Polishing equipment and flattening device for polishing pad of polishing equipment

Abstract

The utility model relates to polishing equipment and a flattening device of a polishing pad of the polishing equipment, the flattening device of the polishing pad comprises two flattening driving mechanisms, a connecting piece and a flattening device, each flattening driving mechanism comprises a moving driving source, the connecting piece is used for connecting the two flattening driving mechanisms, and a movable magnetic element is arranged on the connecting piece; a sleeve rail which is matched and sleeved with the connecting piece is arranged on the flattening device; the movable driving source drives the magnetic element to move on the connecting piece, and the sleeve rail is driven to move along with the magnetic element in a magnetic suspension mode. According to the flattening device for the polishing pad, the flattening device is adjusted to the position above the center position of the polishing disc through the flattening driving mechanism and the connecting piece, the flattening device is in close contact with the polishing pad on the polishing disc, rotation of the flattening device is matched with driving of the moving driving source to drive the flattening device to move on the connecting piece, and then rotation of the polishing disc is combined; the polishing pad of the polishing disc is flattened, the flattening efficiency of the polishing pad is improved, and the flattening quality can be guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and particularly to a polishing device and a flattening device for a polishing pad thereof. Background Art

[0002] Semiconductor wafers are important basic products in the electronics industry such as integrated circuits, communication products, and medical treatment. Semiconductor wafers are widely used in various fields and play a very crucial role. In the process of industrial production of wafers, the ingot is transformed into wafers through the slicing process, and the wafers need to go through processes such as grinding, polishing, and cleaning before the production of wafers is completed. In the process of wafer processing, the polishing process is a connecting process. This polishing process not only needs to remove the damaged layer generated in the previous process, but also needs to provide a good surface polishing morphology for subsequent cleaning. The polishing pad is essential in the wafer polishing process. However, any polishing pad has a certain service life in actual production. After polishing a certain number of wafers, it is necessary for someone to tear up the worn-out polishing pad on the polishing disc manually, paste a new polishing pad on the polishing disc, and after pasting, operations such as removing air bubbles, flattening and trimming, and cleaning the polishing pad need to be carried out to complete the replacement work of the entire polishing pad.

[0003] The existing flattening action of the polishing pad is carried out by manually holding a conical flattening tool and flattening from the inner circle to the outer circle on the polishing pad. During the flattening process, it is necessary for someone to hold the flattening tool with a certain force and continuously flatten it on the polishing pad for 5 - 6 circles (manually holding the flattening tool and manually flattening and trimming for 2 - 3 circles plus turning on the rotation switch of the polishing machine, and then manually holding the flattening tool and flattening and trimming on the polishing pad for 2 - 3 circles) to complete the trimming work of the polishing pad. The entire flattening process takes about 20 min to 30 min. Therefore, the defects of the existing flattening and trimming method of the polishing pad are as follows: First, since the rotation switch of the polishing machine needs to be turned on during the process of flattening the polishing pad, and the person holds the flattening tool and extends it into the polishing pad of the polishing machine and flattens the pad from the inner circle to the outer circle. If a malfunction occurs in the polishing machine at this time, it may cause harm to the person by the polishing machine, and there is a certain safety and environmental risk; Second, the manual flattening of the polishing pad takes a long time, affecting the processing efficiency of the product and unable to achieve the excellent effect of cost reduction and efficiency increase; Third, it is very time-consuming and laborious to manually flatten and trim the polishing pad. During the flattening process, the staff needs to try to maintain a uniform force, and the staff can only judge the force during the flattening process by feeling. Otherwise, it may cause damage to the polishing pad or unevenness of the polishing pad and some blistering phenomena. If the polishing pad is damaged or uneven, it may lead to poor flatness of the polished product. For example, there is a certain probability that the flatness of the first 2 - 3 batches of wafer products after replacing the polishing pad will be on the high side, which may be caused by the staff not flattening the polishing pad. Summary of the Utility Model

[0004] The present application provides a flattening device for a polishing apparatus and a polishing pad thereof, which is used to solve the technical problems that the flattening process of the existing polishing pad is manually operated, resulting in low work efficiency and unguaranteed quality.

[0005] To achieve the above object, the present application provides the following technical solutions:

[0006] In a first aspect, a flattening device for a polishing pad is provided, which is applied to a polishing machine. A polishing disc with a polishing pad is provided on the polishing machine. The flattening device for the polishing pad includes:

[0007] Two flattening driving mechanisms are respectively arranged on the polishing machine on both sides of the polishing disc. Each flattening driving mechanism includes a moving driving source, and the moving driving sources of the two flattening driving mechanisms are linked.

[0008] A telescopic connecting member is arranged above the polishing disc. The connecting member is used to connect the two flattening driving mechanisms, and a movable magnetic element is arranged on the connecting member.

[0009] A rotatable flattening device is movably sleeved on the connecting member. A sleeve rail that is matched and sleeved with the connecting member is arranged on the flattening device. The moving driving source drives the magnetic element to move on the connecting member, and the sleeve rail is driven to move with the magnetic element in a magnetic levitation manner.

[0010] Preferably, each flattening driving mechanism includes a base and a lifting arm arranged on the base. One end of the connecting member is connected to the side arm of the lifting arm in one flattening driving mechanism, and the other end of the connecting member is connected to the side arm of the lifting arm in the other flattening driving mechanism.

[0011] Preferably, a control switch for adjusting the height of the lifting arm is arranged on the base.

[0012] Preferably, the control switch is a knob switch.

[0013] Preferably, a first switch for controlling the moving driving source to drive the magnetic element to move leftward on the connecting member and a second switch for controlling the moving driving source to drive the magnetic element to move rightward on the connecting member are arranged on the base.

[0014] Preferably, both the first switch and the second switch are button switches.

[0015] Preferably, the moving driving source is a motor, and both ends of the magnetic element are connected to the moving driving sources of the two flattening driving mechanisms.

[0016] Preferably, the magnetic element is a magnet.

[0017] Preferably, it is located above the central position of the polishing disc, and the flattening device is sleeved on the connecting member.

[0018] In a second aspect, a polishing device is provided, including a polishing machine and a flattening device for the polishing pad as described above. The polishing machine includes a polishing disc and a polishing driving source for driving the polishing disc to rotate.

[0019] The polishing device and the flattening device for its polishing pad. The flattening device for the polishing pad is applied to a polishing machine. A polishing disc with a polishing pad is provided on the polishing machine. The flattening device for the polishing pad includes two flattening driving mechanisms, a connecting member, and a flattening device. The two flattening driving mechanisms are respectively arranged on the polishing machine on both sides of the polishing disc. Each flattening driving mechanism includes a moving driving source, and the moving driving sources of the two flattening driving mechanisms are linked and connected; the connecting member is arranged above the polishing disc, and the connecting member is used to connect the two flattening driving mechanisms. A movable magnetic element is arranged on the connecting member; the flattening device is movably sleeved on the connecting member, and a sleeve rail matching the connecting member is arranged on the flattening device; the moving driving source drives the magnetic element to move on the connecting member, and drives the sleeve rail to move with the magnetic element in a magnetic levitation manner.

[0020] It can be seen from the above technical solutions that the present application has the following advantages: The flattening device for the polishing pad adjusts the flattening device to above the central position of the polishing disc through the flattening driving mechanism and the connecting member, and the flattening device is in close contact with the polishing pad on the polishing disc. By combining the rotation of the flattening device with the driving of the moving driving source to drive the flattening device to move on the connecting member and then combining with the rotation of the polishing disc, the flattening operation of the polishing pad on the polishing disc is realized, improving the flattening efficiency of the polishing pad, and the flattening quality can also be guaranteed. It solves the technical problem that the flattening process of the existing polishing pad is manually operated, resulting in low work efficiency and unable to guarantee the quality.

[0021] The polishing device can realize the automatic flattening operation of the polishing pad on the polishing disc through the flattening device for the polishing pad, improving the processing efficiency, which cannot be achieved by manually flattening the polishing pad. And it acts from the inner circle to the outer circle of the polishing pad slowly. This process can significantly reduce the generation of bubbles on the polishing pad, laying a good foundation for the subsequent processing of the wafer, and to a certain extent, improving the yield of the produced wafer and manufacturing a wafer product with better flatness. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 This is a schematic perspective view of the flattening device for the polishing pad described in the embodiments of the present application. Detailed implementation manners

[0024] To make the objectives, features, and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the embodiments described below are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0025] In the description of the embodiments of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0026] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0027] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0028] The embodiment of the present application provides a flattening device for a polishing device and its polishing pad, which is used to solve the technical problems that the flattening process of the existing polishing pad is manually operated, resulting in low work efficiency and inability to guarantee quality. In this embodiment, the flattening device for the polishing device and its polishing pad takes the flattening of the polishing pad on the polishing disc as an example for illustration. In other embodiments, the flattening device for the polishing device and its polishing pad can also be applied to the flattening process of products such as sticking labels and films on workpieces.

[0029] Embodiment 1:

[0030] As Figure 1 shown, the embodiment of the present application provides a flattening device for a polishing pad, which is applied to a polishing machine. A polishing disc 1 with a polishing pad is provided on the polishing machine. The flattening device for the polishing pad includes two flattening driving mechanisms, a connecting member 4, and a flattening device 3.

[0031] In the embodiment of the present application, the two flattening driving mechanisms are respectively arranged on both sides of the polishing disc 1 on the polishing machine. Each flattening driving mechanism includes a moving driving source (not marked in the figure), and the moving driving sources (not marked in the figure) of the two flattening driving mechanisms are linked and connected.

[0032] It should be noted that the moving driving source can be a motor.

[0033] In the embodiment of the present application, the connecting member 4 is arranged above the polishing disc 1. The connecting member 4 is used to connect the two flattening driving mechanisms, and a movable magnetic element (not marked in the figure) is arranged on the connecting member 4.

[0034] It should be noted that both ends of the connecting member 4 are respectively connected to the two flattening driving mechanisms, and the connecting member 4 is telescopic. In this embodiment, the magnetic element (not marked in the figure) is built into the connecting member 4, and both ends of the magnetic element (not marked in the figure) are respectively connected to the moving driving sources of the two flattening driving mechanisms. The moving driving source drives the magnetic element (not marked in the figure) to move left or right on the connecting member 4. The magnetic element (not marked in the figure) is selected as a magnet. The connecting member 4 can be adjusted according to the diameter of the polishing disc 1, so that the flattening device 3 can be arranged above the center position of the polishing disc 1 with different size specifications. In other embodiments, the magnetic element (not marked in the figure) can be a magnetic rod, an inductor, or a magnetic bead, etc.

[0035] In the embodiment of the present application, the flattening device 3 is movably sleeved on the connecting member 4, and a sleeve rail 5 that is matched with the connecting member 4 is arranged on the flattening device 3; the moving driving source (not marked in the figure) drives the magnetic element (not marked in the figure) to move on the connecting member 4, and the sleeve rail 5 is driven to move with the magnetic element (not marked in the figure) by means of magnetic levitation.

[0036] It should be noted that the flattening device 3 is sleeved on the connecting member 4 above the central position of the polishing disc 1. Since the flattening device of this polishing pad automatically flattens the polishing pad on the polishing disc 1, the flattening device 3 is set to be rotatable (such as self-rotating). In this embodiment, in order to enable the flattening device 3 to flatten the polishing pad on the polishing disc 1 in all aspects, the flattening device 3 is movably arranged on the connecting member 4 through the sleeve rail 5, and a magnetic element (not marked in the figure) is driven by a moving drive source (not marked in the figure) to move left and right on the connecting member 4. Due to the magnetic levitation working principle, the magnetic element (not marked in the figure) drives the sleeve rail 5 to move left and right on the connecting member 4 along with the magnetic element (not marked in the figure), so that the movement of the flattening device 3 on the connecting member 4 can enable the flattening device 3 to flatten the polishing pad on the polishing disc 1 in all aspects. Among them, the sleeve rail 5 moves on the connecting member 4 in a magnetic levitation adsorption manner.

[0037] In the embodiment of the present application, the flattening device of this polishing pad first installs two flattening drive mechanisms on both sides of the polishing disc. The flattening device 3 is adjusted to above the central position of the polishing disc 1 through the flattening drive mechanism and the connecting member 4, and the flattening device 3 is in close contact with the polishing pad on the polishing disc 1, which is convenient for the flattening device 3 to flatten the polishing pad. By using the rotation of the polishing disc and the self-rotation of the flattening device 3, and then cooperating with the drive of a moving drive source (not marked in the figure) to drive the flattening device 3 to move on the connecting member 4, the flattening operation of the polishing pad 1 on the polishing disc 1 is realized.

[0038] A flattening device for a polishing pad provided by the present application is applied to a polishing machine. A polishing disc with a polishing pad is provided on the polishing machine. The flattening device of the polishing pad includes two flattening drive mechanisms, a connecting member and a flattening device. The two flattening drive mechanisms are respectively arranged on both sides of the polishing disc on the polishing machine. Each flattening drive mechanism includes a moving drive source, and the moving drive sources of the two flattening drive mechanisms are linked; the connecting member is arranged above the polishing disc, and the connecting member is used to connect the two flattening drive mechanisms. A movable magnetic element is arranged on the connecting member; the flattening device is movably sleeved on the connecting member, and a sleeve rail matching the connecting member is arranged on the flattening device; the moving drive source drives the magnetic element to move on the connecting member, and the sleeve rail is driven to move along with the magnetic element in a magnetic levitation manner. The flattening device of the polishing pad adjusts the flattening device to above the central position of the polishing disc through the flattening drive mechanism and the connecting member, and the flattening device is in close contact with the polishing pad on the polishing disc. By using the self-rotation of the flattening device and cooperating with the drive of the moving drive source to drive the flattening device to move on the connecting member and then combining with the rotation of the polishing disc, the flattening operation of the polishing pad of the polishing disc is realized, improving the flattening efficiency of the polishing pad, and the flattening quality can also be guaranteed, solving the technical problems that the flattening process of the existing polishing pad is manually operated, with low work efficiency and unable to guarantee the quality.

[0039] Such as Figure 1As shown, in one embodiment of the present application, each flattening drive mechanism includes a base 9 and a lifting arm 6 disposed on the base 9. One end of a connector 4 is connected to the side arm of the lifting arm 6 in one flattening drive mechanism, and the other end of the connector 4 is connected to the side arm of the lifting arm 6 in the other flattening drive mechanism. A control switch 2 for adjusting the height of the lifting arm 6 is disposed on the base 9.

[0040] It should be noted that each flattening drive mechanism is mounted on the polishing machine via a base 9. In this embodiment, the control switch 2 is a knob switch. Rotating the knob switch can adjust the height of the lifting arm 6, thereby controlling the position of the flattener 3. The height adjustment or lifting of the lifting arm 6 can be achieved using a lifting mechanism built into the base 9. The lifting mechanism includes a gear connected to the knob switch and a rack meshing with the gear. The rack is connected to the lifting arm 6. Rotating the knob switch drives the gear to rotate, and the rotation of the gear drives the rack to rise and fall, thereby driving the lifting arm 6. The structure of the lifting mechanism is a relatively mature technology in this field and will not be described in detail in this embodiment.

[0041] like Figure 1 As shown, in one embodiment of the present application, a first switch 7 for controlling the mobile driving source to drive the magnetic element to move to the left on the connecting member 4 and a second switch 8 for controlling the mobile driving source to drive the magnetic element to move to the right on the connecting member 4 are provided on the base 9.

[0042] It should be noted that both the first switch 7 and the second switch 8 can be key switches.

[0043] In the embodiment of the present application, the working principle of the flattening device of the polishing pad is as follows: first, two flattening drive mechanisms are installed on both sides of the center of the polishing disc 1, and the flattener 3 is also placed in the middle position of the polishing disc 1. The connecting piece 4 needs to be consistent with the diameter of the polishing disc 1 to ensure that the flattener 3 can flatten the polishing pad on the polishing disc 1 in all directions. Before flattening the polishing pad of the polishing disc 1, it is necessary to tear off the old polishing pad from the polishing disc 1, tear off the film on the adhesive side of the new polishing pad, and attach the new polishing pad to the polishing disc 1 in the air, and do not stick to it; adjust the height of the flattener 3 by the lifting arm 6 so that the flattener 3 is in the middle position; after controlling the polishing disc 1 to rotate one circle, the flattener 3 is translated by the mobile drive source, and the control of the polishing disc 1 to rotate one circle is repeated, and then the flattener 3 is translated. During the flattening operation of the polishing pad, the polishing pad needs to be lifted on all sides.

[0044] It should be noted that the installation of the flattener of the flattening device for the polishing pad takes about 2 minutes, the time for trimming the polishing pad takes about 8 minutes, and the whole process of flattening the polishing pad takes about 10 minutes. Compared with the existing manual flattening method for the polishing pad, the flattening device for the polishing pad reduces the time consumption by half, which significantly improves both production efficiency and labor. The flattening device for the polishing pad adopts the method of the flattener rotating and translating in combination. This method cannot be achieved by manual flattening. And it acts from the inner circle of the polishing pad to the outer circle slowly. This process can significantly reduce the generation of bubbles on the polishing pad, laying a good foundation for the subsequent processing of wafers, and can improve the yield of the produced wafers to a certain extent, and manufacture wafer products with better flatness.

[0045] Embodiment 2:

[0046] The embodiment of the present application provides a polishing device, including a polishing machine and the above-mentioned flattening device for the polishing pad. The polishing machine includes a polishing platen and a polishing drive source for driving the polishing platen to rotate.

[0047] It should be noted that the content of the flattening device for the polishing pad has been described in Embodiment 1 and will not be repeated in this embodiment. The flattening device for the polishing pad is arranged on the polishing machine. The polishing drive source can be selected as a motor. In this embodiment, the polishing device can automatically flatten the polishing pad on the polishing platen through the flattening device for the polishing pad, improving the processing efficiency. This method cannot be achieved by manual flattening of the polishing pad. And it acts from the inner circle of the polishing pad to the outer circle slowly. This process can significantly reduce the generation of bubbles on the polishing pad, laying a good foundation for the subsequent processing of wafers, and can improve the yield of the produced wafers to a certain extent, and manufacture wafer products with better flatness.

[0048] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A flattening device for a polishing pad, which is applied to a polishing machine. A polishing disc with a polishing pad is provided on the polishing machine, and it is characterized in that The flattening device of the polishing pad includes: Two flattening driving mechanisms, which are respectively arranged on both sides of the polishing disc on the polishing machine. Each flattening driving mechanism includes a moving driving source, and the moving driving sources of the two flattening driving mechanisms are linked and connected; A telescopic connecting member, which is arranged above the polishing disc. The connecting member is used to connect the two flattening driving mechanisms, and a movable magnetic element is arranged on the connecting member; A rotatable flattening device, which is movably sleeved on the connecting member. A sleeve rail that is matched and sleeved with the connecting member is arranged on the flattening device; the moving driving source drives the magnetic element to move on the connecting member, and drives the sleeve rail to move with the magnetic element in a magnetic levitation manner.

2. The flattening device for a polishing pad according to claim 1, characterized in that, Each flattening driving mechanism includes a base and a lifting arm arranged on the base. One end of the connecting member is connected to the side arm of the lifting arm in one flattening driving mechanism, and the other end of the connecting member is connected to the side arm of the lifting arm in the other flattening driving mechanism.

3. The flattening device of the polishing pad according to claim 2, characterized in that, A control switch for adjusting the height of the lifting arm is arranged on the base.

4. The flattening device of the polishing pad according to claim 3, characterized in that, The control switch is a knob switch.

5. The flattening device of the polishing pad according to claim 2, wherein, A first switch for controlling the moving driving source to drive the magnetic element to move leftward on the connecting member and a second switch for controlling the moving driving source to drive the magnetic element to move rightward on the connecting member are arranged on the base.

6. The flattening device for the polishing pad according to claim 5, characterized in that, Both the first switch and the second switch are push-button switches.

7. The flattening device for the polishing pad according to any one of claims 1-6, characterized in that, The moving driving source is a motor, and both ends of the magnetic element are connected to the moving driving sources of the two flattening driving mechanisms.

8. The flattening device of the polishing pad according to any one of claims 1-6, characterized in that, The magnetic element is a magnet.

9. The flattening device for the polishing pad according to any one of claims 1-6, characterized in that Above the central position of the polishing disc, the flattening device is sleeved on the connecting member.

10. A polishing device, characterized in that, It includes a polishing machine and the flattening device of the polishing pad according to any one of claims 1-9. The polishing machine includes a polishing disc and a polishing driving source for driving the polishing disc to rotate.

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