Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

Technical Field

[0001] The utility model relates to a driving mechanism. More specifically, the utility model particularly relates to a driving mechanism for driving an optical element to move. Background Art

[0002] With the development of technology, many current electronic devices (such as smart phones or digital cameras) have the functions of taking pictures or videos. The use of these electronic devices is becoming more and more common, and they are developing towards a convenient, thin and light design direction to provide users with more choices.

[0003] Some electronic devices with the functions of taking pictures or videos are provided with a lens driving module to drive an optical element to move, so as to achieve the functions of autofocusing (AF) and optical image stabilization (OIS). Light can pass through the aforementioned optical element and form an image on a photosensitive element.

[0004] However, how to further miniaturize the lens driving module and improve its stability and reliability has become an important challenge for researchers in this related technical field. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the aforementioned known problems, an embodiment of the utility model provides a driving mechanism for driving an optical element to move. The aforementioned driving mechanism mainly includes a fixed part, a movable part and a driving component. In one embodiment, the aforementioned movable part is connected to the aforementioned fixed part, the aforementioned optical element is arranged on the aforementioned movable part, the aforementioned optical element has an optical axis, and the aforementioned driving component is used to drive the optical element to move relative to the fixed part.

[0007] In one embodiment, the aforementioned driving mechanism further includes a flexible circuit board and a circuit board arranged on the fixed part, and the aforementioned driving component includes a long strip-shaped first magnetic element arranged on the movable part and a first coil and a second coil arranged in the aforementioned circuit board. Wherein, the aforementioned circuit board is arranged on the aforementioned flexible circuit board, the long axis of the aforementioned first magnetic element is parallel to a first axial direction, and the aforementioned circuit board and the aforementioned first magnetic element are separated by a distance in a second axial direction. In addition, the aforementioned first axial direction, the aforementioned second axial direction and the aforementioned optical axis are perpendicular to each other.

[0008] In one embodiment, the drive mechanism further includes an adhesive element, and the fixing portion has a protruding structure extending in the direction of the optical axis. The adhesive element connects the protruding structure and the flexible circuit board, and the protruding structure and the circuit board do not overlap in the second axial direction.

[0009] In one embodiment, the adhesive element contacts the circuit board, the protruding structure, and the flexible circuit board.

[0010] In one embodiment, the drive mechanism further includes a buffer element disposed on the movable portion. When the movable portion moves relative to the fixing portion to an extreme position along the second axial direction, the buffer element contacts the circuit board.

[0011] In one embodiment, the hardness of the buffer element is less than the hardness of the movable portion.

[0012] In one embodiment, the hardness of the buffer element is less than the hardness of the fixing portion.

[0013] In one embodiment, the hardness of the movable portion is less than the hardness of the fixing portion.

[0014] In one embodiment, the drive assembly includes a horizontal coil and a second magnetic element. The flexible circuit board has a body and a bent portion bent relative to the body. The horizontal coil is disposed on the bent portion, and the second magnetic element is disposed on the movable portion and adjacent to the horizontal coil.

[0015] In one embodiment, the horizontal coil is electrically connected to the bent portion, and the long axis of the horizontal coil is perpendicular to the optical axis.

[0016] In one embodiment, the horizontal coil and the second magnetic element are arranged along the optical axis direction.

[0017] In one embodiment, the drive mechanism further includes a positioning post that passes through the bent portion and the horizontal coil along the optical axis direction.

[0018] In one embodiment, the distance between the positioning post and the second magnetic element is less than the distance between the horizontal coil and the second magnetic element.

[0019] In one embodiment, the fixing portion includes a housing and a base connected to each other, and the positioning post bonds the housing.

[0020] In one embodiment, the fixing portion has a protruding structure extending in the direction of the optical axis. The bent portion is bonded to the protruding structure by a first adhesive, and the body is bonded to the protruding structure by a second adhesive, and the first adhesive and the second adhesive are separated from each other.

[0021] In one embodiment, the driving mechanism further includes a metal part fixed on the bent part, and the positioning post passes through the metal part.

[0022] In one embodiment, the fixing part has a protruding structure extending in the direction of the optical axis, and a clamping block is formed on the protruding structure, wherein the clamping block passes through the bent part along the optical axis.

[0023] In one embodiment, the circuit board is not parallel to the bent part.

[0024] In one embodiment, the body is in a C shape.

[0025] In one embodiment, the horizontal coil is an enameled wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Shows an exploded view of the driving mechanism according to an embodiment of the present invention.

[0027] Figure 2 Shows Figure 1 Another exploded view of the driving mechanism in

[0028] Figure 3 Shows Figure 1 , Figure 2 The perspective view of the driving mechanism after assembly in

[0029] Figure 4 Shows an exploded view of the driving mechanism after removing the housing, the base and the flexible circuit board.

[0030] Figure 5 Shows the perspective view of the driving mechanism after removing the housing, the base and the flexible circuit board.

[0031] Figure 6 Shows a schematic diagram of the relative positional relationship of the flexible circuit board, the base and the first and second magnetic elements after combination.

[0032] Figure 7 Shows an exploded view of the flexible circuit board and the base before combination.

[0033] Figure 8 Shows another perspective exploded view of the flexible circuit board and the base before combination.

[0034] Figure 9 Shows a schematic diagram of the relative positional relationship of the first and second coils and the position sensor.

[0035] Figure 10 Shows a schematic diagram of the position sensor deviating from the center of the first magnetic element in the Z-axis direction.

[0036] Figure 11It shows a cross-sectional view after the aforementioned driving mechanism is removed from the housing.

[0037] Figure 12 It shows another cross-sectional view after the aforementioned driving mechanism is removed from the housing.

[0038] Figure 13 It shows a schematic diagram of a conductive element connecting the inner surface of the body of a flexible circuit board and the side surface of a circuit substrate.

[0039] Figure 14 It shows a schematic diagram of a bonding element connecting a protruding structure of a base and a flexible circuit board.

[0040] The reference numerals are as follows:

[0041] 100: Driving mechanism

[0042] B: Base

[0043] B1: Protruding structure

[0044] B11: Locking block

[0045] C1: Vertical coil

[0046] C2: Horizontal coil

[0047] E1: First electronic component

[0048] E2: Second electronic component

[0049] F: Frame

[0050] F1: Plastic block

[0051] F2: Metal bracket

[0052] FR: Buffer element

[0053] G: Bonding element

[0054] G1: First adhesive

[0055] G2: Second adhesive

[0056] H: Housing

[0057] HS: Position sensor

[0058] J: Magnetic conductive sheet

[0059] K: Conductive element

[0060] L: Guide rod

[0061] LH: Carrier

[0062] LH1: First component

[0063] LH2: Second component

[0064] M1: First magnetic element

[0065] m1: First magnetic unit

[0066] M2: Second magnetic element

[0067] m2: Second magnetic unit

[0068] N: Clamping member

[0069] O: Optical axis

[0070] P: Flexible circuit board

[0071] P1: Body

[0072] P11: Inner surface

[0073] P2: Bending portion

[0074] PC: Circuit board

[0075] PC0: Groove

[0076] PC1: First coil

[0077] PC2: Second coil

[0078] PC3: Side surface

[0079] Q: Metal part

[0080] Q1: Positioning post

[0081] S: Elastic element

[0082] T: Metal sheet

[0083] W: Metal rod Detailed implementation manners

[0084] The following describes the driving mechanism of the embodiments of the present invention. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts that can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific method and are not intended to limit the scope of the present invention.

[0085] Unless otherwise defined, all terms (including technical and scientific terms) used in this patent have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in a commonly used dictionary, should be interpreted as having a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0086] The foregoing and other technical contents, features, and effects of the present utility model will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, or back, etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are for illustration and not for limiting the present utility model.

[0087] First, please refer to Figures 1 to 6 together, in which Figure 1 shows an exploded view of the drive mechanism 100 according to an embodiment of the present utility model, Figure 2 represents Figure 1 another exploded view of the drive mechanism 100 in Figure 3 represents Figure 1 , Figure 2 a three-dimensional view of the drive mechanism 100 after assembly in Figure 4 shows an exploded view of the drive mechanism 100 after removing the housing H, the base B, and the flexible circuit board P, Figure 5 represents a three-dimensional view of the drive mechanism 100 after removing the housing H, the base B, and the flexible circuit board P, Figure 6 shows a schematic diagram of the relative positional relationship of the flexible circuit board P, the base B, and the first and second magnetic elements M1, M2 after combination.

[0088] As Figures 1 to 6 shown, the drive mechanism 100 of this embodiment is, for example, a voice coil motor (VCM), which can be installed inside a mobile phone or other portable electronic device to drive an optical element (such as an optical lens) to move, so as to achieve functions such as auto focusing (AF) or optical image stabilization (OIS).

[0089] The foregoing drive mechanism 100 mainly includes a hollow housing H, a base B, a flexible circuit board P, a carrier LH, a frame F, a clamping member N, a plurality of elastic elements S, and a plurality of metal thin rods W. In this embodiment, the foregoing housing H has a hollow structure and is combined with the base B, and the flexible circuit board P is fixed on the base B, where the housing H and the base B can jointly form a fixed part of the drive mechanism 100.

[0090] In addition, the foregoing carrier LH and frame F are movably received inside the housing H, and an optical element (not shown in the drawings) can be fixed inside the carrier LH, where the foregoing carrier LH and frame F constitute a movable part that can move relative to the foregoing fixed part (housing H and base B).

[0091] Specifically, the aforementioned carrier LH is connected to the frame F through an elastic element S (reed), and the elastic element S is further connected to the base B below through a thin metal rod W, such that the carrier LH and the frame F can be suspended in the driving mechanism 100 in a movable manner. Through the aforementioned mechanism configuration, external light can enter the driving mechanism 100 along the optical axis O (Z-axis direction) of the optical element, and the light will pass through the optical lens and reach an image sensing element (not shown) located below the base B, thereby generating a digital image.

[0092] It should be particularly noted that the aforementioned carrier LH is composed of a first member LH1 and a second member LH2 that are fixedly connected to each other. A vertical coil C1 is respectively provided on opposite sides of the aforementioned second member LH2, and a first magnetic element M1 (such as a magnet) corresponding to the aforementioned vertical coil C1 is provided on opposite sides of the frame F.

[0093] When a current signal is applied to the aforementioned vertical coil C1, the magnetic force generated between the vertical coil C1 and the first magnetic element M1 can drive the carrier LH and the optical element disposed therein to move relative to the frame F along the optical axis O direction (Z-axis direction), thereby achieving the functions of autofocus (AF) or optical image stabilization (OIS).

[0094] In this embodiment, the aforementioned clamping member N is fixed to the top side of the frame F. In addition, two guide rods L extending in the Z-axis direction are clamped between the carrier LH and the clamping member N to stably guide the carrier LH to move relative to the frame F along the optical axis O direction (Z-axis direction).

[0095] On the other hand, it can be seen from Figures 1 to 6 that the flexible printed circuit board P has a C-shaped body P1 and a bent portion P2 bent relative to the body. A horizontal coil C2 is provided on the bottom side of the bent portion P2, and a second magnetic element M2 (such as a magnet) adjacent to the horizontal coil C2 is provided on one side of the frame F. The horizontal coil C2 is electrically connected to the bent portion P2, and the long axis of the horizontal coil C2 is perpendicular to the optical axis O (Z-axis). The horizontal coil C2 and the second magnetic element M2 are arranged along the optical axis O direction.

[0096] In addition, a metal member Q and at least one positioning post Q1 are provided above the bent portion P2. The positioning post Q1 passes through the metal member Q, the bent portion P2, and the horizontal coil C2 along the optical axis O direction to accurately position the horizontal coil C2 on the bent portion P2. The aforementioned horizontal coil C2 is, for example, an enameled wire.

[0097] When a current signal is applied to the aforementioned horizontal coil C2, the frame F and the carrier LH can be driven to move relative to the base B along a first axial direction (Y-axis direction) by the magnetic force generated between the horizontal coil C2 and the second magnetic element M2, thereby enabling the function of optical image stabilization (OIS).

[0098] In addition, as can be seen from Figure 1 and Figure 6 , circuit boards PC that are not parallel to the bent portions P2 are respectively provided on both sides of the body P1 of the flexible printed circuit board P. The thickness of the flexible printed circuit board P is less than that of the circuit board PC, and coils adjacent to the first magnetic element M1 are provided inside the circuit board PC.

[0099] When a current signal is applied to the coil inside the aforementioned circuit board PC, the carrier LH and the frame can be driven to move relative to the base B along a second axial direction (X-axis direction) by the magnetic force generated between the coil and the first magnetic element M1, thereby enabling the function of optical image stabilization (OIS).

[0100] In this embodiment, the aforementioned vertical coil C1, horizontal coil C2, first and second magnetic elements M1, and first and second coils C1, C2 ( Figure 7 and Figure 8 ) serve as a driving assembly of the driving mechanism 100, which can be used to drive the carrier LH to move relative to the frame F. In addition, it can also be used to drive the movable part (the carrier LH and the frame F) to move together relative to the fixed part (the base B and the housing H).

[0101] In addition, as can be seen from Figure 1 and Figure 4 , a first electronic component E1 and a second electronic component E2 are provided on the first member LH1 of the carrier LH. The first electronic component E1 is, for example, a Hall sensing element, which is used to sense the position change of the second magnetic element M2 (such as a magnet) provided on the frame F, and the second electronic component E2 is an integrated circuit component, such as a control IC.

[0102] In this embodiment, the aforementioned frame F is composed of two mutually engaged plastic blocks F1 and a U-shaped metal bracket F2 ( Figure 4 ), wherein the aforementioned first magnetic element M1 is fixed on the metal bracket F2 and is located between the two plastic blocks F1.

[0103] Next, please refer to Figure 7 and Figure 8 and Figure 9 and Figure 10 together, where Figure 7 shows an exploded view of the flexible printed circuit board P and the base B before combination, Figure 8Exploded view of another perspective of the flexible printed circuit board P and the base B before bonding Figure 9 Schematic diagram showing the relative positional relationship of the first and second coils PC1, PC2 and the position sensor HS Figure 10 Schematic diagram showing that the position sensor HS deviates from the center of the first magnetic element M1 in the Z-axis direction

[0104] As shown in No. Figure 7 , Figure 8 , Figure 9 , Figure 10 As shown, the base B of this embodiment is formed with a protruding structure B1 extending in the direction of the Z-axis O, and the protruding structure B1 is formed with at least one engaging block B11( Figure 8 ), and the aforementioned engaging block B11 passes through the bent portion P2 in the Z-axis direction

[0105] Specifically, in the circuit board PC of this embodiment, a first coil PC1 and two second coils PC2 arranged along the Z-axis direction are provided. The first and second coils PC1, PC2 (such as planar coils) at least partially overlap in the Z-axis direction, are electrically connected to the flexible printed circuit board P and are adjacent to the aforementioned first magnetic element M1

[0106] The length of the aforementioned first coil PC1 in the Y-axis direction is greater than the length of the second coil PC2 in the Y-axis direction; in addition, a position sensor HS (such as a Hall sensing element) is provided on the flexible printed circuit board P and is accommodated in a groove PC0 of the circuit board PC, where the position of the position sensor HS is between the two second coils PC2, and is used to sense the movement of the movable part relative to the fixed part in the X-axis direction

[0107] It should be particularly noted that the aforementioned position sensor HS is slightly lower than the center of the first magnetic element M1 in the Z-axis direction, where the position sensor HS and the first magnetic element M1 at least partially overlap in the X-axis direction, and the position sensor HS and the second coil PC2 at least partially overlap in the Y-axis direction

[0108] In addition, the aforementioned second coil PC2 does not protrude from the first coil PC1 in the Y-axis direction, and the position sensor HS and the first coil PC1 do not overlap with each other in the Y-axis direction. In addition, the aforementioned position sensor HS and the first coil PC1 at least partially overlap in the Z-axis direction, and the aforementioned position sensor HS and the second coil PC2 do not overlap with each other in the Z-axis direction

[0109] From Figure 10As can be seen, the foregoing first magnetic element M1 includes a first magnetic unit m1 and a second magnetic unit m2 arranged along the Z-axis direction, wherein the foregoing first magnetic unit m1 and the first coil PC1 at least partially overlap in the X-axis direction, and the foregoing second magnetic unit m2 and the foregoing second coil PC2 at least partially overlap in the X-axis direction.

[0110] In addition, the foregoing second magnetic unit m2 and the position sensor HS at least partially overlap in the X-axis direction, and the foregoing first magnetic unit m1 and the position sensor HS do not overlap with each other in the X-axis direction.

[0111] In this embodiment, the long axis of the first magnetic element M1 is parallel to the Y-axis direction (the first axial direction), and the circuit board PC and the first magnetic element M1 are separated by a distance in the X-axis direction (the second axial direction).

[0112] Please also refer to Figure 11 、 Figure 12 , wherein Figure 11 shows a cross-sectional view of the foregoing drive mechanism 100 after removing the housing H, Figure 12 shows another cross-sectional view of the foregoing drive mechanism 100 after removing the housing H.

[0113] From Figure 11 it can be seen that a metal sheet T is disposed between the first magnetic unit m1 and the second magnetic unit m2, and the magnetic pole directions of the foregoing first magnetic unit m1 and the second magnetic unit m2 are different.

[0114] It should be understood that a magnetic conductive sheet J ( Figure 1 ) is further provided on the base B of this embodiment, wherein a magnetic attraction force can be generated between the magnetic conductive sheet J and the first magnetic element M1, so that the frame F can be stably suspended above the base B.

[0115] In this embodiment, the magnetic permeability of the foregoing magnetic conductive sheet J is higher than that of the metal sheet T, and the second magnetic unit m2 will be located between the metal sheet T and the magnetic conductive sheet J after assembly.

[0116] Next, please refer to Figure 13 , wherein Figure 13 shows a schematic diagram of the conductive element K connecting the inner surface P11 of the main body P1 of the flexible circuit board P and the side surface PC3 of the circuit board PC.

[0117] From Figure 13 it can be seen that a conductive element K (such as solder) is applied to the inner surface P11 of the main body P1 of the flexible circuit board P and the side surface PC3 of the circuit board PC to electrically connect the flexible circuit board P and the circuit board PC, wherein the foregoing inner surface P11 faces the circuit board PC, and the foregoing side surface PC3 is adjacent to the foregoing inner surface P11.

[0118] Please refer to again Figure 14 , in which Figure 14 shows a schematic diagram of a protruding structure B1 of a base B connected to a subsequent element G and a flexible circuit board P.

[0119] From Figure 8 , Figure 14 , it can be seen that the base B has four protruding structures B1 extending in the Z-axis direction. In addition, two subsequent elements G (such as glue) are respectively applied to two of the aforementioned protruding structures B1 ( Figure 8 ), to bond and fix the flexible circuit board P to the base B, where the aforementioned protruding structure B1 does not overlap with the circuit board PC in the X-axis direction. In this embodiment, the aforementioned subsequent element G also contacts the circuit board PC, the protruding structure B1, and the flexible circuit board P ( Figure 14 ), so that the aforementioned three can be firmly joined to each other.

[0120] On the other hand, as Figure 5 shown, at least one buffer element FR (such as rubber or a flexible plastic block) is further provided on the plastic block F1 of the aforementioned frame F. In this way, when the movable part moves to an extreme position relative to the fixed part in the X-axis direction, the aforementioned buffer element FR will contact the circuit board PC to prevent the first magnetic element M1 from directly hitting the circuit board PC and causing damage to its structure.

[0121] In this embodiment, the hardness of the aforementioned buffer element FR is less than the hardness of the plastic block F1 of the frame F and the base B. In addition, the hardness of the aforementioned plastic block F1 is less than the hardness of the aforementioned base B.

[0122] On the other hand, from Figure 12 , it can be seen that the positioning post Q1 passes through the horizontal coil C2, and the distance between the positioning post Q1 and the second magnetic element M2 is less than the distance between the horizontal coil C2 and the second magnetic element M2. In this way, when the frame F moves relative to the base B in the Z-axis direction, the positioning post Q1 will contact the second magnetic element M2, thereby preventing the second magnetic element M2 from directly colliding with the horizontal coil C2 and causing damage to its structure.

[0123] In this embodiment, the top end of the positioning post Q1 can be bonded to the housing H during assembly to improve the overall structural strength and reliability of the driving mechanism 100.

[0124] In addition, from Figure 8 , it can be seen that the bent portion P2 of the flexible circuit board P can be bonded to the top surface of the protruding structure B1 through a first adhesive G1, and the body P1 of the flexible circuit board P can be bonded to the outer side surface of the protruding structure B1 through a second adhesive G2, where the aforementioned first and second adhesives G1, G2 are separated from each other and do not contact each other.

[0125] Based on the above configuration, the carrier LH and the frame F can share the first magnetic element M1, reducing the overall structural size and enabling functions such as autofocus or optical image stabilization. In addition, the arrangement of the first electronic element E1 corresponding to the second magnetic element M2 can also reduce the number of induction magnets provided, achieving the purpose of miniaturization and light weight of the drive mechanism 100. Additionally, by arranging the position sensor HS between the second coils PC2, the crosstalk sensing effect caused by rotation can also be reduced, achieving the purpose of improving sensing accuracy.

[0126] Although the embodiments of the present utility model and their advantages have been disclosed above, it should be understood that those skilled in the art can make changes, substitutions, and modifications without departing from the spirit and scope of the present utility model.

[0127] Furthermore, the protection scope of the present utility model is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future from the disclosed content of the present utility model. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to the present utility model.

[0128] Therefore, the protection scope of the present utility model includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods, and steps. Additionally, each claim constitutes an individual embodiment, and the protection scope of the present utility model also includes the combination of each claim and embodiment.

[0129] Although the present utility model has been disclosed in the above with preferred embodiments, it is not intended to limit the present utility model. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to that defined by the appended claims.

Claims

1. A driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, characterized in that, The driving mechanism includes: A fixed part; A movable part, movably connected to the fixed part, wherein the optical element is disposed on the movable part; and A driving component for driving the movable part to move relative to the fixed part.

2. The drive mechanism according to claim 1, wherein, The driving mechanism further includes a flexible circuit board and a circuit substrate disposed on the fixed part, and the driving component includes a long strip-shaped first magnetic element disposed on the movable part and a first coil and a second coil disposed within the circuit substrate, wherein the circuit substrate is disposed on the flexible circuit board, the long axis of the first magnetic element is parallel to a first axial direction, and the circuit substrate and the first magnetic element are spaced apart by a distance in a second axial direction, wherein the first axial direction, the second axial direction, and the optical axis are perpendicular to each other.

3. The drive mechanism according to claim 2, wherein, The driving mechanism further includes a connecting element, and the fixed part has a protruding structure extending in the direction of the optical axis, wherein the connecting element connects the protruding structure and the flexible circuit board, and the protruding structure and the circuit substrate do not overlap in the second axial direction.

4. The drive mechanism according to claim 3, characterized in that, The connecting element contacts the circuit substrate, the protruding structure, and the flexible circuit board.

5. The drive mechanism according to claim 2, wherein The driving mechanism further includes a buffer element disposed on the movable part, and when the movable part moves relative to the fixed part to a limit position along the second axial direction, the buffer element contacts the circuit substrate.

6. The drive mechanism according to claim 5, characterized in that The hardness of the buffer element is less than the hardness of the movable part.

7. The drive mechanism according to claim 5, characterized in that The hardness of the buffer element is less than the hardness of the fixed part.

8. The drive mechanism according to claim 5, characterized in that, The hardness of the movable part is less than the hardness of the fixed part.

9. The drive mechanism according to claim 2, wherein, The driving component includes a horizontal coil and a second magnetic element, and the flexible circuit board has a body and a bent portion bent relative to the body, wherein the horizontal coil is disposed on the bent portion, and the second magnetic element is disposed on the movable part and is adjacent to the horizontal coil.

10. The drive mechanism according to claim 9, characterized in that, The horizontal coil is electrically connected to the bent portion, and the long axis of the horizontal coil is perpendicular to the optical axis.

11. The drive mechanism according to claim 9, characterized in that, The horizontal coil and the second magnetic element are arranged along the optical axis direction.

12. The drive mechanism according to claim 11, characterized in that, The driving mechanism further includes a positioning post, and the positioning post passes through the bent portion and the horizontal coil along the optical axis direction.

13. The drive mechanism according to claim 12, characterized in that, The distance between the positioning post and the second magnetic element is less than the distance between the horizontal coil and the second magnetic element.

14. The drive mechanism according to claim 12, characterized in that, The fixed part includes a housing and a base connected to each other, and the positioning post bonds the housing.

15. The drive mechanism according to claim 12, characterized in that, The fixed part has a protruding structure extending in the direction of the optical axis, the bent portion is bonded to the protruding structure by a first adhesive, the body is bonded to the protruding structure by a second adhesive, and the first adhesive and the second adhesive are separated from each other.

16. The drive mechanism according to claim 12, wherein, The driving mechanism further includes a metal part fixed to the bent portion, and the positioning post passes through the metal part.

17. The drive mechanism according to claim 12, characterized in that, The fixed part has a protruding structure extending in the direction of the optical axis, and the protruding structure is formed with a clamping block, wherein the clamping block passes through the bent portion along the optical axis direction.

18. The drive mechanism according to claim 9, characterized in that, The circuit substrate is not parallel to the bent portion.

19. The drive mechanism according to claim 9, characterized in that, The body is C-shaped.

20. The drive mechanism according to claim 9, characterized in that, The horizontal coil is an enameled wire.

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