Radio frequency device in quantum computing based on module packaging

Abstract

The utility model provides a radio frequency device in quantum computing based on module packaging, which can be applied to the technical field of quantum computing and microwaves. The device comprises a high-frequency board, a power board and a packaging shell, the high-frequency board comprises an amplification module and a power division module, the amplification module comprises an amplifier chip and is used for amplifying an input radio-frequency signal, the power division module comprises N stages of power sub-modules, the nth stage of power sub-module comprises 2n paths of output ends, the power division module is used for performing power distribution processing on the radio frequency signals amplified by the amplification module based on the N-stage power division module so as to output multiple paths of target radio frequency signals with coherent phases and the same amplitude from multiple paths of output ends; the power panel is used for converting one path of input voltage input signal into at least one path of voltage output signal and supplying power to the amplification module of the high-frequency board; the packaging shell comprises a main shell, a microwave surface inner cover plate and a main cover plate, and the packaging shell is used for bearing the high-frequency board and the power board and shielding external electromagnetic interference.

Description

Technical Field

[0001] The utility model relates to the technical fields of quantum computing and microwave technology, and particularly relates to a radio frequency device in quantum computing based on module packaging. Background Art

[0002] A microwave signal source is an electronic device that can provide a signal source for radio frequency signals and can set and output signals with corresponding frequencies and amplitudes according to user requirements. Generally, a microwave signal source usually has only 1 to 2 channels, while the testing of a quantum superconducting computing chip requires dozens or even hundreds of high-frequency microwave signals with coherent phases and consistent amplitudes to be input.

[0003] In the process of implementing the concept of the utility model, the inventor found that for a general microwave signal source with 1 to 2 channels in the related art, the signal channels can be expanded by an integrated method. However, multi-channel integration will cause the radio frequency device to have a larger volume, higher power consumption, and greater difficulty in synchronously controlling multiple microwave signal sources in the multi-channel integration. Summary of the Utility Model

[0004] In view of the above problems, the utility model provides a radio frequency device in quantum computing based on module packaging.

[0005] According to the first aspect of the utility model, there is provided a radio frequency device in quantum computing based on module packaging, including: a high-frequency board, a power supply board, and a packaging housing. The high-frequency board includes an amplification module and a power splitting module. The amplification module includes an amplifier chip. The amplification module is used to amplify the input radio frequency signal. The power splitting module includes N levels of power splitting sub-modules. The nth level of the power splitting sub-module includes 2 n output terminals. The power splitting module is used to perform power distribution processing on the radio frequency signal amplified by the amplification module based on the N levels of power splitting sub-modules, so as to output multiple target radio frequency signals with coherent phases and the same amplitude from multiple output terminals, where N and n are both positive integers greater than or equal to 1, and n is less than or equal to N. The power supply board is used to convert an input voltage input signal into at least one voltage output signal, and the at least one voltage output signal is used to supply power to the amplification module of the high-frequency board. The packaging housing includes a main housing, a microwave in-plane cover plate, and a main cover plate. The packaging housing is used to carry the high-frequency board and the power supply board, and is also used to shield external electromagnetic interference.

[0006] According to an embodiment of the utility model, the amplification module is composed of at least one amplifier chip among a driver amplifier chip, a low-noise amplifier chip, a driver amplifier chip, a gain amplifier chip, and a power amplifier chip, and the at least one voltage output signal is used to supply power to the at least one amplifier chip.

[0007] According to an embodiment of the present utility model, the above power supply board includes a printed circuit board, a switching power supply chip, a voltage regulator chip, capacitors, and resistors.

[0008] According to an embodiment of the present utility model, the above power supply board is arranged on the back surface or the side surface of the above high-frequency board.

[0009] According to an embodiment of the present utility model, the above amplifier chip includes any one of the following: a gallium arsenide chip, a gallium nitride chip, and an indium phosphide chip.

[0010] According to an embodiment of the present utility model, the connection manner between the above amplification module and the above power distribution module includes a microstrip line.

[0011] According to an embodiment of the present utility model, the above power distribution module includes a microstrip line structure or a power splitter chip.

[0012] According to an embodiment of the present utility model, the connection manner between the above power distribution module and the above high-frequency board includes gold wire bonding or patch welding.

[0013] According to an embodiment of the present utility model, the connection manner between the above amplification module and the above high-frequency board includes gold wire bonding or patch welding.

[0014] According to an embodiment of the present utility model, the above packaging housing is made of a metal material.

[0015] According to the radio frequency device in quantum computing based on module packaging provided by the present utility model, the power supply board supplies power to the amplification module on the high-frequency board, the amplification module amplifies an input radio frequency signal, and then the amplified radio frequency signal is input into a power distribution module including N-stage power sub-modules for power distribution processing. Multiple target radio frequency signals with the same phase and amplitude can be output from multiple output terminals. Compared with the integration of multiple signal sources in the related art, the radio frequency device in quantum computing based on module packaging has the characteristics of small volume, low power consumption, low cost, and light weight. Moreover, since there is only one input radio frequency signal, it can avoid the difficulty of synchronous control in the integration of multiple signal sources. The packaging housing can carry the high-frequency board and the power supply board and can also shield external electromagnetic interference, thereby improving the quality of the output multiple target radio frequency signals with the same phase and amplitude. Description of the Drawings

[0016] Through the following description of the embodiments of the present utility model with reference to the drawings, the above and other objects, features, and advantages of the present utility model will become clearer. In the drawings:

[0017] Figure 1 Schematically shows the structural diagram of the radio frequency device in quantum computing based on module packaging according to an embodiment of the present utility model.

[0018] Figure 2 Schematically shows the circuit structure diagram of a high-frequency board according to an embodiment of the present invention.

[0019] Figure 3 Schematically shows the circuit structure diagram of a power splitting module according to an embodiment of the present invention.

[0020] Figure 4 Schematically shows the structure diagram of an amplification module according to an embodiment of the present invention.

[0021] Figure 5 Schematically shows the structure diagram of a power supply board according to an embodiment of the present invention.

[0022] In the above-mentioned drawings, the meanings of the reference numerals are specifically as follows:

[0023] 100 - Radio frequency device in quantum computing based on module packaging;

[0024] 110 - High-frequency board;

[0025] 1110 - Amplification module;

[0026] 1111 - Low-noise amplifier chip;

[0027] 1112 - Power amplifier chip;

[0028] 1120 - Power splitting module;

[0029] 1121 - First-stage power splitting sub-module;

[0030] 1122 / 1123 - Second-stage power splitting sub-module;

[0031] 1130 - Radio frequency source;

[0032] 120 - Power supply board;

[0033] 130 - Packaging housing. Detailed implementation manners

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, it should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present invention. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present invention.

[0035] The terms used herein are merely for describing specific embodiments and are not intended to limit the present utility model. The terms "comprising", "including" and the like used herein indicate the presence of the described features, steps, operations and / or components, but do not preclude the presence or addition of one or more other features, steps, operations or components.

[0036] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0037] In the case of using expressions such as "at least one of A, B, and C, etc.", generally, it should be interpreted according to the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include, but is not limited to, a system having only A alone, having only B alone, having only C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0038] In the process of implementing the present utility model, it is found that in the related art, a microwave signal source usually has only 1-2 channels. Even if the device has multiple outputs, the structural sources are often completely independent multiple channels, and there will be phase differences, which far from meet the signal requirements of dozens or even hundreds of high-frequency microwave signal inputs for testing quantum superconducting computing chips. If multiple signal sources are integrated to expand the signal channels, not only the volume is huge, the power consumption is high, but also the cost is expensive, and the synchronous control of multiple signal sources is also difficult.

[0039] In view of this, an embodiment of the present utility model provides a radio frequency device in quantum computing based on module packaging, including: a high-frequency board, a power supply board, and a packaging housing. The high-frequency board includes an amplification module and a power splitting module. The amplification module includes an amplifier chip. The amplification module is used to amplify the input radio frequency signal. The power splitting module includes N-level power splitting sub-modules. The nth-level power splitting sub-module includes 2 n output terminals. The power splitting module is used to perform power distribution processing on the radio frequency signal amplified by the amplification module based on the N-level power splitting sub-modules, so as to output multiple target radio frequency signals with the same phase and the same amplitude from the multiple output terminals, where N and n are both positive integers greater than or equal to 1, and n is less than or equal to N; the power supply board is used to convert an input voltage input signal into at least one voltage output signal, and the at least one voltage output signal is used to supply power to the amplification module of the high-frequency board; the packaging housing includes a main housing, a microwave in-plane cover plate, and a main cover plate. The packaging housing is used to carry the high-frequency board and the power supply board, and is also used to shield external electromagnetic interference.

[0040] Figure 1Schematically shows a structural diagram of a radio frequency device in quantum computing based on module packaging according to an embodiment of the present invention. Figure 2 Schematically shows a circuit structural diagram of a high-frequency board according to an embodiment of the present invention. Figure 3 Schematically shows a circuit structural diagram of a power splitting module according to an embodiment of the present invention.

[0041] As Figure 1 shown, the radio frequency device 100 in quantum computing based on module packaging of this embodiment includes: a high-frequency board 110, a power supply board 120, and a packaging housing 130.

[0042] According to an embodiment of the present invention, the high-frequency board 110, namely a high-frequency printed circuit board, is a specially designed circuit board that can process and transmit high-frequency signals. The operating frequency of high-frequency signals is usually higher than 1 GHz.

[0043] As Figure 2 shown, the high-frequency board 110 may include an amplification module 1110 and a power splitting module 1120. A radio frequency source 1130 inputs a path of radio frequency signal to the amplification module 1110. The amplification module 1110 performs amplification processing on the input radio frequency signal. The amplified radio frequency signal is input to the power splitting module 1120. The power splitting module 1120 outputs multiple target radio frequency signals with the same phase and amplitude. The power supply board 120 supplies power to the amplification module 1110. The high-frequency board 110 can carry the amplification module 1110 and the power splitting module 1120.

[0044] According to an embodiment of the present invention, the input radio frequency signal can be a path of radio frequency signal. The amplification module may include amplifier chips, and there may be one or more types of amplifier chips. The amplifier chips can be active chips. The amplification module can be used to amplify an input path of radio frequency signal.

[0045] According to an embodiment of the present invention, the power splitting module 1120 may include N levels of power splitting sub-modules. The nth level of power splitting sub-module may include 2 n output terminals, and the Nth level of power splitting sub-module may include 2 N output terminals. For example, the power splitting module 1120 may include 3 levels of power splitting sub-modules. The 2nd level of power splitting sub-module may include 4 output terminals, and the 3rd level of power splitting sub-module may include 8 output terminals. The power splitting module 1120 can be used to perform power distribution processing on the radio frequency signal amplified by the amplification module based on the N levels of power splitting sub-modules, so as to output multiple target radio frequency signals with the same phase and amplitude from multiple output terminals, where N and n are both positive integers greater than or equal to 1, and n is less than or equal to N.

[0046] According to an embodiment of the present invention, the frequencies of the output multi-channel phase-coherent and amplitude-equal target radio frequency signals may be different or the same. For example, in the case of outputting 4-channel target radio frequency signals, the frequencies of the first, second, and third target radio frequency signals may be the same, and the frequency of the fourth target radio frequency signal may be different from the frequencies of the first, second, and third target radio frequency signals.

[0047] As Figure 3 shown, the power splitter module 1120 may include two-stage power splitting sub-modules, and each power splitting sub-module may be a two-way power splitting sub-module. The first-stage power splitting sub-module 1121 may include two output terminals. The second-stage power splitting sub-modules may include 1122 and 1123. The second-stage power splitting sub-module 1122 may include two output terminals, and the second-stage power splitting sub-module 1123 may include two output terminals. Therefore, the second-stage power splitter module may include four output terminals.

[0048] According to an embodiment of the present invention, the power supply board 120 may be used to convert an input single-channel voltage input signal into at least one-channel voltage output signal, and the at least one-channel voltage output signal is used to supply power to the amplification module of the high-frequency board 110. For example, the power supply board may convert an input single-channel 12V voltage input signal into multiple-channel voltage output signals through a voltage stabilizing chip. For example, it is converted into three voltage output signals of 5V, 8V, and -8V respectively, which are used to supply power to the amplification module of the high-frequency board 110. The power supply board 120 may include a positive voltage input signal, that is, a single-channel voltage input signal and a ground input signal. The power supply board 120 may include multiple voltage output signals. For example, the power supply board 120 may include four output ports for outputting four voltage output signals.

[0049] According to an embodiment of the present invention, the packaging housing 130 may include a main housing, a microwave in-plane cover plate, and a main cover plate. The packaging housing 130 may be used to carry the high-frequency board 110 and the power supply board 120. The packaging housing may be a metal packaging housing, so as to be used for shielding external electromagnetic interference.

[0050] According to an embodiment of the present invention, the power supply board supplies power to the amplification module on the high-frequency board. The amplification module amplifies an input radio frequency signal, and then inputs the amplified radio frequency signal into a power distribution module including N-stage power sub-modules for power distribution processing, so as to output multiple target radio frequency signals with the same phase and amplitude from multiple output terminals. Compared with the integration of multiple signal sources in the related art, the radio frequency device in quantum computing based on module packaging has the characteristics of small volume, low power consumption, low cost, and light weight. Moreover, since there is only one input radio frequency signal, it can avoid the difficulty of synchronous control in the integration of multiple signal sources. The packaging shell can carry the high-frequency board and the power supply board, and can also shield external electromagnetic interference, thereby improving the quality of the output multiple target radio frequency signals with the same phase and amplitude.

[0051] According to an embodiment of the present invention, the amplification module is composed of at least one amplifier chip among a driver amplifier chip, a low-noise amplifier chip, a driver amplifier chip, a gain amplifier chip, and a power amplifier chip, and at least one voltage output signal is used to supply power to at least one amplifier chip.

[0052] According to an embodiment of the present invention, the amplification module can be composed of at least one amplifier chip among a driver amplifier chip, a low-noise amplifier chip, a driver amplifier chip, a gain amplifier chip, and a power amplifier chip. For example, the amplification chip can be composed of a single driver amplifier chip. For another example, the amplification chip can be composed of a low-noise amplifier chip and a driver amplifier chip. For another example, the amplification chip can be composed of a low-noise amplifier chip, a gain amplifier chip, and an amplifier chip.

[0053] According to an embodiment of the present invention, at least one voltage output signal can be used to supply power to at least one amplifier chip. For example, when there are 4 voltage output signals according to the requirements of the radio frequency device, the 4 voltage output signals can be used to supply power to 4 amplifier chips.

[0054] According to an embodiment of the present invention, according to the requirements of the radio frequency device, if the output power is adjustable, a gain-adjustable attenuator chip can be selected to be placed in front of the amplifier chip; if the output power is not adjustable, a gain-adjustable attenuator chip can be selected not to be placed in front of the amplifier chip.

[0055] Figure 4 The structural diagram of the amplification module according to an embodiment of the present invention is schematically shown.

[0056] As Figure 4 shown, the amplification module 1110 can be composed of a low-noise amplifier chip 1111 and a power amplifier chip 1112.

[0057] According to an embodiment of the present invention, the amplifier module can be composed of one or a combination of multiple amplifier chips, which improves the flexibility of the composition of the amplification module.

[0058] According to an embodiment of the present invention, the power supply board includes a printed circuit board, a switching power supply chip, a voltage regulator chip, capacitors, and resistors.

[0059] According to an embodiment of the present invention, the power supply board may include a printed circuit board (Printed Circuit Board, PCB), a switching power supply chip, a voltage regulator chip, capacitors, and resistors. Among them, the switching power supply chip, the voltage regulator chip, the capacitors, and the resistors are arranged on the printed circuit board.

[0060] According to an embodiment of the present invention, the voltage regulator chip may include multiple parallel voltage regulators. For example, in the case where the amplifier chip requires 5 voltage signals, the voltage regulator chip may include 5 parallel voltage regulators.

[0061] Figure 5 Schematically shows the structural diagram of the power supply board according to an embodiment of the present invention.

[0062] As Figure 5 shown, the power supply board 120 may include a positive input terminal and a negative input terminal. The positive input terminal is used for inputting a voltage input signal, and the negative input terminal is used for inputting a ground input signal. The power supply board 120 may include 4 output terminals, and each output terminal outputs a voltage output signal.

[0063] According to an embodiment of the present invention, through the power supply board, an input voltage input signal can be converted into multiple voltage output signals through the voltage regulator chip, so as to supply power to multiple amplifier chips, thereby avoiding the integration of multiple voltage outputs and simplifying the complexity of use of the radio frequency device.

[0064] According to an embodiment of the present invention, the power supply board may be arranged on the back or side of the high-frequency board to supply power to the amplifier chips on the high-frequency board.

[0065] According to an embodiment of the present invention, a voltage is input from the outside to the power supply board, and multiple voltages can be output at multiple output terminals of the power supply board according to the requirements of the high-frequency board. The multiple output voltages may include positive voltage and negative voltage. For example, the output voltages may be values such as +5V, +8V, +28V, -0.7V, etc.

[0066] According to an embodiment of the present utility model, the presence of the power supply board can avoid directly inputting voltage onto the amplifier chip of the amplification module, which may cause the breakdown of the amplifier chip. Thus, it can play a protective role while ensuring the normal operation of the amplifier chip. Moreover, the power supply board can include multiple output terminals, thereby avoiding the integration of multiple voltage outputs and simplifying the usage complexity of the radio frequency device.

[0067] According to an embodiment of the present utility model, the amplifier chip includes any one of the following: gallium arsenide chip, gallium nitride chip, indium phosphide chip.

[0068] According to an embodiment of the present utility model, a gallium arsenide (GaAs) chip can be a chip including the semiconductor material gallium arsenide. A gallium nitride (GaN) chip can be a chip including the semiconductor material gallium nitride. An indium phosphide (InP) chip can be a chip including the semiconductor material indium phosphide. The amplifier chip can employ, but is not limited to, gallium arsenide (GaAs) chips, gallium nitride (GaN) chips, indium phosphide (InP) chips.

[0069] According to an embodiment of the present utility model, the amplifier chip can adopt gallium arsenide (GaAs) chips, gallium nitride (GaN) chips, indium phosphide (InP) chips or other chips with the same function, improving the flexibility of the amplifier chips used in the radio frequency device.

[0070] According to an embodiment of the present utility model, the connection manner between the amplification module and the power distribution module includes a microstrip line. The connection manner between the power distribution module and the high-frequency board includes wire bonding or chip soldering. The connection manner between the amplification module and the high-frequency board includes wire bonding or chip soldering.

[0071] According to an embodiment of the present utility model, the connection manner between the amplification module and the power distribution module can adopt, but is not limited to, a microstrip line.

[0072] According to an embodiment of the present utility model, the connection manner between the power distribution module and the high-frequency board can adopt, but is not limited to, forms such as wire bonding or chip soldering. The connection manner between the amplification module and the high-frequency board can also adopt, but is not limited to, forms such as wire bonding or chip soldering.

[0073] According to an embodiment of the present utility model, the connection manner between the amplification module and the power distribution module can adopt, but is not limited to, a microstrip line. The connection manners between the power distribution module and the high-frequency board and between the amplification module and the high-frequency board can adopt, but is not limited to, wire bonding or chip soldering, improving the flexibility of the connection manners between modules and between the power distribution module, the amplification module and the high-frequency board.

[0074] According to an embodiment of the present utility model, the power distribution module includes a microstrip line structure or a power splitter chip.

[0075] According to the embodiments of the present utility model, the power splitting module may adopt, but is not limited to, a microstrip line structure or a power splitter chip. The power splitting module may include N-level power splitting sub-modules, and the power splitting sub-modules may be in forms such as two-way power splitting or four-way power splitting.

[0076] According to the embodiments of the present utility model, the number of power splitting sub-modules included in the power splitting module can be determined according to the requirements of the radio frequency device. Based on multiple power splitting sub-modules, multiple target radio frequency signals with the same phase and the same amplitude can be output, improving the flexibility of the radio frequency device setting, so that the designed radio frequency device can meet the requirements of dozens or even hundreds of radio frequency signals required for the quantum superconducting computing chip test.

[0077] According to the embodiments of the present utility model, the encapsulation housing is made of a metal material.

[0078] According to the embodiments of the present utility model, the encapsulation housing may be made of a metal material. For example, the material of the encapsulation housing may be copper, or for another example, the material of the encapsulation housing may be aluminum. The material of the encapsulation housing is not limited to aluminum or copper.

[0079] According to the embodiments of the present utility model, the encapsulation housing is formed into a metal housing by using a metal material, so that external electromagnetic interference can be shielded, improving the quality of the multiple output target radio frequency signals.

[0080] According to the embodiments of the present utility model, the radio frequency device in quantum computing based on module encapsulation uses an amplifier chip or a microstrip line integrated on a high-frequency board, and is assembled with the encapsulation housing through the high-frequency board. It is a signal source integrated expansion device that integrates power amplification, power distribution, and regulated power supply, and can output multiple target radio frequency signals with the same phase and the same amplitude for use during the quantum superconducting chip test. Compared with the integration of multiple signal sources in the related art, it has the characteristics of small volume, low power consumption, and low cost, and can avoid the problem of difficult synchronous control in the integration of multiple signal sources.

[0081] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present utility model. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a portion of code that contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, as well as combinations of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0082] Those skilled in the art can understand that the features described in various embodiments of the present utility model can be combined or / and combined in various ways, even if such combinations or combinations are not explicitly described in the present utility model. In particular, without departing from the spirit and teachings of the present utility model, the features described in various embodiments of the present utility model can be combined and / and combined in various ways. All such combinations and / and combinations fall within the scope of the present utility model.

[0083] The embodiments of the present utility model have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present utility model. Although the embodiments have been described separately above, this does not mean that the measures in each embodiment cannot be used advantageously in combination. Without departing from the scope of the present utility model, those skilled in the art can make various substitutions and modifications, and all such substitutions and modifications should fall within the scope of the present utility model.

Claims

1. A radio frequency device in quantum computing based on module encapsulation, characterized in that Comprising: A high-frequency board, a power supply board, and a packaging housing. The high-frequency board includes an amplification module and a power splitting module. The amplification module includes an amplifier chip. The amplification module is used to amplify the input radio frequency signal. The power splitting module includes N levels of power splitting sub-modules. The nth level of the power splitting sub-module includes 2 n output terminals. The power splitting module is used to perform power distribution processing on the radio frequency signal amplified by the amplification module based on the N levels of power splitting sub-modules, so as to output multiple target radio frequency signals with the same phase and the same amplitude from the multiple output terminals, where N and n are both positive integers greater than or equal to 1, and n is less than or equal to N; The power supply board is configured to convert an input voltage input signal into at least one voltage output signal, and the at least one voltage output signal is used to supply power to the amplification module of the high-frequency board. The packaging housing includes a main housing, a microwave in-plane cover plate, and a main cover plate. The packaging housing is used to carry the high-frequency board and the power supply board, and is also used to shield external electromagnetic interference.

2. The device according to claim 1, wherein The amplification module is composed of at least one amplifier chip among a driver amplifier chip, a low-noise amplifier chip, a driver amplifier chip, a gain amplifier chip, and a power amplifier chip, and the at least one voltage output signal is used to supply power to the at least one amplifier chip.

3. The device according to claim 1, characterized in that, The power supply board includes a printed circuit board, a switching power supply chip, a voltage regulator chip, capacitors, and resistors.

4. The device according to claim 3, characterized in that, The power supply board is arranged on the back or the side of the high-frequency board.

5. The device according to claim 2, characterized in that The amplifier chip includes any one of the following: a gallium arsenide chip, a gallium nitride chip, and an indium phosphide chip.

6. The device according to claim 1, characterized in that The connection mode between the amplification module and the power divider module includes a microstrip line.

7. The device according to claim 6, characterized in that The power divider module includes a microstrip line structure or a power divider chip.

8. The device according to claim 7, characterized in that, The connection mode between the power divider module and the high-frequency board includes wire bonding or patch welding.

9. The device according to claim 8, characterized in that, The connection mode between the amplification module and the high-frequency board includes wire bonding or patch welding.

10. The device according to claim 1, characterized in that, The packaging housing is made of a metal material.

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