Integrated temperature and pressure integrated sensor
Through the integrated temperature and pressure integrated sensor design, the problems of low integration, slow response and complex installation of the temperature and pressure sensors in the thermal management system of new energy vehicles are solved, and efficient and stable temperature and pressure signal measurement is achieved.
Patent Information
- Application Number
- CN202422432791.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-10-09
AI Technical Summary
In the prior art, the temperature pressure sensors are not integrated in the thermal management system of new energy vehicles, have slow temperature response, complex installation structure, low production efficiency, and inconsistent temperature signal response.
It adopts an integrated temperature-pressure integrated sensor design, including a shell, O-ring, NTC protective cap, NTC ceramic support assembly, ceramic induction component assembly and circuit board, and sealing is achieved through threaded structure and flange structure, simplifying the installation process, optimizing the sensor structure, and improving signal response speed and consistency.
It realizes high integration and rapid response of temperature pressure sensors, simplifies the installation process, reduces production costs and improves production efficiency, and ensures the stability and consistency of temperature and pressure signals.
Smart Images

Figure CN223138721U_ABST
Abstract
Description
Technical Field
[0001] The utility model discloses a temperature and pressure sensor, belonging to the technical field of sensors, and specifically relates to an integrated temperature and pressure sensor. Background Art
[0002] The temperature and pressure sensor is installed in the vehicle thermal management system of new energy vehicles, and seals through a threaded interface while detecting the medium pressure and temperature problems. The pressure ceramic core or MEMS and additional structures are used to measure the pressure signal. The pressure ceramic chip requires multiple seals and has a complex structure. The MEMS sensitive element has a small structure and a large difference in thermal expansion coefficient from that of metal, and cannot be directly fixed on the surface of the metal structure. There are also some temperature and pressure sensors that cannot accurately position the temperature sensitive element, resulting in large differences in temperature performance among products. Therefore, there are technical problems in the prior art that the temperature and pressure sensors in the air conditioning system and thermal management system have low integration, slow temperature response, complex installation structure, high production process cost, and low production efficiency. Content of the Utility Model
[0003] Purpose of the utility model: To provide an integrated temperature and pressure sensor to solve the above-mentioned problems.
[0004] Technical solution: An integrated temperature and pressure sensor includes: a housing, an O-ring, an NTC protection cap, an NTC ceramic support assembly, a ceramic sensing element assembly, a circuit board, and a connector;
[0005] In a further embodiment, the NTC ceramic support assembly is installed in the housing, the O-ring is installed between the housing and the NTC ceramic support assembly, the ceramic sensing element assembly is located in the housing and fixedly installed on the NTC ceramic support assembly, the circuit board is located on the ceramic sensing element assembly, the housing is fixedly connected to the connector, and the NTC protection cap is sleeved on the NTC ceramic support assembly.
[0006] In a further embodiment, one end of the housing has a threaded structure on the outside and a flange structure on the other end. The inside of the housing is in a multi-level cup-shaped structure for installing the O-ring, NTC protection cap, NTC ceramic support assembly, circuit board, and ceramic sensing element assembly. A material extrusion deformation structure is reserved at the other end of the housing.
[0007] In a further embodiment, the O-ring is installed in the cavity formed by the ceramic sensing element assembly, the housing, and the NTC ceramic support assembly.
[0008] In a further embodiment, one end of the NTC protection cap is a cross-shaped structure to ensure full contact between the NTC and the measured medium and to ensure that the NTC resists the flow impact of the measured medium, and the other end is a semi-circular buckle structure with bilateral symmetry.
[0009] In a further embodiment, the NTC ceramic support assembly is composed of an NTC, a metal frame, and an injection molded part;
[0010] The NTC is fixedly connected to the bottom of the injection molded part through the metal frame, and through holes are formed in the injection molded part.
[0011] In a further embodiment, the ceramic sensing element assembly is composed of a lower electrode plate, an adhesive, an upper electrode plate, an NTC conductive terminal, and a pressure signal conductive terminal;
[0012] The lower electrode plate is fixedly connected to the upper electrode plate through the adhesive. Through holes corresponding to the through holes in the injection molded part are provided on both the lower electrode plate and the upper electrode plate. The NTC conductive terminal is sleeved in the through holes in the lower electrode plate, the upper electrode plate, and the injection molded part, and the pressure signal conductive terminal is installed on the upper electrode plate.
[0013] In a further embodiment, the circuit board is connected to the ceramic sensing element assembly, the NTC ceramic support assembly, and the connector. The chip and electronic components on the circuit board together transmit the voltage signal related to pressure output by the ceramic and the voltage signal related to temperature output by the NTC to the connector.
[0014] Beneficial effects: The present utility model provides a temperature and pressure sensor structure with a simple structure, fast response speed, high medium compatibility, and high consistency of product pressure and temperature signals; it solves the design problems existing in the prior art of the thermal management system of new energy vehicles, such as the low integration of temperature and pressure sensors, slow temperature sensitivity, especially inconsistent temperature signal responses, complex fixing structures, many process steps, and low production efficiency. The temperature signal terminal on the ceramic passes through the ceramic, which optimizes the sensor structure design, reduces the auxiliary sealing design structure, and lowers the process difficulty. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is an exploded view of the sensor of the present utility model.
[0016] Figure 2 is an axonometric view of the sensor of the present utility model.
[0017] Figure 3 is a schematic diagram of the NTC ceramic support group of the present utility model.
[0018] Figure 4 is a schematic diagram of the ceramic sensing element assembly of the present utility model.
[0019] Figure 5 is a cross-sectional view of the sensor of the present utility model.
[0020] Reference numerals in the drawings: housing 1, O-ring 2, NTC protection cap 3, NTC ceramic support assembly 4, ceramic sensing element assembly 5, circuit board 6, connector 7, NTC 4-1, metal frame 4-2, injection molded part 4-3, lower electrode plate 5-1, binder 5-2, upper electrode plate 5-3, NTC conductive terminal 5-4, pressure signal conductive terminal 5-5. Specific embodiments
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0022] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.
[0023] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, the technical features involved in different embodiments of the present utility model described below may be combined with each other as long as they do not conflict with each other.
[0024] The present utility model provides a temperature and pressure sensor structure with simple structure, fast response speed, high medium compatibility, and high consistency of product pressure and temperature signals; it solves the design problems existing in the prior art of the thermal management system of new energy vehicles, such as the low integration of temperature and pressure sensors, slow temperature sensitivity, especially inconsistent response of temperature signals, complex fixed structure, many technological steps, and low production efficiency. The temperature signal terminal on the ceramic passes through the ceramic, optimizing the sensor structure design, reducing the auxiliary sealing design structure, and lowering the technological difficulty.
[0025] An integrated temperature and pressure sensor, comprising: a housing 1, an O-ring 2, an NTC protection cap 3, an NTC ceramic support assembly 4, a ceramic sensing element assembly 5, a circuit board 6, and a connector 7.
[0026] In one embodiment, as Figures 1 to 5 shown, the NTC ceramic support assembly 4 is installed inside the housing 1, the O-ring 2 is installed between the housing 1 and the NTC ceramic support 4 assembly, the ceramic sensing element assembly 5 is located inside the housing 1 and fixedly installed on the NTC ceramic support assembly 4, the circuit board 6 is located on the ceramic sensing element assembly 5, the housing 1 is fixedly connected to the connector 7, and the NTC protection cap 3 is sleeved on the NTC ceramic support assembly 4.
[0027] In one embodiment, as Figures 1 to 5 shown, one end outside of the housing 1 is a threaded structure, and the other end outside is a flange structure. The inside of the housing 1 is a multi-level cup-shaped structure for installing the O-ring 2, the NTC protection cap 3, the NTC ceramic support assembly 4, the circuit board 6, and the ceramic sensing element assembly 5. A material extrusion deformation structure is reserved at the other end of the housing 1. After riveting, all the parts inside the sensor are fixed. The cumulative tolerances of the internal structures of the product are different, and the same riveting pressure ensures the consistency of the internal structure stress of the product and the consistency of the product output.
[0028] In one embodiment, as Figures 1 to 5 shown, the O-ring 2 is installed in the cavity formed by the ceramic sensing element assembly 5, the housing 1, and the NTC ceramic support assembly 4, and the sealing form for simultaneously measuring two types of signals, pressure and temperature, inside the sensor is realized through the O-ring 2.
[0029] In one embodiment, as Figures 1 to 5 shown, one end of the NTC protection cap 3 is a cross structure to ensure full contact between the NTC 4-1 and the measured medium and to ensure that the NTC 4-1 resists the flow impact of the measured medium, and the other end is a semi-circular buckle structure with bilateral symmetry.
[0030] In one embodiment, as Figures 1 to 5As shown, the NTC ceramic support assembly 4 is composed of an NTC 4-1, a metal frame 4-2, and an injection molded part 4-3;
[0031] The NT4-1C is fixedly connected to the bottom of the injection molded part 4-3 through the metal frame 4-2, and through holes are provided in the injection molded part 4-3;
[0032] After the NTC 4-1 is mechanically riveted and fixed on the metal frame 4-2, soldering is carried out. This method ensures good electrical contact. The other end of the metal frame 4-2 is in interference connection with the NTC conductive terminal 5-4, leading the temperature signal out of the sensor and accessing the system.
[0033] In one embodiment, as Figures 1 to 5 shown, the ceramic sensing element assembly is composed of a lower plate 5-1, an adhesive 5-2, an upper plate 5-3, an NTC conductive terminal 5-4, and a pressure signal conductive terminal 5-54; the temperature signal terminal passes through the upper plate 5-2 and the lower plate 5-1 to lead the signal out of the sensor;
[0034] The lower plate 5-1 is fixedly connected to the upper plate 5-3 through the adhesive 5-2. Through holes corresponding to the through holes in the injection molded part 4-3 are provided on both the lower plate 5-1 and the upper plate 5-3. The NTC conductive terminal 5-4 is sleeved in the through holes in the lower plate 5-1, the upper plate 5-3, and the injection molded part 4-3, and the pressure signal conductive terminal is installed on the upper plate 5-3.
[0035] In one embodiment, as Figures 1 to 5 shown, the circuit board 6 is connected to the ceramic sensing element assembly 5, the NTC ceramic support assembly 4, and the connector 7. The chips and electronic components on the circuit board 6 together transfer the voltage signal related to pressure output by the ceramic and the voltage signal related to temperature output by the NTC 4-1 to the connector, providing these two signals to the system.
[0036] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present invention.
Claims
1. An integrated temperature and pressure sensor, characterized in that, Including: A housing, an O-ring, an NTC protection cap, an NTC ceramic support assembly, a ceramic sensing element assembly, a circuit board, and a connector; The NTC ceramic support assembly is installed inside the housing. The O-ring is installed between the housing and the NTC ceramic support assembly. The ceramic sensing element assembly is located inside the housing and fixedly installed on the NTC ceramic support assembly. The circuit board is located on the ceramic sensing element assembly. The housing is fixedly connected to the connector, and the NTC protection cap is sleeved on the NTC ceramic support assembly.
2. The integrated temperature and pressure sensor according to claim 1, wherein One end of the housing has a threaded structure on the outside, and the other end has a flange structure on the outside. The inside of the housing is a multi-level cup-shaped structure for installing the O-ring, the NTC protection cap, the NTC ceramic support assembly, the circuit board, and the ceramic sensing element assembly. A material extrusion deformation structure is reserved at the other end of the housing.
3. The integrated temperature and pressure sensor according to claim 1, wherein The O-ring is installed in the cavity formed by the ceramic sensing element assembly, the housing, and the NTC ceramic support assembly.
4. The integrated temperature and pressure sensor according to claim 1, characterized in that, One end of the NTC protection cap has a cross structure to ensure full contact between the NTC and the measured medium and to ensure that the NTC resists the flow impact of the measured medium. The other end has a semi-circular snap structure symmetric on both sides.
5. The integrated temperature and pressure sensor according to claim 1, wherein The NTC ceramic support assembly is composed of an NTC, a metal frame, and an injection molded part; The NTC is fixedly connected to the bottom of the injection molded part through the metal frame, and through holes are formed in the injection molded part.
6. The integrated temperature and pressure sensor according to claim 5, wherein, The ceramic sensing element assembly is composed of a lower electrode plate, an adhesive, an upper electrode plate, an NTC conductive terminal, and a pressure signal conductive terminal; The lower electrode plate is fixedly connected to the upper electrode plate through the adhesive. Through holes corresponding to the through holes in the injection molded part are provided on both the lower electrode plate and the upper electrode plate. The NTC conductive terminal is sleeved in the through holes in the lower electrode plate, the upper electrode plate, and the injection molded part. The pressure signal conductive terminal is installed on the upper electrode plate.
7. The integrated temperature and pressure sensor according to claim 5, wherein The circuit board connects the ceramic sensing element assembly, the NTC ceramic support assembly, and the connector. The chips and electronic components on the circuit board together transfer the voltage signal related to pressure output by the ceramic and the voltage signal related to temperature output by the NTC to the connector.