Terminal with tin climbing prevention structure

Abstract

The utility model relates to a terminal with an anti-tin-climbing structure, each terminal structure is arranged on a board-to-board connector, each terminal defines a contact section, a welding section and a connecting section located between the contact section and the welding section, and a bending extension section for bending and forming the contact section is defined between the contact section and the connecting section. Wherein a bending section is defined between the welding section and the connecting section, an electrogilding layer for soldering tin to be attached and fixed on a circuit board is formed on the surface of the welding section, and a nickel blocking layer which is not attached to the soldering tin is formed on the surface of the bending section, so that the problem of tin climbing of the terminal in the board-to-board connector during board welding is effectively solved.

Description

Technical Field

[0001] The utility model relates to a terminal, in particular to a terminal with an anti-tin creeping structure. Background Art

[0002] The current terminal welding technology is mainly divided into two types: surface mount technology (SMT) and through-hole welding technology (DIP). Regardless of which welding technology is used, solder is used for auxiliary welding. However, many problems often occur during welding operations, such as tin creep, exposed solder or empty solder.

[0003] Regarding the specific problem of tin creeping mentioned above, it is mainly that when the welding part is welded to the circuit board, the solder will be adsorbed on the metal layer after being melted into liquid by high temperature heating. However, since the metal liquid will diffuse during the brush plating process, it is not easy to control the metal layer within a certain range, so the solder is also difficult to control. Therefore, tin creeping is easy to occur during the welding process, which leads to poor welding. Utility Model Content

[0004] The utility model provides a terminal with an anti-tin creeping structure, aiming to solve the above technical problem.

[0005] An embodiment of the utility model provides a terminal with an anti-tin creeping structure, mainly comprising a plurality of terminals arranged on a board-to-board connector, each of the terminals defining a contact section, a welding section and a connecting section located between the contact section and the welding section, wherein a bending extension section for the contact section to be bent and formed is defined between the contact section and the connecting section, and the contact section and the connecting section are parallel to each other, and the contact section is shorter than the connecting section, wherein the welding section and the bending extension section are parallel to each other, and the welding section is adjacent to the end of the contact section away from the bending extension section, wherein a bending section is defined between the welding section and the connecting section, a gold-plated layer for tin material to adhere to and be fixed to a circuit board is formed on the surface of the welding section, and a nickel-blocking layer that does not adhere to the tin material is formed on the surface of the bending section.

[0006] Preferably, the nickel barrier layer has a thickness of 0.2 mm.

[0007] Due to the adoption of the above technical solution, the utility model has the following beneficial effects:

[0008] A bending section is defined between the welding section and the connecting section. A gold-plated layer is formed on the surface of the welding section for the tin material to adhere to and fix to the circuit board, while a nickel-blocking layer is formed on the surface of the bending section to which the tin material does not adhere, effectively solving the problem of tin creeping when the terminals in the board-to-board connector are soldered. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1This is a schematic three-dimensional structure diagram of the terminal of the present utility model.

[0010] Figure 2 This is a schematic side view structure diagram of the terminal of the present utility model.

[0011] Figure 3 This is a schematic structure diagram of the board-to-board connector of the present utility model.

[0012] Figure 4 This is a schematic diagram of the use of solder for the terminal of the present utility model.

[0013] Symbol Description

[0014] Terminal 1, contact section 10, welding section 12, electroplated gold layer 120, connection section 14, bent extension section 16, bent section 18, nickel-resistant layer 180, board-to-board connector 2, solder 3, circuit board 4. Detailed Embodiment

[0015] Please refer to Figure 1 , Figure 2 and Figure 3 shown. This is a schematic three-dimensional structure diagram of the terminal of the present utility model, a schematic side view structure diagram of the terminal, and a schematic structure diagram of the board-to-board connector. The present utility model is a terminal with an anti-creeper structure, mainly including a plurality of terminals 1 disposed on a board-to-board connector 2. Each terminal 1 defines a contact section 10, a welding section 12, and a connection section 14 located between the contact section 10 and the welding section 12. A bent extension section 16 for bending the contact section 10 is defined between the contact section 10 and the connection section 14, and the contact section 10 and the connection section 10 are parallel to each other, and the contact section 10 is shorter than the connection section 14. The welding section 12 is parallel to the bent extension section 16, and the welding section 12 is adjacent to the end of the contact section 10 facing away from the bent extension section 16. A bent section 18 is defined between the welding section 12 and the connection section 14. An electroplated gold layer 120 for the solder to adhere to and be fixed on the circuit board is formed on the surface of the welding section 12, and a nickel-resistant layer 180 that does not adhere to the solder is formed on the surface of the bent section 18, and the range of the nickel-resistant layer is 0.2 mm.

[0016] Refer to Figure 4 shown. This is a schematic diagram of the use of solder for the terminal of the present utility model. To clearly show the position of the solder 3, only a single terminal 1 and the circuit board 4 are shown. When soldering, the terminal 1 is placed at the position of the circuit board 4 with pads (not shown in the figure). At this time, the solder 3 is melted into a liquid state by high-temperature heating and will be adsorbed on the electroplated gold layer 120 on the surface of the welding section 12. At this time, the diffused solder 3 will be blocked by the nickel-resistant layer 180 on the surface of the bent section 18 and cannot adhere, so as to effectively control the range of the solder 3 (the dotted line range). Therefore, the phenomenon of solder creep is effectively prevented during the welding process, and the problem of poor welding is improved.

[0017] Furthermore, the nickel-resistant layer 180 mainly adopts a gold stripping process to remove the originally plated gold on the surface. This can not only stabilize the size range of the nickel-resistant layer 180, but also, since there is a bending section 18 defined between the welding section 12 and the connecting section 14, the nickel-resistant layer 180 formed on the surface of the bending section 18 can be non-adherent to the solder, thus effectively solving the problem of solder climbing that occurs when the terminals 1 in the board-to-board connector 2 are soldered to the board.

Claims

1. A terminal with an anti-creeper soldering structure, characterized in that : It includes a plurality of terminals arranged on a board-to-board connector, each of the terminals defines a contact section, a welding section and a connecting section located between the contact section and the welding section, wherein a bending extension section for the contact section to be bent and formed is defined between the contact section and the connecting section, and the contact section and the connecting section are parallel to each other, and the contact section is shorter than the connecting section, wherein the welding section and the bending extension section are parallel to each other, and the welding section is adjacent to the end of the contact section away from the bending extension section, wherein a bending section is defined between the welding section and the connecting section, a gold-plated layer for tin material to adhere to and be fixed to a circuit board is formed on the surface of the welding section, and a nickel-blocking layer that does not adhere to the tin material is formed on the surface of the bending section.

2. The terminal with a tin climbing prevention structure according to claim 1, characterized in that :The nickel barrier layer has a range of 0.2 mm.

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