High-frequency equipment voltage and frequency boosting circuit applied to medical equipment

Abstract

The utility model discloses a high-frequency equipment voltage and frequency boosting circuit applied to medical equipment, belongs to the field of medical equipment circuits, and solves the problems that in the prior art, the frequency of medical equipment is difficult to adjust, the circuit hardware requirement is high, and the cost is high. The power supply module is electrically connected with a fundamental frequency oscillation circuit, the fundamental frequency oscillation circuit is electrically connected with a rectification energy storage circuit, the rectification energy storage circuit is connected with a frequency modulation time-delay circuit, and the frequency modulation time-delay circuit is connected with a boost output circuit. According to the utility model, the stability and reliability of the frequency and voltage regulation circuit are mainly improved, the working efficiency is improved, and the economic cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of medical device circuits, and particularly to a high-frequency device step-up and frequency-up circuit applied to medical equipment. Background Art

[0002] With the development of technology, the requirements for high-frequency devices are getting higher and higher. Especially in the fields of industry, communication, medical treatment, etc., higher requirements are put forward for the efficiency, stability, reliability and cost-effectiveness of the devices. In the medical field, the mains voltage of 220V / 50Hz is converted into a high-frequency high-voltage AC output. According to the "skin effect" principle of high-frequency voltage, the current flows on the surface of the human body. In addition, since the inside of the conductor has a larger inductance than the surface, the resistance to alternating current is large, making the current concentrated on the surface of the conductor rather than flowing through the internal organs of the human body. Therefore, this high-frequency current will not cause harm to the organs. Using the high-frequency electric spark generated by the high-density current of the tool head, the surface tissue can be quickly melted, and the patient basically has no obvious discomfort, so as to achieve the cutting effect. However, most of the products on the market directly convert the grid voltage into high-frequency high voltage, such as a high-frequency medical treatment device disclosed in the application with publication number CN101138518A. This requires high circuit hardware, high cost, difficult frequency adjustment, high insulation requirements, and the final product has a large volume. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a high-frequency device step-up and frequency-up circuit applied to medical equipment to solve the problems of difficult frequency adjustment, high circuit hardware requirements and high cost in the prior art.

[0004] The utility model is realized by the following technical solutions:

[0005] A high-frequency device step-up and frequency-up circuit applied to medical equipment includes a power supply module. The power supply module is electrically connected to a fundamental frequency oscillation circuit. The fundamental frequency oscillation circuit includes a multivibrator IC1 and a multivibrator IC2. The multivibrator IC1 is electrically connected to the multivibrator IC2. The multivibrator IC2 is electrically connected to a MOS transistor Q2. The MOS transistor Q2 is electrically connected to a rectifying and energy storage circuit. The rectifying and energy storage circuit is connected to a frequency modulation delay circuit. The frequency modulation delay circuit includes a multivibrator IC3 and a multivibrator IC4. The multivibrator IC3 is electrically connected to the multivibrator IC4. The multivibrator IC4 is connected to a MOS transistor Q4 through a flip-flop IC5. The MOS transistor Q4 is connected to a step-up output circuit. The frequency modulation delay circuit is connected to the step-up output circuit. By using the combination of the fundamental frequency oscillation circuit and the frequency modulation delay circuit, the change of the frequency can be controlled more precisely, so as to optimize the energy conversion efficiency. By adjusting the frequency, the energy loss can be reduced and the efficiency of the overall system can be improved.

[0006] Further, a transformer T1 is provided between the multivibrator IC2 and the MOS transistor Q2. One side of the transformer T1 is electrically connected to the MOS transistor Q1, and the other side is electrically connected to a rectifier diode D1 and a voltage regulator diode D3. The rectifier diode D1 and the voltage regulator diode D3 are electrically connected to the MOS transistor Q2. The MOS transistor Q1 is electrically connected to the multivibrator IC2.

[0007] Further, the multivibrator IC4 is connected to a flip-flop IC5. The flip-flop IC5 and the multivibrator IC4 are respectively connected to the input ends of a NAND gate chip IC6. The output end of the NAND gate chip IC6 is connected to a MOS transistor Q3. The MOS transistor Q3 is connected to a transformer T3. The transformer T3 is electrically connected to a rectifier diode D9 and a voltage regulator diode D11. The rectifier diode D9 and the voltage regulator diode D11 are electrically connected to the MOS transistor Q4.

[0008] Further, the rectifying and energy storage circuit includes a transformer T1. The transformer T1 is connected to a rectifier bridge, and the rectifier bridge includes diodes D4, D5, D6, and D7. The presence of the rectifying and energy storage circuit can provide a stable DC power supply for the system, ensuring the normal operation of the subsequent circuit even under fluctuating input voltages.

[0009] Further, the boost output circuit includes a transformer T4. One side of the transformer T4 is electrically connected to a resistor R5, and the other side is connected to a capacitor C14.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0011] The present utility model pulse-modulates the direct current processed by the power supply module through the fundamental frequency oscillation circuit, then expands the pulse width through the frequency modulation and delay circuit, and finally realizes the high-frequency output of high voltage through the high-frequency on and off of the switching device. The device has a smaller volume, improves the stability and reliability of the frequency modulation and voltage regulation circuit, improves the working efficiency, and reduces the economic cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is the circuit principle of the present utility model Figure 1 ;

[0013] Figure 2 is the circuit principle of the present utility model Figure 2 . DETAILED DESCRIPTION OF THE EMBODIMENTS

[0014] To enable those skilled in the art to better understand the technical solution of the present utility model, the technical solution of the present utility model will be clearly and completely described below in conjunction with the attached drawings of the present utility model. Based on the embodiments in this application, other similar embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application. In addition, the directional terms mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for illustration rather than limitation of the present utility model creation.

[0015] The present utility model will be further described below in conjunction with the attached drawings.

[0016] Embodiment 1: A high-frequency device boost and frequency boost circuit applied to medical equipment, as Figure 1 - Figure 2 shown, includes a power supply module. The power supply module is electrically connected to a fundamental frequency oscillation circuit. The fundamental frequency oscillation circuit includes a multivibrator IC1 and a multivibrator IC2. The multivibrator IC1 is electrically connected to the multivibrator IC2. The multivibrator IC2 is electrically connected to a MOS transistor Q2. The MOS transistor Q2 is electrically connected to a rectification and energy storage circuit. The rectification and energy storage circuit is electrically connected to the fundamental frequency oscillation circuit. The rectification and energy storage circuit is connected to a frequency modulation delay circuit. The frequency modulation delay circuit includes a multivibrator IC3 and a multivibrator IC4. The multivibrator IC3 is electrically connected to the multivibrator IC4. The multivibrator IC4 is connected to a MOS transistor Q4 through a flip-flop IC5. The MOS transistor Q4 is connected to a boost output circuit. The frequency modulation delay circuit is connected to the boost output circuit. By using a combination of the fundamental frequency oscillation circuit and the frequency modulation delay circuit, the change of frequency can be controlled more precisely, thereby optimizing the energy conversion efficiency. By adjusting the frequency, energy loss can be reduced and the efficiency of the overall system can be improved. Among them, both the multivibrator IC1 and the multivibrator IC3 use CD4047 chips, and both the multivibrator IC2 and the multivibrator IC4 use CD4528 chips.

[0017] Embodiment 2: A high-frequency device step-up and frequency-up circuit applied to medical equipment. A transformer T1 is provided between the multivibrator IC2 and the MOS transistor Q2. One side of the transformer T1 is electrically connected to the MOS transistor Q1, and the other side is electrically connected to a rectifier diode D1 and a voltage regulator diode D3. The rectifier diode D1 and the voltage regulator diode D3 are electrically connected to the MOS transistor Q2. The MOS transistor Q1 is electrically connected to the multivibrator IC2. The multivibrator IC4 is connected to a flip-flop IC5. The flip-flop IC5 and the multivibrator IC4 are respectively connected to the input terminals of a NAND gate chip IC6. The output terminal of the NAND gate chip IC6 is connected to a MOS transistor Q3. The MOS transistor Q3 is connected to a transformer T3. The transformer T3 is electrically connected to a rectifier diode D9 and a voltage regulator diode D11. The NAND gate chip IC6 uses a CD4011 chip, and the MOS transistor Q3 uses an IRF530 transistor. The rectifier diode D9 and the voltage regulator diode D11 are electrically connected to the MOS transistor Q4. The rectifying and energy storage circuit includes the transformer T1. The transformer T1 is connected to a rectifier bridge. The rectifier bridge includes diodes D4, D5, D6, and D7. The diodes D4, D5, D6, and D7 use STTA1206D. The existence of the rectifying and energy storage circuit can provide a stable DC power supply for the system, ensuring the normal operation of the subsequent circuit even under the condition of input voltage fluctuation. The step-up output circuit includes a transformer T4. One side of the transformer T4 is electrically connected to a resistor R5, and the other side is connected to a capacitor C14. Others are the same as those in Embodiment 1.

[0018] The 220V / 50Hz network power supply is rectified by the power supply module to obtain a DC 311V voltage. The period and frequency are adjusted by the multivibrator IC1 of the fundamental frequency oscillation circuit, and then the pulse width is adjusted by the multivibrator IC2. Finally, the on-off of the MOS transistor Q2 is controlled through the transformer T1, the rectifier diode D1, and the voltage regulator diode D3, modulating the power supply module voltage into an AC high-frequency voltage of 311V / 50 - 250kHz. Then, through the transformer T1 of the rectifying and energy storage circuit and the rectifier bridge, the voltage can be increased to 440V / 50 - 250kHz. Then, the period and frequency are adjusted by the multivibrator IC3 of the frequency modulation and delay circuit, and then the pulse width is adjusted by the multivibrator IC4. Finally, the on-off of the MOS transistor Q4 is controlled through the transformer T3, the rectifier diode D9, and the voltage regulator diode D11, modulating the voltage of the rectifying and energy storage circuit into an AC 440V / 250 - 1000kHz. Finally, through the RLC oscillation circuit composed of the transformer T4, the capacitor C14, and the resistor R5 in the step-up output circuit, the voltage of the frequency modulation and delay circuit is modulated into an AC 440 - 8000V / 250 - 1000kHz. The purpose of stable frequency modulation and voltage regulation is achieved.

[0019] The above has described the present utility model in detail. As mentioned above, the above is only the preferred embodiment of the present utility model, and it cannot limit the scope of implementation of the present utility model. That is, all equal changes and modifications made according to the scope of this application should still fall within the scope covered by the present utility model.

Claims

1. A high-frequency device step-up and frequency-up circuit applied to medical equipment, including a power supply module, characterized in that: The power supply module is electrically connected to a fundamental frequency oscillation circuit. The fundamental frequency oscillation circuit includes a multivibrator IC1 and a multivibrator IC2. The multivibrator IC1 is electrically connected to the multivibrator IC2. The multivibrator IC2 is electrically connected to an MOS transistor Q2. The MOS transistor Q2 is electrically connected to a rectifying and energy storage circuit. The rectifying and energy storage circuit is connected to a frequency modulation and delay circuit. The frequency modulation and delay circuit includes a multivibrator IC3 and a multivibrator IC4. The multivibrator IC3 is electrically connected to the multivibrator IC4. The multivibrator IC4 is connected to an MOS transistor Q4 through a flip-flop IC5. The MOS transistor Q4 is connected to a boost output circuit. The frequency modulation and delay circuit is connected to the boost output circuit.

2. The high-frequency device boost and frequency boost circuit applied to a medical device according to claim 1, characterized in that: A transformer T1 is provided between the multivibrator IC2 and the MOS transistor Q2. One side of the transformer T1 is electrically connected to an MOS transistor Q1, and the other side is electrically connected to a rectifying diode D1 and a voltage stabilizing diode D3. The rectifying diode D1 and the voltage stabilizing diode D3 are electrically connected to the MOS transistor Q2. The MOS transistor Q1 is electrically connected to the multivibrator IC2.

3. The high-frequency device step-up and frequency-up circuit applied to a medical device according to claim 1, characterized in that: The multivibrator IC4 is connected to a flip-flop IC5. The flip-flop IC5 and the multivibrator IC4 are respectively connected to the input terminals of a NAND gate chip IC6. The output terminal of the NAND gate chip IC6 is connected to an MOS transistor Q3. The MOS transistor Q3 is connected to a transformer T3. The transformer T3 is electrically connected to a rectifying diode D9 and a voltage stabilizing diode D11. The rectifying diode D9 and the voltage stabilizing diode D11 are electrically connected to the MOS transistor Q4.

4. The high-frequency device boost and frequency boost circuit applied to a medical device according to claim 1, characterized in that: The rectifying and energy storage circuit includes a transformer T1. The transformer T1 is connected to a rectifying bridge. The rectifying bridge includes diodes D4, D5, D6, and D7.

5. The high-frequency device boost and frequency increase circuit applied to a medical device according to claim 1, characterized in that: The boost output circuit includes a transformer T4. One side of the transformer T4 is electrically connected to a resistor R5, and the other side is connected to a capacitor C14.

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