Probe station and test system for semiconductor

Abstract

The utility model provides a probe station and a test system for a semiconductor. The probe station comprises a probe card and a slide glass disc, the probe card comprises a probe, the slide glass disc is used for bearing a semiconductor to be tested, and the probe card can perform an electrical test on the semiconductor to be tested. The probe station further comprises a supporting assembly and a temperature adjusting assembly. The temperature adjusting assembly is provided with an air inlet part, a heat exchange part and a cold air outlet part which communicate in sequence. The air inlet part is used for introducing external air, the heat exchange part is used for carrying out heat exchange on the external air introduced through the air inlet part to obtain cold air flow, the cold air outlet part is used for discharging the cold air flow, and the cold air outlet part is aligned with the tip of the probe, so that the tip of the probe reaches the electrical property test temperature of the semiconductor to be tested. According to the probe station provided by the invention, the temperature adjusting assembly is utilized, so that when the probe card is utilized to test the semiconductor to be tested, the cooling gas with the preset temperature is provided for the tip of the probe, the electrical test temperature can be reached, and the test requirements of semiconductor products such as FRD can be met.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor testing equipment, and particularly relates to a probe station and a testing system for semiconductors. Background Art

[0002] Some electrical parameters of certain semiconductor products such as fast recovery diodes (FRDs) are temperature-sensitive, and even a slight change in temperature will cause a large change in the electrical parameters. For example, for an FRD, within a certain temperature range, its reverse leakage current IR increases with the increase in temperature. For example Figure 1 shows the relationship curve between the reverse leakage current IR and temperature of a measured FRD product. After computer fitting, within the range of 0°C to 45°C, the reverse leakage current IR of this FRD product and temperature are approximately in an exponential relationship. The above temperature sensitivity brings certain difficulties to the testing of semiconductor products such as FRDs. To ensure that the obtained electrical parameters are true and reliable, the testing temperature needs to be strictly controlled during the testing process.

[0003] However, most of the probe stations currently available in the market for semiconductor product detection do not have a temperature control function. In addition, during the testing process, the temperature of the probe station itself will also increase, so it cannot meet the testing requirements of semiconductor products such as fast recovery diodes. A small number of probe stations have a temperature control function, but their structures are complex, they occupy a large area, and they are expensive.

[0004] Therefore, it is urgent to develop a probe station with a temperature control function and a testing system for semiconductors to solve the technical problems existing in the prior art to a certain extent. Summary of the Utility Model

[0005] The purpose of this application is to provide a probe station and a testing system for semiconductors. The probe station has a temperature control function and can meet the testing requirements of semiconductor products such as FRDs while having a simple structure.

[0006] This application provides a probe station, including a probe card and a wafer chuck. The probe card includes probes, and the wafer chuck is used to hold the semiconductor to be tested; the probe station further includes a support assembly and a temperature adjustment assembly;

[0007] The support assembly includes a base, the base has a mounting groove, the probe card is mounted on the base, and the wafer chuck is movably arranged in the mounting groove so that the probe card can perform electrical testing on the semiconductor to be tested;

[0008] The temperature regulating component has an air inlet, a heat exchange part and a cold air outlet which are connected in sequence; the air inlet is used to allow the outside air to enter, the heat exchange part is used to perform heat exchange on the outside air introduced through the air inlet to obtain a cold air flow, the cold air outlet is used to discharge the cold air flow, and the cold air outlet is aligned with the needle tip of the probe so that the needle tip of the probe reaches the electrical test temperature of the semiconductor to be tested.

[0009] In the above technical solution, further, the temperature adjustment component is a vortex cooler;

[0010] The gas input end of the vortex cooler is the air intake;

[0011] The cold air flow output end of the vortex cooler is the cold air outlet;

[0012] The hot air flow output end of the vortex cooler is the hot air outlet;

[0013] The heat pipe of the vortex cooler is the heat exchange part. The heat pipe can vortex-exchange the external gas introduced. The cold air flow generated after the heat exchange is transported to the needle tip of the probe through the cold air flow output end, and the hot air flow generated after the heat exchange is guided to the outside through the hot air flow output end.

[0014] In the above technical solution, further, the temperature adjustment assembly also includes an airflow adjustment component arranged at the gas input end of the vortex cooler;

[0015] The airflow adjustment component comprises a top screw, and the temperature and / or flow rate of the cold airflow can be changed by screwing the top screw.

[0016] In the above technical solution, further, the temperature adjustment component also includes a thermometer, and the thermometer is arranged on the probe card to detect the temperature at the probe.

[0017] In the above technical solution, further, the temperature adjustment assembly also includes a fixing plate;

[0018] The fixing plate is arranged above the probe card to isolate the probe card from external gas;

[0019] The cold air flow output end passes through the fixing plate to deliver the cold air flow to the needle tip of the probe.

[0020] In the above technical solution, further, the fixing plate is a plate-like structure made of a transparent material.

[0021] In the above technical solution, further, the support assembly also includes a bearing plate, a pad and a locking member, wherein:

[0022] The carrying plate is arranged on the side wall of the mounting groove and is used for carrying the probe card;

[0023] The pad is arranged on a side of the probe card away from the carrier plate, and the locking element passes through the pad and abuts against the probe card to fix the probe card on the carrier plate.

[0024] In the above technical solution, further, the fixing plate is disposed on the backing plate, and a redundant gap is formed between the fixing plate and the locking member at the position of the locking member.

[0025] In the above technical solution, further, both the carrier plate and the backing plate are multiple, and the multiple carrier plates and the multiple backing plates are arranged in one-to-one correspondence.

[0026] The present application also provides a test system for semiconductors, including an automatic test machine and the probe station of any one of the above technical solutions;

[0027] Among them, the automatic test machine is connected to the probe card, and can send a test signal to the probe card and can obtain a feedback signal from the probe card.

[0028] Compared with the prior art, the present application has the following beneficial effects:

[0029] For the probe station provided by the present application, by using the temperature adjustment component, when using the probe card to test the semiconductor to be tested, by providing a cooling gas with a preset temperature to the tip of the probe, the electrical test temperature can be achieved, and while the probe station has a simple structure, it also meets the test requirements of semiconductor products such as FRD, especially the low-temperature test requirements.

[0030] In addition, compared with the probe stations with temperature control functions in the prior art, the probe station provided in the present application has the characteristics of simple structure, small occupied space, and low cost.

[0031] The present application also provides a test system for semiconductors. Since it includes an automatic test machine and the above probe station, it also has a temperature control function, thereby ensuring the accuracy of testing the semiconductor wafer to be tested using the automatic test machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 To measure the relationship curve between the reverse leakage current IR and temperature of a certain FRD product;

[0033] Figure 2 An exploded view of the probe station provided in an embodiment of the present application from a first perspective;

[0034] Figure 3 A schematic structural view of the probe station provided in an embodiment of the present application from a first perspective;

[0035] Figure 4 An exploded view of the probe station provided in an embodiment of the present application from a second perspective, and the probe station in the figure is in a standby state;

[0036] Figure 5This is a schematic structural diagram of a probe station provided in an embodiment of the present application from a second perspective. The probe station in the figure is in a working state;

[0037] Figure 6 This is a top view of the probe station provided in an embodiment of the present application;

[0038] Figure 7 This is a side view of the probe station provided in an embodiment of the present application;

[0039] Figure 8 This is a schematic diagram of a locking member and a fixing plate in the probe station provided in an embodiment of the present application;

[0040] Figure 9 This is a schematic structural diagram of a wafer to be measured.

[0041] Reference numerals: 1 - probe card; 2 - support assembly; 3 - temperature adjustment assembly; 5 - air inlet part; 6 - wafer to be measured; 7 - hot air flow output end; 8 - fixing plate; 9 - nut; 10 - base; 11 - support part; 12 - backing plate; 13 - mounting groove; 14 - redundant gap; 15 - locking member; 16 - die; 17 - carrier plate. Detailed implementation manners

[0042] Next, the technical solutions of the present application will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. The detailed description of the following embodiments is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0043] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0044] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0045] Embodiment 1

[0046] The following combines Figures 1 to 8 to describe in detail the structure and working principle of the probe station provided in Embodiment 1.

[0047] The probe station provided in this embodiment includes a probe card 1, a wafer chuck, a support assembly 2, and a temperature adjustment assembly 3. Among them, the probe card 1 includes a probe base and a plurality of probes arranged on the probe base; in this embodiment, the plurality of probes are arranged in a circular shape, and the tip of each probe faces the center of the circle. The tip of the probe faces downward ( Figure 7 the bottommost part in [[]] is the tip of the probe), that is, the tip of the probe points to the center of the circle in a manner of being inclined downward relative to the horizontal plane or being bent downward. The wafer chuck is used to carry the semiconductor to be tested.

[0048] The semiconductor to be tested in this embodiment can be, for example, a wafer to be tested. As Figure 9 shown, the wafer to be tested 6 is formed with a plurality of die 16, and the plurality of die 16 are arranged in an array, and the scribing lines are between adjacent die 16; several test pads (PADs) are led out around or on the die 16. During the test, the tip of the probe is directly contacted with the test pad of the die 16 on the wafer to be tested 6 to realize electrical testing, and then unqualified die 16 can be screened out or it can be understood whether the relevant process meets the process requirements. The test process will be explained in detail below.

[0049] As Figures 2 to 4 shown, the support assembly 2 includes a base 10, and the base 10 has a mounting groove 13. For example, the mounting groove 13 is a groove-shaped structure opened on one surface of the base 10 for installing the probe card 1 and accommodating the wafer chuck. The wafer chuck is movably arranged in the mounting groove 13, so that the semiconductor to be tested on the wafer chuck can be aligned with the probe card 1 by moving the wafer chuck, that is, the probe of the probe card 1 can reliably contact the test pad of the die to be tested.

[0050] As Figure 4 and Figure 5As shown, the temperature regulation component 3 has an air inlet part 5, a heat exchange part, and a cold air outlet part that are connected in sequence. The air inlet part 5 is used to introduce external gas. The external gas introduced through the air inlet part 5 undergoes heat exchange in the heat exchange part, and the cooled gas is obtained after heat exchange. This cooled gas is discharged through the cold air outlet part. Among them, the cold air outlet part is aligned with the tip of the probe, so that the temperature at the tip of the probe can reach the electrical test temperature of the semiconductor to be measured, that is, it can make the semiconductor to be measured, especially the die to be measured, reach its electrical test temperature, thereby obtaining more accurate and reliable test results.

[0051] Furthermore, the temperature regulation component 3 can adopt a vortex tube cooler, which is generally a tubular structure and can also be called a vortex tube. The vortex tube has three ports, namely a gas input end, a cold air flow output end, and a hot air flow output end. In addition, a heat pipe is provided inside the vortex tube. Among them, the gas input end is the above-mentioned air inlet part 5, the cold air flow output end is the above-mentioned cold air outlet part, the hot air flow output end 7 is arranged on the side of the tubular structure, and the heat pipe is the above-mentioned heat exchange part. Therefore, the entire vortex tube cooler is approximately an irregular T-shaped structure. The gas input end, the cold air flow output end, and the heat pipe are located in the same tubular structure. The hot air flow output end 7 is arranged on the side of the tubular structure and is closer to the cold air flow output end relative to the gas input end.

[0052] The vortex tube inputs compressed air or nitrogen with a certain pressure through the gas input end. Through the internal energy conversion of the vortex tube, the cooling gas generated at one end, such as cold air or cooled nitrogen, is discharged through the cold air flow output end. Since the cold air flow output end is aligned with the tip of the probe, it can ensure that the temperature at the tip of the probe reaches the electrical test temperature. Of course, the electrical test temperature will vary depending on different semiconductors to be measured and test requirements. The heating gas generated at the other end is discharged through the hot air flow output end 7.

[0053] The compressed air and nitrogen introduced into the temperature regulation component 3, such as the vortex tube, preferably come from the plant centralized gas supply system. In practice, an intake pipe is connected between the gas input end and the plant centralized gas supply system, and the compressed air or nitrogen in the plant centralized gas supply system is introduced into the vortex tube through the intake pipe. Since the plant centralized gas supply system is not within the protection scope of this application, it will not be elaborated here.

[0054] It should be noted that the working principle of the eddy current cooler is understandable to those skilled in the art. For example, compressed air or nitrogen with a certain pressure enters the eddy current tube nozzle and expands and accelerates. When the accelerated air flow enters an eddy current generator, the rotating air flow enters the interior of the heat pipe along the heat pipe wall at a relatively high rotational speed, such as 1,000,000 rpm. After the air flow in the heat pipe undergoes eddy current exchange, energy separation occurs, and the air flow is divided into two air flows - one is a hot air flow and the other is a cold air flow. At the end of the heat pipe, a part of the compressed air or nitrogen is discharged in the form of hot air through a regulating valve, and the remaining compressed air or nitrogen returns at a lower speed through the center of the rotating air flow entering the heat pipe. This cold air flow forms ultra-low temperature cold air through the center of the generator and is collected and discharged at the cold air end. Here, the detailed structure thereof will not be elaborated further.

[0055] In summary, the present application utilizes the temperature adjustment component 3, such that when using the probe card 1 to test the semiconductor to be tested, it can ensure that the temperature at the tip of the probe is within the electrical test temperature range, for example, within the range of 23.5 ± 0.5 °C, thereby achieving a stable and reliable test effect and meeting the test requirements. In addition, compared with the existing probe stations with temperature control functions, such as high and low temperature probe stations, the probe station provided in the present application has a simpler structure and occupies less space; furthermore, this probe station can be obtained by adding a temperature adjustment component on the basis of a traditional probe station, and basically no major transformation of the original probe station is required, so the transformation cost is relatively low.

[0056] In this embodiment, the temperature adjustment component 3 may further include an air flow adjustment member; the air flow adjustment member includes a setscrew. By screwing the setscrew, the air flow size at the gas input end can be changed to change the preset temperature.

[0057] Specifically, the gas input end may be a channel structure. The setscrew passes through the side wall of the eddy current cooler and vertically extends into the channel. By screwing the setscrew, the length of the setscrew located in the channel can be changed, changing the cut-off area of the air flow introduction and thus changing the air flow size, and ultimately changing the flow rate and / or temperature of the cold air flow. Here, the setscrew can be understood as a rod-shaped member with threads. Further, when the setscrew is tightened, that is, the setscrew is completely screwed into the channel, the air flow becomes the smallest. At this time, the air flow becomes smaller, the temperature of the cold air flow and the electrical test temperature increase; on the contrary, when the air flow increases, the temperature of the cold air flow and the electrical test temperature decrease.

[0058] In this embodiment, the temperature adjustment component 3 may further include a thermometer, which is disposed on the probe card 1, such as on the probe base of the probe card 1, particularly at a position of the probe base close to the probe, so as to visually display the test temperature, enabling technicians to obtain the required electrical test temperature by adjusting the cold air flow rate or the like according to the actual situation. In addition, the probe card 1 further includes a printed circuit board for signal transmission. Optionally, the thermometer may also be disposed on the printed circuit board of the probe card and connected to the circuit on the printed circuit board to transmit the temperature signal detected by the thermometer to the printed circuit board, thereby obtaining the temperature information near the probe under the action of the vortex cooler.

[0059] In this embodiment, as shown in combination with Figure 2 , Figure 4 and Figure 5 , the temperature adjustment component 3 further includes a fixing plate 8, and the fixing plate 8 is used for installing and fixing the vortex cooler.

[0060] Specifically, the fixing plate 8 is disposed above the probe card 1, and the cold air output end passes through the fixing plate 8 to divert the cold air flow to the probe card 1, so that the vicinity of the probe tip of the probe card 1 reaches the electrical test temperature.

[0061] Furthermore, the fixing plate 8 is provided with mounting holes, and the cold air output end passes through the mounting holes and transmits the cold air flow to the probe card 1; in addition, the cold air output end and the fixing plate 8 can be connected by a nut 9, which facilitates the disassembly and installation of the cold air output end from the fixing plate 8.

[0062] Even further, the fixing plate 8 is a plate-like structure made of a transparent material, so as to facilitate observing whether the cold air flow ejected from the vortex cooler is directly facing the tip of the probe card 1 and observing the flow condition of the cold air flow. Preferably, the fixing plate 8 is an acrylic plate.

[0063] In this embodiment, as shown in combination with Figure 2 and Figure 4 , the support component 2 further includes a carrier plate 17, a backing plate 12 and a locking member 15 in addition to the above-mentioned base 10.

[0064] Specifically, the base 10 is a plate-like structure with a certain thickness. Along the thickness direction of the base 10, the mounting groove 13 of the base 10 penetrates the upper and lower end faces of the base 10, that is to say, the mounting groove 13 can be understood as a through groove. In this embodiment, the mounting groove 13 does not penetrate the upper and lower end faces of the base 10, that is, the bottom of the mounting groove 13 is located inside the base 10.

[0065] Specifically, the carrier plate 17 is disposed on the side wall of the mounting groove 13; preferably, the carrier plate 17 is a strip-shaped plate structure and is installed on the side wall of the mounting groove 13, and the probe card 1 is lapped on the carrier plate 17 and is installed on the carrier plate 17 by the locking member 15. Specifically, asFigures 2 to 4 As shown, for example, two spaced-apart strip-shaped support portions 11 are formed on the side wall of one side of the installation groove 13. The two strip-shaped support portions 11 on one side of the installation groove 13 face each other, and both ends of the carrier plate 17 are respectively connected to the two strip-shaped support portions 11 facing each other. Here, the support portion 11 and the installation groove 13 can be integrally formed, or the support portion 11 can be welded to the side wall of the installation groove 13, or the integration of the support portion 11 and the installation groove 13 can be achieved through detachable threaded connection; similarly, the carrier plate 17 can be fixedly connected to the two strip-shaped support portions 11 by welding or other means, or the carrier plate 17 can be detachably connected to the two strip-shaped support portions 11 by threaded connection or other means. In addition, the carrier plate 17 can also be directly installed on the side wall of the installation groove 13 by fixed connection means such as welding or by detachable connection means such as threaded connection, or the carrier plate 17 can be integrally formed with the installation groove 13.

[0066] In addition, considering that a semiconductor to be tested is provided on the carrier tray, in order to ensure the smooth progress of the test, the distance between the carrier plate 17 and the bottom end of the installation groove 13 is set to be greater than the total height of the carrier tray and the semiconductor to be tested. Here, the bottom end of the installation groove 13 can be understood as the plane where the end face on the carrier tray side of the installation groove 13 is located.

[0067] In the embodiment, the carrier tray can move within the installation groove 13, and specifically can move along the width direction, length direction, and height direction of the installation groove 13 to align the tip of the probe with the die to be tested on the wafer to be tested. During actual testing, the carrier tray carrying the wafer to be tested first moves to the required position below the probe card 1 along the length direction and / or width direction of the installation groove 13; then moves upward along the height direction of the installation groove 13 to make the tip of the probe contact the test pad of the die to be tested; after the test of the die to be tested is completed, the carrier tray first moves downward along the height direction of the installation groove 13, then moves along the length and / or width direction of the installation groove 13 until it moves to the position required for testing the next die to be tested, and finally moves upward along the height direction of the installation groove 13 to make the tip of the probe contact the next die to be tested until all the dies to be tested on the wafer to be tested are tested.

[0068] Specifically, the backing plate 12 is arranged on the side of the probe card 1 facing away from the carrier plate 17, thereby forming a sandwich structure of the carrier plate 17, the probe card 1, and the backing plate 12.

[0069] Furthermore, the backing plate 12 presses on the circumferential edge of the probe card 1, and the part of the probe card 1 provided with probes can be exposed.

[0070] Specifically, the locking member 15 passes through the backing plate 12 and abuts against the probe card 1 to fix the probe card 1 to the carrier plate 17. The locking member 15 can specifically be a flat head screw. Threaded holes are provided on the backing plate 12. The flat head screw passes through the threaded hole and abuts against the probe card 1. By tightening the flat head screw, the probe card 1 can be kept tightly fixed to the carrier plate 17.

[0071] Specifically, there are multiple carrier plates 17 and multiple backing plates 12, and the multiple carrier plates 17 and the multiple backing plates 12 are arranged in one-to-one correspondence. For example, there are two carrier plates 17 and two backing plates 12. The two carrier plates 17 are oppositely arranged on two facing side walls of the installation groove 13. Both ends of the probe card 1 are respectively lapped on the two carrier plates 17 on both sides. The two backing plates 12 are respectively arranged above the probe card 1 corresponding to the carrier plates 17, and are respectively fixedly connected by the locking member 15 such as a flat head screw described above.

[0072] Specifically, in combination with Figure 3 and Figure 8 as shown, threaded holes are provided at both ends of each backing plate 12 along its length direction, that is, the probe card 1 and the carrier plate 17 are reliably fixed by four flat head screws.

[0073] In this embodiment, in combination with Figure 3 and Figure 8 as shown, the fixing plate 8 can be placed on the backing plate 12, and a redundant gap 14 is formed between the fixing plate 8 and the locking member 15 at the position of the locking member 15, so that the fixing plate 8 can move slightly on the backing plate 12 to make the cold air outlet end opposite to the tip of the probe, ensuring the stability of the test temperature.

[0074] During the test process, the fixing plate 8 also plays a role of isolation, used to isolate the relatively high-temperature gas in the environment and the low-temperature gas in the installation groove 13. It is not difficult to understand that the larger the area of the fixing plate 8, the more beneficial it is to the isolation effect and the accuracy of the test results can be guaranteed. However, in actual operation, considering that the cold air outlet end should be aligned with the tip of the probe card 1, therefore, the temperature adjustment component 3 should be adjustable along the length direction of the installation groove 13. Therefore, as Figure 8 shown, the four corners of the fixing plate 8 are set to be arc-shaped, so that there are arc-shaped deficiency parts at the four corners of the fixing plate 8. A redundant gap 14 is formed between this deficiency part and the locking member 15, so that the fixing plate 8 can have a certain amount of movement in the length direction of the installation groove 13. As Figure 8 shown, it not only ensures that the fixing plate 8 has a large enough coverage area but also enables the fixing plate 8 to move with a predetermined margin in the length direction of the installation groove 13.

[0075] It should be noted that during the test, by increasing the thickness of the backing plate 12, changing the thickness of the fixing plate 8, selecting nuts 9 of appropriate specifications, and choosing an appropriate connection method between the fixing plate 8 and the cold air outlet, the distance between the cold air outlet and the tip of the needle can be adjusted to effectively control the test temperature.

[0076] In summary, in combination with Figure 9 , a schematic structural diagram of a wafer to be tested is provided. In the figure, each square represents a die 16 of an FRD (fast recovery diode). Six of the dies 16 are randomly selected for testing. The dies to be tested are highlighted in black squares in the figure and are respectively denoted as 1# to 6#. Under the same test conditions, the probe station provided by the present application and the existing probe station with a temperature control mechanism (i.e., a high and low temperature probe station) are respectively used to test each die to be tested. The electrical test temperature is controlled within the range of 23.5 ± 0.5 °C. The test results are shown in Table 1 below.

[0077] Table 1 Reverse leakage current IR test results (unit: nA)

[0078]

[0079] From the test results in Table 1, it can be seen that when the probe station in Embodiment 1 of the present application and the existing high and low temperature probe station are respectively used to test the same wafer to be tested, the test results of the same die are relatively consistent, indicating that the probe station of the present application can obtain relatively accurate test results and meet the test requirements of semiconductor products such as FRDs. In addition, it should be noted that when the probe station of the present application is used for testing, the reverse leakage current IR of the six dies all concentrates within the range of 802 nA to 871 nA, and the values are relatively uniform, which also confirms the consistency of the electrical parameters of the product.

[0080] Embodiment 2

[0081] The present embodiment provides a test system for semiconductors, including an automatic test machine and the probe station in Embodiment 1.

[0082] Specifically, the automatic test machine is connected to the probe card and can send excitation signals of current and voltage to the probe card, and obtain the output signals of the dies to be tested of the wafer to be tested.

[0083] During the test, when the wafer to be tested is transferred to the carrier plate, the test system for semiconductors identifies and confirms the initial position of the wafer to be tested through the internal camera system, and then the probe station conducts tests according to the pre-set wafer map (MAP) direction to be tested, or conducts tests in the wafer map according to the moving position sent by the automatic test machine.

[0084] In summary, the test system for semiconductors provided in this embodiment includes the probe station in Embodiment 1, so it also has a temperature control function. That is to say, when the structure of the probe station is simple, the temperature at the tip of the probe can always be maintained at the electrical test temperature required for testing, thereby ensuring the accuracy and reliability of the test results.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A probe station, comprising a probe card and a wafer chuck, the probe card including probes, and the wafer chuck being configured to hold a semiconductor under test; characterized in that, The probe station also includes a support component and a temperature adjustment component; The support assembly includes a base, the base has a mounting groove, the probe card is mounted on the base, and the wafer carrier is movably disposed in the mounting groove, so that the probe card can perform electrical testing on the semiconductor to be tested; The temperature regulating component has an air inlet, a heat exchange part and a cold air outlet which are connected in sequence; the air inlet is used to allow the outside air to enter, the heat exchange part is used to perform heat exchange on the outside air introduced through the air inlet to obtain a cold air flow, the cold air outlet is used to discharge the cold air flow, and the cold air outlet is aligned with the needle tip of the probe so that the needle tip of the probe reaches the electrical test temperature of the semiconductor to be tested.

2. The probe station according to claim 1, wherein The temperature regulating component is a vortex cooler; The gas input end of the vortex cooler is the air inlet; The cold air flow output end of the vortex cooler is the cold air outlet; The hot air flow output end of the vortex cooler is a hot air outlet; The heat pipe of the vortex cooler is the heat exchange part, and the heat pipe can vortex exchange the external gas introduced. The cold air flow generated after the heat exchange is transported to the needle tip of the probe through the cold air flow output end, and the hot air flow generated after the heat exchange is guided to the outside through the hot air flow output end.

3. The probe station according to claim 2, wherein The temperature adjustment assembly further includes an airflow adjustment member disposed at the gas input end of the vortex cooler; The airflow adjustment component comprises a top screw, and the temperature and / or flow rate of the cold airflow can be changed by screwing the top screw.

4. The probe station according to claim 2, wherein The temperature adjustment component further includes a thermometer, which is disposed on the probe card to detect the temperature at the probe.

5. The probe station according to claim 2, characterized in that, The temperature adjustment assembly also includes a fixing plate; The fixing plate is disposed above the probe card to isolate the probe card from external gas; The cold air flow output end passes through the fixing plate to deliver the cold air flow to the needle tip of the probe.

6. The probe station according to claim 5, characterized in that, The fixing plate is a plate-shaped structure made of a transparent material.

7. The probe station according to claim 5 or 6, characterized in that, The support assembly further comprises a bearing plate, a backing plate and a locking member, wherein: The carrying plate is arranged on the side wall of the mounting groove and is used for carrying the probe card; The pad is arranged on a side of the probe card away from the carrier plate, and the locking member passes through the pad and abuts against the probe card to fix the probe card on the carrier plate.

8. The probe station according to claim 7, characterized in that The fixing plate is arranged on the backing plate, and a redundant gap is formed between the fixing plate and the locking member at the position of the locking member.

9. The probe station according to claim 7, wherein, There are multiple carrier plates and multiple pads, and the multiple carrier plates and the multiple pads are arranged in a one-to-one correspondence.

10. A test system for semiconductors, characterized in that, Comprising an automatic testing machine and a probe station as claimed in any one of claims 1 to 9; The automatic test machine is connected to the probe card and can send a test signal to the probe card and obtain a feedback signal from the probe card.

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