Intelligent probe assembly

Abstract

The utility model discloses an intelligent probe assembly which comprises a first probe contact, a second probe contact and a signal processing unit. Wherein the second probe contact and the first probe contact are oppositely arranged, so that the first probe contact and the second probe contact can be in contact with a detected part at the same time during detection; the signal processing unit is respectively connected with the first probe contact and the second probe contact, and the signal processing unit is used for sending an electric signal to the first probe contact and judging whether the first probe contact and the second probe contact are in contact with a detected part or not according to the received electric signal of the second probe contact; therefore, whether the probe is effectively contacted with the metal to-be-tested part or not is judged through the double-path probe contact and signal detection, so that the test efficiency and accuracy are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB circuit board detection, and particularly relates to an intelligent probe assembly. Background Art

[0002] In the related art, a probe is a test pin used to test a PCBA, with a gold-plated surface and a high-performance spring with an average life of 30,000 to 100,000 times inside. In recent years, with the rapid development of industries such as batteries, there are more and more low-voltage and high-current products, and the frequency of metal structural parts applied to PCBA has increased. After these electronic products are manufactured, they need to be subjected to functional tests. The traditional test system usually directly docks with the test points using metal probes. The existing probes cannot determine whether the test points are in normal contact with the probes, resulting in poor test efficiency and accuracy. Content of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems in the above technologies to some extent. For this reason, an object of the utility model is to provide an intelligent probe assembly, which can determine whether the probe effectively contacts the metal part to be measured through a dual-channel probe contact head plus signal detection, thereby improving the test efficiency and accuracy.

[0004] To achieve the above object, an intelligent probe assembly proposed by an embodiment of the utility model includes: a first probe contact head; a second probe contact head, which is disposed opposite to the first probe contact head so that the first probe contact head and the second probe contact head can simultaneously contact the part to be measured during detection; a signal processing unit, which is respectively connected to the first probe contact head and the second probe contact head. The signal processing unit is used to send an electrical signal to the first probe contact head and determine whether the first probe contact head and the second probe contact head contact the part to be measured according to the electrical signal received by the second probe contact head.

[0005] The intelligent probe assembly proposed by an embodiment of the utility model includes a first probe contact head, a second probe contact head and a signal processing unit; wherein, the second probe contact head is disposed opposite to the first probe contact head so that the first probe contact head and the second probe contact head can simultaneously contact the part to be measured during detection; the signal processing unit is respectively connected to the first probe contact head and the second probe contact head. The signal processing unit is used to send an electrical signal to the first probe contact head and determine whether the first probe contact head and the second probe contact head contact the part to be measured according to the electrical signal received by the second probe contact head; thus, it can be determined whether the probe effectively contacts the metal part to be measured through a dual-channel probe contact head plus signal detection, thereby improving the test efficiency and accuracy.

[0006] In addition, the intelligent probe assembly proposed by the above embodiment of the utility model may further have the following additional technical features:

[0007] Optionally, the first probe contact and the second probe contact are provided on the same probe.

[0008] Optionally, the signal processing unit includes a processor and a voltage detection unit, and the processor is connected to the first probe contact and the second probe contact through the voltage detection unit.

[0009] Optionally, the first probe contact is connected to the voltage detection unit through a first connection point, and the second probe contact is connected to the voltage detection unit through a second connection point.

[0010] Optionally, a pressure sensor is further included, and the pressure sensor is configured to feed back the pressure value during the use of the probe to the processor.

[0011] Optionally, a temperature sensor is further included, and the temperature sensor is configured to feed back the temperature value during the use of the probe to the processor.

[0012] Optionally, a communication unit is further included, and the processor performs data transmission through the communication unit. Description of the Drawings

[0013] Figure 1 is a schematic structural diagram of an intelligent probe assembly according to an embodiment of the present invention;

[0014] Figure 2 is a block diagram of an intelligent probe assembly according to an embodiment of the present invention. Detailed Embodiments

[0015] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0016] In order to better understand the above technical solutions, the exemplary embodiments of the present invention will be described in more detail with reference to the drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention can be more thoroughly understood and the scope of the present invention can be fully conveyed to those skilled in the art.

[0017] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings of the specification and the specific embodiments.

[0018] The intelligent probe assembly according to the embodiment of the present invention will be described below with reference to the accompanying drawings.

[0019] Reference Figure 1-2 As shown, the intelligent probe assembly proposed in the embodiment of the present invention includes a first probe contact 10, a second probe contact 20, and a signal processing unit 30.

[0020] Among them, the second probe contact 20 is disposed opposite to the first probe contact 10 so that the first probe contact 10 and the second probe contact 20 can simultaneously contact the measured part during detection; the signal processing unit 30 is respectively connected to the first probe contact 10 and the second probe contact 20, and the signal processing unit 30 is used to send an electrical signal to the first probe contact 10 and determine whether the first probe contact 10 and the second probe contact 20 contact the measured part according to the received electrical signal of the second probe contact 20.

[0021] It should be noted that during detection, the probe needs to be pressed down so that the contact on the probe contacts the measured part. In this application, by providing the first probe contact 10, the second probe contact 20, and the signal processing unit 30, the signal processing unit 30 sends an electrical signal to one of the probe contacts. If the other probe contact receives the same electrical signal, it can be determined that the probe has been connected to the measured metal part; if the other probe contact does not receive the same electrical signal, it can be determined that the probe is not connected to the measured metal part, so that it can be determined with 100% whether the probe is connected to the measured part.

[0022] That is to say, when the two probe contacts simultaneously contact the metal part, it can be short-circuited, and the short-circuit characteristic can be used to determine whether the probe effectively contacts the test part.

[0023] As an embodiment, the first probe contact 10 and the second probe contact 20 are provided on the same probe.

[0024] That is to say, in order to save the space occupied by the probe, the first probe contact 10 and the second probe contact 20 can be provided on the same probe.

[0025] It should be noted that as Figure 1 shown, in order to enable the first probe contact 10 and the second probe contact 20 to simultaneously contact the measured part, the first probe contact 10 and the second probe contact 20 need to be provided on the same horizontal plane, and the first probe contact 10 and the second probe contact 20 are arranged parallel to each other on the same probe.

[0026] As an embodiment, the signal processing unit 30 includes a processor 301 and a voltage detection unit 301. The processor 301 is connected to the first probe contact 10 and the second probe contact 20 through the voltage detection unit 302.

[0027] As an embodiment, the first probe contact 10 is connected to the voltage detection unit 302 through the first connection point 101, and the second probe contact 20 is connected to the voltage detection unit 302 through the second connection point 201.

[0028] That is to say, after the processor 301 sends an electrical signal to the voltage detection unit 302 and then transmits it to one of the probe contacts, when the two probe contacts are effectively connected to the metal part to be measured, the other probe contact and the connection point will obtain the same electrical signal, and it is transmitted back to the processor 301 through the voltage detection unit 302 to form a closed loop.

[0029] It should be noted that the above voltage detection unit 302 can adopt any existing voltage detection unit 302 that can detect electrical signals, and the specific circuit principle thereof will not be elaborated in detail in this application.

[0030] As an embodiment, the intelligent probe assembly further includes a pressure sensor 40, and the pressure sensor 40 is used to feedback the pressure value during the use of the probe to the processor 301.

[0031] It should be noted that as Figure 1 shown, when the pressure of the probe against the part to be measured is too large, the part to be measured may be deformed, or the surface coating may be damaged, thus affecting the product quality. Therefore, adding the pressure sensor 40 at the end of the probe can feedback the pressure value during the use of the probe, and when the pressure value exceeds the preset standard value, it can be discovered and maintained in time.

[0032] As an embodiment, the intelligent probe assembly further includes a temperature sensor 50, and the temperature sensor 50 is used to feedback the temperature value during the use of the probe to the processor 301.

[0033] It should be noted that as Figure 1 shown, when the probe is used in low-voltage and high-current tests, and the contact impedance is large during long-term tests, it will cause serious heating. Therefore, adding a temperature sensor to measure the temperature of the contact part and feedback over-temperature.

[0034] As an embodiment, the intelligent probe assembly further includes a communication unit 60, and the processor 301 performs data transmission through the communication unit 60.

[0035] It should be noted that the processor 301 is any existing chip with signal acquisition and communication functions. It is connected to the communication unit 60, voltage detection unit 301, pressure sensor 40, and temperature sensor 50 through its corresponding pins, so as to send the electrical signals detected by the voltage detection unit, the pressure values collected by the pressure sensor, and the temperature values collected by the temperature sensor to the processor for processing. And through the communication function of the processor, the various data reflected are transmitted to the user for real-time monitoring, improving the reliability of the product and the production safety at the same time.

[0036] In summary, the intelligent probe assembly proposed according to the embodiments of the present invention includes a first probe contact, a second probe contact, and a signal processing unit. Among them, the second probe contact is disposed opposite to the first probe contact so that the first probe contact and the second probe contact can simultaneously contact the measured part during detection. The signal processing unit is respectively connected to the first probe contact and the second probe contact. The signal processing unit is used to send an electrical signal to the first probe contact and determine whether the first probe contact and the second probe contact contact the measured part according to the received electrical signal of the second probe contact. Thus, by using the dual-channel probe contacts plus signal detection to judge whether the probe effectively contacts the metal measured part, the test efficiency and accuracy are improved.

[0037] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0038] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0039] In the present utility model, unless otherwise clearly stipulated and defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly stipulated and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0041] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0042] Although the embodiments of the present utility model have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present utility model. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present utility model.

Claims

1. An intelligent probe assembly, characterized in that, Comprising: A first probe contact; A second probe contact, the second probe contact being disposed opposite to the first probe contact so that the first probe contact and the second probe contact can simultaneously contact the measured part during detection; A signal processing unit, the signal processing unit being respectively connected to the first probe contact and the second probe contact, the signal processing unit being configured to send an electrical signal to the first probe contact and determine whether the first probe contact and the second probe contact contact the measured part according to the received electrical signal of the second probe contact.

2. The intelligent probe assembly according to claim 1, wherein, The first probe contact and the second probe contact are provided on the same probe.

3. The intelligent probe assembly according to claim 2, wherein The signal processing unit includes a processor and a voltage detection unit, and the processor is connected to the first probe contact and the second probe contact through the voltage detection unit.

4. The intelligent probe assembly according to claim 3, wherein, The first probe contact is connected to the voltage detection unit through a first connection point, and the second probe contact is connected to the voltage detection unit through a second connection point.

5. The intelligent probe assembly according to claim 3, wherein It further includes a pressure sensor, and the pressure sensor is configured to feed back the pressure value during the use of the probe to the processor.

6. The intelligent probe assembly according to claim 5, wherein, It further includes a temperature sensor, and the temperature sensor is configured to feed back the temperature value during the use of the probe to the processor.

7. The intelligent probe assembly according to claim 6, wherein It further includes a communication unit, and the processor performs data transmission through the communication unit.

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