along the pushing and pulling direction of the drawer.

9. The cold storage device according to claim 5, wherein, A connecting member is further provided on the semiconductor refrigeration assembly, one end of the connecting member being connected to the semiconductor refrigeration assembly and the other end being connected to the wall of the chamber.

10. The cold storage device according to claim 9, characterized in that, The connecting member includes a telescopic bracket, and the telescopic bracket is arranged to be telescopic along the pushing and pulling direction of the drawer.

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