Solder strip arranging and clamping device and solder strip arranging system

Abstract

The utility model provides a welding strip arranging and clamping device and a welding strip arranging system.The welding strip arranging and clamping device comprises a base, a power output part, a limiting part and clamping assemblies, in the x direction, the two sides of the base are each provided with one clamping assembly, and each clamping assembly comprises a plurality of clamping jaw units arranged in the y direction; the power output part drives all the clamping jaw units to clamp or release a plurality of welding strips at the same time. In the x direction, a plurality of limiting pieces are arranged between the two clamping jaw units located on the same horizontal line, the limiting pieces comprise first limiting rods and second limiting rods, and gaps for containing welding strips are formed between the first limiting rods and the second limiting rods; when the welding strip is clamped, after the welding strip is arranged in the gap, the two ends of the welding strip are clamped by the corresponding clamping jaw units; when the welding strip is released, after the first limiting rod and the second limiting rod elastically abut against the battery piece, the clamping jaw unit loosens the welding strip, so that the welding strip falls to the preset position along the gap, and high arrangement precision and arrangement efficiency are achieved.

Description

Technical Field

[0001] This application belongs to the technical field of photovoltaic module production. Specifically, it relates to a solder ribbon arranging and gripping device and a solder ribbon arranging system. Background Art

[0002] As the size of photovoltaic modules gradually increases, the number of solder ribbons required in the manufacturing process of photovoltaic modules also increases accordingly, resulting in higher and higher requirements for the arranging accuracy of solder ribbons during the arranging process. Existing solder ribbon handling grippers are difficult to meet the high precision and high efficiency required for the solder ribbon arrangement of a whole-board module.

[0003] During the solder ribbon arranging process, the commonly used gripping device is that two grippers open and close simultaneously around a rotating shaft, or one gripper is fixed and the other gripper opens and closes around the rotating shaft, so as to grip or place the solder ribbon on the cell or the backsheet. During the process of gripping the solder ribbon, the solder ribbon is prone to adhesion to the gripper, resulting in the solder ribbon being easily driven to cause lateral displacement during the opening and closing process of the gripper, thus affecting the accuracy of placing the solder ribbon on the cell or the backsheet. Summary of the Utility Model

[0004] In view of this, this application provides a solder ribbon arranging and gripping device and a solder ribbon arranging system. By arranging a plurality of limit members between two gripper units for gripping the same solder ribbon, the solder ribbon falls along the gap of the limit members to a preset position during the solder ribbon arranging process, realizing the high-precision handling and placement of a whole string of solder ribbons.

[0005] A solder ribbon arranging and gripping device provided by this application includes a base, a power output member, limit members, and a gripping assembly. On both sides of the base in the x direction, one gripping assembly is provided respectively. Each gripping assembly includes a plurality of gripper units arranged along the y direction. The power output member drives all the gripper units to grip or release multiple solder ribbons;

[0006] In the x direction, a plurality of limit members are arranged between two gripper units on the same horizontal line. The limit members include a first limit rod and a second limit rod. The first limit rod and the second limit rod are installed on the side of the base facing the solder ribbon along the y direction. There is a gap for accommodating the solder ribbon between the first limit rod and the second limit rod;

[0007] When gripping the solder ribbon, after the solder ribbon is placed in the gap, both ends of the solder ribbon are clamped by the corresponding gripper units; when releasing the solder ribbon, after the first limit rod and the second limit rod elastically press against the cell, the gripper units release the solder ribbon, so that the solder ribbon falls along the gap to a preset position.

[0008] Preferably, in the x direction, three limit members are provided between two jaw units located on the same horizontal line, and are respectively arranged corresponding to the two ends and the middle of the same solder tape.

[0009] Preferably, the jaw unit includes an upper clamping part and a lower clamping part, and the clamping assembly includes an upper mounting plate and a lower mounting plate. All the upper clamping parts corresponding to each clamping assembly are mounted on the same upper mounting plate along the y direction, and all the lower clamping parts corresponding to each clamping assembly are mounted on the same lower mounting plate along the y direction;

[0010] When clamping the solder tape, the power output member drives the lower mounting plate to move laterally, so that all the lower clamping parts on the lower mounting plate simultaneously move from the side below the corresponding solder tape to below the solder tape, and can drive the upper mounting plate to move downward, so that all the upper clamping parts on the upper mounting plate move downward simultaneously until each upper clamping part presses the solder tape below it on the lower clamping part below the solder tape, and finally both ends of each solder tape are clamped by the corresponding jaw unit;

[0011] When placing the solder tape, the power output member drives the upper mounting plate to move upward, so that all the upper clamping parts on the upper mounting plate move upward simultaneously, and can drive the lower mounting plate to move laterally, so that all the lower clamping parts on the lower mounting plate simultaneously move from below the corresponding solder tape to the side below the solder tape, so that all the solder tapes are placed at the preset positions.

[0012] Preferably, a cam follower is mounted on the upper mounting plate, and a guide groove is formed on the lower mounting plate. The upper part of the guide groove is inclined, and the lower part of the guide groove is vertical;

[0013] When clamping the solder tape, the power output member drives the upper mounting plate to move downward, and the cam follower moves from the upper end of the guide groove to the lower end, so that the lower clamping part moves from the side below the solder tape to below the solder tape, and at the same time the upper clamping part moves downward until the upper clamping part presses the solder tape on the lower clamping part below the solder tape;

[0014] When placing the solder tape, the power output member drives the upper mounting plate to move upward, and the cam follower moves from the lower end of the guide groove to the upper end, so that the upper clamping part moves upward, and at the same time the lower clamping part moves from below the solder tape to the side below the solder tape.

[0015] Preferably, during the process of clamping and placing the solder tape, the upper mounting plate is guided by a vertical guiding element, and the lower mounting plate is guided by a horizontal guiding element.

[0016] Preferably, the power output member includes a rotating shaft, two pressing wheels and two springs. Both of the pressing wheels are fixedly installed on the rotating shaft. Above each upper mounting plate, there is provided one pressing wheel. One end of the spring is connected to the upper end of the upper mounting plate, and the other end is connected to the base;

[0017] The rotating shaft rotates to drive the pressing wheel to gradually apply a downward force to the upper mounting plate below it, causing the spring to be gradually compressed, so that the upper mounting plate moves downward. Or the rotating shaft rotates to make the downward force applied by the pressing wheel to the upper mounting plate below it gradually return to zero, causing the spring to gradually return to its initial state, so that the upper mounting plate moves upward.

[0018] Preferably, it further includes a first pressing assembly and a second pressing assembly. The first pressing assembly includes a first power output member and a first pressing plate. The first pressing plate is located in the middle of the base. The first power output member drives the first pressing plate to move up and down. Along the y direction, a plurality of first pressing parts are provided on the first pressing plate, and each first pressing part corresponds to one solder tape;

[0019] The second pressing assembly includes a second power output member and two second pressing plates. The second power output member drives the two second pressing plates to move up and down. Along the x direction, the two second pressing plates are respectively located on both sides of the base. Along the y direction, a plurality of second pressing parts are provided on each second pressing plate, and each second pressing part on each second pressing plate corresponds to one solder tape;

[0020] When placing the solder tape, the first power output member drives the first pressing plate to move downward until each first pressing part presses the middle part of the solder tape below it on the battery cell. Then the jaw unit releases the solder tape. Subsequently, the second power output member drives the two second pressing plates to move downward until each second pressing part on one of the second pressing plates presses one end of the solder tape below it on the battery cell, and each second pressing part on the other second pressing plate presses the other end of the solder tape below it on the battery cell.

[0021] Preferably, the first pressing assembly further includes a first guiding member, and the first pressing plate is guided by the first guiding member during the up and down movement; and / or,

[0022] The second pressing assembly further includes a second guiding member, and the second pressing plate is guided by the second guiding member during the up and down movement.

[0023] Preferably, along the x-direction, UV lamp mounting brackets are provided both in the middle of the base and on both sides of the base. The length direction of each UV lamp mounting bracket is arranged along the y-direction, and a UV lamp is installed at the bottom of each of them.

[0024] After the solder tape is placed at a preset position, each of the UV lamps is activated so that each solder joint on each solder tape can be irradiated by the UV lamp, thereby preliminarily fixing all the solder tapes at the preset position.

[0025] A solder tape layout system provided in this application includes a plurality of solder tape layout clamping devices arranged along the x-direction to simultaneously clamp or release multiple groups of solder tapes.

[0026] The beneficial effects of this application are as follows:

[0027] 1. When clamping the solder tape, the solder tape is placed in the gap, and both ends of the solder tape are then clamped by the jaws of the jaw unit to ensure that each solder tape is clamped by the corresponding jaw unit; when placing the solder tape, after the first limiting rod and the second limiting rod press on the battery cell, the jaw unit then releases the solder tape, enabling the solder tape to fall along the gap to the preset position, having a high layout accuracy and layout efficiency.

[0028] 2. When clamping and placing the solder tape, the lower clamping part moves between the lower side and the bottom of the solder tape, cooperating with the upper clamping part to clamp the solder tape up and down, and to carry and place the solder tape, which can ensure the layout accuracy of the solder tape while carrying an entire string of solder tapes at the same time.

[0029] 3. When placing the solder tape, under the mutual cooperation of the first pressing component and the second pressing component, it is possible to further prevent the solder tape from shifting in position during the layout process, and after the solder tape is placed at the preset position, it can be preliminarily fixed at the preset position by being irradiated with a UV lamp. Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the provided drawings.

[0031] The structures, ratios, sizes, etc. depicted in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which this application can be implemented. Therefore, they do not have technical essential significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that this application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in this application.

[0032] Figure 1 A perspective view of the solder strip arranging and gripping device provided for this application from the first perspective;

[0033] Figure 2 A perspective view of the solder strip arranging and gripping device provided for this application from the second perspective;

[0034] Figure 3 The front view of the solder strip arranging and gripping device provided for this application;

[0035] Figure 4 The side view of the solder strip arranging and gripping device provided for this application;

[0036] Figure 5 The bottom view of the solder strip arranging and gripping device provided for this application;

[0037] Figure 6 It is a structural diagram of the cam follower and the guiding groove cooperating with each other.

[0038] In the figure: 1 - base; 11 - main body base; 12 - adapter plate; 13 - first mounting bracket; 131 - first connecting rod; 14 - first UV lamp mounting bracket; 15 - first UV lamp; 16 - second mounting bracket; 161 - second connecting rod; 17 - second UV lamp mounting bracket; 18 - second UV lamp; 2 - power output member; 21 - pressure wheel; 22 - spring; 3 - limiting member; 31 - gap; 32 - first limiting rod; 33 - second limiting rod; 4 - solder strip; 5 - jaw unit; 51 - upper gripping part; 52 - lower gripping part; 53 - upper mounting plate; 54 - lower mounting plate; 55 - cam follower; 56 - guiding groove; 57 - vertical guiding element; 58 - horizontal guiding element; 6 - first pressing assembly; 61 - first power output member; 611 - first pressure wheel; 62 - first pressing plate; 63 - first downward pressing part; 64 - first guiding element; 641 - first guide rod; 642 - first linear bearing; 7 - second pressing assembly; 71 - second power output member; 711 - second pressure wheel; 72 - second pressing plate; 73 - second downward pressing part; 74 - second guiding element; 741 - second guide rod; 742 - second linear bearing; 8 - connecting plate; 9 - leveling bolt. Detailed implementation manners

[0039] Next, the embodiments in the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0040] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0041] The present application provides a solder ribbon arrangement clamping device. Referring to Figures 1-6 , it includes a base 1, a power output member 2, a limiting member 3, and a clamping assembly. In the x-direction, a clamping assembly is provided on each side of the base 1. Each clamping assembly includes a plurality of jaw units 5 arranged along the y-direction. The power output member 2 drives all the jaw units 5 to clamp or release a plurality of solder ribbons 4.

[0042] In the x-direction, a plurality of limiting members 3 are provided between two jaw units 5 located on the same horizontal line. The limiting member 3 includes a first limiting rod 32 and a second limiting rod 33. The first limiting rod 32 and the second limiting rod 33 are installed on the side of the base 1 facing the solder ribbon 4 along the y-direction. There is a gap 31 for accommodating the solder ribbon between the first limiting rod 32 and the second limiting rod 33.

[0043] When clamping the solder ribbon 4, after the solder ribbon 4 is placed in the gap 31, both ends of the solder ribbon 4 are clamped by the corresponding jaw units 5. When releasing the solder ribbon 4, after the first limiting rod 32 and the second limiting rod 33 elastically press against the solar cell, the jaw units 5 release the solder ribbon 4, so that the solder ribbon 4 falls along the gap 31 to a preset position.

[0044] In this embodiment, the x-direction refers to the extending direction of the solder ribbon 4, and the y-direction refers to the direction perpendicular to the extending direction of the solder ribbon 4, that is, the arrangement direction of the solder ribbons 4 in a group of solder ribbons 4. The preset position refers to the position where the main grid lines are located on the solar cell.

[0045] A solder ribbon arrangement clamping device can clamp or release a group of solder ribbons 4 at the same time. Here, a group of solder ribbons 4 refers to the solder ribbons 4 required for a solar cell, that is, the number of solder ribbons 4 in a group of solder ribbons 4 is the same as the number of main grid lines on a solar cell. Through a solder ribbon arrangement clamping device, a group of solder ribbons 4 can be arranged on a solar cell at the same time, having a high arrangement efficiency.

[0046] Each solder ribbon 4 in this embodiment is limited by a plurality of limiting members 3. Specifically, the two jaw units 5 cooperate with each other so that both ends of the solder ribbon 4 are clamped. During the process of placing the solder ribbon 4 on the main grid line, the limiting member 3 first contacts the solar cell, and then the jaw units 5 release the solder ribbon 4, so that each solder ribbon 4 falls along the corresponding gap 31 to the main grid line to avoid the position of the solder ribbon 4 from shifting when it is placed on the main grid line.

[0047] The first limiting rod 32 and the second limiting rod 33 can be probe structures, or other elastic structures, or the parts of the first limiting rod 32 and the second limiting rod 33 in contact with the solar cell are made of elastic materials. This embodiment does not make specific limitations on this, as long as it can elastically press against the solar cell before the jaw unit 5 releases the solder tape 4 and will not damage the solar cell.

[0048] The width of the gap 31 between the first limiting rod 32 and the second limiting rod 33 should be greater than the width of the solder tape 4, so that the solder tape 4 can be placed in the corresponding gap 31 during the process of gripping and transporting the solder tape 4.

[0049] Preferably, in the x direction, three limiting members 3 are provided between two jaw units 5 located on the same horizontal line, and are respectively arranged corresponding to the two ends and the middle part of the same solder tape 4. In this way, during the process of gripping and transporting the solder tape 4, both ends and the middle part of each solder tape 4 are restricted within the corresponding gap 31, and when placing the solder tape 4, both ends and the middle part of the solder tape 4 can be accurately placed on the corresponding main grid lines on the solar cell along the corresponding gap 31, so that the solder tape 4 is arranged on the solar cell with a high arrangement accuracy.

[0050] Reference Figures 1-3 As shown in, the jaw unit 5 includes an upper gripping part 51 and a lower gripping part 52, and the gripping assembly includes an upper mounting plate 53 and a lower mounting plate 54. All the upper gripping parts 51 corresponding to each gripping assembly are mounted on the same upper mounting plate 53 along the y direction, and all the lower gripping parts 52 corresponding to each gripping assembly are mounted on the same lower mounting plate 54 along the y direction;

[0051] When gripping the solder tape 4, the power output member 2 drives the lower mounting plate 54 to move horizontally, so that all the lower gripping parts 52 on the lower mounting plate 54 simultaneously move from the side below the corresponding solder tape 4 to below the solder tape 4, and can drive the upper mounting plate 53 to move downward, so that all the upper gripping parts 51 on the upper mounting plate 53 simultaneously move downward until each upper gripping part 51 presses the solder tape 4 below it onto the lower gripping part 52 below the solder tape 4, and finally both ends of each solder tape 4 are clamped by the corresponding jaw unit 5;

[0052] When placing the solder tape 4, the power output member 2 drives the upper mounting plate 53 to move upward, so that all the upper gripping parts 51 on the upper mounting plate 53 simultaneously move upward, and can drive the lower mounting plate 54 to move horizontally, so that all the lower gripping parts 52 on the lower mounting plate 54 simultaneously move from below the corresponding solder tape 4 to the side below the solder tape 4, so that all the solder tapes 4 are placed at the preset positions.

[0053] When placing the welding ribbon 4, the upper clamping part 51 moves upward to separate from the welding ribbon 4, and the lower clamping part 52 moves horizontally from below the welding ribbon 4 to the side below the welding ribbon 4. In this way, the horizontal offset degree of the welding ribbon 4 can be reduced when placing the welding ribbon 4, so that the welding ribbon 4 is arranged on the battery cell with a high arrangement accuracy.

[0054] The upper clamping part 51 can be made of a probe or other flexible materials, as long as the upper clamping part 51 does not damage the welding ribbon 4 when cooperating with the lower clamping part 52 to clamp and place the welding ribbon 4.

[0055] The lower clamping part 52 has a high hardness, so that when the upper clamping part 51 presses the welding ribbon 4 on the lower clamping part 52, the lower clamping part 52 will not be deformed due to the downward pressure of the upper clamping part 51, ensuring that the welding ribbon 4 can be clamped by the upper clamping part 51 and the lower clamping part 52. In addition, the thickness of the lower clamping part 52 is relatively thin. In this way, during the process of placing the welding ribbon 4, the height of the welding ribbon 4 from the battery cell can be made smaller, thereby reducing the offset degree of the welding ribbon 4 during the falling process. Preferably, the thickness of the lower clamping part 52 is below 0.5 mm.

[0056] The horizontal plane where the lower surfaces of the first limiting rod 32 and the second limiting rod 33 are located is lower than the horizontal plane where the lower surface of the lower clamping part 52 is located, so that when placing the welding ribbon 4, the first limiting rod 32 and the second limiting rod 33 can elastically press on the battery cell. At this time, the lower clamping part 52 and the battery cell do not contact, so that while the upper clamping part 51 moves upward, the lower clamping part 52 moves horizontally to release the welding ribbon 4.

[0057] In this embodiment, the power output member 2 can be four air cylinders, and each air cylinder drives an upper mounting plate 53 or a lower mounting plate 54 to move. When clamping the welding ribbon 4, the corresponding air cylinder first drives the corresponding lower mounting plate 54 to move horizontally, so that the lower clamping part 52 moves from the side below the corresponding welding ribbon 4 to below the welding ribbon 4, and then the corresponding air cylinder drives the corresponding upper mounting plate 53 to move downward until the upper clamping part 51 presses the corresponding welding ribbon 4 on the lower clamping part 52 below it. During this process, the upper mounting plates 53 in the two clamping assemblies can move simultaneously or differently, and the lower mounting plates 54 in the two clamping assemblies can also move simultaneously or differently, as long as the two ends of each welding ribbon 4 are finally clamped. When placing the welding ribbon 4, the welding ribbon 4 clamped by the two clamping jaws 5 moves above the main grid line of the battery cell. Subsequently, under the action of the corresponding air cylinder, the upper clamping part 51 moves upward to separate from the welding ribbon 4, and then under the action of the corresponding air cylinder, the lower clamping part 52 moves horizontally, so that the lower clamping part 52 moves from below the corresponding welding ribbon 4 to the side below the welding ribbon 4. At this time, the welding ribbon 4 is completely separated from the clamping jaw unit 5 and falls onto the main grid line of the battery cell.

[0058] The methods and devices for moving the solder tape 4 clamped by the gripper unit 5 above the battery cell are all prior arts and will not be described in detail here.

[0059] Alternatively, the power output member 2 can also drive the upper clamping portion 51 to move up and down and the lower clamping portion 52 to move horizontally at the same time. In this embodiment, this method of clamping the solder tape 4 is preferably adopted.

[0060] Specifically, referring to Figure 6 , a cam follower 55 is installed on the upper mounting plate 53, a guide groove 56 is formed on the lower mounting plate 54, the upper part of the guide groove 56 is inclined, and the lower part of the guide groove 56 is vertical;

[0061] When clamping the solder tape 4, the power output member 2 drives the upper mounting plate 53 to move downward, and the cam follower 55 moves from the upper end to the lower end of the guide groove 56, so that the lower clamping portion 52 moves from the side below the solder tape 4 to below the solder tape 4, and at the same time the upper clamping portion 51 moves downward until the upper clamping portion 51 presses the solder tape 4 on the lower clamping portion 52 below the solder tape 4;

[0062] When placing the solder tape 4, the power output member 2 drives the upper mounting plate 53 to move upward, and the cam follower 55 moves from the lower end to the upper end of the guide groove 56, so that the upper clamping portion 51 moves upward, and at the same time the lower clamping portion 52 moves from below the solder tape 4 to the side below the solder tape 4.

[0063] In this embodiment, the power output member 2 directly drives the upper mounting plate 53 to move up and down and indirectly drives the lower mounting plate 54 to move horizontally.

[0064] When clamping the solder tape 4, the power output member 2 drives the upper mounting plate 53 to move downward. The cam follower 55 first moves in the inclined upper part of the guide groove 56, so that while the upper mounting plate 53 moves downward, the lower mounting plate 54 moves horizontally. That is, during the downward movement of the upper clamping portion 51, the lower clamping portion 52 moves from the side below the solder tape 4 to below the solder tape 4. Subsequently, the power output member 2 continues to drive the upper mounting plate 53 to move downward, so that the cam follower 55 enters the vertical lower part of the guide groove 56. At this time, the lower mounting plate 54 no longer moves horizontally, and the lower clamping portion 52 is always located below the solder tape 4. During this process, the upper clamping portion 51 gradually presses down until it presses the solder tape 4 on the lower clamping portion 52 below it. It can be understood that the length of the lower part of the guide groove 56 should be able to satisfy the downward movement of the upper clamping portion 51 until the solder tape 4 is pressed on the lower clamping portion 52.

[0065] When placing the solder ribbon 4, the power output member 2 drives the upper mounting plate 53 to move upward. The cam follower 55 first moves within the lower portion of the guiding groove 56. At this time, the lower clamping portion 52 remains stationary, and the upper clamping portion 51 moves upward. Subsequently, the power output member 2 continues to drive the upper mounting plate 53 to move upward, causing the cam follower 55 to enter the upper portion of the guiding groove 56. At this time, the lower mounting plate 54 moves laterally. At the same time, the upper mounting plate 53 continues to move upward, that is, the lower clamping portion 52 moves from below the solder ribbon 4 to the side below the solder ribbon 4, and the upper clamping portion 51 continues to move upward, causing the solder ribbon 4 to be separated from the lower clamping portion 52 and placed on the corresponding main grid line of the solar cell.

[0066] Regarding the inclination angle of the upper portion of the guiding groove 56, it can be set according to the actually required lateral movement distance of the lower clamping portion 52. This angle enables the lower clamping portion 52 to be exactly located below the corresponding solder ribbon 4 when the cam follower 55 just moves from the upper portion of the guiding groove 56 to the lower portion.

[0067] Furthermore, the base 1 includes a main base 11 and two adapter plates 12. Along the x direction, the two adapter plates 12 are respectively installed on both sides of the main base 11, and the first limiting rod 32 and the second limiting rod 33 are both installed at the bottom of the main base 11.

[0068] As Figure 2 shown, during the process of clamping and placing the solder ribbon 4, the upper mounting plate 53 is guided by a vertical guiding element 57, and the lower mounting plate 54 is guided by a horizontal guiding element 58.

[0069] The vertical guiding element 57 and the horizontal guiding element 58 can be in the form of a guide rail cooperating with a slider, or can be linear motion components such as a guide rod and a linear bearing. In this embodiment, it is preferably to adopt the way of a guide rail cooperating with a slider to guide the movement of the upper mounting plate 53 and the lower mounting plate 54.

[0070] For example, the vertical guiding element 57 includes a vertical guide rail and a vertical slider. The vertical guide rail is vertically installed on the upper mounting plate 53, and the vertical slider is installed on the adapter plate 12. The vertical slider is slidably connected to the vertical guide rail. During the up and down movement of the upper mounting plate 53, the vertical guide rail slides up and down relative to the vertical slider to play a guiding role. Of course, it can also be that the vertical guide rail is vertically installed on the adapter plate 12 and the vertical slider is installed on the upper mounting plate 53. In this embodiment, it is preferably to set two vertical guiding elements 57, that is, along the y direction, both sides of the upper mounting plate 53 are slidably connected to the adapter plate 12 through a vertical guiding element respectively.

[0071] The horizontal guiding element 58 includes a horizontal guide rail and a horizontal slider. The horizontal guide rail is installed on the adapter plate 12 along the y direction, and the horizontal slider is installed on the lower mounting plate 54. The horizontal slider is slidably connected to the horizontal guide rail. During the lateral movement of the lower mounting plate 54, the horizontal slider slides relative to the horizontal guide rail to play a guiding role. Of course, it can also be that the horizontal slider is installed on the adapter plate 12 and the horizontal guide rail is installed on the lower mounting plate 54 along the y direction. In this embodiment, it is preferably set to have two horizontal guiding elements 58, that is, along the y direction, both sides of the lower mounting plate 54 are slidably connected to the adapter plate 12 through a horizontal guiding element 58 respectively.

[0072] As Figure 3 shown, the power output member 2 includes a rotating shaft (not shown in the figure), two pressing wheels 21 and two springs 22. Both of the two pressing wheels 21 are fixedly installed on the rotating shaft. Above each upper mounting plate 53, there is provided a pressing wheel 21. One end of the spring 22 is connected to the upper end of the upper mounting plate 53, and the other end is connected to the base 1;

[0073] The rotating shaft rotates to drive the pressing wheel 21 to gradually apply a downward force to the upper mounting plate 53 below it, so that the spring 22 is gradually compressed, thereby causing the upper mounting plate 53 to move downward, or the rotating shaft rotates to make the downward force applied by the pressing wheel 21 to the upper mounting plate 53 below it gradually return to zero, so that the corresponding spring 22 gradually returns to its initial state, thereby causing the upper mounting plate 53 to move upward.

[0074] In this embodiment, the upper end of the upper mounting plate 53 is located at the upper end of the adapter plate 12. One end of the spring 22 is connected to the upper end of the upper mounting plate 53, and the other end is connected to the upper end of the adapter plate 12. During the downward movement of the upper mounting plate 53, the spring 22 is compressed, and during the upward movement of the upper mounting plate 53, the spring 22 gradually returns to its initial state to realize the clamping and releasing of the welding tape 4.

[0075] When it is necessary to clamp the welding tape 4, the rotating shaft rotates, driving the two pressing wheels 21 to simultaneously apply a gradually downward force to the corresponding upper mounting plate 53, causing all the upper clamping portions 51 to move downward simultaneously, and all the lower clamping portions 52 to simultaneously move from the side below the corresponding welding tape 4 to below the welding tape 4. That is, under the action of the power output member 2, each clamping jaw unit 5 simultaneously clamps both ends of all the welding tapes 4 in a group of welding tapes 4. During this process, through the vertical guiding element 57 and the horizontal guiding element 58 for guiding, the spring 22 is gradually compressed.

[0076] When the solder tape 4 needs to be placed on the battery cell, the rotating shaft rotates in a direction opposite to the rotation direction when the solder tape 4 is clamped, so that the downward force applied by the pressing wheel 21 to the corresponding upper mounting plate 53 gradually returns to zero, that is, each clamping jaw unit 5 simultaneously releases both ends of all the solder tapes 4 in a group of solder tapes 4, so that a group of solder tapes 4 are simultaneously placed on the battery cell. During this process, through the vertical guiding element 57 and the horizontal guiding element 58 for guiding, the spring 22 gradually returns to its initial state, so that the upper mounting plate 53 moves upward to release each solder tape 4.

[0077] As Figures 1-3 shown, it further includes a first pressing assembly 6 and a second pressing assembly 7. The first pressing assembly 6 includes a first power output member 61 and a first pressing plate 62. The first pressing plate 62 is located in the middle of the base 1. The first power output member 61 drives the first pressing plate 62 to move up and down. Along the y direction, a plurality of first downward pressing portions 63 are provided on the first pressing plate 62, and each first downward pressing portion 63 corresponds to one solder tape 4;

[0078] The second pressing assembly 7 includes a second power output member 71 and two second pressing plates 72. The second power output member 71 drives the two second pressing plates 72 to move up and down. Along the x direction, the two second pressing plates 72 are respectively located on both sides of the base 1. Along the y direction, a plurality of second downward pressing portions 73 are provided on each second pressing plate 72, and each second downward pressing portion 73 on each second pressing plate 72 corresponds to one solder tape 4;

[0079] When placing the solder tape 4, the first power output member 61 drives the first pressing plate 62 to move downward until each first downward pressing portion 63 presses the middle part of the solder tape 4 below it on the battery cell, and then the clamping jaw unit 5 releases the solder tape 4. Subsequently, the second power output member 71 drives the two second pressing plates 72 to move downward until each second downward pressing portion 73 on one of the second pressing plates 72 presses one end of the solder tape 4 below it on the battery cell, and each second downward pressing portion 73 on the other second pressing plate 72 presses the other end of the solder tape 4 below it on the battery cell.

[0080] The specific process of placing the solder tape 4 on the battery cell in this embodiment is as follows:

[0081] After the solder tape 4 clamped by the gripper unit 5 moves to a specific position above the solar cell, the entire solder tape arrangement and clamping device moves downward until the first limiting rod 32 and the second limiting rod 33 elastically press against the solar cell below them. Subsequently, the first power output member 61 is activated to drive the first pressing plate 62 to move downward until each first downward pressing portion 63 presses the middle part of the solder tape 4 below it onto the main grid line below the solder tape 4. Then, the gripper unit 5 releases the solder tape 4, causing the solder tape 4 to be placed on the corresponding main grid line on the solar cell. Then, the second power output member 71 is activated to drive the two second pressing plates 72 to move downward simultaneously, so that both ends of each solder tape 4 are pressed onto the corresponding main grid line by the second downward pressing portion 73 above it. By arranging the solder tape 4 in the above manner, it can be further ensured that the position of the solder tape 4 will not shift during the arrangement process, improving the arrangement accuracy of the solder tape 4.

[0082] The first downward pressing portion 63 and the second downward pressing portion 73 can be designed in the form of probes, or can be springs, or can be made of flexible materials such as sponge and silica gel, as long as the first downward pressing portion 63 and the second downward pressing portion 73 will not damage the solder tape 4 and the solar cell when pressing the solder tape 4 on the solar cell.

[0083] Continue to refer to Figures 2-3 , the first pressing assembly 6 further includes a first guiding member 64, and the first pressing plate 62 is guided by the first guiding member 64 during the up and down movement; and / or,

[0084] The second pressing assembly 7 further includes a second guiding member 74, and the second pressing plate 72 is guided by the second guiding member 74 during the up and down movement.

[0085] The first guiding member 64 and the second guiding member 74 can be in the form of a guide rail cooperating with a slider, or can be linear motion devices such as a guide rod and a linear bearing. The settings of the first guiding member 64 and the second guiding member 74 can play a guiding role in the movement of the first pressing plate 62 and the second pressing plate 72, ensuring that each first downward pressing portion 63 and each second downward pressing portion 73 can press on the corresponding solder tape 4.

[0086] Preferably, both the first guiding member 64 and the second guiding member 74 are guide rods + linear bearings. Specifically, the first guiding member 64 includes a first guide rod 641 and a first linear bearing 642, and the second guiding member 74 includes a second guide rod 741 and a second linear bearing 742. Further, there are two first guiding members 64, and there are also two second guiding members 74 corresponding to each second pressing plate 72.

[0087] Refer to Figures 1-3 , UV lamp mounting brackets are provided in the middle and on both sides of the base 1, the length direction of each UV lamp mounting bracket is arranged along the y direction, and a UV lamp is installed at its bottom;

[0088] After the solder tapes 4 are placed at the preset positions, the UV lamps are activated so that each solder joint on each solder tape 4 can be irradiated by the UV lamps, thereby initially fixing all the solder tapes 4 at the preset positions.

[0089] Specifically, the UV lamp is strip-shaped, and its length is greater than or equal to the width of a group of solder tapes 4 in the y direction, so that in the y direction, the solder joints of a group of solder tapes 4 located on the same horizontal line can be irradiated by the same UV lamp.

[0090] The UV lamp mounting frame includes a first UV lamp mounting frame 14 and two second UV lamp mounting frames 17.

[0091] A through hole is provided in the middle of the main body substrate 11 along the y direction. Above the through hole, there is a first mounting frame 13 which is fixedly installed on the main body substrate 11. Below the first mounting frame 13, there is a first UV lamp mounting frame 14. A first UV lamp 15 is installed on the first UV lamp mounting frame 14. A first pressing plate 62 is arranged at the bottom of the first UV lamp mounting frame 14, and a plurality of hollow parts are provided at the bottom of the first pressing plate 62. Each hollow part corresponds to a plurality of solder joints or each hollow part corresponds to one solder joint, so that the light beam emitted by the first UV lamp 15 can irradiate the solder joints of each solder tape 4 through the hollow parts, or the entire bottom of the first pressing plate 62 is hollow, and in this way, the light beam emitted by the first UV lamp 15 can also irradiate the solder joints of each solder tape 4. In order to enable the first UV lamp 15 to irradiate the solder joints while the first pressing part 63 can also press the middle part of the corresponding solder tape 4 on the battery cell, the width of the first pressing plate 62 in this embodiment is greater than the width of the first UV lamp mounting frame 14, and the first pressing parts 63 are installed on one side of the first pressing plate 62 along the y direction.

[0092] Or this embodiment can also be designed such that the first pressing part 62 and the first UV lamp mounting frame 14 are the same component, the first UV lamp 15 is installed at the bottom of this component, and a plurality of first pressing parts 63 are installed on one side of this component along the y direction.

[0093] Along the y direction, a first linear bearing 642 is provided at each end of the first mounting bracket 13. The first guide rod 641 passes through the first mounting bracket 13 and passes through the corresponding first linear bearing 642. The lower ends of the two first guide rods 641 are fixedly connected to the first UV lamp mounting bracket 14. The two first guide rods 641 are connected by a first connecting rod 131. The first power output member 61 drives the first connecting rod 131 to move up and down, so that the first guide rod 641 moves up and down relative to the corresponding first linear bearing 642 to play a guiding role. Moreover, when the first guide rod 641 moves up and down, the first UV lamp mounting bracket 14 connected thereto can move up and down, so that the first UV lamp 15 and the first pressing portion 63 move up and down.

[0094] The first power output member 61 can be a cylinder, that is, the power output end of the cylinder is fixedly connected to the first connecting rod 131, and the first connecting rod 131 is driven to move up and down by the cylinder.

[0095] Alternatively, the first power output member 61 includes a first rotating shaft, a first pressing wheel 611 and a first spring. The first pressing wheel 611 is located above the first connecting rod 131, and the first pressing wheel 611 is fixedly installed on the first rotating shaft. One end of the first spring is connected to the first connecting rod 131, and the other end is connected to the first mounting bracket 13 below the first connecting rod 131. When the first rotating shaft rotates, the first pressing wheel 611 applies a downward force to the first connecting rod 131 or the downward force applied by the first pressing wheel 611 to the first connecting rod 131 gradually returns to zero, so that the first spring is compressed or gradually restored to the initial state, thereby causing the first UV lamp 15 and the first pressing portion 63 to move downward or upward. The specific process is similar to that of the rotating shaft driving the pressing wheel 21 described above.

[0096] This embodiment can also be designed as follows, referring to Figure 3 , the first pressing wheel 611 is fixedly connected to the first connecting rod 131, so that the first spring does not need to be provided, and the rotation of the first rotating shaft can directly move the first connecting rod 131 upward or downward.

[0097] In this embodiment, a second mounting bracket 16 is provided on one side of each adapter board 12 facing away from the main body base 11. A second UV lamp mounting bracket 17 is provided at the bottom of the second mounting bracket 16. A second UV lamp 18 is mounted on the second UV lamp mounting bracket 17. The second pressing plate 72 is disposed at the bottom of the second UV lamp mounting bracket 17, and a plurality of hollow portions are provided at the bottom of the second pressing plate 72. Each hollow portion corresponds to a plurality of solder joints or each hollow portion corresponds to a solder joint, so that the light beam emitted by the second UV lamp 18 can pass through the hollow portion and irradiate on the solder joints of each solder tape 4, or the entire bottom of the second pressing plate 72 is hollow, and in this way, the light beam emitted by the second UV lamp 18 can also irradiate on the solder joints of each solder tape 4. In order to enable the second UV lamp 18 to irradiate on the solder joints while the second pressing portion 73 can also press the corresponding solder tape 4 on the battery cell, the width of the second pressing plate 72 in this embodiment is greater than the width of the second UV lamp mounting bracket 17, and each second pressing portion 73 is mounted on one side of the second pressing plate 72 along the y direction.

[0098] The adapter board 12 is fixedly connected to the main body base 11 and the second mounting bracket 16 respectively. Along the y direction, a second linear bearing 742 is provided at each end of the second mounting bracket 16. The second guide rod 741 passes through the second mounting bracket 16 and passes through the corresponding second linear bearing 742. The lower ends of the two second guide rods 741 are fixedly connected to the second UV lamp mounting bracket 17. The two second guide rods 741 are connected by a second connecting rod 161. The second power output member 71 drives the second connecting rod 161 to move up and down, so that the second guide rod 741 moves up and down relative to the corresponding second linear bearing 742 to play a guiding role, and the second guide rod 741 moves up and down, which can make the second UV lamp mounting bracket 17 connected thereto move up and down, so that the second UV lamp 18 and the second pressing portion 73 move up and down.

[0099] The second power output member 71 can be a cylinder, that is, the power output end of the cylinder is fixedly connected to the second connecting rod 161, and the second connecting rod 161 is driven to move up and down by the cylinder.

[0100] Alternatively, the second power output member 71 includes a second rotating shaft, second pressing wheels 711 and second springs. Above each second connecting rod 161, there is provided a second pressing wheel 711. Along the x direction, the second pressing wheels 711 provided above the two second connecting rods 161 on both sides of the base 1 are fixed on the second rotating shaft. One end of the second spring is connected to the second connecting rod 161, and the other end is connected to the second mounting bracket 16 below the second connecting rod 161. The rotation of the second rotating shaft causes the second pressing wheel 711 to apply a downward force to the second connecting rod 161 or the downward force applied by the second pressing wheel 711 to the second connecting rod 161 gradually returns to zero, so that the second spring is compressed or gradually returns to its initial state, thereby causing the second UV lamp 18 and the second downward pressing portion 73 to move downward or upward. The specific process is similar to that of the rotating shaft driving the pressing wheel 21 described above.

[0101] Similarly, this embodiment can also be designed as follows. Referring to Figure 3 , the second pressing wheel 711 is fixedly connected to the second connecting rod 161, so that the second spring does not need to be provided. The rotation of the second rotating shaft can directly cause the two second connecting rods 161 to move upward or downward.

[0102] When the middle part of the solder tape 4 is pressed by the first downward pressing portion 63 on the main grid line corresponding to the battery cell, the first UV lamp 15 also moves downward. Then, the clamping assembly releases the solder tape 4. The two ends of the solder tape 4 are pressed by the corresponding second downward pressing portions 73 on the main grid line corresponding to the battery cell, and the second UV lamp 18 also moves downward. The first UV lamp 15 and the second UV lamp 18 can be started simultaneously or non-simultaneously to irradiate each solder joint on the solder tape 4, so that a set of solder tapes 4 are all preliminarily fixed on the main grid lines of the battery cells.

[0103] It can be understood that when the first UV lamp 15 and the second UV lamp 18 are started to irradiate each solder joint, both ends and the middle part of each solder tape 4 are pressed on the main grid line. After the irradiation is completed, the first downward pressing portion 63 and the second downward pressing portion 73 move upward again. In this way, the effect of fixing each solder tape 4 on the main grid line can be better, and the position between the solder tape 4 and the main grid line can be prevented from shifting during the irradiation of the UV lamp.

[0104] In the above description, a solder tape 4 is provided with a total of three solder joints in the middle and at both ends. In actual production, the number of solder joints on a solder tape 4 may be more or less than three. The number of UV lamps provided in this embodiment is the same as the number of solder joints on a solder tape 4, so that all solder joints on the solder tape 4 can be irradiated by the UV lamp.

[0105] In another embodiment of the present application, a solder tape arrangement system is provided, which includes a plurality of solder tape arrangement clamping devices arranged along the x direction to simultaneously clamp or release multiple groups of solder tapes 4.

[0106] Referring to Figure 2, a connecting plate 8 is provided above the main body base 11. The main body base 11 is installed on the connecting plate 8 through a plurality of leveling bolts 9, so that each solder ribbon arranging and clamping device is installed on a frame (not shown in the figure) through the corresponding connecting plate 8, and the levelness of the main body substrate 11 is adjusted through the corresponding leveling bolts 9 to ensure that each solder ribbon 4 can be smoothly clamped / released, each limiting rod can elastically press on the battery cell, and each pressing part can press the corresponding solder ribbon 4 on the main grid line.

[0107] In this embodiment, it can be set that two adjacent solder ribbon arranging and clamping devices share a second mounting frame 16, a second UV lamp mounting frame 17, a second UV lamp 18 and a second pressing plate 72. Specifically, along the y direction, a row of second pressing parts 73 are provided on each side of the second pressing plate 72. One row of second pressing parts 73 corresponds to the ends of each solder ribbon 4 in one group of solder ribbons 4, and the other row of second pressing parts 73 corresponds to the ends of each solder ribbon 4 in another adjacent group of solder ribbons 4. In the x direction, the width of the second UV lamp 18 can cover the adjacent two groups of solder joints in two adjacent groups of solder ribbons 4, so that the adjacent solder joints of the two adjacent groups of solder ribbons 4 can be irradiated by the same second UV lamp 18.

[0108] The number of solder ribbon arranging and clamping devices can be set according to the number of battery cells in a string of battery strings. One solder ribbon arranging and clamping device is used to clamp and arrange the solder ribbons 4 of one battery cell.

[0109] The pressing wheels 21 on each solder ribbon arranging and clamping device are fixedly installed on the same rotating shaft, the first pressing wheels 611 on each solder ribbon arranging and clamping device are fixedly installed on the same first rotating shaft, and the second pressing wheels 711 on each solder ribbon arranging and clamping device are fixedly installed on the same second rotating shaft.

[0110] The rotating shaft rotates, so that the pressing wheels 21 on each solder ribbon arranging and clamping device simultaneously apply a downward force to the lower mounting plate 54 below it or the downward force applied to the lower mounting plate 54 gradually becomes zero, so as to simultaneously clamp or release multiple groups of solder ribbons 4. The first rotating shaft rotates, so that the first pressing parts 63 on each solder ribbon arranging and clamping device simultaneously press the middle parts of the corresponding solder ribbons 4 on the battery cell. Similarly, the second rotating shaft rotates, so that the second pressing parts 73 on each solder ribbon arranging and clamping device simultaneously press the ends of the corresponding solder ribbons 4 on the battery cell. Through the above design, multiple groups of solder ribbons 4 are simultaneously clamped, transported and arranged, and the middle parts or both ends of all the solder ribbons 4 in multiple groups of solder ribbons 4 are simultaneously pressed on the main grid line, and the arranging efficiency is high.

[0111] When clamping, transporting, and arranging multiple groups of solder tapes 4 simultaneously, since the lower clamping part 52 moves between the side below the solder tape 4 and below the solder tape 4, when placing the entire string of solder tapes 4 at the corresponding position of the battery string, the lower clamping parts 52 in adjacent two solder tape arranging and clamping devices can smoothly disengage from the solder tape 4, enabling the normal transportation of the entire string of solder tapes 4.

[0112] While being able to quickly arrange the solder tapes 4 on the main grid lines of each cell in a string of battery cells, this application has a high arrangement accuracy. And after pressing the solder tape 4 on the main grid line, by irradiating with a UV lamp, the solder tape 4 can be preliminarily fixed on the main grid line, preventing the position between the solder tape 4 and the main grid line from shifting during the movement to the welding station.

[0113] In this specification, each embodiment is described in a progressive, or parallel, or a combination of progressive and parallel manners. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and reference can be made to the description of the method part for related parts.

[0114] It should be noted that in the description of this application, it should be understood that the orientation or positional relationships indicated by terms such as "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present simultaneously.

[0115] It also should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that an article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the article or device including the above elements.

[0116] The foregoing description of the disclosed embodiments enables those skilled in the art to practice or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A solder strip arrangement clamping device, characterized in that, It includes a base (1), a power output member (2), a limiting member (3) and a clamping assembly. On the x-axis, a clamping assembly is provided on each side of the base (1). Each clamping assembly includes a plurality of jaw units (5) arranged along the y-axis. The power output member (2) drives all the jaw units (5) to clamp or release a plurality of solder tapes (4). On the x-axis, a plurality of limiting members (3) are provided between two jaw units (5) on the same horizontal line. The limiting member (3) includes a first limiting rod (32) and a second limiting rod (33). The first limiting rod (32) and the second limiting rod (33) are installed on the side of the base (1) facing the solder tape (4) along the y-axis. There is a gap (31) for accommodating the solder tape (4) between the first limiting rod (32) and the second limiting rod (33). When clamping the solder tape (4), after the solder tape (4) is placed in the gap (31), both ends of the solder tape (4) are clamped by the corresponding jaw units (5). When releasing the solder tape (4), after the first limiting rod (32) and the second limiting rod (33) elastically press against the solar cell, the jaw units (5) release the solder tape (4), causing the solder tape (4) to fall along the gap (31) to a preset position.

2. The solder strip arrangement clamping device according to claim 1, wherein On the x-axis, three limiting members (3) are provided between two jaw units (5) on the same horizontal line, and they are respectively arranged corresponding to both ends and the middle of the same solder tape (4).

3. The solder tape arrangement clamping device according to claim 1, characterized in that, The jaw unit (5) includes an upper clamping part (51) and a lower clamping part (52). The clamping assembly includes an upper mounting plate (53) and a lower mounting plate (54). All the upper clamping parts (51) corresponding to each clamping assembly are installed on the same upper mounting plate (53) along the y-axis. All the lower clamping parts (52) corresponding to each clamping assembly are installed on the same lower mounting plate (54) along the y-axis. When clamping the solder tape (4), the power output member (2) drives the lower mounting plate (54) to move horizontally, so that all the lower clamping parts (52) on the lower mounting plate (54) simultaneously move from the side below the corresponding solder tape (4) to below the solder tape (4), and can drive the upper mounting plate (53) to move downward, so that all the upper clamping parts (51) on the upper mounting plate (53) move downward simultaneously until each upper clamping part (51) presses the solder tape (4) below it against the lower clamping part (52) below the solder tape (4). Finally, both ends of each solder tape (4) are clamped by the corresponding jaw units (5). When placing the welding tape (4), the power output member (2) drives the upper mounting plate (53) to move upward, so that all the upper clamping portions (51) on the upper mounting plate (53) move upward simultaneously, and can drive the lower mounting plate (54) to move laterally, so that all the lower clamping portions (52) on the lower mounting plate (54) move from below the corresponding welding tape (4) to the side below the welding tape (4) simultaneously, so that all the welding tapes (4) are placed at the preset positions.

4. The solder strip arrangement clamping device according to claim 3, wherein, A cam follower (55) is mounted on the upper mounting plate (53), and a guide groove (56) is formed in the lower mounting plate (54). The upper part of the guide groove (56) is inclined, and the lower part of the guide groove (56) is vertical; When clamping the welding tape (4), the power output member (2) drives the upper mounting plate (53) to move downward, and the cam follower (55) moves from the upper end to the lower end of the guide groove (56), so that the lower clamping portion (52) moves from the side below the welding tape (4) to below the welding tape (4), and at the same time the upper clamping portion (51) moves downward until the upper clamping portion (51) presses the welding tape (4) on the lower clamping portion (52) below the welding tape (4); When placing the welding tape (4), the power output member (2) drives the upper mounting plate (53) to move upward, and the cam follower (55) moves from the lower end to the upper end of the guide groove (56), so that the upper clamping portion (51) moves upward, and at the same time the lower clamping portion (52) moves from below the welding tape (4) to the side below the welding tape (4).

5. The solder tape arrangement clamping device according to claim 4, characterized in that, During the process of clamping and placing the welding tape (4), the upper mounting plate (53) is guided by a vertical guiding element (57), and the lower mounting plate (54) is guided by a horizontal guiding element (58).

6. The solder tape arrangement clamping device according to claim 4, characterized in that, The power output member (2) includes a rotating shaft, two pressing wheels (21) and two springs (22). Both of the two pressing wheels (21) are fixedly mounted on the rotating shaft, and one of the pressing wheels (21) is provided above each upper mounting plate (53). One end of the spring (22) is connected to the upper end of the upper mounting plate (53), and the other end is connected to the base (1); The rotation of the rotating shaft drives the pressing wheel (21) to gradually apply a downward force to the upper mounting plate (53) below it, so that the spring (22) is gradually compressed, thereby causing the upper mounting plate (53) to move downward, or the rotation of the rotating shaft causes the downward force applied by the pressing wheel (21) to the upper mounting plate (53) below it to gradually return to zero, so that the spring (22) gradually returns to its initial state, thereby causing the upper mounting plate (53) to move upward.

7. A solder tape arrangement clamping device according to any one of claims 1-6, characterized in that, It further includes a first pressing assembly (6) and a second pressing assembly (7). The first pressing assembly (6) includes a first power output member (61) and a first pressing plate (62). The first pressing plate (62) is located in the middle of the base (1). The first power output member (61) drives the first pressing plate (62) to move up and down. Along the y direction, a plurality of first downward pressing portions (63) are provided on the first pressing plate (62), and each of the first downward pressing portions (63) is arranged corresponding to one of the solder tapes (4). The second pressing assembly (7) includes a second power output member (71) and two second pressing plates (72). The second power output member (71) drives the two second pressing plates (72) to move up and down. Along the x direction, the two second pressing plates (72) are respectively located on both sides of the base (1). Along the y direction, a plurality of second downward pressing portions (73) are provided on each of the second pressing plates (72), and each of the second downward pressing portions (73) on each of the second pressing plates (72) is arranged corresponding to one of the solder tapes (4). When placing the solder tape (4), the first power output member (61) drives the first pressing plate (62) to move downward until each of the first downward pressing portions (63) presses the middle part of the solder tape (4) below it on the battery cell. Then the jaw unit (5) releases the solder tape (4). Subsequently, the second power output member (71) drives the two second pressing plates (72) to move downward until each of the second downward pressing portions (73) on one of the second pressing plates (72) presses one end of the solder tape (4) below it on the battery cell, and each of the second downward pressing portions (73) on the other second pressing plate (72) presses the other end of the solder tape (4) below it on the battery cell.

8. The solder strip arrangement clamping device according to claim 7, wherein, The first pressing assembly (6) further includes a first guiding member (64), and the first pressing plate (62) is guided by the first guiding member (64) during the up and down movement; and / or, The second pressing assembly (7) further includes a second guiding member (74), and the second pressing plate (72) is guided by the second guiding member (74) during the up and down movement.

9. A solder tape arrangement clamping device according to any one of claims 1-6, characterized in that, Along the x direction, UV lamp mounting brackets are provided in the middle of the base (1) and on both sides of the base (1). The length direction of each UV lamp mounting bracket is along the y direction, and UV lamps are installed at their bottoms. After the solder tape (4) is placed at the preset position, each of the UV lamps is started, so that each solder joint on each solder tape (4) can be irradiated by the UV lamp, thereby initially fixing all the solder tapes (4) at the preset position.

10. A solder tape arrangement system, characterized in that, It includes a plurality of solder tape arrangement and clamping devices according to any one of claims 1 - 9 arranged along the x direction to simultaneously clamp or release multiple groups of solder tapes (4).

Images