Battery pack adapter

Abstract

The utility model discloses a battery pack adapter. The battery pack adapter comprises a shell, a battery pack interface, a circuit board and a power radiating piece, wherein the battery pack interface is arranged in the shell, the circuit board is arranged in the shell and comprises a substrate and components arranged on the substrate, the substrate comprises a first side surface and a second side surface which are opposite to each other, the components are arranged on the first side surface of the substrate, and the components comprise power components used for controlling power and signal components used for processing signals. The power component is arranged in a first area of the first side surface, the signal component is arranged in a second area of the first side surface, the first area and the second area are sequentially distributed in the width direction of the first side surface, and the power heat dissipation piece is arranged in the first area and is in heat conduction connection with at least part of the power component. In this way, the heat dissipation effect of the power component is improved, and meanwhile the small overall size is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of power adapters, and particularly relates to a battery pack adapter. Background Art

[0002] The circuit board of the battery pack adapter and the layout of its components affect the heat dissipation of the circuit board and the overall volume of the machine. Poor heat dissipation of the circuit board will cause the components to fail to work properly or even be damaged. A bad layout will increase the overall volume of the adapter and reduce its portability. Therefore, how to ensure the effective heat dissipation of the components on the premise of suppressing the increase in the overall volume is one of the main design difficulties of the battery pack adapter. Content of the Utility Model

[0003] Therefore, what the utility model mainly solves is the technical problems of poor heat dissipation of the circuit board of the battery pack adapter and non-compact overall volume in the prior art.

[0004] To solve the above technical problems, the utility model provides a battery pack adapter, including:

[0005] A housing;

[0006] A battery pack interface, arranged on the housing and used for plugging in the battery pack;

[0007] A circuit board, arranged in the housing, including a substrate and components arranged on the substrate. The substrate includes a first side surface and a second side surface opposite to each other, and the components are arranged on the first side surface of the substrate;

[0008] The components include power components for controlling power and signal components for processing signals. The power components are arranged in a first area on the first side surface, and the signal components are arranged in a second area on the first side surface. The first area and the second area are distributed in sequence along the width direction of the first side surface;

[0009] A power heat dissipation member, arranged in the first area and thermally connected to at least part of the power components.

[0010] In one embodiment, the first area extends along the length direction of the substrate, and the power components are distributed approximately evenly along the length direction of the substrate in the first area.

[0011] In one embodiment, the power components include five groups of components. The height of three groups of components is greater than that of the remaining two groups of components. The remaining two groups of components are arranged at intervals between the three groups of components, and the power heat dissipation member is arranged on the remaining two groups of components;

[0012] The height of the power heat dissipation component is lower than or equal to the maximum height of the three groups of components.

[0013] In one embodiment, the remaining two groups of components include MOS transistors, the three groups of components include capacitors and / or inductors, the power heat dissipation component is fixedly arranged on the upper surface of the MOS transistors, and the capacitors and / or inductors are arranged adjacent to the power heat dissipation component; the capacitor is connected to the power heat dissipation component through a thermal conductive adhesive, and / or the inductor is connected to the power heat dissipation component through a thermal conductive adhesive.

[0014] In one embodiment, the battery pack interface includes an electrode seat for docking with the battery pack and an open end opposite to the electrode seat, the component further includes an electrical socket for plugging in with an external connector, the housing is provided with a socket opposite to the electrical socket, the electrode seat and the electrical socket are arranged at the same end of the substrate close to the substrate, and the socket and the open end are respectively located at both ends of the housing.

[0015] In one embodiment, the substrate further includes a welding position for welding a wire, and the electrical socket and the welding position are arranged at both ends of the first region relatively;

[0016] There is a wire passing cavity between the substrate and the electrode seat, one end of the wire is welded to the welding position, and the other end is connected to the electrode seat after passing through the wire passing cavity.

[0017] In one embodiment, a heat dissipation plate is further included, which is arranged on the second side surface of the substrate and is roughly matched with the shape of the second side surface, and the outer surface of the heat dissipation plate facing away from the substrate forms the inner wall of the wire passing cavity.

[0018] In one embodiment, the heat dissipation plate includes a notch opposite to the welding position, the wire passes through the notch and is welded to the welding position, and except for the notch, the outer edge of the heat dissipation plate is flush with the outer edge of the substrate.

[0019] In one embodiment, the housing includes a main body and a protruding part, the battery pack interface is arranged at the bottom of the main body, the protruding part is arranged at the top of the main body opposite to the battery pack interface, the protruding part is higher than the top of the main body, a main cavity is formed in the main body, the circuit board is arranged in the main cavity, an extended cavity is formed in the protruding part, the extended cavity is communicated with the main cavity, the overall height of the power components is greater than the overall height of the signal components, and at least part of the power components extends into the extended cavity.

[0020] In one embodiment, in the width direction of the main body, the protruding part is roughly centered on the top of the main body, and the midline of the first side surface perpendicular to the width direction passes through the first region.

[0021] The technical solution provided by the present utility model has the following advantages:

[0022] For the battery pack adapter provided by the present utility model, the power components are arranged in the first area on the first side surface of the substrate, and the signal components are arranged in the second area on the first side surface of the substrate. Since the signal components are usually small in volume, the power components are large in size, and the heat generated by the power components is usually greater than that of the signal components, the first area and the second area are arranged in sequence along the width direction of the first side surface, which is beneficial to improving the heat dissipation effect of the power components. Moreover, the power components with larger volume are concentrated in the first area, and the housing of the battery pack adapter can be locally shaped corresponding to the first area to accommodate the power components, reducing the adverse consequence of the increase in the overall volume of the whole machine caused by the scattered arrangement of the power components. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 Schematic perspective view of the battery pack adapter provided by the embodiment of the present utility model;

[0025] Figure 2 For Figure 1 Schematic cross-sectional view of the battery pack adapter shown;

[0026] Figure 3 Schematic perspective view of the circuit board and heat dissipation structure of the battery pack adapter provided by the embodiment of the present utility model;

[0027] Figure 4 For Figure 3 Schematic top view of the circuit board and its heat dissipation mechanism shown;

[0028] Figure 5 Schematic internal structure view of the battery pack adapter provided by the embodiment of the present utility model with the protruding part and the first half shell hidden. Detailed Embodiments

[0029] The following will clearly and completely describe the technical solutions of the present utility model in conjunction with the drawings. Obviously, the described embodiments are some, rather than all, of the embodiments of the present utility model. The present utility model will be described in detail below with reference to the drawings and in conjunction with the embodiments. It should be noted that, without conflict, the embodiments and features in the embodiments of the present utility model can be combined with each other.

[0030] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present utility model are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

[0031] In the present utility model, unless otherwise stated, the orientation terms such as "upper", "lower", "top", "bottom" are usually in reference to the direction shown in the drawings, or in reference to the vertical, perpendicular or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer of the contour of each component itself, but the above orientation terms do not limit the present utility model.

[0032] This embodiment provides a battery pack adapter. Figure 1 It is a schematic three-dimensional structure diagram of the battery pack adapter provided by the embodiment of the present utility model. Figure 2 is Figure 1 the schematic cross-sectional structure diagram of the battery pack adapter shown. Please refer to Figure 1 and Figure 2 The battery pack adapter includes a housing 10, a battery pack interface 20, a circuit board 30 and a power heat dissipation member 41.

[0033] The housing 10 is the outer shell of the battery pack adapter and forms a receiving space inside. The circuit board 30 is disposed inside the housing 10 and is located in the receiving space. The battery pack interface 20 is disposed on the outer side surface of the housing 10 and is used for detachably plugging with a battery pack (not shown). Specifically, the battery pack interface 20 includes an electrode seat 22 and an open end 21 disposed opposite to the electrode seat 22. The open end 21 is an open port formed on one side of the housing 10, and the open end 21 is used for the battery pack to pass through to plug with the electrode seat 22. In a specific implementation, the battery pack plugs with the electrode seat 22 along the direction from the open end 21 to the electrode seat 22.

[0034] The battery pack interface 20 attaches the battery pack in a sliding manner. Specifically, the battery pack interface 20 includes two parallel slide rails 23. The slide rails 23 are disposed on the bottom side of the housing 10 and extend along the length direction of the housing 10. Correspondingly, two matching chutes are provided on the battery pack, and the length of the chute is substantially the same as that of the slide rail 23. Align the two slide rails 23 with the chutes on the battery pack and apply a thrust along the direction of the slide rail, so that the battery pack can be inserted into the battery pack interface along the slide rail and dock with the electrode seat 22, realizing the sliding plugging of the battery pack and the adapter.

[0035] The circuit board 30 includes a substrate 31 and components 32 disposed on the substrate 31. Please refer to Figure 3 and Figure 4, the substrate 31 is generally flat, including a first side surface and a second side surface facing away from each other, and the component 32 is disposed on the first side surface of the substrate 31. Specifically, the first side surface is the side surface facing away from the battery pack interface 20, and the second side surface is the side surface facing the battery pack interface 20. In other words, the component 32 is disposed on the first side surface of the substrate 31 facing away from the battery pack interface 20. Preferably, all components are disposed on the first side surface, and no components are disposed on the second side surface, keeping it relatively flat.

[0036] The component 32 includes a power component for controlling power and a signal component for processing signals. The first side surface is generally divided into a first region 31a and a second region 31b according to the types of the disposed components. The power component is disposed in the first region 31a, and the signal component is disposed in the second region. Specifically, according to the position of the power component located at the edge on the first side surface, the outer contour of the first region 31a can be generally determined. Similarly, according to the position of the signal component located at the edge on the first side surface, the outer contour of the second region 31b can be generally determined. For the sake of simplicity, the regular boundary range approximately containing the power component can be determined as the first region 31a, and the regular region range approximately containing the signal component can be determined as the second region 31b. Exemplarily, please refer to Figure 4 As shown, the power components are generally distributed in a rectangular area. The first region 31a is represented by a rectangular area generally covering the power components. The signal components are also generally distributed in a rectangular area. The second region 31b is represented by a rectangular area generally covering the signal components. The first region 31a and the second region 31b are generally two independent regions, but there may be a partial overlap in the part where the two regions are close to each other. For example, part of the signal component may extend into the rectangular range of the first region, or part of the power component may extend into the rectangular range of the second region. Of course, the first region and the second region can also be divided by an irregular boundary. The outer contours of the first region and the second region are determined according to the positions of the components at the edge. The first region and the second region determined in this way may have no overlapping parts.

[0037] After determining the first region 31a according to the boundary approximately enclosing the power component and the second region 31b according to the boundary approximately enclosing the signal component, the first region 31a and the second region 31b are distributed in sequence along the width direction of the first side surface. It should be noted that the substrate 31 is generally rectangular. The width direction of the first side surface is the width direction of the substrate 31, and the length direction of the first side surface is the length direction of the substrate 31.

[0038] For the battery pack adapter provided in this embodiment, the power components are arranged in the first area on the first side surface of the substrate, and the signal components are arranged in the second area on the first side surface of the substrate. Since the signal components are usually small in size, the power components are large in size, and the heat generated by the power components is usually greater than that of the signal components, the first area and the second area are arranged in sequence along the width direction of the first side surface, which is beneficial to improving the heat dissipation effect of the power components. Moreover, the power components with larger volume are concentrated in the first area, and the housing of the battery pack adapter can be shaped locally corresponding to the first area to accommodate the power components, reducing the adverse consequence of the increase in the overall volume of the whole machine caused by the scattered arrangement of the power components.

[0039] In a specific embodiment, the housing 10 includes a main body 11 and a protruding portion 12 connected to the main body 11. The protruding portion 12 protrudes from the top of the main body 11. The top wall of the main body 11 surrounds the protruding portion 12. The battery pack interface 20 is arranged at the bottom of the main body 11 opposite to the protruding portion 12. A main cavity is formed inside the main body 11, and the circuit board 30 is arranged in the main cavity. An extended cavity is formed inside the protruding portion 12, and the extended cavity is communicated with the main cavity. The overall height of the power components is greater than the overall height of the signal components, and at least part of the power components extends into the extended cavity. In this way, the power components with higher height are accommodated by the extended cavity of the protruding portion, rather than the overall increase in the volume of the main body, which is beneficial to keeping the main body small and achieving the purpose of accommodating the higher power components, ensuring the small overall size of the battery pack adapter.

[0040] Specifically, in the width direction of the main body 11, the protruding portion 12 is generally centered on the top of the main body 11, and the midline of the first side surface perpendicular to the width direction passes through the first area 31a. Distances are reserved between the first area 31a and both side edges of the width of the substrate 31. The first area 31a is generally located in the middle area of the width direction of the first side surface of the substrate 31, and the midline of the substrate 31 perpendicular to the width direction passes through this area. The power components are relatively high and are arranged in the middle area of the width direction of the first side surface, with a certain distance from the edge of the circuit board. The protruding portion 12 is also generally centered on the top of the main body 11, and the relatively high power components can just be accommodated in the extended cavity formed by the protruding portion 12, and the structural layout is very reasonable. One side of the signal components is close to the first area 31a, and it is not excluded that part of them extends into the first area 31a. The other side of the signal components is close to the edge of the substrate 31. The signal components are relatively low in height and have little influence on the height of the housing. The signal components are arranged close to the edge of the circuit board. Correspondingly, the side of the main body 11 adjacent to the protruding portion 12 can be designed with an inclined surface, which can not only provide accommodation space for the signal components, but also make the appearance of the adapter look beautiful and small.

[0041] In a specific embodiment, the main body 11 includes a first half shell 113 and a second half shell 115. The first half shell 113 and the second half shell 115 are joined together along the width direction of the main body 11 to form a main cavity. Please refer to Figure 2 and Figure 5 As shown, after the first half shell 113 and the second half shell 115 are joined together, an opening is formed at the top. The protruding part 12 is disposed at the opening and is clamped between the first half shell 113 and the second half shell 115, and is fixed by the joining of the first half shell 113 and the second half shell 115.

[0042] The structures of the first half shell 113 and the second half shell 115 are substantially the same and are substantially symmetric about the joining surface. Notches are provided in the middle regions where the first half shell 113 and the second half shell 115 are joined. After the first half shell 113 and the second half shell 115 are joined together, the two notches are joined to form the above-mentioned opening. In this way, the protruding part 12 is clamped and positioned at the joining place of the two half shells, and the fixation of the protruding part can be achieved after the two half shells are fixed, which is convenient for assembly and molding.

[0043] As described above, the first side surface of the substrate 31 is roughly divided into a first region 31a and a second region 31b according to the types of the arranged components. The power components are arranged in the first region 31a, and the signal components are arranged in the second region 31b. In a specific embodiment, the first region 31a extends along the length direction of the substrate 31, and the power components are roughly evenly distributed in the first region 31a along the length direction of the substrate 31. Specifically, the first region 31a is roughly a rectangular region, the length side of the first region 31a is parallel to the length direction of the substrate 31, and the power components are roughly evenly distributed along the length direction of the substrate 31. In this way, the mutual influence of heat between the power components can be reduced, and the overall heat dissipation effect can be improved. Preferably, the second region 31b also extends along the length direction of the first side surface.

[0044] In a specific embodiment, please refer to Figure 3 and Figure 4, according to the arrangement relationship, the power components include five groups of components arranged in sequence, and the height of three groups of components (323, 325) is greater than the height of the remaining two groups of components 321. The remaining two groups of components 321 are arranged at intervals between the three groups of components (323, 325). For the purpose of easy explanation, in the arrangement order, the five groups of components are defined to occupy the first position, the second position, the third position, the fourth position and the fifth position in sequence, and three groups of components are respectively arranged at the first position, the third position and the fifth position, and the remaining two groups of components are respectively arranged at the second position and the fourth position. The power heat sink 41 is arranged on the remaining two groups of components 321, and the height of the power heat sink 41 is lower than or equal to the maximum height of the three groups of components (323, 325). Since three groups of components are higher than the remaining two groups of components, the power heat sink is arranged on the remaining two groups of components with lower height, adjacent to the three groups of higher components, and does not exceed the maximum height of the three groups of components, which is beneficial to enhancing the overall heat dissipation effect of the power components and maintaining a lower overall height of the circuit board assembly.

[0045] In a specific embodiment, the five groups of components are arranged in a straight line in sequence, corresponding to the first position, the second position, the third position, the fourth position and the fifth position in a straight line arrangement. One of the three groups of components (323, 325) is located in the middle position of the straight line, that is, the third position, and the other two of the three groups of components (323, 325) are respectively located at the two ends of the straight line, that is, the first position and the fifth position. The number of the power heat sinks 41 is two, and the two power heat sinks 41 are respectively arranged on the remaining two groups of components 321, respectively located at the second position and the fourth position. In this way, the heat of the five groups of components arranged in a straight line is dispersed, which is beneficial to improving the efficiency of heat exchange with the outside world, reducing the mutual heat influence between the five groups of components, and having a better heat dissipation effect.

[0046] In a specific embodiment, the remaining two groups of components 321 include MOS transistors, and the three groups of components include capacitors 323 or inductors 325, or both can be included. Exemplarily, MOS transistors are arranged at both the second position and the fourth position, capacitors 323 are arranged at the first position and the fifth position, and an inductor 325 is arranged at the third position. The MOS transistors are mounted on the first side surface, the power heat sink 41 is fixedly arranged on the upper surface of the MOS transistors, and the capacitors 323 and the inductor 325 are adjacent to the power heat sink 41, and the overall heat dissipation effect is better. In this embodiment, the power heat sink 41 is adhered to the upper surface of the MOS transistors. It is preferably adhered with a thermal conductive adhesive, which can enhance the heat transfer efficiency between the power heat sink 41 and the MOS transistors.

[0047] Further, in order to enhance the heat transfer efficiency and improve the heat dissipation effect, the power heat dissipation member 41 is thermally connected to three groups of components by thermal conductive adhesive, thereby enhancing the heat dissipation effect of the three groups of components. Specifically, in the embodiment where the three groups of components include capacitors and inductors, both the capacitor 323 and the inductor 325 are thermally connected to the power heat dissipation member 41 by thermal conductive adhesive. In the embodiment where the three groups of components include capacitors or inductors, the capacitor 323 is thermally connected to the power heat dissipation member 41 by thermal conductive adhesive, or the inductor 325 is thermally connected to the power heat dissipation member 41 by thermal conductive adhesive.

[0048] In order to enhance the heat dissipation effect of power components, in one embodiment, please refer to Figure 1 , the power heat dissipation member includes a plurality of spaced-apart extended heat sinks. Specifically, the extended heat sinks are in the shape of thin sheets, and the plurality of extended heat sinks are arranged in parallel with each other, with a gap between adjacent extended heat sinks. The extension plane of each extended heat sink is substantially perpendicular to the first side surface, and the same sides of all the extended heat sinks are connected to each other, and the connected part is adhered to the MOS transistor. The extended heat sinks increase the thermal contact area, which is beneficial to improving the heat dissipation effect.

[0049] Please refer to Figure 1 and Figure 2 , the component 32 includes an electrical socket 324, and the electrical socket 324 is arranged on the first side surface of the substrate 31 for plugging into an external connector. The housing 10 is provided with a socket 114 opposite to the electrical socket 324, and the external connector is plugged into the electrical socket 324 through the socket 114. Specifically, the external connector is plugged into the electrical socket 324 along the direction of the socket 114 towards the electrical socket 324. As described above, the battery pack interface 20 includes an electrode seat 22 and an open end 21 arranged opposite to the electrode seat 22, and the battery pack is plugged into the electrode seat 22 along the direction from the open end 21 to the electrode seat 22. The socket 114 and the open end 21 are respectively located at both ends of the housing 10. Preferably, the electrode seat 22 is parallel and spaced apart from the substrate 31, and the electrode seat 22 and the electrical socket 324 are arranged near the same end of the substrate 31, and the electrode seat 22 and the electrical socket 324 are respectively located on both sides of the extension plane of the substrate 31. In this way, the insertion paths of the battery pack and the external connector are respectively located on opposite sides of the battery pack adapter, the insertion paths do not interfere with each other, the insertion directions are opposite, and the operation is more convenient and smooth.

[0050] The above "the electrode seat 22 is parallel to the substrate 31" is understood as that the plugging and unplugging direction of the electrode seat 22 is parallel to the substrate 31. Taking Figure 2 the "up", "down", "left", and "right" of the shown drawing as a reference, both the electrode seat 22 and the electrical socket 324 are arranged near the left side of the substrate 31, the electrode seat 22 is located below the substrate 31, and the electrical socket 324 is located above the substrate 31.

[0051] In a specific embodiment, please refer to Figure 2 ,3 and Figure 4 For connecting the wire, the substrate 31 further includes a welding position 315 for welding the wire. The electrical socket 324 and the welding position 315 are oppositely arranged at both ends of the first region. There is a wire passing cavity 112 between the substrate 31 and the electrode base 22. One end of the wire is welded to the welding position 315, and the other end is connected to the electrode base 22 after passing through the wire cavity 112. In Figure 2 In the left-right direction of the shown drawing, the welding position 315 is located at the right end of the substrate 31, the electrical socket 324 is located at the upper side of the left end of the substrate 31, and the electrode base 22 is located at the lower side of the left end of the substrate 31. Arranging a wire passing cavity between the substrate and the electrode base can facilitate the layout of the wire and also enhance the heat dissipation of the substrate.

[0052] Furthermore, to improve the heat dissipation effect, please continue to refer to Figure 2 , the battery pack adapter further includes a heat dissipation plate 42 for enhancing the heat dissipation of the substrate 31. Specifically, the heat dissipation plate 42 is generally in the shape of a flat plate, arranged on the second side surface of the substrate 31, and is roughly matched with the shape of the second side surface. The outer surface of the heat dissipation plate 42 facing away from the substrate 31 forms the inner wall of the wire passing cavity 112. The setting of the heat dissipation plate 42 can increase the heat dissipation area of the second side surface of the substrate and improve the heat dissipation effect.

[0053] Specifically, for facilitating the connection with the wire, the heat dissipation plate 42 includes a notch 420 opposite to the welding position 315. The wire passes through the notch 420 and is welded to the welding position 315. Except for the notch 420, the outer edge of the heat dissipation plate 42 is flush with the outer edge of the substrate 31. In this way, the setting of the heat dissipation plate maximizes the heat dissipation area without increasing the overall width and length of the circuit board and the heat dissipation structure, and at the same time ensures the smooth connection between the wire and the welding position.

[0054] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art can make other different forms of changes or modifications without creative efforts, and all of them should fall within the protection scope of the present invention.

Claims

1. A battery pack adapter, characterized in that, Comprising: A housing; A battery pack interface, disposed on the housing for plugging into a battery pack; A circuit board, disposed within the housing, including a substrate and components disposed on the substrate. The substrate includes a first side surface and a second side surface facing away from each other, and the components are disposed on the first side surface of the substrate; The components include power components for controlling power and signal components for processing signals. The power components are disposed in a first region of the first side surface, and the signal components are disposed in a second region of the first side surface. The first region and the second region are sequentially distributed along the width direction of the first side surface; A power heat sink, disposed in the first region and thermally connected to at least some of the power components.

2. The battery pack adapter according to claim 1, characterized in that, The first region extends along the length direction of the substrate, and the power components are substantially evenly distributed in the first region along the length direction of the substrate.

3. The battery pack adapter according to claim 2, characterized in that, The power components include five groups of components, where the height of three groups of components is greater than the height of the remaining two groups of components. The remaining two groups of components are spaced apart and disposed between the three groups of components, and the power heat sink is disposed on the remaining two groups of components; The height of the power heat sink is lower than or equal to the maximum height of the three groups of components.

4. The battery pack adapter according to claim 3, wherein, The remaining two groups of components include MOS transistors, and the three groups of components include capacitors and / or inductors. The power heat sink is fixedly disposed on the upper surface of the MOS transistors, and the capacitors and / or inductors are disposed adjacent to the power heat sink; the capacitors are connected to the power heat sink through thermal conductive glue, and / or, the inductors are connected to the power heat sink through thermal conductive glue.

5. The battery pack adapter according to claim 1, characterized in that, The battery pack interface includes an electrode seat for docking with a battery pack and an opening disposed opposite the electrode seat. The components further include an electrical socket for plugging into an external connector. The housing is provided with a socket opposite the electrical socket. The electrode seat and the electrical socket are disposed near the same end of the substrate, and the socket and the opening are respectively located at both ends of the housing.

6. The battery pack adapter according to claim 5, characterized in that, The substrate further includes welding positions for welding wires. The electrical socket and the welding positions are disposed opposite each other at both ends of the first region; There is a wire passing cavity between the substrate and the electrode seat. One end of the wire is welded to the welding position, and the other end passes through the wire passing cavity and then is connected to the electrode seat.

7. The battery pack adapter according to claim 6, characterized in that, It further includes a heat dissipation plate, disposed on the second side surface of the substrate, substantially matching the shape of the second side surface. The outer surface of the heat dissipation plate facing away from the substrate forms the inner wall of the wire passing cavity.

8. The battery pack adapter according to claim 7, characterized in that, The heat dissipation plate includes a notch opposite the welding position. The wire passes through the notch and is welded to the welding position. Except for the notch, the outer edge of the heat dissipation plate is flush with the outer edge of the substrate.

9. The battery pack adapter according to claim 1, wherein The housing includes a main body and a protruding portion. The battery pack interface is disposed at the bottom of the main body. The protruding portion is disposed at the top of the main body opposite to the battery pack interface. The protruding portion is higher than the top of the main body. A main cavity is formed within the main body, and the circuit board is disposed within the main cavity. An extended cavity is formed within the protruding portion, and the extended cavity communicates with the main cavity. The overall height of the power components is greater than the overall height of the signal components, and at least a part of the power components extends into the extended cavity.

10. The battery pack adapter according to claim 9, characterized in that, In the width direction of the main body, the protruding portion is disposed approximately in the middle of the top of the main body, and the midline of the first side surface perpendicular to the width direction passes through the first region.

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