Driver and motor control system

Abstract

The utility model relates to a driver and a motor control system. The driver comprises a first substrate, a second substrate, a driving unit and a power module, wherein the driving unit and the power module are integrated in the same package to form an intelligent power module; the power module is arranged on the first substrate, the driving unit is arranged on the second substrate, and the first substrate and the second substrate are arranged in parallel, so that the technical problems that a traditional driver is large in size, low in reliability and high in cost are solved, the overall size of the driver is remarkably reduced, the reliability of the driver is improved, and the cost of the driver is reduced. And the cost of the driver is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of motor control, and particularly to a driver and a motor control system. Background Art

[0002] The hardware components (i.e., driver hardware) in traditional electric control technology are: a logic unit MCU / DSP, a drive unit PRE-DRIVE, and a power module MOSFET / IGBT. These three parts are all independent devices / modules, and the packaging technology and heat dissipation technology of the power module are poor, resulting in a large volume, low reliability, and high cost of traditional drivers. For example, since each device / module is independent, a large space is required to install these devices / modules and ensure sufficient heat dissipation space. There are many connection lines between each device / module, increasing the number of fault points, and each independent device / module may have its own heat dissipation problem, affecting the stability of the overall system. Independent devices / modules mean more manufacturing costs, assembly costs, and possibly higher maintenance costs.

[0003] In view of the above problems, no effective solution has been proposed yet. Summary of the Utility Model

[0004] Embodiments of the present application provide a driver and a motor control system to at least solve the technical problems of large volume, low reliability, and high cost existing in traditional drivers.

[0005] According to one aspect of the embodiments of the present application, a driver is provided, including: a first substrate, a second substrate, a drive unit, and a power module; wherein: the drive unit and the power module are integrated in the same package to form an intelligent power module; the power module is disposed on the first substrate, the drive unit is disposed on the second substrate, and the first substrate and the second substrate are disposed in parallel.

[0006] Optionally, the power module includes one or more power switching devices, and the power switching devices include silicon carbide power switching devices or gallium nitride power switching devices.

[0007] Optionally, the first substrate and the second substrate have the same substrate diameter, and the maximum value of the substrate diameter is less than 57 mm; the first substrate and the second substrate have the same substrate thickness, and the substrate thickness is 1.6 mm.

[0008] Optionally, the value of the substrate diameter is 45 mm.

[0009] Optionally, the first substrate is a metal substrate.

[0010] Optionally, the metal substrate includes an aluminum substrate or a copper substrate.

[0011] Optionally, it further includes: a logic unit, connected to the driving unit, and the logic unit is disposed on the second substrate.

[0012] Optionally, it further includes: a communication unit, connected to the logic unit, and the communication unit is disposed on the second substrate; a sampling unit, respectively connected to the logic unit and the power module, and the sampling unit is disposed on the first substrate.

[0013] Optionally, it further includes: a radiator for reducing the operating temperature of the power switching device in the power module; wherein, the first substrate is attached to the upper surface of the radiator.

[0014] According to another aspect of the embodiments of the present application, a motor control system is provided, including: a motor and a motor driver connected thereto; wherein, the motor driver includes the driver described above.

[0015] In the embodiments of the present application, the driver includes a first substrate, a second substrate, a driving unit and a power module; wherein: the driving unit and the power module are integrated in the same package to form an intelligent power module; the power module is disposed on the first substrate, the driving unit is disposed on the second substrate, and the first substrate and the second substrate are arranged in parallel, thereby solving the technical problems of the traditional driver having a large volume, low reliability and high cost, achieving the technical effects of significantly reducing the overall volume of the driver, improving the reliability of the driver, and reducing the cost of the driver. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can obtain other embodiments according to these drawings without creative efforts.

[0017] Figure 1 A schematic diagram of a driver provided by an embodiment of the present application;

[0018] Figure 2 A schematic diagram of another driver provided by an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the connection relationship of each component in the motor control system provided by an embodiment of the present application. Detailed Embodiments

[0020] Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the embodiments of the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided to more thoroughly and completely understand the embodiments of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not used to limit the protection scope of the present application.

[0021] According to one aspect of the embodiments of the present application, a driver is provided. Figure 1 The following is a schematic diagram of a driver provided by an embodiment of the present application, as Figure 1 shown, the driver includes: a first substrate 11, a second substrate 12, a driving unit 13, and a power module 14; wherein:

[0022] The driving unit 13 and the power module 14 are integrated in the same package to form an intelligent power module;

[0023] The power module 14 is disposed on the first substrate 11, the driving unit 13 is disposed on the second substrate 12, and the first substrate 11 and the second substrate 12 are disposed in parallel.

[0024] The driving unit 13 is used to control the on / off of the power switching device in the power module 14.

[0025] In the embodiments of the present application, the driver includes a first substrate, a second substrate, a driving unit, and a power module; wherein: the driving unit and the power module are integrated in the same package to form an intelligent power module; the power module is disposed on the first substrate, the driving unit is disposed on the second substrate, and the first substrate and the second substrate are disposed in parallel, thereby solving the technical problems of the traditional driver having a large volume, low reliability, and high cost, and achieving the technical effects of significantly reducing the overall volume of the driver, improving the reliability of the driver, and reducing the cost of the driver.

[0026] The intelligent power module simplifies the number of modules in the architecture by integrating the driving unit 13 and the power module 14 in a single package, thereby realizing the reduction of the overall size of the driver. By using an intelligent power module with a half-bridge or full-bridge structure, three / six power devices are encapsulated in two / one module, thereby further reducing the volume. Further, the driving unit 13 further includes a protection circuit, and the protection circuit is used to monitor the state of the power switching device and cut off the power supply in case of an abnormality.

[0027] A dual - substrate layout is adopted. The first substrate 11 is provided with a power module 14, which is responsible for handling high - current and high - power applications. The second substrate 12 is provided with a drive unit 13, which is responsible for handling signals and control logic. The first substrate 11 and the second substrate 12 are placed in parallel, which can effectively utilize space and is also beneficial for heat dissipation.

[0028] In addition, the power module 14 is fixed on the first substrate 11 through direct connection technology (such as direct bonded copper DBC technology) to reduce thermal resistance and electrical impedance. The drive unit 13 and the power module 14 are connected by short and thick lines to reduce signal delay and electromagnetic interference.

[0029] Optionally, the second substrate is used to receive instructions from an external controller and generate control signals; the first substrate is adjacent to or integrated on the same layer as the second substrate, and is used to receive control signals and convert them into voltage and current signals required to drive power switching devices; wherein, the positional relationship between the first substrate and the second substrate enables them to be connected through direct physical connection or through short - distance internal traces, so as to minimize signal transmission delay and reduce electromagnetic interference, thereby achieving a reduction in the overall size of the driver.

[0030] Optionally, the above - mentioned driver further includes: a support structure, which is used to maintain the parallel relationship and spacing between the first substrate and the second substrate, and the spacing is preferably 1 to 5 mm to ensure electrical isolation and air circulation; a connection structure, which is used to connect the first substrate and the second substrate, and the connection structure is preferably located at the edge of the substrate to reduce the impact on the intermediate area; wherein, the first substrate and the second substrate remain parallel to ensure stable electrical performance.

[0031] Furthermore, the support structure includes support columns or insulating frames, and the support columns or insulating frames are made of non - conductive materials.

[0032] The above - mentioned driver is used to drive motors, inverters or other power electronic devices.

[0033] Optionally, when the driver is a motor driver, the logic unit issues a pulse - width modulation (PWM) signal to control the speed and torque of the motor; the drive unit: receives the PWM signal from the logic unit, amplifies the signal and converts it into a signal suitable for driving power switching devices; the power module contains multiple power switching devices (such as IGBTs), and conducts and turns off according to the signal provided by the drive unit, thereby controlling the voltage waveform output to the motor.

[0034] As an alternative embodiment, the above - mentioned power module 14 includes one or more power switching devices, and the power switching devices include silicon carbide power switching devices or gallium nitride power switching devices.

[0035] The power module 14 includes one or more power switching devices. Silicon carbide (SiC) power switching devices or gallium nitride (GaN) power switching devices can be selected as the core components. SiC and GaN devices have a relatively high operating temperature range and can maintain stable operation in harsh environments. SiC and GaN devices have a lower on-resistance and switching losses, so the operating efficiency of the driver can be improved. SiC and GaN devices have a faster switching speed, can support a higher switching frequency, and thus improve the dynamic response and control accuracy of the system.

[0036] The above-mentioned silicon carbide (SiC) power switching devices include, but are not limited to, metal-oxide-semiconductor field-effect transistors (SiC MOSFETs), junction field-effect transistors (SiC JFETs), Schottky barrier diodes (SiC SBDs), and insulated-gate bipolar transistors (SiC IGBTs).

[0037] The above-mentioned gallium nitride (GaN) power switching devices include, but are not limited to, high electron mobility transistors (GaN HEMTs) and field-effect transistors (GaN FETs).

[0038] In a specific implementation process, the number of power switching devices included in the power module 14 can be set according to the needs of the application scenario. For example, 6 power switching devices can be set in the power module 14.

[0039] As an alternative embodiment, the substrate diameters of the first substrate 11 and the second substrate 12 are the same, and the maximum value of the substrate diameter is less than 57 mm; the substrate thicknesses of the first substrate 11 and the second substrate 12 are the same, and the substrate thickness is 1.6 mm.

[0040] Since the traditional substrate diameter is usually greater than or equal to 57 mm, by limiting the maximum value of the substrate diameter to not exceed 57 mm in the embodiments of the present application, the overall volume of the driver is significantly reduced, making it more compact. In addition, the substrate thickness of 1.6 mm helps to further reduce the thickness of the driver, making it more suitable for application scenarios with limited space.

[0041] In a specific implementation process, the substrate diameter can be set according to the needs of the application scenario. For example, the substrate diameter of the power module can be 55 mm, 50 mm, 45 mm, etc.

[0042] The first substrate and the second substrate have the same size and shape.

[0043] As an alternative embodiment, the value of the substrate diameter is 45 mm.

[0044] The diameters of the first substrate 11 and the second substrate 12 are the same, and the diameter value is 45 mm. By defining the substrate diameter as 45 mm, the overall volume of the driver is further significantly reduced, making it more compact.

[0045] As an alternative embodiment, the first substrate 11 is a metal substrate. The second substrate 12 is an FR4 substrate.

[0046] The traditional first substrate is usually an FR4 substrate. FR4 is a common glass fiber-reinforced epoxy resin material. The thermal resistance of FR4 is mainly affected by the thickness of the board and the glass fiber content. Therefore, the fiber has a relatively high thermal conductivity. In contrast, the first substrate 11 in this application is a metal substrate. The metal substrate has higher mechanical strength compared to other types of substrates (such as FR4), which helps protect the internal components from mechanical stress damage. Additionally, the metal substrate (especially the copper substrate) has a similar coefficient of thermal expansion to the power module, which helps reduce stress accumulation caused by thermal cycling, thereby improving the reliability and lifespan of the system.

[0047] The intelligent power module that combines the drive unit and the power module not only reduces the overall volume of the driver but also decreases the distance between the drive unit and the power module. The reduction in distance helps improve the control performance of the drive unit over the power module (i.e., better signal integrity), and the improved performance further reduces the heat generation of the power module and enhances its reliability. After packaging, although the volume of the intelligent power module is reduced, the heat sources generated by the module are more concentrated, and it will face heat dissipation problems. Therefore, a high-performance heat dissipation solution design is required. The embodiment of this application also provides a heat dissipation method by using an aluminum substrate / copper substrate to achieve high-efficiency heat dissipation performance, and then combines the intelligent power module with the aluminum substrate / copper substrate heat dissipation and applies it to the driver product.

[0048] In addition, in addition to the above-mentioned integration of the drive unit and the power module in one package, it can be replaced by integrating the logic unit and the drive unit in one package, which can also reduce the overall volume of the driver.

[0049] As an alternative embodiment, the metal substrate includes an aluminum substrate or a copper substrate.

[0050] Aluminum or copper as a heat-conducting material can effectively improve the heat conduction efficiency from the power module to the outside world, thereby enhancing the heat dissipation performance of the entire system. For example, taking aluminum as the substrate, it has excellent heat dissipation performance. The thermal resistance of the aluminum substrate is mainly affected by the thermal conductivity of the material and the thickness of the board. Therefore, it is necessary to select a material with high thermal conductivity. The thermal conductivity of a high-purity aluminum substrate is better than that of an alloy aluminum substrate. In addition, the board thickness also affects the thermal resistance, and a thicker aluminum substrate has a lower thermal resistance. Under the condition of the same board thickness and size, the aluminum substrate has good heat dissipation, and its thermal conductivity is about 10 times that of FR4.

[0051] The embodiment of this application adopts an aluminum substrate / copper substrate for heat dissipation, ensuring high heat dissipation performance.

[0052] Figure 2 For another schematic diagram of the driver provided by the embodiment of this application, as Figure 2 shown, the driver further includes: a logic unit 15, connected to the driving unit 13, and the logic unit 15 is arranged on the second substrate 12.

[0053] The second substrate 12 carries the driving unit 13 and the logic unit 15, and is used for signal processing, control logic, and execution of advanced algorithms. In addition, the logic unit 15 and the driving unit 13 are connected through a dedicated line to ensure the accuracy and stability of signal transmission. The above-mentioned logic unit 15 includes, but is not limited to, a micro control unit (MCU).

[0054] Furthermore, as Figure 2 shown, the driver further includes: a communication unit 16, connected to the logic unit 15, and the communication unit 16 is arranged on the second substrate 12; a sampling unit 17, respectively connected to the logic unit 15 and the power module 14, and the sampling unit 17 is arranged on the first substrate 11.

[0055] The sampling unit 17 is used to detect relevant parameters of the power module 14, such as current, voltage, etc. The driving unit 13, the logic unit 15, and the communication unit 16 are arranged on the second substrate 12. The driving unit 13 is used to drive the power module 14. The logic unit 15 is used for signal processing, control logic, and execution of advanced algorithms. The communication unit 16 is used for data exchange with other devices.

[0056] The sampling unit 17 and the logic unit 15 are connected through a dedicated line for transmitting the detected data. The communication unit 16 and the logic unit 15 are connected through a dedicated line for sending and receiving control instructions and status information.

[0057] The sampling unit 17 can monitor the status of the power module in real time, while the communication unit 16 can perform data exchange with other systems, enhancing the monitoring ability and networking level of the driver.

[0058] Furthermore, asFigure 2 As shown, the driver further includes: a radiator 18 for reducing the operating temperature of the power switching device in the power module; wherein, the first substrate 11 is attached to the upper surface of the radiator 18.

[0059] The radiator 18 is used to reduce the operating temperature of the power switching device in the power module, and the first substrate 11 is directly attached to the upper surface of the radiator 18. High-performance thermal interface materials (TIMs) are used to enhance the heat conduction from the power module to the radiator. By directly attaching the first substrate 11 to the radiator 18, more efficient heat conduction can be achieved, further improving the heat dissipation performance.

[0060] Optionally, the radiator is made of a high thermal conductivity material, is in close contact with the silicon carbide power switching device, and has a finned design to increase the surface area and improve the natural cooling efficiency; wherein, the radiator is connected to the power switching device by means of screws or adhesives, etc., and a high-performance thermal interface material is used between the radiator and the power switching device to reduce the contact thermal resistance.

[0061] In addition, the radiator is integrated with a temperature sensor for monitoring the operating temperature of the silicon carbide power switching device. The radiator can dissipate heat according to the operating temperature of the power switching device by automatically adjusting the cooling effect.

[0062] According to another aspect of the embodiments of the present application, a motor control system is provided, including: a motor and a motor driver connected thereto; wherein, the motor driver includes the driver in the embodiments of the present application.

[0063] Figure 3 Schematic diagram of the connection relationships of the various components in the motor control system provided by the embodiments of the present application, as Figure 3 shown, the motor driver includes a logic unit (MCU STM32F407ZE), a drive unit (Drive IC), a power unit (MOSFET*6), a communication unit (CAN, EtherCAT, and LAN9252), a sampling unit (sampling resistor, current sampling integrated circuit (CURRENT SAMPLE IC)), a transceiver (LTC2851), and other auxiliary components; wherein, the logic unit is connected to the magnetic encoder through the transceiver; the drive unit is respectively connected to the logic unit and the power unit, the logic unit is also respectively connected to the sampling unit and the motor, and the logic unit is also connected to the sampling unit. In addition, the logic unit is also respectively connected to a debug port (SWD), a clock source (CLOCK 8M), an electrically erasable programmable read-only memory chip (24LC16), and a temperature sensor (Temp sensor).

[0064] Further, the logic unit uses a microcontroller (STM32F407ZE) as the control center of the entire system. Among them, it is connected to the magnetic encoder through a transceiver (LTC2851) to obtain the position and speed information of the motor; it is connected to the drive unit to control the switching action of the power unit; it is connected to the sampling unit to read the data of the current sampling integrated circuit (CURRENTSAMPLE IC) to monitor the working current of the motor; it is directly connected to the motor to control the operating state of the motor; it is connected to the debug port (SWD) for debugging and program downloading; it is connected to the clock source (CLOCK 8M) to provide a stable clock signal for the system; it is connected to the electrically erasable programmable read-only memory chip (24LC16) to store system configurations and key data; it is connected to the temperature sensor (Temp sensor) to monitor the temperature of the system.

[0065] Further, the drive unit (Drive IC) is used to receive the control signals from the logic unit and convert these signals into appropriate voltage and current signals to drive the power unit. Among them, it is connected to the logic unit to receive control signals; it is connected to the power unit to drive the power unit.

[0066] Further, the power unit (MOSFET*6) is a bridge circuit composed of six MOSFETs, which is used to control the current flow direction of the motor. Among them, it is connected to the drive unit to receive drive signals; it is connected to the motor to control the current of the motor.

[0067] Further, the communication unit includes CAN, EtherCAT, and LAN9252, which are used for communication with other devices or systems. Among them, CAN and EtherCAT are used for data exchange with other devices; LAN9252 is used for Ethernet communication to achieve remote monitoring and control.

[0068] Further, the sampling unit includes a sampling resistor and a current sampling integrated circuit (CURRENT SAMPLE IC), which are used to monitor the working current of the motor. Among them, the sampling resistor is connected in series in the current path of the motor to generate a voltage signal proportional to the current; the current sampling integrated circuit is used to convert the voltage signal into current data and read it through the logic unit.

[0069] Further, the transceiver (LTC2851) is used to convert the analog signal of the magnetic encoder into a digital signal and transmit the digital signal to the logic unit.

[0070] In the embodiments of the present application, by optimizing the connection relationships between various devices, the compactness, reliability, and ease of use of the system are achieved, and the overall performance of the system is improved.

[0071] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper", etc. can be used here to describe the spatial positional relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figure for the device. For example, if the device in the drawing is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding interpretations of the spatial relative descriptions used here will be made accordingly.

[0072] In addition, it should be noted that the use of terms such as "first", "second", etc. to define components is only for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the scope of protection of this application.

[0073] The above are only the preferred embodiments of this application and are not used to limit this application. For those skilled in the art, various changes and modifications can be made to this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of this application shall be included within the scope of protection of this application.

Claims

1. A driver, characterized in that, Comprising: A first substrate, a second substrate, a driving unit, and a power module; wherein: The driving unit and the power module are integrated in the same package to form an intelligent power module; The power module is disposed on the first substrate, the driving unit is disposed on the second substrate, and the first substrate and the second substrate are arranged in parallel.

2. The driver according to claim 1, wherein The power module includes one or more power switching devices, and the power switching devices include silicon carbide power switching devices or gallium nitride power switching devices.

3. The driver according to claim 1, wherein The first substrate and the second substrate have the same substrate diameter, and the maximum value of the substrate diameter is less than 57 mm; The first substrate and the second substrate have the same substrate thickness, and the substrate thickness is 1.6 mm.

4. The driver according to claim 3, wherein The value of the substrate diameter is 45 mm.

5. The driver according to claim 1, characterized in that, The first substrate is a metal substrate.

6. The driver according to claim 5, characterized in that, The metal substrate includes an aluminum substrate or a copper substrate.

7. The driver according to claim 1, characterized in that, Further comprising: A logic unit, connected to the driving unit, and the logic unit is disposed on the second substrate.

8. The driver according to claim 7, characterized in that Further comprising: A communication unit, connected to the logic unit, and the communication unit is disposed on the second substrate; A sampling unit, respectively connected to the logic unit and the power module, and the sampling unit is disposed on the first substrate.

9. The driver according to any one of claims 1 to 8, characterized in that, Further comprising: A radiator for reducing the operating temperature of the power switching devices in the power module; wherein, the first substrate is attached to the upper surface of the radiator.

10. A motor control system, characterized in that, Comprising: A motor and a motor driver connected thereto; wherein, the motor driver includes the driver according to any one of claims 1 to 9.

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