Thin plate clamp for electroplating and etching circuit board

Abstract

The utility model discloses a thin plate clamp for circuit board electroplating and etching, and belongs to the technical field of clamps. The device mainly comprises a frame body; the solution tank is erected in the frame body; the sliding mechanism is located at the upper end of the frame body, and the sliding mechanism is used for conveying the circuit board; the clamping mechanism is located at the lower end of the sliding mechanism, the clamping mechanism is used for clamping a circuit board, and the clamping mechanism comprises a transmission assembly located at the lower end of the clamping mechanism; the third air cylinder is located at the lower end of the clamping mechanism; the high-pressure air pump is fixedly connected with the output end of the third air cylinder; and the spray head is communicated with the high-pressure air pump. According to the thin plate clamp for electroplating and etching of the circuit board, the high-pressure air pump is used for spraying pumped gas out through the spray head, and the effect of cleaning copper powder and tin powder plated on the electroplating clamp is achieved.

Description

Technical Field

[0001] This application relates to the technical field of jigs, specifically a thin plate jig for electroplating and etching of circuit boards. Background Art

[0002] A circuit board is a support for electronic components and a carrier for electrical connections, and is an important component in the electronics industry. Electroplating uses electrolysis principles to deposit a layer of other metals or alloys on the surface of certain metals to improve their wear resistance, electrical conductivity, corrosion resistance and other properties. Etching is to remove part of the material on the circuit board through chemical or physical methods to form the required circuit pattern.

[0003] Jigs are used to fix circuit boards during electroplating and etching processes to ensure their stability and position accuracy during processing. A suitable jig design can reduce the deformation and breakage of thin plates during processing, and improve production efficiency and product quality.

[0004] For example, the patent with the publication number CN206686450U discloses a thin plate jig for electroplating and etching of circuit boards. This patent supports the flatness of the circuit board during processing through a movable support plate, so that the circuit board will not be deformed during processing. At the same time, multiple movable support plates can be used in cooperation when processing large circuit boards.

[0005] During the implementation of the above patent, since before use or after recycling, it is necessary to clean the copper powder and tin powder plated on the electroplating jig in the previous process to keep the jig clean, prepare for the next round of recycling, and ensure good contact with the circuit board in production.

[0006] Therefore, it is necessary to provide a thin plate jig for electroplating and etching of circuit boards to solve the above problems.

[0007] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application, and therefore, it may include information that does not constitute prior art. Summary of the Invention

[0008] Based on the above problems existing in the prior art, the problem to be solved by this application is: to provide a thin plate jig for electroplating and etching of circuit boards, which solves the problem that the copper powder and tin powder plated on the electroplating jig will cause poor contact with the circuit board after recycling.

[0009] The technical solution adopted by this application to solve its technical problems is: a thin plate jig for electroplating and etching of circuit boards, including:

[0010] A frame;

[0011] A solution tank, which is installed inside the frame;

[0012] A sliding mechanism, which is located at the upper end of the frame body and is used for transporting the circuit board;

[0013] A clamping mechanism, which is located at the lower end of the sliding mechanism and is used for clamping the circuit board. The clamping mechanism includes:

[0014] A transmission component, which is located at the lower end of the clamping mechanism;

[0015] A third air cylinder, which is located at the lower end of the clamping mechanism;

[0016] A high-pressure air pump, which is fixedly connected to the output end of the third air cylinder;

[0017] A nozzle, which is communicated with the high-pressure air pump.

[0018] Furthermore, two groups of support frames are fixedly arranged on both sides of the frame body. A bottom plate is fixedly connected to the upper end of the frame body. A slide rail is fixedly arranged at the lower end of the bottom plate. A slider is slidably connected to the slide rail. A motor is fixedly arranged on one side of the slide rail. The motor is fixedly connected to the support frame. A lead screw is fixedly installed at the output end of the motor. The slider is in transmission connection with the lead screw. A base is fixedly arranged at the lower end of the slider.

[0019] Furthermore, four groups of first air cylinders are fixedly connected to the base. Four groups of first connecting blocks are fixedly arranged at the output ends of the first air cylinders.

[0020] Furthermore, four groups of second air cylinders are fixedly arranged at the lower ends of the four groups of first connecting blocks. Four groups of second connecting blocks are fixedly arranged at the output ends of the four groups of second air cylinders. Two groups of clamping plates are fixedly arranged on the four groups of second connecting blocks.

[0021] Furthermore, a waste liquid bucket is arranged on one side of the frame body away from the solution tank.

[0022] The beneficial effect of the present application is that the thin plate fixture for electroplating and etching of circuit boards provided by the present application uses a high-pressure air pump to spray the pumped gas through a nozzle, achieving the effect of cleaning the copper powder and tin powder plated on the electroplating fixture.

[0023] In addition to the purposes, features and advantages described above, the present application has other purposes, features and advantages. The following will refer to the drawings to further elaborate on the present application in detail. Description of the Drawings

[0024] The specification drawings constituting a part of the present application are used to provide a further understanding of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application.

[0025] In the drawings:

[0026] Figure 1 This is the overall schematic diagram of the thin plate fixture for circuit board electroplating and etching in this application;

[0027] Figure 2 It is Figure 1 The schematic diagram of the sliding mechanism in

[0028] Figure 3 It is Figure 2 The schematic diagram of A in

[0029] Figure 4 It is Figure 1 The schematic diagram of the waste bin in

[0030] Among them, each reference numeral in the figure:

[0031] 1. Frame; 2. Solution tank; 3. Waste liquid barrel; 4. Sliding mechanism; 41. Support frame; 42. Motor; 43. Base plate; 44. Slide rail; 46. Lead screw; 47. Slide block; 48. Clamping mechanism; 481. First cylinder; 482. Second cylinder; 483. Base; 484. Clamping plate; 485. Third cylinder; 486. Nozzle; 487. High-pressure air pump; 488. First connecting block; 489. Second connecting block. Specific embodiments

[0032] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The following will describe this application in detail with reference to the drawings and in combination with the embodiments.

[0033] In order to enable those skilled in the art to better understand the solution of this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0034] As Figure 1 shown, this application provides a thin plate fixture for circuit board electroplating and etching, including a frame 1 and a solution tank 2 installed inside the frame 1, and the solution tank 2 is used to store the solution required for electroplating;

[0035] As Figure 1 and Figure 2 shown, a sliding mechanism 4 is installed at a position on the upper end of the frame 1 far from the solution tank 2, and the sliding mechanism 4 is used to transfer the circuit board;

[0036] The sliding mechanism 4 includes two sets of support frames 41 fixedly arranged on both sides of the frame body 1. At the same time, a bottom plate 43 is fixedly connected to the upper end of the frame body 1, and a slide rail 44 is fixedly arranged at the lower end of the bottom plate 43;

[0037] A slider 47 is slidably connected to the slide rail 44. A motor 42 is fixedly arranged on one side of the slide rail 44. The motor 42 is fixedly connected to the support frame 41. The output end of the motor 42 is fixedly installed with a lead screw 46, and the slider 47 is in transmission connection with the lead screw 46. Thus, when the motor 42 operates, it can drive the slider 47 to move along the direction of the slide rail 44;

[0038] As Figure 2 and Figure 3 shown, a clamping mechanism 48 is fixedly arranged at the lower end of the slider 47, and the clamping mechanism 48 is used for clamping the circuit board;

[0039] The clamping mechanism 48 includes a base 483 fixedly arranged at the lower end of the slider 47, and a transmission assembly is fixedly arranged on the base 483;

[0040] The transmission assembly includes four first cylinders 481 fixedly connected to the base 483. The output ends of the four first cylinders 481 are fixedly provided with four first connection blocks 488. Four second cylinders 482 are fixedly arranged at the lower ends of the four first connection blocks 488. The output ends of the four second cylinders 482 are fixedly provided with four second connection blocks 489;

[0041] At the same time, two clamping plates 484 are fixedly arranged on the four second connection blocks 489;

[0042] When the first cylinder 481 operates, it can push the four first connection blocks 488 to approach each other. Thus, the four first connection blocks 488 will drive the four second cylinders 482 to get closer to each other, so that the two clamping plates 484 at the lower ends of the four second cylinders 482 will fit together to produce a clamping effect on the circuit board;

[0043] And the four second cylinders 482 can use the clamping plates 484 to clamp the circuit board and drive the circuit board to move up or down;

[0044] At the same time, a cleaning mechanism is fixedly arranged on both sides of the transmission assembly at the lower end of the base 483, and the cleaning mechanism is used for cleaning the clamping mechanism 48;

[0045] The cleaning mechanism includes third cylinders 485 fixedly arranged at the lower end of the base 483 on both sides of the transmission assembly. The output ends of the third cylinders 485 are fixedly provided with high-pressure air pumps 487. The output end of the high-pressure air pump 487 is connected to a spray head 486, and the spray head 486 is used for cleaning the clamping mechanism 48;

[0046] As Figure 1 and Figure 4As shown in the figure, a waste liquid bucket 3 is provided on the side of the frame body 1 away from the solution tank 2. The waste liquid bucket 3 is used to collect the waste liquid cleaned out by the cleaning mechanism on the clamping mechanism 48;

[0047] It should be noted that when the clamping mechanism 48 needs to be cleaned after electroplating, the sliding mechanism 4 will drive the clamping mechanism 48 to move into the waste liquid bucket 3 to complete the waste liquid cleaning, so as to prevent the waste liquid from entering the solution tank 2;

[0048] In summary, when the PCB electroplating and etching starts, the clamping mechanism 48 will clamp the PCB and use the sliding mechanism 4 to perform the electroplating and etching process. After electroplating and etching, the sliding mechanism 4 will drive the clamping mechanism 48 to move into the waste liquid bucket 3 and use the cleaning mechanism for cleaning, so as to facilitate the next round of processing.

[0049] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. The thin plate fixture for electroplating and etching of circuit boards is characterized in that: Comprising: Frame body (1); Solution tank (2), which is installed inside the frame body (1); Sliding mechanism (4), which is located at the upper end of the frame body (1), and the sliding mechanism (4) is used for transporting the circuit board; Clamping mechanism (48), which is located at the lower end of the sliding mechanism (4), and the clamping mechanism (48) is used for clamping the circuit board. The clamping mechanism (48) includes: Transmission component, which is located at the lower end of the clamping mechanism (48); Third cylinder (485), which is located at the lower end of the clamping mechanism (48); High-pressure air pump (487), which is fixedly connected to the output end of the third cylinder (485); Spray head (486), which is communicated with the high-pressure air pump (487).

2. The thin plate fixture for electroplating and etching of circuit boards according to claim 1, wherein: Two sets of support frames (41) fixedly arranged on both sides of the frame body (1), a bottom plate (43) is fixedly connected to the upper end of the frame body (1), a slide rail (44) is fixedly arranged at the lower end of the bottom plate (43), a slider (47) is slidably connected to the slide rail (44), a motor (42) is fixedly arranged on one side of the slide rail (44), the motor (42) is fixedly connected to the support frame (41), a lead screw (46) is fixedly installed at the output end of the motor (42), the slider (47) is in transmission connection with the lead screw (46), and a base (483) is fixedly arranged at the lower end of the slider (47).

3. The thin plate fixture for electroplating and etching of circuit boards according to claim 2, wherein: Four groups of first cylinders (481) fixedly connected to the base (483), and four groups of first connection blocks (488) are fixedly arranged at the output ends of the first cylinders (481).

4. The thin plate fixture for electroplating and etching of circuit boards according to claim 3, characterized in that: Four groups of second cylinders (482) are fixedly arranged at the lower ends of the four groups of first connection blocks (488), four groups of second connection blocks (489) are fixedly arranged at the output ends of the four groups of second cylinders (482), and two groups of clamping plates (484) are fixedly arranged on the four groups of second connection blocks (489).

5. The thin plate fixture for electroplating and etching of circuit boards according to claim 1, characterized in that: A waste liquid bucket (3) is arranged on one side of the frame body (1) away from the solution tank (2).

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