Electroplating control equipment and wafer preparation control system
Through the design of electroplating control equipment, the continuous transfer of wafers between electroplating liquid tanks is achieved, the problem of low efficiency of traditional wafer electroplating processes is solved, the continuity and efficiency of the process flow is improved, and the risk of environmental pollution is reduced.
Patent Information
- Application Number
- CN202422145751.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-09-02
AI Technical Summary
Traditional wafer electroplating processes have problems such as high process complexity, low efficiency and long production time.
An electroplating control device is designed, including a controller, a multi-directional rotatable plating head and an independently distributed plating solution tank. The plating object is transported to the plating head by a robot and performing plating operations in the plating solution tank along a preset path to achieve continuous transfer and automatic pick-up and placement.
It has achieved improvements in the smoothness and efficiency of the wafer plating process, reduced operating steps and transfer time, reduced the risks of environmental pollution and cross-contamination, and ensured product quality.
Smart Images
Figure CN223150687U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor manufacturing technologies, and particularly to an electroplating control device and a wafer preparation control system. Background Art
[0002] In the process of semiconductor manufacturing, wafer electroplating is an important link for realizing multi-layer circuit connection and metallization. However, when the traditional electroplating process is used for wafer electroplating, there are generally problems such as high process complexity, low efficiency, and long production time. Summary of the Invention
[0003] The technical problem to be solved by the present disclosure is to overcome the above-mentioned defects in the prior art and provide an electroplating control device and a wafer preparation control system.
[0004] The present disclosure solves the above technical problems through the following technical solutions:
[0005] The present disclosure provides an electroplating control device, which includes a controller, an electroplating head communicatively connected to the controller and capable of multi-directional rotation, and an electroplating solution tank structure;
[0006] Wherein, the electroplating solution tank structure includes a plurality of electroplating solution tanks, and each electroplating solution tank is independently distributed based on the position of the manipulator. The manipulator is used to transport the object to be electroplated to the electroplating head for fixation;
[0007] The controller is used to send a target driving instruction to the electroplating head;
[0008] The electroplating head is used to receive the target driving instruction and transfer the object to be electroplated to different electroplating solution tanks in sequence according to a first preset electroplating path;
[0009] Wherein, at each electroplating solution tank, the electroplating head is used to drive the object to be electroplated to perform matching electroplating-related operations in the corresponding electroplating solution tank along a second preset electroplating path.
[0010] Preferably, different electroplating solution tanks are arranged at a radius position centered on the position of the manipulator.
[0011] Preferably, different electroplating solution tanks are centered at the radius position centered on the position of the manipulator.
[0012] Preferably, the radius positions where different electroplating solution tanks are located include positions within the moving range of the manipulator and arranged in a semi-circular array.
[0013] Preferably, different electroplating solution tanks are arranged at equal intervals.
[0014] Preferably, the moving directions of the electroplating head that can rotate in multiple directions include a horizontal moving direction that can be transferred above different electroplating solution tanks, a vertical moving direction that can be transferred into any one of the electroplating solution tanks for electroplating, and a preset flipping direction for flipping the object to be electroplated.
[0015] Preferably, the object to be electroplated includes a wafer.
[0016] Preferably, the electroplating solution contained in the electroplating solution tank includes Ni (nickel) electroplating solution or Au (gold) electroplating solution.
[0017] Preferably, at least one of the distribution spacing, quantity, and size of different electroplating solution tanks is set based on the target process requirements.
[0018] The present disclosure also provides a wafer preparation control system, and the wafer preparation control system includes the electroplating control device as described above.
[0019] On the basis of conforming to the common knowledge in the art, the above preferred conditions can be combined arbitrarily to obtain various preferred examples of the present disclosure.
[0020] The positive and progressive effects of the present disclosure are as follows:
[0021] In the present disclosure, in the electroplating area, each electroplating solution tank is distributed based on the manipulator. By combining the positions and structural layouts of these electroplating solution tanks with the electroplating head that can move in multiple directions, it is possible to allow the manipulator to continuously transfer the object to be electroplated from one electroplating solution tank directly to another electroplating solution tank based on the electroplating head without changing its position, realizing the continuous electroplating or cleaning process of different metal layers of the object to be electroplated. That is, the continuous transfer of the object to be electroplated between electroplating solution tanks is achieved, and the automatic picking, placing, and electroplating process of the object to be electroplated between electroplating areas is more smooth, without returning to the initial position, reducing the operation steps, effectively saving the transfer time, significantly shortening the overall electroplating time, and improving the continuity and efficiency of the process flow; in addition, through continuous electroplating processes and precise manipulator operations, the number of times the object to be electroplated is exposed to the environment is effectively reduced, and the risks of environmental pollution and cross-contamination are reduced, thereby ensuring the quality of the product. Description of the Drawings
[0022] Figure 1 It is a schematic diagram of the modules of the electroplating control device provided in Embodiment 1 of the present disclosure.
[0023] Figure 2 It is a schematic structural diagram of the electroplating solution tank structure provided in Embodiment 2 of the present disclosure.
[0024] Figure 3 It is a schematic structural diagram of the electroplating control device provided in Embodiment 2 of the present disclosure
[0025] Figure 4 This is a schematic diagram of the modules of the wafer preparation control system provided in Embodiment 3 of the present disclosure. Detailed implementation manners
[0026] The present disclosure will be further described below by way of embodiments, but the present disclosure is not limited thereto.
[0027] In the embodiments of the present disclosure, prefix words such as "first" and "second" are only used to distinguish different described objects, and have no limiting effect on the position, order, priority, quantity or content of the described objects. The use of ordinal words and other prefix words for distinguishing described objects in the embodiments of the present disclosure does not constitute a limitation on the described objects. The statements of the described objects refer to the descriptions in the context of the claims or embodiments, and should not constitute redundant limitations due to the use of such prefix words. In addition, in the description of this embodiment, unless otherwise specified, "a plurality of" means two or more.
[0028] In the semiconductor manufacturing process, the traditional electroplating process has low efficiency when continuously electroplating wafers. Based on this, a new type of electroplating control device is proposed. The electroplating control device grabs the wafer from the EFEM (a semiconductor production device) system by a manipulator and transports it to the electroplating head; the electroplating head first flips to make the wafer face up and fixes the wafer by vacuum adsorption; then, the electroplating head flips the wafer again and vertically places it in the electroplating solution for electroplating; after electroplating is completed, the manipulator grabs the wafer and directly moves it along the track to the next electroplating tank, and repeats the above electroplating steps until the wafer electroplating is completed.
[0029] In order to further improve the electroplating efficiency and further optimize the design of the electroplating control device, the present disclosure proposes a new type of integrated electroplating control device, which realizes continuous electroplating of wafers in the electroplating area by using the distribution design of the electroplating tanks in the electroplating area and the multi-directional movement ability of the electroplating head, so as to solve the problems existing in the existing electroplating process. Specifically:
[0030] Embodiment 1
[0031] As Figure 1 shown, the present disclosure provides an electroplating control device, which includes a controller 1, an electroplating head 2 communicatively connected to the controller 1 and capable of multi-directional rotation, and an electroplating solution tank structure 3;
[0032] Among them, the electroplating solution tank structure 3 includes a plurality of electroplating solution tanks 4, and each electroplating solution tank 4 is independently distributed based on the position of the manipulator. The manipulator is used to transport the object to be electroplated (including but not limited to wafers) to the electroplating head 2 for fixation;
[0033] The object to be electroplated includes but is not limited to wafers.
[0034] Specifically, the moving directions of the rotatable electroplating head 2 in multiple directions include: the horizontal moving direction that can be transferred above different electroplating solution tanks 4, the vertical moving direction that can be transferred into any one of the electroplating solution tanks 4 for electroplating, the preset flipping direction for flipping the object to be electroplated, etc. The controller 1 is used to send a target driving instruction to the electroplating head 2;
[0035] The electroplating head 2 is used to receive the target driving instruction and transfer the object to be electroplated to different electroplating solution tanks 4 in sequence according to the first preset electroplating path;
[0036] Wherein, at each electroplating solution tank 4, the electroplating head 2 is used to drive the object to be electroplated to perform matching electroplating-related operations in the corresponding electroplating solution tank 4 along the second preset electroplating path;
[0037] For example, the structure 3 of the electroplating solution tank 4 includes 3 electroplating solution tanks 4 arranged around the manipulator. The first preset electroplating path corresponds to: transferring the object to be electroplated to the 3 electroplating solution tanks 4 in sequence from left to right. The second preset electroplating path corresponds to: driving the electroplating head 2 to flip 180 degrees along the set direction to ensure that the wafer is face up, and firmly fixing the wafer by the principle of vacuum adsorption; after the fixation is completed, the electroplating head 2 flips 180 degrees again along the set direction to restore the wafer to the initial position, and then moves vertically downward along the Z axis to immerse the wafer into the electroplating solution in the corresponding electroplating solution tank 4 for electroplating treatment. After the electroplating is completed, the electroplating head 2 moves to the adjacent electroplating solution tank 4 to perform electroplating with the next pair of metal electroplating solutions or other operations until the electroplating of each metal electroplating solution is completed to determine the completion of the electroplating operation on the wafer;
[0038] Of course, for different target-driven instructions, the corresponding first preset electroplating path and second preset electroplating path will be different, and can be specifically set or adjusted according to the requirements of the actual process preparation scenario, and flexibly set to meet the operation requirements of different scenarios; the specific implementation process is similar to the above process and will not be elaborated here. In this solution, in the electroplating area, each electroplating bath 4 is distributed based on the manipulator. By combining the positions and structural layouts of these electroplating baths 4 with the electroplating head 2 that can move in multiple directions, it is possible to allow the manipulator to continuously transfer the object to be electroplated from one electroplating bath 4 directly to another electroplating bath 4 without changing its position based on the electroplating head 2, realizing the continuous electroplating or cleaning process of different metal layers of the object to be electroplated, that is, realizing the continuous transfer of the object to be electroplated between the electroplating baths 4. The automatic picking, placing and electroplating process of the wafer between the electroplating areas is smoother, without returning to the initial position, reducing the operation steps, effectively saving the transfer time, significantly shortening the overall electroplating time, and improving the continuity and efficiency of the process flow; in addition, through the continuous electroplating process and precise manipulator operation, the number of times the object to be electroplated is exposed to the environment is effectively reduced, and the risks of environmental pollution and cross-contamination are reduced, thus ensuring the product quality.
[0039] Embodiment 2
[0040] The electroplating control device of this embodiment is a further improvement of Embodiment 1. Specifically:
[0041] In an implementable solution, different electroplating baths 4 are arranged at a radius position centered on the position of the manipulator.
[0042] In this solution, with the position of the manipulator as the center, different electroplating baths 4 are arranged at the radius position, so that it is possible to allow the manipulator to continuously transfer the object to be electroplated from one electroplating bath 4 directly to another electroplating bath 4 without changing its position based on the electroplating head 2, realizing the continuous transfer of the object to be electroplated between the electroplating baths 4, without returning to the initial position, reducing the operation steps, effectively saving the transfer time, significantly shortening the overall electroplating time, and improving the continuity and efficiency of the process flow.
[0043] In an implementable solution, different electroplating baths 4 are centered at a radius position centered on the position of the manipulator.
[0044] Preferably, as Figure 2 shown, the radius positions where different electroplating baths 4 are located include positions arranged in a semi-circular array within the moving range of the manipulator.
[0045] Furthermore, different electroplating baths 4 are arranged at equal intervals.
[0046] Among them, Figure 2 in Figure 2 , the R direction corresponds to the direction in which the electroplating head moves to different electroplating solution tanks, A corresponds to the electroplating head, and B and C correspond to different electroplating solution tanks (for example, B corresponds to the Au electroplating solution tank and C corresponds to the Ni electroplating solution tank); the semi-circular dotted line is at the radius position centered on the position of the manipulator.
[0047] In this solution, through the reasonable and optimized design of the positions of different electroplating solution tanks 4 relative to the manipulator, the manipulator can truly transfer the object to be electroplated directly from one electroplating solution tank 4 to another electroplating solution tank 4 continuously based on the electroplating head 2 without changing its position, realizing the continuous transfer of the object to be electroplated between the electroplating solution tanks 4, so as to greatly improve the continuity and efficiency of the process flow.
[0048] In an implementable solution, the electroplating solution contained in the electroplating solution tank 4 includes Ni electroplating solution, Au electroplating solution, etc.
[0049] In this solution, other types of electroplating solutions can also be contained in the electroplating solution tank 4, and which electroplating solution tank 4 contains what type of electroplating solution and the amount of the electroplating solution contained can all be determined or adjusted according to the actual situation to meet the electroplating requirements of different electroplating scenarios.
[0050] In an implementable solution, at least one of the distribution spacing, quantity, and size of different electroplating solution tanks 4 is set based on the target process requirements.
[0051] In this solution, how far apart different electroplating solution tanks 4 are from each other, how many electroplating solution tanks 4 are set, and the size of each electroplating solution tank 4 can all be designed or adjusted according to the actual situation to achieve personalized design for specific electroplating scenarios and meet the requirements of various scenarios as much as possible.
[0052] Next, in combination with Figure 3 , the working principle of the electroplating control device of this embodiment will be specifically described: (1) Based on the target drive instruction, the electroplating head A flips 180 degrees along the set direction (such as the θ direction in Figure 3 ) to ensure that the wafer is face up and firmly fixes the wafer through the principle of vacuum adsorption;
[0053] (2) After the fixation is completed, the electroplating head A flips 180 degrees along the θ direction again to restore the wafer to the initial position;
[0054] (3) Move vertically downward along the Z axis to immerse the wafer in the electroplating solution in the electroplating solution tank B (or C) for electroplating;
[0055] (4) After the electroplating process is completed, the electroplating head A utilizes its ability to move left and right along the R axis and directly moves to the adjacent electroplating solution tank to perform electroplating of the next metal or other subsequent operations; similarly in sequence until the electroplating operations for all metal layers on the wafer are completed, thereby determining the completion of the entire wafer electroplating process.
[0056] Embodiment 3
[0057] As Figure 4 shown, the present disclosure also provides a wafer preparation control system 100, and the wafer preparation control system includes the electroplating control device 200 as in Embodiment 1 or Embodiment 2 above.
[0058] The electroplating control device as described above is integrated in the wafer preparation control system of this solution, thereby realizing the continuous transfer of the object to be electroplated between the electroplating solution tanks without returning to the initial position, reducing the operation steps, effectively saving the transfer time, significantly shortening the overall electroplating time, improving the continuity and efficiency of the process flow, and thus enhancing the overall performance of the entire wafer preparation control system.
[0059] Although the specific embodiments of the present disclosure have been described above, those skilled in the art should understand that this is only for illustration purposes. The protection scope of the present disclosure is defined by the appended claims. Without departing from the principles and essence of the present disclosure, those skilled in the art can make various changes or modifications to these embodiments, but these changes and modifications all fall within the protection scope of the present disclosure.
Claims
1. An electroplating control device, characterized in that, The electroplating control device includes a controller, an electroplating head communicatively connected to the controller and capable of multi-directional rotation, and an electroplating solution tank structure; Among them, the electroplating solution tank structure includes a plurality of electroplating solution tanks, and each electroplating solution tank is independently distributed based on the position of the manipulator. The manipulator is used to transport the object to be electroplated to the electroplating head for fixation; The controller is used to send a target drive instruction to the electroplating head; The electroplating head is used to receive the target drive instruction and transfer the object to be electroplated to different electroplating solution tanks in sequence according to a first preset electroplating path; Among them, at each electroplating solution tank, the electroplating head is used to drive the object to be electroplated to perform matching electroplating-related operations in the corresponding electroplating solution tank along a second preset electroplating path.
2. The electroplating control device according to claim 1, wherein The different electroplating solution tanks are arranged at a radius position centered on the position of the manipulator.
3. The electroplating control device according to claim 2, wherein The centers of the different electroplating solution tanks are located at the radius position centered on the position of the manipulator.
4. The electroplating control device according to claim 3, characterized in that, The radius positions where the different electroplating solution tanks are located include positions within the movement range of the manipulator and arranged in a semi-circular array.
5. The electroplating control device according to claim 4, wherein, The different electroplating solution tanks are arranged at equal intervals.
6. The electroplating control device according to claim 1, wherein, The movement directions of the electroplating head capable of multi-directional rotation include a horizontal movement direction that can be transferred above different electroplating solution tanks, a vertical movement direction that can be transferred into any one of the electroplating solution tanks for electroplating, and a preset flipping direction for flipping the object to be electroplated.
7. The electroplating control device according to any one of claims 1-6, characterized in that, The object to be electroplated includes a wafer.
8. The electroplating control device according to any one of claims 1-6, characterized in that, The electroplating solution contained in the electroplating solution tank includes Ni electroplating solution or Au electroplating solution.
9. The electroplating control device according to any one of claims 1-6, characterized in that, At least one of the distribution spacing, quantity, and size of the different electroplating solution tanks is set based on the target process requirements.
10. A wafer preparation control system, characterized in that, The wafer preparation control system includes the electroplating control device according to any one of claims 1-9.