Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

Technical Field

[0001] The utility model relates to a driving mechanism. More specifically, the utility model particularly relates to a driving mechanism for driving an optical element to move. Background Art

[0002] With the development of technology, many current electronic devices (such as smart phones or digital cameras) have the functions of taking pictures or videos. The use of these electronic devices is becoming more and more common, and they are developing towards a convenient, thin and light design direction to provide users with more choices.

[0003] Some electronic devices with the functions of taking pictures or videos are provided with a lens driving module to drive an optical element to move, so as to achieve the functions of autofocusing (AF) and optical image stabilization (OIS). Light can pass through the aforementioned optical element and form an image on a photosensitive element.

[0004] However, how to further miniaturize the lens driving module and improve its stability and reliability has become an important challenge for researchers in this related technical field. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the aforementioned well-known problems, an embodiment of the utility model provides a driving mechanism for driving an optical element to move. The aforementioned driving mechanism mainly includes a fixed part, a movable part and a driving component. In an embodiment, the aforementioned movable part is connected to the aforementioned fixed part, the aforementioned optical element is arranged on the aforementioned movable part, the aforementioned optical element has an optical axis, and the aforementioned driving component is used to drive the aforementioned optical element to move relative to the aforementioned fixed part.

[0007] In an embodiment, the aforementioned driving mechanism further includes a first electronic component, a circuit structure and a wire. The aforementioned movable part includes a first component and a second component that are fixed to each other, and the aforementioned driving component includes a vertical coil. The aforementioned first electronic component and the aforementioned circuit structure are arranged on the aforementioned first component, the aforementioned vertical coil and the aforementioned wire are arranged on the aforementioned second component, and the aforementioned wire is electrically connected to the aforementioned vertical coil and the aforementioned circuit structure.

[0008] In one embodiment, the driving mechanism further includes a first electronic component, a circuit structure, and a wire. The movable part includes a first member and a second member that are fixedly connected to each other, and the driving assembly includes a vertical coil. The first electronic component and the circuit structure are disposed on the first member, the vertical coil and the wire are disposed on the second member, and the wire is electrically connected to the vertical coil and the circuit structure.

[0009] In one embodiment, the first member forms a groove for accommodating the first electronic component, and the depth of the groove is less than the thickness of the first electronic component.

[0010] In one embodiment, the driving mechanism further includes a second electronic component disposed on the first member, and when viewed along the optical axis direction, the first electronic component and the second electronic component at least partially overlap.

[0011] In one embodiment, the first electronic component and the second electronic component are integrated circuit components, and the circuit structure is embedded inside the first member and electrically connected to the first electronic component and the second electronic component.

[0012] In one embodiment, the first electronic component and the second electronic component are strip-shaped, and the long axis directions of the first electronic component and the second electronic component are not parallel to each other.

[0013] In one embodiment, the driving mechanism further includes an elastic element, the movable part further includes a frame, and the driving assembly includes a first magnetic element disposed on the frame and adjacent to the vertical coil. The elastic element is disposed on the first member and connected to the frame.

[0014] In one embodiment, the frame forms a cavity, and when the first member contacts the frame, at least a part of the first electronic component is located in the cavity.

[0015] In one embodiment, the elastic element is electrically connected to the circuit structure, and the material of the elastic element is different from that of the circuit structure.

[0016] In one embodiment, the elastic element is sandwiched between the circuit structure and an external circuit in the optical axis direction.

[0017] In one embodiment, the driving mechanism further includes a thin metal rod electrically connecting the elastic element and a conductive terminal on the fixed part, and the elastic element is a reed.

[0018] In one embodiment, the driving mechanism further includes a guide rod and a hollow clamping member. The guide rod and the clamping member are fixed to the frame, and the guide rod is clamped between the movable part and the clamping member.

[0019] In one embodiment, the driving mechanism further includes two elastic elements, and the movable part includes a polygonal bearing member and a frame. The two elastic elements are disposed on the same side of the bearing member and are movably connected to the bearing member and the frame.

[0020] In one embodiment, the two elastic elements are respectively formed with an elongated elastic structure, and the two elastic structures are adjacent to each other and parallel to each other.

[0021] In one embodiment, the driving mechanism further includes a damping element that connects the two elastic structures.

[0022] In one embodiment, the first member is formed with a first through hole, and the second member is formed with a second through hole for accommodating the optical element. When viewed along the optical axis direction, the first through hole is smaller than the second through hole.

[0023] In one embodiment, the second member is polygonal and has a winding post. An electrical contact of the circuit structure is adjacent to the winding post, and at least a part of the wire is located between the winding post and the electrical contact in the optical axis direction.

[0024] In one embodiment, the second member is formed with a groove for accommodating the wire, and the electrical contact is located between the winding post and the groove in the optical axis direction.

[0025] In one embodiment, the driving mechanism further includes two wires, the second member further has two winding posts, and the driving assembly further includes two vertical coils. The two vertical coils are respectively electrically connected to the circuit structure through the two wires, and when viewed along the optical axis direction, the two winding posts are located on the same side of the second member.

[0026] In one embodiment, the driving mechanism further includes a connecting wire that electrically connects the two vertical coils, and the second member is further formed with a recess structure for accommodating the connecting wire. The bottom surface of the groove and the recess structure are coplanar in the optical axis direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 An exploded view showing a driving mechanism according to an embodiment of the present invention.

[0028] Figure 2 Showing Figure 1 Another exploded view of the driving mechanism in

[0029] Figure 3 Showing Figure 1 、 Figure 2 A perspective view of the assembled driving mechanism in

[0030] Figure 4 Shows an exploded view of the drive mechanism after removing the housing, base, and flexible circuit board.

[0031] Figure 5 Shows a perspective view of the drive mechanism after removing the housing, base, and flexible circuit board.

[0032] Figure 6 Shows a schematic diagram of the relative positional relationship of the flexible circuit board, base, and first and second magnetic elements after combination.

[0033] Figure 7 Shows an exploded view of the flexible circuit board and the base before combination.

[0034] Figure 8 Shows another exploded view of the flexible circuit board and the base before combination from another perspective.

[0035] Figure 9 Shows a schematic diagram of the relative positional relationship of the first and second coils and the position sensor.

[0036] Figure 10 Shows a schematic diagram of the position sensor deviating from the center of the first magnetic element in the Z-axis direction.

[0037] Figure 11 Shows a cross-sectional view of the aforementioned drive mechanism after removing the housing.

[0038] Figure 12 Shows another cross-sectional view of the aforementioned drive mechanism after removing the housing.

[0039] Figure 13 Shows a schematic diagram of the conductive element connecting the inner surface of the body of the flexible circuit board and the side surface of the circuit board.

[0040] Figure 14 Shows a schematic diagram of a connecting element connecting the protruding structure of the base and the flexible circuit board.

[0041] Figure 15 Shows an exploded view of the first and second electronic components, a circuit board, a plurality of metal wires, and the first and second members of the carrier before combination.

[0042] Figure 16 Shows an exploded view of the elastic element and the carrier before combination.

[0043] Figure 17 Shows a schematic diagram of the elastic element connecting the carrier and the frame.

[0044] Figure 18 Shows Figure 17 A schematic diagram of the recess formed on the frame in

[0045] Figure 19Schematic diagram showing that the wires and connecting wires are arranged on the bottom side of the second component.

[0046] Figure 20 Schematic diagram showing the electrical connection points where the wires and connecting wires are electrically connected to the vertical coil and the metal wire.

[0047] The reference numerals are as follows:

[0048] 100: Driving mechanism

[0049] B: Base

[0050] B1: Protruding structure

[0051] B11: Clamping block

[0052] C1: Vertical coil

[0053] C2: Horizontal coil

[0054] E1: First electronic component

[0055] E2: Second electronic component

[0056] E3: Circuit board

[0057] E4: Metal wire

[0058] F: Frame

[0059] F1: Plastic block

[0060] F11: Concave cavity

[0061] F2: Metal bracket

[0062] FR: Buffer element

[0063] G: Adhesive element

[0064] G1: First adhesive

[0065] G2: Second adhesive

[0066] H: Housing

[0067] HS: Position sensor

[0068] J: Magnetic conductive sheet

[0069] K: Conductive element

[0070] L: Guide rod

[0071] LH: Carrier

[0072] LH1: First component

[0073] LH10: First through hole

[0074] LH11: Groove

[0075] LH2: Second component

[0076] LH20: Second through hole

[0077] LH21: Wire winding post

[0078] M1: First magnetic element

[0079] m1: First magnetic unit

[0080] M2: Second magnetic element

[0081] m2: Second magnetic unit

[0082] N: Clamping part

[0083] O: Optical axis

[0084] P: Flexible circuit board

[0085] P1: Body

[0086] P11: Inner surface

[0087] P2: Bent part

[0088] PC: Circuit board

[0089] PC0: Groove

[0090] PC1: First coil

[0091] PC2: Second coil

[0092] PC3: Side surface

[0093] PD1: Electrical contact

[0094] PD2: Electrical contact

[0095] PD3: Electrical contact

[0096] Q: Metal part

[0097] Q1: Positioning post

[0098] R1: Groove

[0099] R2: Concave structure

[0100] RC1: Wire

[0101] RC2: Connecting wire

[0102] S: Elastic element

[0103] S1: Elastic structure

[0104] S2: Elastic structure

[0105] T: Metal sheet

[0106] W: Thin metal rod Specific implementation manners

[0107] The driving mechanism of the embodiments of the present utility model will be described below. However, it can be easily understood that the embodiments of the present utility model provide many suitable utility model concepts that can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present utility model in a specific way and are not intended to limit the scope of the present utility model.

[0108] Unless otherwise defined, all terms (including technical and scientific terms) used in this patent have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It can be understood that these terms, such as those defined in a commonly used dictionary, should be interpreted to have a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0109] The foregoing and other technical contents, features and effects of the present utility model will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are for illustration and not for limiting the present utility model.

[0110] First, please refer to Figures 1 to 6 , wherein Figure 1 shows an exploded view of the driving mechanism 100 according to an embodiment of the present utility model, Figure 2 shows Figure 1 another exploded view of the driving mechanism 100 in Figure 3 shows Figure 1 , Figure 2 a three-dimensional view of the assembled driving mechanism 100 in Figure 4 shows an exploded view of the aforementioned driving mechanism 100 after removing the housing H, the base B and the flexible circuit board P, Figure 5 shows a three-dimensional view of the driving mechanism 100 after removing the housing H, the base B and the flexible circuit board P, Figure 6 shows a schematic diagram of the relative positional relationship of the flexible circuit board P, the base B and the first and second magnetic elements M1, M2 after combination.

[0111] As Figures 1 to 6As shown, the drive mechanism 100 of this embodiment is, for example, a voice coil motor (VCM), which can be installed inside a mobile phone or other portable electronic device to drive an optical element (such as an optical lens) to move, so as to achieve functions such as auto focusing (AF) or optical image stabilization (OIS).

[0112] The aforementioned drive mechanism 100 mainly includes a hollow housing H, a base B, a flexible circuit board P, a carrier LH, a frame F, a clamping member N, a plurality of elastic elements S, and a plurality of metal thin rods W. In this embodiment, the aforementioned housing H has a hollow structure and is combined with the base B, and the flexible circuit board P is fixed on the base B, wherein the housing H and the base B can jointly form a fixed part of the drive mechanism 100.

[0113] In addition, the aforementioned carrier LH and the frame F are movably accommodated in the housing H, and an optical element (not shown in the figure) can be fixed in the carrier LH, wherein the aforementioned carrier LH and the frame F form a movable part that can move relative to the aforementioned fixed part (the housing H and the base B).

[0114] Specifically, the aforementioned carrier LH is connected to the frame F through an elastic element S (reed), and the elastic element S is further connected to the lower base B through a metal thin rod W, so that the carrier LH and the frame F can be suspended in the drive mechanism 100 in a movable manner. Through the aforementioned mechanism configuration, external light can enter the drive mechanism 100 along the optical axis O (Z-axis direction) of the optical element, and the light will pass through the optical lens and reach an image sensing element (not shown) located below the base B, thereby generating a digital image.

[0115] It should be particularly noted that the aforementioned carrier LH is composed of a first member LH1 and a second member LH2 that are fixedly connected to each other. A vertical coil C1 is respectively provided on the opposite sides of the aforementioned second member LH2, and a first magnetic element M1 (such as a magnet) corresponding to the aforementioned vertical coil C1 is provided on the opposite sides of the frame F.

[0116] When a current signal is applied to the aforementioned vertical coil C1, the magnetic force generated between the vertical coil C1 and the aforementioned first magnetic element M1 can be used to drive the carrier LH and the optical element disposed therein to move together relative to the aforementioned frame F along the optical axis O direction (Z-axis direction), thereby achieving the functions of auto focusing (AF) or optical image stabilization (OIS).

[0117] In this embodiment, the aforementioned clamping member N is fixed to the top side of the frame F. In addition, two guide rods L extending in the Z-axis direction are sandwiched between the carrier LH and the clamping member N to stably guide the carrier LH to move relative to the frame F along the optical axis O direction (Z-axis direction).

[0118] On the other hand, it can be seen from Figures 1 to 6 that the flexible printed circuit board P has a C-shaped body P1 and a bent portion P2 bent relative to the body. A horizontal coil C2 is provided on the bottom side of the bent portion P2, and a second magnetic element M2 (such as a magnet) adjacent to the horizontal coil C2 is provided on one side of the frame F. The horizontal coil C2 is electrically connected to the bent portion P2, and the long axis of the horizontal coil C2 is perpendicular to the optical axis O (Z-axis). The horizontal coil C2 and the second magnetic element M2 are arranged along the optical axis O direction.

[0119] In addition, a metal member Q and at least one positioning post Q1 are provided above the bent portion P2. The positioning post Q1 passes through the metal member Q, the bent portion P2, and the horizontal coil C2 along the optical axis O direction to accurately position the horizontal coil C2 on the bent portion P2. The aforementioned horizontal coil C2 is, for example, an enameled wire.

[0120] When a current signal is applied to the aforementioned horizontal coil C2, the magnetic force generated between the horizontal coil C2 and the second magnetic element M2 can drive the frame F and the carrier LH to move together relative to the base B along a first axial direction (Y-axis direction), thereby achieving the function of optical image stabilization (OIS).

[0121] In addition, it can be seen from Figure 1 and Figure 6 that circuit boards PC not parallel to the bent portion P2 are respectively provided on both sides of the body P1 of the flexible printed circuit board P. The thickness of the flexible printed circuit board P is less than the thickness of the circuit board PC, and a coil adjacent to the first magnetic element M1 is provided inside the circuit board PC.

[0122] When a current signal is applied to the coil inside the aforementioned circuit board PC, the magnetic force generated between the coil and the first magnetic element M1 can drive the carrier LH and the frame to move together relative to the base B along a second axial direction (X-axis direction), thereby achieving the function of optical image stabilization (OIS).

[0123] In this embodiment, the aforementioned vertical coil C1, horizontal coil C2, first and second magnetic elements M1, and first and second coils C1, C2 ( Figure 7 and Figure 8)As a driving component of the driving mechanism 100, it can be used to drive the carrier LH to move relative to the frame F. In addition, it can also be used to drive the moving part (the carrier LH and the frame F) to move relative to the fixed part (the base B and the housing H) together.

[0124] In addition, as can be seen from Figure 1 and Figure 4 , a first electronic component E1 and a second electronic component E2 are provided on the first member LH1 of the carrier LH. The first electronic component E1 is, for example, a Hall sensing element for sensing the position change of the second magnetic element M2 (such as a magnet) provided on the frame F, and the second electronic component E2 is an integrated circuit component, such as a control IC.

[0125] In this embodiment, the aforementioned frame F is composed of two plastic blocks F1 that are mutually engaged and a U-shaped metal bracket F2 ( Figure 4 ), where the aforementioned first magnetic element M1 is fixed on the metal bracket F2 and is located between the two plastic blocks F1.

[0126] Next, please refer to Figure 7 and Figure 8 and Figure 9 and Figure 10 together, where Figure 7 shows an exploded view of the aforementioned flexible circuit board P and the base B before combination, Figure 8 shows another perspective exploded view of the flexible circuit board P and the base B before combination, Figure 9 shows a schematic diagram of the relative positional relationship between the first and second coils PC1, PC2 and the position sensor HS, Figure 10 shows a schematic diagram of the position sensor HS deviating from the center of the first magnetic element M1 in the Z-axis direction.

[0127] As shown in Figure 7 and Figure 8 and Figure 9 and Figure 10 , the base B of this embodiment is formed with a protruding structure B1 extending in the direction of the Z-axis O, and the protruding structure B1 is formed with at least one engaging block B11 ( Figure 8 ), where the aforementioned engaging block B11 passes through the bent portion P2 in the Z-axis direction.

[0128] Specifically, a first coil PC1 and two second coils PC2 arranged along the Z-axis direction are provided inside the circuit board PC of this embodiment. The first and second coils PC1, PC2 (such as planar coils) at least partially overlap in the Z-axis direction, are electrically connected to the flexible circuit board P and are adjacent to the aforementioned first magnetic element M1.

[0129] The length of the foregoing first coil PC1 in the Y-axis direction is greater than the length of the second coil PC2 in the Y-axis direction; in addition, a position sensor HS (such as a Hall sensing element) is disposed on the flexible circuit board P and received in a groove PC0 of the circuit substrate PC, wherein the position of the position sensor HS is between the two second coils PC2 for sensing the movement of the movable part relative to the fixed part in the X-axis direction.

[0130] It should be specifically noted that the foregoing position sensor HS is slightly lower than the center of the first magnetic element M1 in the Z-axis direction, wherein the position sensor HS and the first magnetic element M1 at least partially overlap in the X-axis direction, and the position sensor HS and the second coil PC2 at least partially overlap in the Y-axis direction.

[0131] In addition, the foregoing second coil PC2 does not protrude from the first coil PC1 in the Y-axis direction, and the position sensor HS and the first coil PC1 do not overlap with each other in the Y-axis direction. In addition, the position sensor HS and the first coil PC1 at least partially overlap in the Z-axis direction, and the position sensor HS and the second coil PC2 do not overlap with each other in the Z-axis direction.

[0132] From Figure 10 it can be seen that the foregoing first magnetic element M1 includes a first magnetic unit m1 and a second magnetic unit m2 arranged along the Z-axis direction, wherein the first magnetic unit m1 and the first coil PC1 at least partially overlap in the X-axis direction, and the second magnetic unit m2 and the second coil PC2 at least partially overlap in the X-axis direction.

[0133] In addition, the second magnetic unit m2 and the position sensor HS at least partially overlap in the X-axis direction, and the first magnetic unit m1 and the position sensor HS do not overlap with each other in the X-axis direction.

[0134] In this embodiment, the long axis of the first magnetic element M1 is parallel to the Y-axis direction (the first axial direction), and the circuit substrate PC and the first magnetic element M1 are separated by a distance in the X-axis direction (the second axial direction).

[0135] Please also refer to Figure 11 、 Figure 12 wherein Figure 11 shows a cross-sectional view of the foregoing drive mechanism 100 after removing the housing H, Figure 12 shows another cross-sectional view of the foregoing drive mechanism 100 after removing the housing H.

[0136] From Figure 11 it can be seen that a metal sheet T is disposed between the first magnetic unit m1 and the second magnetic unit m2, and the magnetic pole directions of the first magnetic unit m1 and the second magnetic unit m2 are different.

[0137] It should be understood that a magnetic conductive sheet J ( Figure 1 ) is additionally provided on the base B of this embodiment. A magnetic attraction force can be generated between the magnetic conductive sheet J and the first magnetic element M1, so that the frame F can be stably suspended above the base B.

[0138] In this embodiment, the magnetic permeability of the aforementioned magnetic conductive sheet J is higher than that of the metal sheet T, and the second magnetic unit m2 will be located between the metal sheet T and the magnetic conductive sheet J after assembly.

[0139] Next, please refer to Figure 13 , where Figure 13 shows a schematic diagram of the conductive element K connecting the inner surface P11 of the main body P1 of the flexible circuit board P and the side surface PC3 of the circuit board PC.

[0140] As can be seen from Figure 13 , a conductive element K (such as solder) is applied to the inner surface P11 of the main body P1 of the flexible circuit board P and the side surface PC3 of the circuit board PC to electrically connect the flexible circuit board P and the circuit board PC. The aforementioned inner surface P11 faces the circuit board PC, and the aforementioned side surface PC3 is adjacent to the aforementioned inner surface P11.

[0141] Please refer to Figure 14 again, where Figure 14 shows a schematic diagram of a bonding element G connecting the protruding structure B1 of the base B and the flexible circuit board P.

[0142] As can be seen from Figure 8 , Figure 14 , the base B has four protruding structures B1 extending in the Z-axis direction. In addition, two bonding elements G (such as glue) are respectively applied to two of the aforementioned protruding structures B1 ( Figure 8 ) to bond and fix the flexible circuit board P to the base B. The aforementioned protruding structure B1 does not overlap with the circuit board PC in the X-axis direction. In this embodiment, the aforementioned bonding element G also contacts the circuit board PC, the protruding structure B1, and the flexible circuit board P ( Figure 14 ) so that the aforementioned three can be firmly joined to each other.

[0143] On the other hand, as shown in Figure 5 , at least one buffer element FR (such as rubber or a soft plastic block) is additionally provided on the plastic block F1 of the aforementioned frame F. In this way, when the movable part moves to an extreme position relative to the fixed part in the X-axis direction, the aforementioned buffer element FR will contact the circuit board PC to prevent the first magnetic element M1 from directly hitting the circuit board PC and causing damage to its structure.

[0144] In this embodiment, the hardness of the aforementioned buffer element FR is less than that of the plastic block F1 of the frame F and the base B. In addition, the hardness of the aforementioned plastic block F1 is less than that of the aforementioned base B.

[0145] On the other hand, it can be seen from Figure 12 that the positioning post Q1 passes through the horizontal coil C2, and the distance between the positioning post Q1 and the second magnetic element M2 is less than the distance between the horizontal coil C2 and the second magnetic element M2. In this way, when the frame F moves relative to the base B in the Z-axis direction, the positioning post Q1 will contact the second magnetic element M2, thereby preventing the second magnetic element M2 from directly colliding with the horizontal coil C2 and causing damage to its structure.

[0146] In this embodiment, the top end of the positioning post Q1 can be bonded to the housing H during assembly to improve the overall structural strength and reliability of the driving mechanism 100.

[0147] In addition, it can be seen from Figure 8 that the bent portion P2 of the flexible circuit board P can be bonded to the top surface of the protruding structure B1 through a first adhesive G1, and the main body P1 of the flexible circuit board P can be bonded to the outer side surface of the protruding structure B1 through a second adhesive G2, wherein the aforementioned first and second adhesives G1 and G2 are separated from each other and do not contact each other.

[0148] Based on the above configuration, the carrier LH and the frame F can share the first magnetic element M1, reducing the overall structural size and enabling functions such as autofocus or optical image stabilization. In addition, the arrangement of the first electronic component E1 corresponding to the second magnetic element M2 can also reduce the number of induction magnets, achieving the purpose of miniaturization and light weight of the driving mechanism 100. In addition, by setting the position sensor HS between the second coils PC2, the crosstalk sensing effect caused by rotation can also be reduced, achieving the purpose of improving the sensing accuracy.

[0149] Next, please refer to Figure 15 , where Figure 15 shows an exploded view of the first and second electronic components E1 and E2, a circuit board E3, a plurality of metal wires E4, and the first and second members LH1 and LH2 of the carrier LH before combination.

[0150] As Figure 15 shown, the aforementioned first and second electronic components E1 and E2 are, for example, integrated circuit components, which can be arranged on a circuit board E3, and when viewed along the Z-axis direction, the aforementioned first and second electronic components E1 and E2 at least partially overlap.

[0151] Specifically, the aforementioned first and second electronic components E1 and E2 are both elongated, and the long axis directions of the first and second electronic components E1 and E2 are perpendicular to each other; in addition, a groove LH11 is formed on the first member LH1 of the aforementioned carrier LH, and the aforementioned first and second electronic components E1 and E2 and the aforementioned circuit board E3 are disposed in the groove LH11.

[0152] It should be particularly noted that a plurality of metal wires E4 form a circuit structure, and it can be combined inside the first member LH1 of the carrier LH by insert molding; specifically, a part of the metal wires E4 is used to electrically connect the elastic element S and the circuit board E3, and another part of the metal wires E4 is used to electrically connect the vertical coil C1 and the circuit board E3.

[0153] In this embodiment, two winding posts LH21 are formed on the same side of the second member LH2 of the carrier LH, and one end of two wires RC1 ( Figure 19 、 Figure 20 ) is connected to the vertical coil C1 located on the opposite side of the second member LH2, and the other end is wound around the winding post LH21 to electrically connect the aforementioned metal wires E4 (circuit structure).

[0154] In an embodiment, a flexible printed circuit (FPC) can also be used to replace the aforementioned metal wires E4, and it is not limited to what is disclosed in the embodiments of the present invention.

[0155] In addition, as can be seen from Figure 15 , a first through hole LH10 is formed in the center of the aforementioned polygonal first member LH1, and a second through hole LH20 is formed in the center of the aforementioned polygonal second member LH2 to accommodate an optical element, wherein when viewed along the Z-axis direction, the aforementioned first through hole LH10 is smaller than the second through hole LH20.

[0156] Please also refer to Figure 15 、 Figure 16 , wherein Figure 16 shows an exploded view before the elastic element S and the carrier LH are combined.

[0157] From Figure 15 、 Figure 16 , it can be seen that two elastic elements S located on the same side of the carrier LH are respectively formed with an elongated elastic structure S1 and S2, the aforementioned elastic structures S1 and S2 are adjacent to each other and parallel to each other, and a part of the metal wires E4 can be respectively connected to the elastic element S through electrical contact points PD1 and PD2, and the remaining metal wires E4 are electrically connected to the wire RC1 fixed on the winding post LH21 from the bottom side of the carrier LH through the electrical contact point PD3 ( Figure 15 )Figure 19 , Figure 20 ), so that it can be further electrically connected to the aforementioned vertical coil C1 through the wire RC1.

[0158] In one embodiment, a damping element (such as gel) can be applied to the aforementioned elastic structures S1, S2, and the elastic structures S1, S2 are connected to each other through the damping element.

[0159] In one embodiment, the aforementioned electrical contacts PD1, PD2 can be electrically connected to the elastic element S by welding, soldering or conductive adhesive, and the elastic element S can be clamped between the electrical contacts PD1, PD2 of the metal wire E4 and an external circuit (such as an aperture circuit, a shutter circuit or other circuit elements) in the Z-axis direction.

[0160] For example, the aforementioned elastic element S can be a reed containing titanium alloy, and the aforementioned metal wire E4 can contain copper alloy.

[0161] Next, please refer to Figure 17 , Figure 18 , where Figure 17 shows a schematic diagram of the elastic element S connecting the carrier LH and the frame F, Figure 18 shows Figure 17 a schematic diagram of a cavity F11 formed on the frame F in

[0162] As shown in Figure 17 , Figure 18 , it can be found that when observed along the Z-axis direction, a plurality of elastic elements S are arranged on the opposite sides of the carrier LH to movably connect the carrier LH and the frame F. In addition, four metal rods W are electrically connected to the elastic elements S and the conductive terminals (not shown) located on the base B along the Z-axis direction.

[0163] In this embodiment, the aforementioned first and second electronic components E1, E2 are arranged in the groove LH11 of the carrier LH and face the cavity F11 on the plastic block F1 of the frame F. The depth of the groove LH11 can be less than the thickness of the first and second electronic components E1, E2. When the first member LH1 of the carrier LH moves along the -Y axis direction and contacts the plastic block F1 of the frame F, at least a part of the first electronic component E1 or the second electronic component E2 can enter the cavity F11 of the plastic block F1 to prevent the first and second electronic components E1, E2 from directly hitting the plastic block F1 and causing damage to its structure.

[0164] Please refer to Figure 19 , Figure 20 again, where Figure 19 shows a schematic diagram of the wire RC1 and the connection wire RC2 arranged on the bottom side of the second member LH2, Figure 20Schematic diagram showing that wire RC1 and connecting wire RC2 are electrically connected to the electrical contact point PD3 of vertical coil C1 and metal wire E4.

[0165] As Figure 19 , Figure 20 shown, the drive mechanism 100 of this embodiment further includes two wires RC1 and one connecting wire RC2. Among them, the aforementioned wire RC1 is arranged in the groove R1 on the bottom side of the second component LH2, and is used to electrically connect the vertical coil C1 and the electrical contact point PD3 of the metal wire E4. Among them, the aforementioned electrical contact point PD3 is adjacent to the winding post LH21, and a part of the wire is located between the winding post LH21 and the electrical contact point PD3 in the Z-axis direction.

[0166] On the other hand, the aforementioned connecting wire RC2 is arranged in the recessed structure R2 on the bottom side of the second component LH2, and is used to electrically connect the vertical coils C1 located on both sides of the carrier LH.

[0167] Through the aforementioned mechanism design method, the vertical coil C1 can be electrically connected to the first and second electronic components E1 and E2 on the circuit board E3 through the aforementioned wire RC1, connecting wire RC2, and metal wire E4, and a loop can be formed between the aforementioned vertical coil C1 and the first and second electronic components E1 and E2.

[0168] It should be particularly noted that the bottom surfaces of the aforementioned groove R1 and the recessed structure R2 are coplanar in the Z-axis direction, and the position of the aforementioned electrical contact point PD3 in the Z-axis direction is between the groove R1 (or the recessed structure R2) and the winding post LH21. In this way, the thickness dimension of the carrier LH in the Z-axis direction can be greatly reduced, and it is helpful to achieve the miniaturization of the drive mechanism 100.

[0169] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that those skilled in the art can make changes, substitutions, and modifications without departing from the spirit and scope of the present invention.

[0170] In addition, the protection scope of the present invention is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person skilled in the art in the relevant technical field can understand the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future from the disclosed content of the present invention. As long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to the present invention.

[0171] Accordingly, the scope of protection of the present utility model includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present utility model also includes combinations of each claim and embodiment.

[0172] Although the present utility model has been disclosed above with preferred embodiments, it is not intended to limit the present utility model. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present utility model. Therefore, the scope of protection of the present utility model shall be subject to that defined by the appended claims.

Claims

1. A driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, characterized in that, The driving mechanism includes: A fixed part; A movable part movably connected to the fixed part, wherein the optical element is disposed on the movable part; and A driving component for driving the movable part to move relative to the fixed part.

2. The drive mechanism according to claim 1, characterized in that, The driving mechanism further includes a first electronic component, a circuit structure, and a wire. The movable part includes a first member and a second member fixed to each other, and the driving component includes a vertical coil. The first electronic component and the circuit structure are disposed on the first member, the vertical coil and the wire are disposed on the second member, and the wire is electrically connected to the vertical coil and the circuit structure.

3. The drive mechanism according to claim 2, characterized in that, The first member forms a groove for accommodating the first electronic component, and the depth of the groove is less than the thickness of the first electronic component.

4. The drive mechanism according to claim 2, wherein The driving mechanism further includes a second electronic component disposed on the first member, and when viewed along the optical axis direction, the first electronic component and the second electronic component at least partially overlap.

5. The drive mechanism according to claim 4, characterized in that The first electronic component and the second electronic component are integrated circuit components, and the circuit structure is embedded inside the first member and electrically connected to the first electronic component and the second electronic component.

6. The drive mechanism according to claim 4, characterized in that, The first electronic component and the second electronic component are strip-shaped, and the long axis directions of the first electronic component and the second electronic component are not parallel to each other.

7. The drive mechanism according to claim 2, characterized in that The driving mechanism further includes an elastic element. The movable part further includes a frame, and the driving component includes a first magnetic element disposed on the frame and adjacent to the vertical coil. The elastic element is disposed on the first member and connected to the frame.

8. The drive mechanism according to claim 7, characterized in that, The frame forms a cavity, and when the first member contacts the frame, at least a part of the first electronic component is located in the cavity.

9. The drive mechanism according to claim 7, wherein, The elastic element is electrically connected to the circuit structure, and the material of the elastic element is different from that of the circuit structure.

10. The drive mechanism according to claim 7, characterized in that, The elastic element is sandwiched between the circuit structure and an external circuit in the optical axis direction.

11. The drive mechanism according to claim 7, characterized in that, The driving mechanism further includes a thin metal rod electrically connecting the elastic element and a conductive terminal on the fixed part, and the elastic element is a reed.

12. The drive mechanism according to claim 7, characterized in that, The driving mechanism further includes a guide rod and a hollow clamping member. The guide rod and the clamping member are fixed to the frame, and the guide rod is clamped between the movable part and the clamping member.

13. The drive mechanism according to claim 7, characterized in that, The driving mechanism further includes two elastic elements. The movable part includes a polygonal carrier and a frame. The two elastic elements are disposed on the same side of the carrier and movably connected to the carrier and the frame.

14. The drive mechanism according to claim 13, characterized in that, The two elastic elements respectively form an elongated elastic structure, and the two elastic structures are adjacent to each other and parallel to each other.

15. The drive mechanism according to claim 14, characterized in that, The driving mechanism further includes a damping element connecting the two elastic structures.

16. The drive mechanism according to claim 2, wherein The first member forms a first through hole, and the second member forms a second through hole for accommodating the optical element. When viewed along the optical axis direction, the first through hole is smaller than the second through hole.

17. The drive mechanism according to claim 2, wherein, The second member is polygonal and has a winding post. An electrical contact point of the circuit structure is adjacent to the winding post, and at least a part of the wire is located between the winding post and the electrical contact point in the optical axis direction.

18. The drive mechanism according to claim 17, wherein, The second component is formed with a groove for accommodating the wire, wherein the electrical contact is located between the winding post and the groove in the optical axis direction.

19. The drive mechanism according to claim 18, wherein, The driving mechanism further includes two wires, the second component further has two winding posts, and the driving assembly further includes two vertical coils, wherein the two vertical coils are electrically connected to the circuit structure through the two wires respectively, and when viewed along the optical axis direction, the two winding posts are located on the same side of the second component.

20. The drive mechanism according to claim 19, characterized in that, The driving mechanism further includes a connecting wire electrically connecting the two vertical coils, and the second component is further formed with a recess structure for accommodating the connecting wire, wherein the bottom surfaces of the groove and the recess structure are coplanar in the optical axis direction.

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