Heat dissipation structure, display card unit and electronic equipment

Abstract

The utility model relates to a heat dissipation structure, a display card unit and electronic equipment, the heat dissipation structure comprises a circuit board, a DDR assembly and a heat dissipation piece, and the heat dissipation piece is located between the circuit board and the DDR assembly; an air passing channel is formed in the heat dissipation piece, and the air passing channel at least penetrates through the two opposite sides of the heat dissipation piece in the first direction. According to the heat dissipation structure, on the premise that the heat dissipation piece meets structural strength supporting, the heat dissipation effect is improved through the air passing channel which is formed in the heat dissipation piece and penetrates through the two opposite sides in the first direction, and therefore the heat dissipation requirement of the DDR assembly is met.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation of electronic devices, and in particular, to a heat dissipation structure, a graphics card unit, and an electronic device. Background Art

[0002] For GPUs (Graphics Processing Units) packaged by non-HBM processes, heat dissipation of the DDR components on the back of the OAM card is a great challenge. In order to optimize the heat dissipation of the DDR components on the back, in related technologies, a metal heat dissipation plate is provided between the back of the DDR components and the circuit board to dissipate heat from the DDR components. The metal heat dissipation member usually uses a steel plate with a low thermal conductivity, and the metal heat dissipation member is directly attached to the circuit board, resulting in poor heat dissipation effect and unable to meet the heat dissipation requirements of the DDR components. Summary of the Utility Model

[0003] The purpose of the present disclosure is to provide a heat dissipation structure, a graphics card unit, and an electronic device. In this heat dissipation structure, on the premise of meeting the structural strength support, the heat dissipation effect is improved by forming an air passing channel that penetrates the opposite sides in the first direction on the heat dissipation member, so as to meet the heat dissipation requirements of the DDR components.

[0004] To achieve the above purpose, in the first aspect of the present disclosure, a heat dissipation structure is provided, including a circuit board, a DDR component, and a heat dissipation member, where the heat dissipation member is located between the circuit board and the DDR component;

[0005] The heat dissipation member is formed with an air passing channel, and the air passing channel at least penetrates the opposite sides of the heat dissipation member in the first direction.

[0006] Optionally, the heat dissipation member includes a first side facing the circuit board and a second side opposite to the first side and facing the DDR component;

[0007] The air passing channel is formed on the first side and / or the second side of the heat dissipation member.

[0008] Optionally, the air passing channel includes at least two first air ducts extending along the first direction and arranged at intervals in the second direction;

[0009] Wherein, the first direction is perpendicular to the second direction.

[0010] Optionally, the air passing channel further includes at least one second air duct connecting the two first air ducts.

[0011] Optionally, the second air duct extends along the second direction;

[0012] A wind guiding structure is formed at the junction of the first air duct and the second air duct, and the wind guiding structure is configured to guide part of the air in the first air duct to the second air duct or guide the air in the second air duct to the first air duct.

[0013] Optionally, through holes are further formed in the heat dissipation member, and the through holes are used to accommodate connectors connecting the circuit board and the circuit board.

[0014] Optionally, a supporting portion for supporting the circuit board and the DDR component is further formed on the heat dissipation member.

[0015] Optionally, heat dissipation fins are further formed on the heat dissipation member.

[0016] Optionally, at least part of the heat dissipation fins are located in the air passing channel, and the extending direction of the heat dissipation fins is the same as the extending direction of the air passing channel.

[0017] Optionally, the heat dissipation member is integrally formed.

[0018] Optionally, the heat dissipation member is made of aluminum or aluminum alloy.

[0019] In a second aspect of the present disclosure, a graphics card unit is provided, and the graphics card unit includes the heat dissipation structure provided in the first aspect of the present disclosure.

[0020] In a third aspect of the present disclosure, an electronic device is further provided, and the electronic device includes the heat dissipation structure provided in the first aspect of the present disclosure or the graphics card unit provided in the second aspect of the present disclosure.

[0021] Through the above technical solutions, that is, the heat dissipation structure of the present disclosure, including a circuit board, a DDR component, and a heat dissipation member between the circuit board and the DDR component, the heat generated by the DDR component can be transferred to the heat dissipation member. Since through air passing channels are formed on the heat dissipation member through opposite sides in its first direction, air can pass through the heat dissipation member in the first direction along the air passing channels, thereby taking away the heat of the heat dissipation member, strengthening heat flow heat transfer, greatly improving the heat dissipation on the back of the DDR component, and improving its working stability. For the heat dissipation structure of the present disclosure, on the premise of meeting the structural strength support, the heat dissipation effect is improved through the through air passing channels formed on the heat dissipation member through opposite sides in the first direction to meet the heat dissipation requirements of the DDR component.

[0022] Other features and advantages of the present disclosure will be described in detail in the subsequent specific implementation section. Description of the Drawings

[0023] The drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification. Together with the following specific implementation, they are used to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the drawings:

[0024] Figure 1 It is a schematic structural diagram of a heat dissipation structure provided by some embodiments of the present disclosure.

[0025] Figure 2 It is a structural diagram of a heat dissipation component provided by some embodiments of the present disclosure.

[0026] Figure 3 It is a top view of a heat dissipation component provided by some embodiments of the present disclosure, in which the wind is schematically shown blowing from the right side to the left side.

[0027] Figure 4 It is a top view of a heat dissipation component provided by some embodiments of the present disclosure, in which the wind is schematically shown blowing from the left side to the right side.

[0028] Explanation of reference numerals

[0029] 10 - Heat dissipation component; 11 - First side; 12 - Second side; 20 - Circuit board; 30 - DDR component; 40 - Connector; 50 - Connection circuit board;

[0030] 110 - First air duct; 120 - Second air duct; 130 - Air guiding structure; 140 - Through hole; 150 - Support part; 160 - Heat dissipation fins. Detailed implementation manners

[0031] The following will describe in detail the specific implementation manners of the present disclosure with reference to the accompanying drawings. It should be understood that the specific implementation manners described herein are only for explaining and illustrating the present disclosure, and are not used to limit the present disclosure.

[0032] In the present disclosure, unless otherwise stated, the orientation terms such as "upper, lower, left, right" generally refer to the upper, lower, left, and right of the corresponding drawings; "inner, outer" refer to the inner and outer of the contour of the component or structure itself; as shown in the drawings, X represents the first direction; Y represents the second direction. "First, second" etc. are used to distinguish one element from another, and do not have sequence and importance. In addition, in the description with reference to the drawings, the same reference numerals in different drawings represent the same elements.

[0033] To achieve the above object, as Figures 1 to 4 shown, an embodiment of the present disclosure provides a heat dissipation structure, which includes a circuit board 20, a DDR component 30, and a heat dissipation component 10, and the heat dissipation component 10 is located between the circuit board 20 and the DDR component 30; the heat dissipation component 10 is formed with an air passing channel, and the air passing channel at least penetrates the opposite sides of the heat dissipation component 10 in the first direction.

[0034] Through the above technical solution, that is, the heat dissipation structure of the present disclosure, which includes a circuit board 20, a DDR component 30, and a heat dissipation member 10 between the circuit board 20 and the DDR component 30, the heat generated by the DDR component 30 can be transferred to the heat dissipation member 10. Since an air passage is formed through opposite sides of the heat dissipation member 10 in its first direction, air can pass through the heat dissipation member 10 in the first direction along the air passage, thereby taking away the heat of the heat dissipation member 10, strengthening the heat flow heat transfer, and greatly improving the heat dissipation on the back of the DDR component 30 and enhancing its working stability. In the heat dissipation structure of the present disclosure, on the premise of meeting the structural strength support, the heat dissipation member 10 improves the heat dissipation effect through the air passage formed through opposite sides in the first direction to meet the heat dissipation requirements of the DDR component 30.

[0035] It can be understood that the above air passage can penetrate opposite side surfaces of the heat dissipation member 10 in the first direction, so that the air in the first direction can directly pass through the air passage, which can take away the heat transferred from the DDR component 30 to the heat dissipation member 10 faster to meet the heat dissipation requirements of the DDR component 30. Among them, the first direction can be the extending direction of the heat dissipation member 10, that is, it can be the direction with a longer length of the heat dissipation member 10. Such a setting can make the length of the air passage as long as possible, thereby facilitating the convective heat transfer of the heat dissipation member 10.

[0036] In addition, air passages penetrating the side surfaces of the heat dissipation member 10 can also be provided in other directions of the heat dissipation member 10, so that air in different directions can enter the air passage, thereby further improving the heat transfer of the heat dissipation member 10. For example, the other direction can be any direction inclined relative to the first direction in the plane where the heat dissipation member 10 is located, including but not limited to the second direction perpendicular to the first direction.

[0037] The air passage can be provided at any suitable position of the heat dissipation member 10. For example, the air passage can be formed on the surface of the heat dissipation member 10 or inside the heat dissipation member 10. In some embodiments, the heat dissipation member 10 includes a first side surface 11 facing the circuit board 20 and a second side surface 12 opposite to the first side surface 11 and facing the DDR component 30; the air passage is formed on the first side surface 11 and / or the second side surface 12 of the heat dissipation member 10.

[0038] Such as Figure 1 and Figure 2As shown, the heat sink 10 includes a first side surface 11 and a second side surface 12 which are oppositely arranged. Among them, the first side surface 11 is the lower side surface facing the circuit board 20, and the second side surface 12 is the upper side surface facing the DDR component 30. An air passage can be formed on the first side surface 11, that is, an air passage is formed between the heat sink 10 and the circuit board 20; it can also be formed on the second side surface 12, that is, an air passage is formed between the heat sink 10 and the DDR component 30. In both cases, the heat of the heat sink 10 can be taken away by the air passing through the air passage.

[0039] In some preferred embodiments, the air passage is formed on the second side surface 12, which can more directly take away the heat transferred from the DDR component 30.

[0040] In other embodiments, the air passage can also be formed inside the heat sink 10, that is, between the first side surface 11 and the second side surface 12. In this setting mode, the effect of taking away the heat of the heat sink 10 can also be achieved by the air passing through the air passage.

[0041] The air passage can be constructed in any suitable manner and structure. In some embodiments, the air passage includes at least two first air ducts 110 extending along a first direction and spaced apart in a second direction; wherein, the first direction is perpendicular to the second direction.

[0042] Among them, the air passage can include two first air ducts 110 extending along the first direction and spaced apart in the second direction. Both of the two first air ducts 110 penetrate through the opposite side surfaces of the heat sink 10 in the first direction, so that more air can pass through the heat sink 10, improving the heat dissipation effect.

[0043] It should be noted that the projections of the two first air ducts 110 in the plane formed by the first direction and the second direction are on both sides of the projection of the DDR component 30 in the second direction in this plane, without occupying the space in the thickness direction of the heat sink 10, further meeting the requirement of improving the heat dissipation effect under the limit thickness. For example, when the thickness of the heat sink 10 is fixed, the area of the air passage can be maximized as much as possible to increase the air volume passing through, so as to enhance the heat dissipation effect.

[0044] In order to further improve the heat dissipation capacity of the heat sink 10, in other embodiments, the air passage can also include at least one second air duct 120 connecting the two first air ducts 110. Among them, the two ends of the second air duct 120 are respectively connected to the two first air ducts 110, so that the air passing through one first air duct 110 can enter the other first air duct 110 through the second air duct 120, thereby increasing the air passage area and increasing the heat taken away from the heat sink 10.

[0045] It can be understood that there can be multiple second air ducts 120, which are respectively connected between two adjacent first air ducts 110 to improve heat dissipation by increasing the air passing area.

[0046] It should be noted that both ends of the first air duct 110 can be configured with an open structure from the inside to the outside. On the one hand, more air can enter; on the other hand, it is also convenient for the hot air after heat exchange to be discharged as soon as possible on the air outlet side.

[0047] The second air duct 120 can be constructed in any suitable way. In some embodiments, the second air duct 120 extends along the second direction; and a wind guiding structure 130 is formed at the connection of the first air duct 110 and the second air duct 120. The wind guiding structure 130 is configured to be able to guide part of the air in the first air duct 110 to the second air duct 120 or guide the air in the second air duct 120 to the first air duct 110. Among them, the wind guiding structure 130 can divert part of the passing air in one first air duct 110 and guide it into the air inlet end of the second air duct 120 connected thereto, for taking away the heat of the heat dissipation member 10 at the corresponding part of the second air duct 120. At the same time, the wind guiding structure 130 can also introduce the passing air in the second air duct 120 into the air outlet end, and mix it with the passing air in another first air duct 110 and then discharge it from the air outlet of the first air duct 110, which is convenient for guiding the flow of air in the first air duct 110 and the second air duct 120.

[0048] Among them, the wind guiding structure 130 can be constructed in any suitable way. For example, it can be a wind guiding plate arranged obliquely at the connection of the first air duct 110 and the second air duct 120. The wind guiding plate is arranged obliquely at a certain angle with the air inlet direction or the air outlet direction. For example, the included angle between the extending direction of the wind guiding plate and the air inlet direction or the air outlet direction is between 30 - 60°, and it can be 30°, 45° or 60°. It can be arranged according to the implementation needs and positions, which will not be elaborated here.

[0049] In addition, the wind guiding structure 130 can be a plurality of ribs arranged at the connection of the first air duct 110 and the second air duct 120, used to guide the passing air in different directions at this place. For example, the incoming air in the first air duct 110 can be respectively introduced into the first air duct 110 and the second air duct 120. Or, the passing air in the second air duct 120 is introduced into the first air duct 110 at its air outlet end, that is, the wind guiding structure 130 can be any suitable structure that can achieve the above guiding function, and the present disclosure does not make specific limitations.

[0050] The circuit board 20 needs to be electrically connected to the DDR component 30 on the other side of the heat sink 10. Generally, the connection between the two needs to be achieved through an electrical connector 40. In some embodiments, a through hole 140 for the connector 40 to pass through may be formed on the heat sink 10. The size of the through hole 140 may be adapted to the size of the connector 40. For example, there may be two through holes 140, which are arranged at intervals in the first direction and are respectively used for the two connectors 40 to pass through.

[0051] It should be noted that the DDR component 30 of the present disclosure may be fixedly connected to a connection circuit board 50 provided on the side of the heat sink 10 away from the circuit board 20. That is, after the connector 40 passes through the through hole 140 of the heat sink 10, it is respectively connected to the circuit board 20 and the connection circuit board 50. The connection circuit board 50 is used to mount the DDR component 30.

[0052] In some embodiments, a support portion 150 for supporting the circuit board 20 and the DDR component 30 is further formed on the heat sink 10. The heat sink 10 is not only used for heat dissipation, but also needs to play a role in supporting the DDR component 30. Therefore, after a wind passage is formed on the heat sink 10 to improve the heat dissipation effect, the support strength requirements are also needed. Therefore, the heat sink 10 is further formed with a support portion 150 that supports between the DDR component 30 and the circuit board 20. To prevent the heat sink 10 from deforming and affecting the electrical connection, or squeezing the wind passage due to deformation and affecting the heat dissipation effect. It can be understood that the support portion 150 can be constructed in any suitable structure. For example, it can be a plurality of convex structures formed on the heat sink 10, and its thickness just meets the gap between the DDR component 30 and the circuit board 20 to form a support.

[0053] In order to further improve the heat dissipation effect of the heat sink 10, in some other embodiments, heat dissipation fins 160 are further formed on the heat sink 10. The heat dissipation fins 160 can further increase the heat dissipation area and greatly improve the heat dissipation on the back of the DDR component 30.

[0054] The heat dissipation fins 160 can be constructed in a suitable manner. In some embodiments, at least part of the heat dissipation fins 160 are located in the wind passage, and the extending direction of the heat dissipation fins 160 is the same as the extending direction of the wind passage. On the one hand, it can increase the heat dissipation area of the heat sink 10. On the other hand, the heat of the heat dissipation fins 160 can be directly taken away by the wind in the wind passage. The heat dissipation fins 160 can extend along the length direction of the wind passage, and can greatly improve the heat dissipation with as little influence on the wind flow as possible.

[0055] The heat sink 10 can be manufactured in any suitable manner. In some embodiments, the heat sink 10 is integrally formed. Among them, the heat sink 10 can be integrally formed by stamping or casting. Under the condition of meeting the use requirements, the manufacturing process is simplified as much as possible to reduce costs.

[0056] In the related art, the heat sink 10 is made of ordinary cold-rolled steel plate, and its thermal conductivity is only 16.2 W / m·K. In order to improve the heat dissipation capacity of the heat sink 10. In some embodiments, the heat sink 10 can be made of aluminum or aluminum alloy. Among them, the heat sink 10 can be made of die-cast aluminum or aluminum alloy, and its thermal conductivity can reach 90 W / m·K, which is much better than the heat sink 10 made of cold-rolled steel plate in the related art and improves the heat dissipation effect.

[0057] As Figure 3 shown, in one embodiment, the structures of the first air duct 110, the second air duct 120, the air guiding structure 130 and the heat dissipation fins 160 are formed on the second side 12 of the heat sink 10 as shown in the figure. When the air flow blows from the right to the left, the air enters from the right ports of the two first air ducts 110. Among them, under the action of the air guiding structure 130 at the connection between the upper part of the first air duct 110 and the upper part of the second air duct 120, part of the air is guided to the upper end of the second air duct 120, and the other part continues to be discharged from the first air duct 110. The air introduced into the second air duct 120 converges with the air flow of the lower first air duct 110 at the lower end and is discharged from the left end outlet of the first air duct 110, so that the heat dissipation of the heat sink 10 can be realized.

[0058] As Figure 4 shown, when the air flow blows from the left to the right, the air enters from the left ports of the two first air ducts 110. Among them, under the action of the air guiding structure 130 at the connection between the lower part of the first air duct 110 and the lower part of the second air duct 120, part of the air is guided to the lower end of the second air duct 120 and enters the second air duct 120, and the other part continues to be discharged from the first air duct 110. The air introduced into the second air duct 120 converges with the air flow of the upper first air duct 110 at the upper end and is discharged from the right end outlet of the first air duct 110, so that the heat dissipation of the heat sink 10 can be realized.

[0059] As Figure 3 and Figure 4 shown, it should be noted that the heat dissipation fins 160 are distributed in the first air duct 110 and the second air duct 120 and extend along the length direction of the air duct. On the premise of further increasing heat dissipation, the heat dissipation area can also be increased.

[0060] Embodiments of the present disclosure provide a graphics card unit. The graphics card unit includes the above-mentioned heat dissipation structure. Therefore, the graphics card unit also has all the advantages brought by the above-mentioned heat dissipation structure, which will not be elaborated here. Among them, the above-mentioned heat dissipation structure can be used in the OAM card of the graphics card unit for dissipating heat from the DDR component 30 on the back of the OAM card.

[0061] Embodiments of the present disclosure also provide an electronic device. The electronic device includes the heat dissipation structure provided in the above embodiments or the electronic device includes the graphics card unit provided in the above embodiments. Therefore, the electronic device also has the advantages of the above heat dissipation structure or graphics card unit, which will not be elaborated one by one here.

[0062] It should be noted that the electronic device can be a device such as a computer, a server, a service station, etc. that requires the above heat dissipation structure or the above graphics card unit. The present disclosure does not make specific limitations.

[0063] Compared with the related art, in the heat dissipation structure, graphics card unit and electronic device of the present disclosure, an air passage is formed through opposite sides in the first direction on the heat dissipation member 10 between the circuit board 20 and the DDR component 30, so that air can pass through the heat dissipation member 10 in the first direction along the air passage, thereby taking away the heat of the heat dissipation member 10, strengthening the heat flow heat transfer, greatly improving the heat dissipation on the back of the DDR component 30, and improving its working stability. On the premise of meeting the structural strength support, the heat dissipation structure of the present disclosure improves the heat dissipation effect through the air passage formed through opposite sides in the first direction on the heat dissipation member 10 to meet the heat dissipation requirements of the DDR component 30.

[0064] The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

[0065] In addition, it should be noted that, in the case of no contradiction, the various specific technical features described in the above specific embodiments can be combined in any suitable manner. To avoid unnecessary repetition, the present disclosure does not separately describe various possible combination methods.

[0066] In addition, any combination can be made between various different embodiments of the present disclosure as long as it does not violate the idea of the present disclosure, and it should also be regarded as the content disclosed by the present disclosure.

Claims

1. A heat dissipation structure, characterized in that, It includes a circuit board, a DDR component and a heat sink, and the heat sink is located between the circuit board and the DDR component; The heat sink is formed with an air passage, and the air passage penetrates at least opposite sides of the heat sink in a first direction.

2. The heat dissipation structure according to claim 1, characterized in that, The heat sink includes a first side facing the circuit board and a second side opposite to the first side and facing the DDR component; The air passage is formed on the first side and / or the second side of the heat sink.

3. The heat dissipation structure according to claim 1, characterized in that The air passage includes at least two first air ducts extending along the first direction and arranged at intervals in a second direction; Wherein, the first direction is perpendicular to the second direction.

4. The heat dissipation structure according to claim 3, characterized in that, The air passage further includes at least one second air duct connecting the two first air ducts.

5. The heat dissipation structure according to claim 4, characterized in that, The second air duct extends along the second direction; A wind guiding structure is formed at the junction of the first air duct and the second air duct, and the wind guiding structure is configured to be able to guide part of the air in the first air duct to the second air duct or guide the air in the second air duct to the first air duct.

6. The heat dissipation structure according to claim 1, characterized in that, A through hole is further formed on the heat sink, and the through hole is used to accommodate a connector connecting the circuit board.

7. The heat dissipation structure according to claim 1, wherein, A supporting portion for supporting the circuit board and the DDR component is further formed on the heat sink.

8. The heat dissipation structure according to any one of claims 1-7, characterized in that, The heat sink is further formed with heat dissipation fins.

9. The heat dissipation structure according to claim 8, wherein, At least part of the heat dissipation fins are located in the air passage, and the extending direction of the heat dissipation fins is consistent with the extending direction of the air passage.

10. The heat dissipation structure according to claim 8, wherein, The heat sink is integrally formed.

11. The heat dissipation structure according to claim 1, wherein The heat sink is made of aluminum or aluminum alloy.

12. A graphics card unit, characterized in that, The graphics card unit includes the heat dissipation structure according to any one of claims 1-11.

13. An electronic device, characterized in that, The electronic device includes the heat dissipation structure according to any one of claims 1-11 or the graphics card unit according to claim 12.

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