Wireless charging module and wireless charging device

Abstract

The embodiment of the utility model discloses a wireless charging module and a wireless charging device, the wireless charging module comprises a shell, a heat dissipation assembly, a coil assembly, a circuit board and a fan, and the shell is provided with an air inlet and an air outlet; the heat dissipation assembly is arranged in the shell, the shell is divided into a first space and a second space by the heat dissipation assembly, the heat dissipation assembly is provided with a heat dissipation air channel, the first end of the heat dissipation air channel communicates with the air outlet, and the air inlet communicates with the second space; the coil assembly is arranged in the first space and is connected with the heat dissipation assembly; the circuit board is arranged in the second space; the fan is arranged in the second space, an air suction opening of the fan communicates with the second space, and an air blowing opening of the fan communicates with the second end of the heat dissipation air channel. As the air inlet duct and the air outlet duct of the fan are relatively independent, when the fan rotates, air outlet and air inlet of the fan basically do not interfere with each other, hot air exhausted by the fan is prevented from flowing to the air inlet as much as possible, and the heat dissipation efficiency of the wireless charging module is improved.

Description

Technical Field

[0001] The present application relates to the field of wireless charging devices, and in particular to a wireless charging module and a wireless charging device. Background Art

[0002] Wireless chargers can charge electronic devices wirelessly, so there is no need to carry data cables, which is more convenient to use. Wireless chargers generate heat when charging, which will affect the speed of wireless charging. In related technologies, in order to improve the heat dissipation effect of wireless chargers, fans are usually set in wireless chargers. Fans can speed up the flow of air, thereby taking away the heat of wireless chargers.

[0003] However, due to the unreasonable air duct settings of some wireless chargers, the air outlet and air inlet of the fan will affect each other, causing hot air backflow, resulting in low heat dissipation efficiency. Utility Model Content

[0004] The embodiments of the present application provide a wireless charging module and a wireless charging device, which can reduce the interference between the air outlet and the air inlet of the fan and improve the heat dissipation efficiency.

[0005] In a first aspect, an embodiment of the present application provides a wireless charging module, which includes a shell, a heat dissipation component, a coil component, a circuit board and a fan, wherein the shell has an air inlet and an air outlet; the heat dissipation component is arranged in the shell, and the heat dissipation component divides the shell into a first space and a second space, and the heat dissipation component has a heat dissipation duct, the first end of the heat dissipation duct is connected to the air outlet, and the air inlet is connected to the second space; the coil component is arranged in the first space and connected to the heat dissipation component; the circuit board is arranged in the second space; the fan is arranged in the second space, the air suction port of the fan is connected to the second space, and the air blowing port of the fan is connected to the second end of the heat dissipation duct.

[0006] In a second aspect, an embodiment of the present application provides a wireless charging device, which includes a support member and the wireless charging module, and the shell is disposed on the support member.

[0007] Beneficial effect: Since the air intake of the fan is connected to the second space, the air outlet of the fan is connected to the heat dissipation duct, and the heat dissipation duct is connected to the air outlet, the air inlet and outlet duct of the fan are relatively independent. When the fan rotates, the air outlet and air inlet of the fan will basically not interfere with each other, and the hot air discharged by the fan is avoided as much as possible to flow to the air inlet, thereby improving the heat dissipation efficiency of the wireless charging module. In addition, since the coil assembly is sealed in the first space, the coil assembly can be kept clean for a long time, so that the heat dissipation effect of the coil assembly remains unchanged and the service life is longer. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0009] Figure 1 Schematic diagram of the structure of the connecting wire of the wireless charging module in an embodiment of the present application;

[0010] Figure 2 Schematic diagram of the structure of the connecting wire of the wireless charging module in another embodiment of the present application;

[0011] Figure 3 Schematic diagram of the structure of the wireless charging module in an embodiment of the present application;

[0012] Figure 4 Schematic diagram of the structure of the wireless charging module in another embodiment of the present application;

[0013] Figure 5 Schematic diagram of the exploded structure of the wireless charging module in an embodiment of the present application;

[0014] Figure 6 Schematic diagram of the exploded structure of the wireless charging module in another embodiment of the present application;

[0015] Figure 7 Schematic diagram of the exploded structure of the heat dissipation component in an embodiment of the present application;

[0016] Figure 8 Schematic diagram of the exploded structure of the wireless charging module in yet another embodiment of the present application;

[0017] Figure 9 Schematic diagram of the exploded structure of the wireless charging module in still another embodiment of the present application;

[0018] Figure 10 Schematic diagram of the structure of the wireless charging module with the middle frame hidden in an embodiment of the present application;

[0019] Figure 11 Schematic diagram of the structure of the wireless charging device in an embodiment of the present application.

[0020] Description of Reference Numerals: 100, wireless charging module; 110, housing; 110a, air inlet; 110b, air outlet; 111, front cover; 112, bottom cover; 113, middle frame; 120, heat dissipation component; 120a, heat dissipation air duct; 121, heat dissipation member; 1211, heat dissipation base; 1212, heat dissipation fins; 122, heat dissipation cover plate; 130, coil assembly; 131, magnetic isolation sheet; 132, induction coil; 140, circuit board; 150, fan; 150a, air suction port; 150b, air blowing port; 160, magnetic ring; 200, wire; 300, wireless charging device; 310, support member; A, air blowing direction; B, air outlet direction; C, air inlet direction. Detailed Description of the Embodiment

[0021] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0022] As Figures 1-4 shown, in the first aspect of the embodiment of the present application, a wireless charging module 100 is provided. The wireless charging module 100 can wirelessly charge electronic devices such as mobile phones, tablet computers, and earphones. When charging, there is no need to plug and unplug the data cable, which is relatively convenient.

[0023] As Figures 1-2 shown, the wireless charging module 100 is powered through the wire 200, and the wire 200 can be connected to the terminals on devices such as a charger or a notebook. The wireless charging module 100 and the wire 200 can be fixedly connected, or as Figures 3-4 shown, the wireless charging module 100 and the wire 200 are pluggable.

[0024] As Figures 3-5 shown, the wireless charging module 100 includes a housing 110, a heat dissipation component 120, a coil assembly 130, a circuit board 140, and a fan 150.

[0025] The housing 110 is used to accommodate the heat dissipation component 120, the coil assembly 130, the circuit board 140, and the fan 150. The housing 110 has a certain protective effect on the heat dissipation component 120, the coil assembly 130, the circuit board 140, and the fan 150. The housing 110 has an air inlet 110a and an air outlet 110b. The air inlet 110a is used for air to flow in, and the air outlet 110b is used for air to flow out. The material of the housing 110 can be plastic, so that different shapes can be formed by injection molding, and the plastic housing 110 has good insulation and is relatively light. The shape of the housing 110 can be generally flat to reduce the thickness of the wireless charging module 100. For example, the shape of the housing 110 is cylindrical.

[0026] The heat dissipation component 120 is disposed within the housing 110. The heat dissipation component 120 divides the housing 110 into a first space and a second space, and the first space and the second space are relatively independent. Exemplarily, the heat dissipation component 120 has a first surface and a second surface facing away from each other in the thickness direction. The housing 110 has a first portion facing the first surface and a second portion facing the second surface. The first surface and the first portion enclose the first space, and the second surface and the second portion enclose the second space. Optionally, the thickness direction of the heat dissipation component 120 is parallel to the thickness direction of the housing 110, and the first space and the second space are spaced apart in the thickness direction of the housing 110. The heat dissipation component 120 has a heat dissipation air duct 120a. The first end of the heat dissipation air duct 120a is communicated with the air outlet 110b, and the air inlet 110a is communicated with the second space. The heat dissipation air duct 120a can define the flow path of the gas, so that the gas flows along a predetermined route, thereby improving the heat dissipation effect of the heat dissipation component 120. The connection manner between the heat dissipation component 120 and the housing 110 can be bonding, snap connection, screw connection, abutting, etc. The material of the heat dissipation component 120 can be a metal material, so as to have a good heat conduction effect.

[0027] The coil assembly 130 can generate an induced magnetic field, so that the wireless charging module 100 wirelessly charges the electronic device through the coil assembly 130. The coil assembly 130 is disposed within the first space, and the coil assembly 130 is connected to the heat dissipation component 120. The heat released by the coil assembly 130 can be conducted to the heat dissipation component 120. Exemplarily, the coil assembly 130 and the heat dissipation component 120 are bonded by a thermal conductive adhesive, so that the coil assembly 130 and the heat dissipation component 120 can be well fixed and have a good heat conduction effect.

[0028] The circuit board 140 is used to control the operation of the coil assembly 130. The circuit board 140 can be welded to the wire 200, or connection terminals are provided on the circuit board 140, and the wire 200 is plugged into the connection terminals. The circuit board 140 also generates heat during operation. When the temperature of the circuit board 140 is too high, the stability of the circuit board 140 will decrease, and the damage probability will also increase. The circuit board 140 is disposed within the second space, and the heat of the circuit board 140 can be dissipated within the second space.

[0029] The fan 150 is arranged in the second space, the air inlet 150a of the fan 150 is connected to the second space, and the air outlet 150b of the fan 150 is connected to the second end of the heat dissipation duct 120a, that is, the first space and the second space are not connected to each other, the coil assembly 130 conducts heat to the heat dissipation assembly 120, and the heat dissipation assembly 120 dissipates heat to the second space. When the fan 150 rotates, the air outside the housing 110 enters the second space from the air inlet 110a, and is then sucked in by the air inlet 150a of the fan 150, and is discharged from the air outlet 150b of the fan 150 to the second end of the heat dissipation duct 120a, and then flows to the first end of the heat dissipation duct 120a, and flows out of the housing 110 through the air outlet 110b. The type of the fan 150 can be centrifugal, so that the wind pressure of the fan 150 is relatively large, the exhaust effect is better, and the heat exchange effect of the heat dissipation assembly 120 is improved. The thickness of the fan 150 may be 3 mm to 10 mm, so that the wireless charging module 100 is not too thick and heavy, and has sufficient heat dissipation air volume. The diameter of the fan 150 may be 17 mm to 45 mm, so that the fan 150 has a certain heat dissipation capacity and does not make the wireless charging module 100 too large.

[0030] When the fan 150 rotates, the air outside the housing 110 flows through the second space, thereby taking away the heat emitted by the circuit board 140, so as to reduce the temperature of the circuit board 140 and improve the stability of the circuit board 140. When the gas discharged by the fan 150 flows through the heat dissipation duct 120a, the heat emitted by the heat dissipation component 120 is taken away, so that the temperature of the coil component 130 can be reduced, thereby reducing the temperature of the coil component 130, increasing the power during wireless charging, thereby increasing the charging speed and shortening the charging time. The fan 150 of the embodiment of the present application can dissipate heat for the circuit board 140 and the coil component 130, and can take into account multiple heat sources at the same time, thereby improving the problem of high local heat generation and high temperature reduction of charging power of the wireless charging module 100, achieving no reduction in charging power throughout the process or reducing the probability of reducing charging power due to heat, so that the wireless charging module 100 outputs a relatively high power as much as possible. Moreover, since the coil assembly 130 is arranged in the first space and the airflow of the fan 150 does not flow through the first space, the coil assembly 130 can be kept in a relatively clean state for a long time, and the coil assembly 130 can be avoided from contact with dust and water vapor as much as possible, thereby extending the service life of the coil and maintaining the heat dissipation effect of the coil assembly 130 unchanged for a long time.

[0031] In summary, since the air inlet 150a of the fan 150 is connected to the second space, the air outlet 150b of the fan 150 is connected to the heat dissipation duct 120a, and the heat dissipation duct 120a is connected to the air outlet 110b, the air inlet duct and the air outlet duct of the fan 150 are relatively independent. When the fan 150 rotates, the air outlet and the air inlet of the fan 150 will basically not interfere with each other, and the hot air discharged by the fan 150 is avoided as much as possible from flowing to the air inlet 110a, thereby improving the heat dissipation efficiency of the wireless charging module 100. In addition, since the coil assembly 130 is sealed in the first space, the coil assembly 130 can be kept clean for a long time, so that the heat dissipation effect of the coil assembly 130 remains unchanged and the service life is longer.

[0032] like Figures 6-7 As shown, in some embodiments, the heat dissipation assembly 120 includes a heat dissipation element 121 and a heat dissipation cover plate 122. The heat dissipation element 121 is mainly used for heat dissipation, and the heat dissipation cover plate 122 is mainly used to cover the heat dissipation element 121 to form a heat dissipation duct 120a. The heat dissipation assembly 120 is set separately to reduce the difficulty of manufacturing and save production costs. The heat dissipation element 121 and the heat dissipation cover plate 122 can be connected by screwing, clamping, bonding, etc.

[0033] Optionally, the heat sink 121 includes a heat sink base 1211 and heat sink fins 1212. The shape of the heat sink base 1211 can be similar to a plate, so as to facilitate the separation of the space in the housing 110, and the thickness is relatively thin. The coil assembly 130 is connected to the heat sink base 1211, and the relatively flat surface of the heat sink base 1211 can be arranged in a close fit with the coil assembly 130 to increase the contact area and improve the heat conduction effect. The heat sink fins 1212 are arranged on the surface of the heat sink 1211 away from the coil assembly 130, and the heat sink fins 1212 are used to increase the contact area with the air, thereby improving the heat dissipation effect of the heat sink 121. There can be multiple heat sink fins 1212, and the multiple heat sink fins 1212 are evenly spaced, so that the heat dissipation efficiency of each part of the heat sink 121 is relatively small. The extension direction of the heat sink fins 1212 can be the same as the extension direction of the heat dissipation air duct 120a, so as to reduce wind resistance and maximize the contact area with the air.

[0034] The heat dissipation cover plate 122 is covered on the heat dissipation fins 1212, and the heat dissipation cover plate 122, the heat dissipation fins 1212 and the heat dissipation base 1211 enclose a heat dissipation duct 120a. Exemplarily, the heat dissipation cover plate 122 is used to close the bottom surface of the heat dissipation duct 120a, the heat dissipation base 1211 is used to close the top surface of the heat dissipation duct 120a, the two heat dissipation fins 1212 located at the outermost periphery are used to close the two side surfaces of the heat dissipation duct 120a, and the heat dissipation fins 1212 located in the middle are used to divide the heat dissipation duct 120a into a plurality of sub-heat dissipation ducts 120a, so as to make the airflow in the heat dissipation duct 120a more uniform, thereby improving the heat dissipation effect of the heat dissipation component 120.

[0035] As Figure 8 shown, in some embodiments, the housing 110 includes a front shell 111, a bottom shell 112, and a middle frame 113.

[0036] The front shell 111 is usually placed facing upward, and the coil assembly 130 is disposed close to the front shell 111. When the electronic device is placed on the front shell 111, the coil assembly 130 can be relatively close to the electronic device, so that the electronic device can sense the coil assembly 130.

[0037] The bottom shell 112 is opposite to and spaced from the front shell 111, and the bottom shell 112 is usually placed facing downward. The bottom shell 112 contacts the desktop to support the wireless charging module 100.

[0038] The middle frame 113 connects the front shell 111 and the bottom shell 112. The connection manner between the middle frame 113 and the front shell 111 can be bonding, welding, integrally formed, etc. The connection manner between the middle frame 113 and the bottom shell 112 can be bonding, welding, integrally formed, etc. The heat dissipation component 120 is connected to the inner wall of the middle frame 113 so that there is a certain sealing effect between the heat dissipation component 120 and the middle frame 113. The heat dissipation component 120, the middle frame 113, and the front shell 111 enclose a first space, and the heat dissipation component 120, the middle frame 113, and the bottom shell 112 enclose a second space.

[0039] As Figure 8 shown, in some embodiments, the middle frame 113 is provided with an air inlet 110a and an air outlet 110b. Both the air inlet 110a and the air outlet 110b are disposed on the middle frame 113. When the wireless charging module 100 is in a conventional placement state (the front shell 111 is placed facing upward and the bottom shell 112 is placed facing downward), when the electronic device is placed on the front shell 111, the electronic device will not block the air inlet 110a and the air outlet 110b.

[0040] Optionally, the air inlet 110a and the air outlet 110b are arranged away from each other to reduce the mutual interference between the air flow at the air inlet 110a and the air flow at the air outlet 110b, and to avoid the hot air discharged from the air outlet 110b flowing back to the air inlet 110a as much as possible, so that the air inlet 110a sucks in relatively cold air. Exemplarily, the air inlet 110a is disposed on one side of the middle frame, and the air outlet 110b is disposed on the other side of the middle frame. The air inlet 110a and the air outlet 110b are arranged away from each other, so that the distance between the air inlet 110a and the air outlet 110b is relatively far, and the air flow interference between the air inlet 110a and the air outlet 110b is less.

[0041] As Figure 9As shown, in some embodiments, the air inlet 150a of the blower 150 is disposed close to the air inlet 110a, so that the air suction resistance of the blower 150 is relatively small, which is beneficial to increasing the air flow rate of the blower 150, and further improving the heat dissipation effect on the heat dissipation component 120. Exemplarily, the blower 150 is disposed close to the air inlet 110a, so that the distance between the air inlet 150a of the blower 150 and the air inlet 110a is relatively short, which is beneficial to reducing the air suction resistance of the blower 150.

[0042] Optionally, the first end of the heat dissipation air duct 120a is disposed close to the air outlet 110b. Exemplarily, the heat dissipation component 120 is disposed close to the air outlet 110b, so that the first end of the heat dissipation air duct 120a is directly attached to the air outlet 110b, and the distance between the first end of the heat dissipation air duct 120a and the air outlet 110b is relatively short, which is beneficial to reducing the exhaust resistance of the heat dissipation air duct 120a.

[0043] As Figures 9-10 shown, in some embodiments, the circuit board 140 is disposed corresponding to the air inlet 150a of the blower 150. Exemplarily, the circuit board 140 is disposed opposite and spaced apart from the air inlet 150a of the blower 150. When the air in the second space is sucked in by the air inlet 150a, the air flow will flow through the circuit board 140, which is beneficial to the air flow taking away the heat of the circuit board 140.

[0044] Optionally, the circuit board 140 is spaced apart from the housing 110. For example, the circuit board 140 is spaced apart from the bottom case 112, so that the heat of the circuit board 140 is difficult to conduct to the housing 110. The housing 110 can maintain a relatively low temperature, so as to avoid the housing 110 conducting heat to the electronic device as much as possible, reduce the impact on the electronic device, and also avoid the housing 110 overheating and having a negative impact on the user, thereby improving the user experience.

[0045] As Figures 7-8 shown, in some embodiments, the flow cross-section of the second end of the heat dissipation air duct 120a is adapted to the flow cross-section of the air blowing port 150b of the blower 150. The flow cross-section is a cross-section perpendicular to the air flow path, that is, the flow cross-section of the second end of the heat dissipation air duct 120a is a cross-section of the second end of the heat dissipation air duct 120a perpendicular to the air blowing direction A of the air blowing port 150b, and the flow cross-section of the air blowing port 150b is a cross-section of the air blowing port 150b perpendicular to the air blowing direction A. The flow cross-sectional area of the second end of the heat dissipation air duct 120a is substantially equal to the flow cross-sectional area of the air blowing port 150b of the blower 150, and the flow cross-section shape of the second end of the heat dissipation air duct 120a is substantially similar to the flow cross-section shape of the air blowing port 150b of the blower 150, so that the exhaust resistance of the second end of the heat dissipation air duct 120a to the air blowing port 150b of the blower 150 is relatively small.

[0046] In some embodiments, the flow cross-section at the first end of the heat dissipation air duct 120a is adapted to the flow cross-section of the air outlet 110b. The flow cross-section at the first end of the heat dissipation air duct 120a is the cross-section where the first end of the heat dissipation air duct 120a is perpendicular to the air outlet direction B of the air outlet 110b, and the flow cross-section of the air outlet 110b is the cross-section where the air outlet 110b is perpendicular to the air outlet direction B. The flow cross-sectional area at the first end of the heat dissipation air duct 120a is approximately equal to the flow cross-sectional area of the air outlet 110b, and the shape of the flow cross-section at the first end of the heat dissipation air duct 120a is approximately the same as the shape of the flow cross-section of the air outlet 110b, so that the air exhaust resistance of the air outlet 110b to the first end of the heat dissipation air duct 120a is relatively small.

[0047] As Figure 8 shown, in some embodiments, the included angle between the air inlet direction C of the air inlet 110a and the air outlet direction B of the air outlet 110b is less than or equal to 90 degrees, so that the air flow discharged from the air outlet 110b will not flow towards the air inlet 110a, thereby reducing the air flow interference between the air inlet 110a and the air outlet 110b. Optionally, the air inlet direction C of the air inlet 110a is the same as the air outlet direction B of the air outlet 110b, so that the air flow discharged from the air outlet 110b is far away from the air outlet 110b.

[0048] As Figure 6 shown, in some embodiments, the fan 150 is in contact with the heat dissipation component 120 so that the air blowing port 150b of the fan 150 is communicated with the second end of the heat dissipation channel. The contact between the fan 150 and the heat dissipation component 120 makes the fan 150 and the heat dissipation component 120 fit tightly, which is beneficial to improving the sealing performance between the air blowing port 150b and the second end of the heat dissipation channel. Moreover, the connection method between the fan 150 and the heat dissipation component 120 is relatively simple. The air blowing port 150b of the fan 150 can be directly docked with the second end of the heat dissipation air duct 120a, which is convenient for assembly and has a low production cost.

[0049] In some embodiments, the heat dissipation member 121 is in contact with the housing 110 so that the first end of the heat dissipation channel is communicated with the air outlet 110b. The contact between the heat dissipation member 121 and the housing 110 makes the heat dissipation member 121 and the housing 110 fit tightly, which is beneficial to improving the sealing performance between the first end of the heat dissipation channel and the air outlet 110b. Moreover, the connection method between the heat dissipation component 120 and the housing 110 is relatively simple. The second end of the heat dissipation air duct 120a can be directly docked with the housing 110, which is convenient for assembly and has a low production cost.

[0050] In some embodiments, the coil assembly 130 may include an induction coil 132 and a magnetic isolation sheet 131. The induction coil 132 is disposed on the magnetic isolation sheet 131. The magnetic isolation sheet 131 can be used for heat conduction. The heat of the induction coil 132 is conducted to the heat dissipation assembly 120 through the magnetic isolation sheet 131. The provision of the magnetic isolation sheet 131 can reduce magnetic field interference and improve the charging efficiency of the induction coil 132.

[0051] In some embodiments, the wireless charging module 100 further includes a semiconductor refrigeration component. The cold end of the semiconductor refrigeration component is connected to the coil assembly 130, and the hot end is connected to the heat dissipation assembly 120. The semiconductor refrigeration component can generate cold to cool down the coil assembly 130. The heat generated by the semiconductor refrigeration component is conducted to the heat dissipation assembly 120 and dissipated by the heat dissipation assembly 120.

[0052] Optionally, the semiconductor refrigeration component includes a PN junction and two substrates respectively disposed at both ends of the PN junction. One of the substrates is connected to the coil assembly 130, and the other substrate is connected to the heat dissipation assembly 120. The Peltier effect is generated by exciting the PN junction with a direct current to achieve refrigeration. Specifically, the PN junction is one of the most basic element structures in the semiconductor refrigeration component. The PN junction is formed by connecting an N-type semiconductor and a P-type semiconductor in series through a current guiding sheet with a relatively high conductivity.

[0053] The working principle of semiconductor refrigeration is as follows: When a direct current voltage is applied to the PN junction, electrons in the P region will flow to the N region, and at the same time, holes in the N region will also flow to the P region. Since the diffusion processes of electrons and holes in the two regions will be resisted by the lattice structure, a certain power loss will be formed, and this loss will cause the temperature of the semiconductor material to rise. However, in this process, the flow directions of electrons and holes are opposite, so a temperature difference will also appear on both sides of the PN junction, thereby achieving refrigeration of the environment by the flow of electrons in the semiconductor material.

[0054] In some other embodiments, the coil assembly 130 further includes a semiconductor refrigeration component, that is, the coil assembly 130 is integrated with the semiconductor refrigeration component to form an integrated structure. Optionally, the induction coil 132 is disposed on the surface of the magnetic isolation sheet 131 facing away from the heat dissipation component 120. The cold end of the semiconductor refrigeration component is connected to the surface of the magnetic isolation sheet 131 facing the heat dissipation component 120, and the hot end of the semiconductor refrigeration component is connected to the heat dissipation component 120. The cold end of the semiconductor refrigeration component can generate cold, thereby further reducing the temperature of the induction coil 132 and improving the charging efficiency. At this time, the semiconductor refrigeration sheet may only include a PN junction. One end of the PN junction is connected to the induction coil 132, and the other end is connected to the heat dissipation component 120. At this time, two substrates originally disposed at both ends of the PN junction can be reduced. Of course, for the convenience of assembling the coil assembly 130 and the heat dissipation component 120, the semiconductor refrigeration sheet may include a PN junction and a substrate. One end of the PN junction is connected to the induction coil 132, and the other end is connected to the substrate. During assembly, the substrate is attached to the heat dissipation component 120, and at this time, one substrate originally disposed at one end of the PN junction can be reduced. In the embodiments of the present application, the semiconductor refrigeration component is integrated into the coil assembly 130, so that the semiconductor refrigeration component is directly connected to the magnetic isolation sheet 131 or the heat dissipation component 120, thereby reducing the substrates originally required for the semiconductor refrigeration component and simplifying the overall structure.

[0055] As Figure 11 shown, in the second aspect of the embodiments of the present application, a wireless charging device 300 is provided. The wireless charging device 300 includes a support member 310 and a wireless charging module 100, and the housing 110 is disposed on the support member 310.

[0056] The wireless charging device 300 may include one or more wireless charging modules 100 to charge one or more devices simultaneously. For example, the wireless charging device 300 is a three-in-one wireless charger, and the wireless charging device 300 can charge a mobile phone, a headset, and a smart watch simultaneously. According to the different forms of the wireless charging device 300, the support member 310 may exemplarily be a base or a bracket.

[0057] In the drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present application, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for exemplary illustration and should not be construed as a limitation of the present application. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0058] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included within the protection scope of the present application.

Claims

1. A wireless charging module, characterized in that, Comprising: A housing having an air inlet and an air outlet; A heat dissipation component disposed within the housing, the heat dissipation component dividing the housing into a first space and a second space, and the heat dissipation component having a heat dissipation air duct, a first end of the heat dissipation air duct communicating with the air outlet, and the air inlet communicating with the second space; A coil assembly disposed within the first space and connected to the heat dissipation component; A circuit board disposed within the second space; A fan disposed within the second space, an air suction port of the fan communicating with the second space, and an air blowing port of the fan communicating with a second end of the heat dissipation air duct.

2. The wireless charging module according to claim 1, characterized in that, The heat dissipation component includes: A heat dissipation member including a heat dissipation base and heat dissipation fins, the coil assembly being connected to the heat dissipation base, and the heat dissipation fins being disposed on a surface of the heat dissipation base facing away from the coil assembly; A heat dissipation cover plate covering the heat dissipation fins, the heat dissipation cover plate, the heat dissipation fins, and the heat dissipation base enclosing to form the heat dissipation air duct.

3. The wireless charging module according to claim 1, wherein The housing includes: A front shell; A bottom shell opposite to and spaced apart from the front shell; A middle frame connecting the front shell and the bottom shell, the heat dissipation component being connected to an inner wall of the middle frame, the heat dissipation component, the middle frame, and the front shell enclosing to form the first space, and the heat dissipation component, the middle frame, and the bottom shell enclosing to form the second space.

4. The wireless charging module according to claim 3, wherein The middle frame is provided with the air inlet and the air outlet, and the air inlet and the air outlet are disposed away from each other.

5. The wireless charging module according to claim 1, characterized in that The air suction port of the fan is disposed close to the air inlet; and / or The first end of the heat dissipation air duct is disposed close to the air outlet.

6. The wireless charging module according to claim 1, characterized in that, A flow cross-section of a second end of the heat dissipation air duct is adapted to a flow cross-section of the air blowing port of the fan; and / or A flow cross-section of a first end of the heat dissipation air duct is adapted to a flow cross-section of the air outlet; and / or An included angle between an air inlet direction of the air inlet and an air outlet direction of the air outlet is less than or equal to 90 degrees.

7. The wireless charging module according to claim 1, characterized in that The fan abuts against the heat dissipation component so that the air blowing port of the fan communicates with the second end of the heat dissipation channel; and / or The heat dissipation member abuts against the housing so that the first end of the heat dissipation channel communicates with the air outlet.

8. The wireless charging module according to claim 1, wherein The circuit board is spaced apart from the housing; and / or The circuit board is disposed corresponding to the air suction port of the fan.

9. The wireless charging module according to claim 1, characterized in that, The coil assembly includes: A magnetic isolation sheet; An induction coil disposed on a surface of the magnetic isolation sheet facing away from the heat dissipation component; A semiconductor refrigeration component, a cold end of the semiconductor refrigeration component being connected to a surface of the magnetic isolation sheet facing the heat dissipation component, and a hot end of the semiconductor refrigeration component being connected to the heat dissipation component; Or, the wireless charging module includes the semiconductor refrigeration component, and the semiconductor refrigeration component is separately disposed from the coil assembly.

10. A wireless charging device, characterized in that, Comprising: A support member; And The wireless charging module according to any one of claims 1-9, the housing being disposed on the support member.

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