Processing structure for special-shaped nano graph
By processing the profiling groove on the standard mask plate and fixing the processing parts with optical glue, nanographic processing is directly carried out in the profiling groove, the problems of high cost of special-shaped nanograph formation and low yield are solved, and efficient and low-cost nanographic processing is achieved.
Patent Information
- Application Number
- CN202422178463.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-05
AI Technical Summary
In the prior art, the processing cost of special-shaped nanopatterned is high and the yield is low. Especially when using the 6025 mask plate, the cutting process is prone to damage the nanopatterned, resulting in a high scrap rate.
The combined structure of the machining parts and the standard mask plate is adopted. The machining parts are in a similar shape to the contour groove. The special-shaped nanopatterned patterns are directly processed on the standard mask plate, fixed by optical adhesive bonding, and nanopatterned processing is carried out in the contour groove. After completion, it is directly separated to avoid cutting damage.
It improves the yield rate of special-shaped nanographics, reduces production costs, simplifies processing processes, and improves production efficiency.
Smart Images
Figure CN223140729U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of wafer nano-pattern processing, and particularly relates to a processing structure for special-shaped nano-patterns. Background Art
[0002] Mass production of nano-patterns is only suitable for 6025 masks. The size of the 6025 standard mask is 6 inches * 6 inches * 0.25 inches, and it is not suitable for processing other sizes such as wafers and chips. Although there are also devices that can meet the processing requirements of other sizes, their production efficiency is low, production defects are not easy to control, and the processing cost is extremely high.
[0003] In the related art, mass production of special-shaped nano-patterns usually involves first processing special-shaped nano-patterns on a 6025 mask, and then cutting the processed nano-patterns so that the size of the nano-patterns meets the usage requirements. However, the nano-patterns are easily damaged during the cutting process, resulting in scrap and extremely high costs. Summary of the Utility Model
[0004] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a processing structure for special-shaped nano-patterns, which can reduce the production cost of a mask plate with special-shaped nano-patterns, has high processing efficiency, and high yield.
[0005] According to an embodiment of the utility model, the processing structure for special-shaped nano-patterns includes:
[0006] A workpiece;
[0007] A standard mask plate, having a processing surface, wherein the processing surface is provided with a profiling groove, and the profiling groove is similar in shape to the workpiece;
[0008] Wherein, the workpiece can be placed in the profiling groove in a fitting manner, and the workpiece is configured such that the tolerance between the top surface of the workpiece and the processing surface in the depth direction of the profiling groove is X, -0.1μm ≤ X ≤ 0.1μm.
[0009] According to an embodiment of the utility model, the processing structure for special-shaped nano-patterns has at least the following beneficial effects: First, a workpiece corresponding to the size of the special-shaped nano-pattern is separately processed, and a profiling groove similar in shape to the workpiece is processed on the standard mask plate. When processing is required, the workpiece is directly placed in the profiling groove, and nano-patterns are processed in the area where the top surface of the workpiece is located. After processing, the workpiece can be taken out, and the required special-shaped nano-patterns can be obtained, greatly improving the yield of the special-shaped nano-patterns and reducing the production cost.
[0010] According to some embodiments of the utility model, the processing surface is provided with a disassembly groove communicating with the profiling groove.
[0011] According to some embodiments of the present utility model, the PV value of the concave surface profile of the profiling groove is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
[0012] According to some embodiments of the present utility model, the roughness of the concave surface of the profiling groove is 0.3 nm.
[0013] According to some embodiments of the present utility model, the PV value of the top surface profile of the workpiece is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
[0014] According to some embodiments of the present utility model, the roughness of the top surface of the workpiece is 0.3 nm.
[0015] According to some embodiments of the present utility model, the PV value of the bottom surface profile of the workpiece is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
[0016] According to some embodiments of the present utility model, the roughness of the bottom surface of the workpiece is 0.3 nm.
[0017] According to some embodiments of the present utility model, the standard mask is a 6025 standard mask.
[0018] According to some embodiments of the present utility model, the standard mask is detachably connected to the workpiece.
[0019] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present utility model. Description of the Drawings
[0020] The following further describes the present utility model in conjunction with the drawings and embodiments, where:
[0021] Figure 1 is a schematic structural diagram of a processing structure for special-shaped nano-patterns according to an embodiment of the present utility model;
[0022] Figure 2 is a side view schematic diagram of a processing structure for special-shaped nano-patterns according to an embodiment of the present utility model.
[0023] Reference Numerals in the Drawings:
[0024] Standard mask 100; Processing surface 110; Profiling groove 120; Dismantling groove 130. Detailed Embodiments
[0025] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.
[0026] In the description of the present utility model, it should be understood that with respect to the orientation description, such as the upper and lower directions, the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.
[0027] In the description of the present utility model, "several" refers to one or more, and "multiple" refers to two or more. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.
[0028] In the description of the present utility model, unless otherwise clearly defined, terms such as "set", "installed", and "connected" should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.
[0029] In the related art, the processing flow of the special-shaped nano-pattern is as follows: A 6025 mask plate with conventional dimensions, or a mask plate with other dimensions, is used to machine a special-shaped nano-pattern on the 6025 mask plate. After the processing is completed, the redundant area is cut off, and the area mainly with the special-shaped nano-pattern is retained. However, during the cutting process, the vibration and stress during cutting will affect the area of the nano-pattern, and defective products are likely to be produced. Moreover, the processing cost of the nano-pattern is very expensive, resulting in a very high production cost of the special-shaped nano-pattern.
[0030] Refer to Figure 1 And Figure 2As shown in the figure, a processing structure for special-shaped nano-patterns according to an embodiment of the present utility model includes: a workpiece and a standard mask plate 100. The shape of the workpiece is consistent with the required mask shape. During the processing of nano-patterns, the processing will be concentrated within the workpiece. The standard mask plate 100 is a mask plate with a standard size, such as the 6025 size. The standard mask plate 100 has a processing surface 110, and the processing surface 110 is provided with a profiling groove 120. The profiling groove 120 is similar in shape to the workpiece. The profiling groove 120 is used to place the workpiece and fix the workpiece. Among them, the workpiece can be placed in the profiling groove 120 in a fitting manner. The workpiece is configured such that the tolerance between the top surface of the workpiece and the processing surface 110 in the groove depth direction of the profiling groove 120 is X, and -0.1μm ≤ X ≤ 0.1μm. In the processing structure for special-shaped nano-patterns of this embodiment, the workpiece is installed in the standard mask plate 100 with a standard size. By using the standard mask plate 100, special-shaped nano-patterns are processed on a conventional mass production device. The workpiece can be directly separated from the standard mask plate 100 to obtain a mask plate with special-shaped nano-patterns, reducing the interference of cutting, having a higher yield rate, and a lower production cost.
[0031] In this embodiment, the workpiece is made using a standard-sized quartz mask plate, such as a Q6025 quartz mask plate. After processing, if the finished product has no defects such as cracks, it is regarded as the required workpiece, and then the workpiece is further polished and buffed to meet the usage requirements. Among them, the workpiece can be circular, or a rectangle with a smaller size, or triangular, or other shapes. In the present utility model, the shape of the workpiece is not restricted, as long as the size of the workpiece is smaller than the size of the standard mask plate and can be completely processed on the processing surface 110 of the standard mask plate 100.
[0032] The standard mask plate 100 is also made using a standard-sized quartz mask plate, such as the 6025 standard size. Theoretically, it can also be standard sizes such as 6012 and 5009. And a profiling groove 120 is processed on the processing surface 110 of the standard mask plate 100, and the outer contour of the standard mask plate 100 is not processed to ensure that the standard mask plate 100 can be smoothly installed in the corresponding processing equipment for processing. After rough machining of the profiling groove 120, further polishing and buffing are carried out so that when the workpiece is placed in the profiling groove 120, the surface of the workpiece is not easily worn by the inner peripheral surface of the profiling groove 120, improving the surface quality of the workpiece. Among them, when the workpiece is placed in the profiling groove 120, the inner peripheral wall of the profiling groove 120 can be attached to the outer peripheral wall of the workpiece to completely fix the workpiece, improving the stability of the workpiece during production and the processing quality of the workpiece.
[0033] Among them, when the workpiece is installed on the standard mask 100, the photoresist between the workpiece and the standard mask 100 is bonded together. Photoresist refers to the process of adsorbing the surfaces of two clean, smooth and conformable optical parts together with a little pressure without using an adhesive. After connection, the connection between the workpiece and the standard mask 100 is more reliable, facilitating the processing of the workpiece within the standard mask 100. Moreover, after processing is completed, the workpiece can also be directly separated from the standard mask 100 to obtain a shaped workpiece with a shaped nano-pattern. The production of the shaped workpiece is more convenient and has a lower cost. Among them, the connection method between the workpiece and the standard mask 100 can also be film pasting, bonding, self-adsorption, gluing, etc.
[0034] Among them, when the workpiece is installed in the profiling groove 120, the tolerance between the upper surface of the workpiece and the processing surface 110 does not exceed 1 μm, such that the upper surface of the workpiece and the processing surface 110 can be basically regarded as the same surface, facilitating the processing of the upper surface of the workpiece with the processing surface 110 as the reference, and producing a nano-pattern with higher precision on the upper surface of the workpiece.
[0035] It should be understood that the workpiece corresponding to the size of the shaped nano-pattern is first processed separately, and a profiling groove 120 similar to the workpiece is processed on the standard mask 100. When processing is required, the workpiece is directly placed in the profiling groove 120, and nano-pattern processing is performed within the area where the top surface of the workpiece is located. After processing is completed, the workpiece can be taken out, and the required shaped nano-pattern can be obtained, greatly improving the yield rate of the shaped nano-pattern and reducing the production cost.
[0036] Refer to Figure 1 And Figure 2 As shown, in some specific embodiments of the present invention, the processing surface 110 is provided with a disassembly groove 130 communicating with the profiling groove 120.
[0037] It should be understood that the user can take out the workpiece in the profiling groove 120 through the disassembly groove 130, and the separation of the workpiece from the profiling groove 120 is more convenient. In this embodiment, the profiling groove 120 is circular, the disassembly groove 130 is rectangular, the inner peripheral wall of the disassembly groove 130 communicates with the inner peripheral wall of the profiling groove 120, and the depth of the disassembly groove 130 is greater than the depth of the profiling groove 120, facilitating the removal of the workpiece from the bottom of the workpiece. Among them, the number of disassembly grooves 130 is two and is axially symmetrically distributed about the center of the profiling groove 120. The number of disassembly grooves 130 can also be three or more.
[0038] In some specific embodiments of the present invention, the PV value of the concave surface profile of the profiling groove 120 is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
[0039] In this embodiment, the inner circumferential surface of the profiling groove 120 is polished so that the PV value of the concave surface profile of the profiling groove 120 is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm. The specific polishing methods include: resin polishing, wool wheel polishing, small grinding head polishing, water jet polishing, ion beam polishing, etc.
[0040] After the concave surface of the profiling groove 120 is polished, the contact between the workpiece and the profiling part is not likely to cause friction, and the workpiece is more easily photo-cemented into the profiling groove 120. Among them, the concave surface of the profiling groove 120 includes the bottom surface of the profiling groove 120 and the inner circumferential surface surrounding the bottom surface.
[0041] Refer to Figure 1 As shown, in some specific embodiments of the present utility model, the roughness of the concave surface of the profiling groove 120 is 0.3 nm.
[0042] It should be understood that by controlling the roughness of the concave surface of the profiling groove 120, the friction between the concave surface of the profiling groove 120 and the surface of the workpiece is lower, which is beneficial to protecting the integrity of the workpiece surface.
[0043] In some specific embodiments of the present utility model, the PV value of the top surface profile of the workpiece is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
[0044] Refer to Figure 1 As shown, in some specific embodiments of the present utility model, the PV value of the bottom surface profile of the workpiece is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
[0045] It should be understood that both the top surface and the bottom surface of the workpiece are polished. The specific polishing methods can include: rough polishing, fine polishing, ring polishing, small grinding head polishing, magnetorheological polishing, ion beam polishing and other polishing processes. After the workpiece is polished, it meets the surface profile requirements.
[0046] Among them, the workpiece can be first machined into the outer shape by CNC and then polished, or it can be polished first and then the outer shape is machined.
[0047] In some specific embodiments of the present utility model, the roughness of the top surface of the workpiece is 0.3 nm.
[0048] In some specific embodiments of the present utility model, the roughness of the bottom surface of the workpiece is 0.3 nm.
[0049] It should be understood that by controlling the roughness of the top surface and the bottom surface of the workpiece, the friction between the top surface and the bottom surface of the workpiece and the concave surface of the profiling groove 120 is lower, which is beneficial to protecting the integrity of the workpiece surface and avoiding scratches.
[0050] Referring to Figure 1 and Figure 2 As shown, in some specific embodiments of the present utility model, the standard mask 100 is detachably connected to the workpiece to be processed.
[0051] It should be understood that after the workpiece to be processed is processed, the workpiece to be processed can be directly detached from the standard mask 100, and the workpiece to be processed is more easily taken out from the standard mask 100, so as to directly obtain a shaped workpiece with a shaped nano-pattern, and the manufacturing cost of the workpiece to be processed is lower.
[0052] In this embodiment, when the workpiece to be processed is installed on the standard mask 100, the workpiece to be processed and the standard mask 100 are installed as a whole. The workpiece to be processed and the standard mask 100 can be directly detached, or under specific working conditions, the workpiece to be processed and the standard mask 100 can be detached.
[0053] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments, and various changes can be made without departing from the gist of the present utility model within the scope of knowledge possessed by those of ordinary skill in the art to which the present utility model pertains.
Claims
1. A processing structure for special-shaped nano-graphs, characterized in that Including: Workpiece to be processed; Standard mask plate, having a processing surface, wherein the processing surface is provided with a profiling groove, and the profiling groove is similar in shape to the workpiece to be processed; Wherein, the workpiece to be processed can be placed in the profiling groove in a fitting manner, and the workpiece to be processed is configured such that the tolerance between the top surface of the workpiece to be processed and the processing surface in the groove depth direction of the profiling groove is X, -0.1 μm ≤ X ≤ 0.1 μm.
2. The processing structure for the special-shaped nano-pattern according to claim 1, wherein: The processing surface is provided with a disassembly groove communicating with the profiling groove.
3. The processing structure for irregular nano-patterns according to claim 1, wherein: The PV value of the concave surface profile of the profiling groove is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
4. The processing structure for irregular nano-patterns according to claim 1, wherein: The roughness of the concave surface of the profiling groove is 0.3 nm.
5. The processing structure for the shaped nano-pattern according to claim 1, wherein: The PV value of the top surface profile of the workpiece to be processed is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
6. The processing structure for the special-shaped nano-pattern according to claim 1, wherein: The roughness of the top surface of the workpiece to be processed is 0.3 nm.
7. The processing structure for irregular nano-patterns according to claim 1, characterized in that: The PV value of the bottom surface profile of the workpiece to be processed is 1 / 6 wavelength - 1 / 10 wavelength, and the wavelength is 632.8 nm.
8. The processing structure for special-shaped nano-patterns according to claim 1, characterized in that: The roughness of the bottom surface of the workpiece to be processed is 0.3 nm.
9. The processing structure for shaped nano-patterns according to claim 1, characterized in that: The standard mask plate is a 6025 standard mask template.
10. The processing structure for irregular nano-patterns according to claim 1, wherein: The standard mask plate is detachably connected to the workpiece to be processed.