Polishing method and device for non-standard frame and storage medium

Abstract

The embodiment of the invention provides a non-standard frame polishing method and device and a storage medium. The method comprises the steps that a non-standard frame is fixed to a first preset position through a first fixing unit; performing primary polishing treatment on the non-standard frame through the first polishing unit to obtain a first frame, wherein the primary polishing treatment comprises rough polishing and medium polishing; the two first frames are buckled through a second fixing unit and then fixed to a second preset position; and controlling the second polishing unit to synchronously carry out secondary polishing treatment on the two first frames to obtain a second frame. Through the first polishing unit, rough polishing and medium polishing before fine polishing can be conducted on the non-standard frames, the polishing precision is guaranteed, the second polishing unit synchronously conducts secondary polishing treatment on the two first frames which are placed at the second preset position in a buckled mode to obtain the second frame, fine polishing of the two first frames can be completed at a time, and the polishing efficiency is improved. And the fine polishing efficiency of the frame is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of frame processing, and in particular to a polishing method and device for non-standard frames and a storage medium. BACKGROUND

[0002] Existing frame polishing is usually performed on standard frames. The polishing of standard frames is difficult to match the polishing of non-standard frames, and therefore, the existing polishing technology cannot meet the polishing requirements of non-standard frames. SUMMARY

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of protection of the claims.

[0004] The main purpose of the embodiments of the present application is to provide a polishing method and device for non-standard frames and a storage medium, which can meet the polishing requirements of non-standard frames.

[0005] In a first aspect, the embodiments of the present application provide a polishing method for non-standard frames, applied to a frame polishing device, the frame polishing device comprising a rough polishing module and a fine polishing module, the rough polishing module comprising a first fixing unit and a first polishing unit, the fine polishing module comprising a second fixing unit and a second polishing unit, and the polishing method for non-standard frames comprising: fixing a non-standard frame at a first preset position by the first fixing unit; obtaining a first frame by performing a one-time polishing process on the non-standard frame by the first polishing unit, the one-time polishing comprising rough polishing and middle polishing; fixing two first frames at a second preset position after being buckled by the second fixing unit; obtaining a second frame by controlling the second polishing unit to perform a two-time polishing process on the two first frames synchronously.

[0006] In some optional embodiments, the first polishing unit comprises a first mechanical arm, a first polishing mechanism is connected to the first mechanical arm, the first polishing mechanism comprises a first polishing wheel and a second polishing wheel; and the first frame is obtained by performing a one-time polishing process on the non-standard frame by the first polishing unit, comprising: obtaining a middle frame by performing rough polishing on the non-standard frame by the first polishing wheel; obtaining the first frame by performing middle polishing on the middle frame by the second polishing wheel, the polishing degree of the first frame being greater than that of the middle frame.

[0007] In some optional embodiments, the first frame is obtained by performing a one-time polishing process on the non-standard frame by the first polishing unit, comprising: determining a first polishing path and a second polishing path according to the first preset position, the first polishing path representing a movement path of the first polishing wheel, and the second polishing path representing a movement path of the second polishing wheel; obtaining frame information representing material information and preset polishing degree information of the non-standard frame; determining a first polishing curve atlas and a second polishing curve atlas according to the first polishing path, the second polishing path and the frame information, the first polishing curve atlas representing a first polishing time, a first polishing pressure and a first polishing rotating speed of the first polishing wheel on the first polishing path, and the second polishing curve atlas representing a second polishing time, a second polishing pressure and a second polishing rotating speed of the second polishing wheel on the second polishing path; driving the first polishing wheel to move along the first polishing path by the first mechanical arm, and controlling the first polishing wheel to perform rough polishing on the non-standard frame according to the first polishing curve atlas at the first polishing time, the first polishing pressure and the first polishing rotating speed, so as to obtain the intermediate frame; driving the second polishing wheel to move along the second polishing path by the first mechanical arm, and controlling the second polishing wheel to perform middle polishing on the intermediate frame according to the second polishing curve atlas at the second polishing time, the second polishing pressure and the second polishing rotating speed, so as to obtain the first frame.

[0008] In some optional embodiments, the second polishing unit comprises a second mechanical arm, and a second polishing mechanism is connected to the second mechanical arm, wherein the second polishing mechanism comprises a polishing disc; and the controlling the second polishing unit to perform secondary polishing on the two first frames simultaneously to obtain the second frame comprises: generating a third polishing path according to the second preset position; driving the polishing disc to move along the third polishing path by the second mechanical arm, so that the polishing disc performs secondary polishing on the two first frames simultaneously to obtain the second frame.

[0009] In some optional embodiments, the second mechanical arm is further provided with a laser ranging unit, and the driving the polishing disc to move along the third polishing path by the second mechanical arm comprises: during the driving of the polishing disc to move along the third polishing path by the second mechanical arm: detecting a relative distance between the two first frames in real time by the laser ranging unit; configuring a middle position of the relative distance as a standard path; Adjusting the position of the polishing disc by the second mechanical arm so that the center of rotation of the polishing disc coincides with the standard path.

[0010] In some optional embodiments, the laser ranging unit comprises a first laser device and a second laser device, the first laser device is arranged on a first side of the polishing disc, the second laser device is arranged on a second side of the polishing disc, a connecting straight line between the first laser device and the second laser device passes through the center of rotation of the polishing disc, and the relative distance between the two first frames is detected in real time by the laser ranging unit, comprising: emitting first excitation light by the first laser device and receiving first reflected light between the first excitation light and the first frame; determining a first distance from the first laser device to the first frame on the side of the first laser device according to the first reflected light; emitting second excitation light by the second laser device and receiving second reflected light between the second excitation light and the first frame; determining a second distance from the second laser device to the first frame on the side of the second laser device according to the second reflected light; subtracting the straight line distance of the connecting straight line from the first distance and the second distance respectively to obtain the relative distance.

[0011] In some optional embodiments, after the position of the polishing disc is adjusted by the second mechanical arm so that the center of rotation of the polishing disc coincides with the standard path, further comprising: obtaining a first polishing degree of the first frame and a second polishing degree of the second frame preset; determining a third polishing time, a third polishing pressure and a third polishing rotation speed of the polishing disc according to the first polishing degree, the second polishing degree and the relative distance.

[0012] In some optional embodiments, the determination of the third polishing time, the third polishing pressure and the third polishing rotation speed of the polishing disc according to the first polishing degree, the second polishing degree and the relative distance comprises: configuring a target polishing degree according to the difference between the second polishing degree and the first polishing degree; determining a polishing area between the polishing disc and the first frame according to the relative distance; determining the third polishing time, the third polishing pressure and the third polishing rotation speed according to the polishing area and the target polishing degree.

[0013] In a second aspect, an embodiment of the present application provides a polishing device for non-standard frames, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor executes the computer program to implement the polishing method for non-standard frames according to the first aspect.

[0014] In a third aspect, a computer storage medium stores computer executable instructions for implementing the polishing method for non-standard frames according to the first aspect.

[0015] The present application has the following beneficial effects: the first fixed unit is used to fix the non-standard frame at a first preset position; the first polishing unit is used to polish the non-standard frame once to obtain a first frame, and the once polishing includes rough polishing and medium polishing; the second fixed unit is used to fix two first frames at a second preset position after the two first frames are buckled; and the second polishing unit is used to polish the two first frames twice synchronously to obtain a second frame. In the technical solution of the embodiment, the first polishing unit is used to polish the non-standard frame rough and medium before fine polishing, so as to ensure the polishing precision, and the second polishing unit is used to polish the two first frames twice synchronously after the two first frames are buckled and placed at the second preset position, so as to complete the fine polishing of the two first frames at one time and improve the fine polishing efficiency of the frame. Therefore, the polishing precision and efficiency of the non-standard frame can be improved.

[0016] Other features and advantages of the present application will be further described in the following description, and will become apparent from the description, or will be learned through practice of the present application. The objects and other advantages of the present application will be realized and achieved by particularly pointed out in the description, claims, and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic diagram of a system platform architecture for performing polishing of non-standard frames provided by an embodiment of the present application; Figure 2 is a flowchart of a polishing method for non-standard frames provided by an embodiment of the present application; Figure 3 is a structural schematic diagram of a rough polishing module provided by an embodiment of the present application; Figure 4 is a schematic diagram of a third frame and a fourth frame placed in a second fixed unit provided by an embodiment of the present application; Figure 5 is a cross-sectional schematic diagram of a polishing disc provided by an embodiment of the present application; Figure 6is a schematic diagram provided by one embodiment of the present application according to the position corresponding between the polishing disc and the third frame and the fourth frame; Figure 7 is a schematic diagram provided by one embodiment of the present application for the laser device to measure the distance of the third frame and the fourth frame; Figure 8 is a schematic diagram provided by one embodiment of the present application for the laser device to measure the distance of the third frame or the fourth frame.

[0018] Reference signs: System platform architecture 1000, processor 1100, memory 1200; First mechanical arm 100, first polishing mechanism 110, first polishing wheel 111, second polishing wheel 112; First fixed unit 200; Second fixed unit 300, third frame 310, fourth frame 320; Polishing disc 400, first laser device 410, second laser device 420. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0020] It should be noted that although the functional modules are divided in the device schematic diagram, and the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second", etc. in the specification, claims or above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

[0021] The embodiments of the present application will be further described below in combination with the drawings.

[0022] As Figure 1 shown, Figure 1 is a schematic diagram of a system platform architecture for performing a polishing method of a non-standard frame provided by one embodiment of the present application.

[0023] In Figure 1 example, the system platform architecture 1000 is provided with a processor 1100 and a memory 1200, wherein the processor 1100 and the memory 1200 can be connected through a bus or other means, Figure 1 in the example of connecting through a bus.

[0024] The memory 1200, as a non-transitory computer readable storage medium, can be used to store non-transitory software programs and non-transitory computer executable programs. In addition, the memory 1200 can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state memory device. In some embodiments, the memory 1200 can optionally include a memory disposed remotely with respect to the processor 1100, which can be connected to the frame polishing device through a network. Examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0025] Those skilled in the art can understand that the system platform architecture 1000 can be applied to a 5G communication network system and a subsequent evolved mobile communication network system, and the like, and the embodiments are not limited thereto.

[0026] Those skilled in the art can understand that, Figure 1 The system platform architecture 1000 shown in the above figure does not constitute a limitation on the embodiments of the present application, and can include more or fewer components than shown, or combine certain components, or different component arrangements.

[0027] Referring to Figure 2 , Figure 2 A step flowchart of a non-standard frame polishing method provided by the present application; applied to Figures 3-8 The frame polishing device shown in the above figure includes a rough polishing module and a fine polishing module, the rough polishing module includes a first fixing unit 200 and a first polishing unit, and the fine polishing module includes a second fixing unit 300 and a second polishing unit. The non-standard frame polishing method of the embodiments of the present application can include but is not limited to: Step S100, fixing the non-standard frame at a first preset position through the first fixing unit 200.

[0028] It should be noted that the non-standard frame of the present application includes a television frame, a computer frame, a vehicle-mounted decorative accessory frame, etc., which are not limited in detail. The first preset position is the position for one-time polishing of the non-standard frame, which is fixed and positioned by the fixing module. The fixing module can be a mold or a movable fixing assembly.

[0029] Specifically, the non-standard frame is fixed at a first preset position to prevent the non-standard frame from shifting when the non-standard frame is polished once. The non-standard frame is clamped by a manipulator or a clamping device with a positioning identification device and then moved to the first fixing unit 200. The non-standard frame is placed at the first preset position by identifying the positioning mark or placement groove on the first fixing unit 200. The specific setting of the first preset position matches the non-standard frame. Different non-standard frames have different first preset positions. That is, non-standard frames of the same type in the same batch have the same first preset position, so that the non-standard frames are polished once in batches. The non-standard frame can be placed in a preset posture, and then clamped at a fixed position by a robotic arm or other clamping device and placed on the first fixed unit 200. It can also clamp a non-standard frame with a random posture, and use a posture recognition device on a clamping device such as a robotic arm to identify the posture of the non-standard frame, and clamp the corresponding clamping part on the non-standard frame. At the same time, the posture of the non-standard frame is adjusted by rotating the robotic arm, and then the non-standard frame is transferred to the first fixed unit 200. The specific adjustment method and clamping method are not limited here.

[0030] Step S200 , performing a polishing process on the non-standard frame by the first polishing unit to obtain a first frame, wherein the polishing process includes rough polishing and medium polishing.

[0031] Specifically, the first polishing unit removes original defects on the frame surface and smoothes the surface of the non-standard frame, so that the first frame obtained by one polishing meets the corresponding preset polishing degree. The specific preset polishing degree is set according to demand and is not limited here.

[0032] At the start of a polishing cycle, the first polishing unit switches to rough polishing mode. The polishing mechanism contacts the frame surface along a pre-set trajectory (e.g., oscillating back and forth along the length of the frame to cover the entire surface to be polished). During rough polishing, a cutting action removes surface protrusions (such as burrs and scale) while creating uniform scratches. After the rough polishing is completed, visual inspection or surface roughness testing is performed, and if it meets the requirements, the process proceeds to medium polishing. After the first polishing unit switches to medium polishing mode, the polishing mechanism covers the frame surface in a finer trajectory (e.g., a spiral or grid pattern). Medium polishing refines the surface through micro-cutting and polishing, eliminating any signs of rough polishing. After the medium polishing is completed, the surface finish is tested again. If it meets the requirements, the polishing cycle is complete, resulting in the first frame.

[0033] In some optional embodiments, the first polishing unit comprises a first mechanical arm 100, and a first polishing mechanism 110 is connected to the first mechanical arm 100, wherein the first polishing mechanism 110 comprises a first polishing wheel 111 and a second polishing wheel 112; and the first frame is obtained by performing one-time polishing on the non-standard frame by the first polishing unit, comprising: performing rough polishing on the non-standard frame by the first polishing wheel 111 to obtain an intermediate frame; and performing middle polishing on the intermediate frame by the second polishing wheel 112 to obtain the first frame, wherein the polishing degree of the first frame is greater than that of the intermediate frame.

[0034] Specifically, referring to Figure 3 , the first polishing unit is composed of a first mechanical arm 100 and a first polishing mechanism 110 on the first mechanical arm 100, and one-time polishing is completed by the cooperation of the first mechanical arm 100 and the first polishing mechanism 110.

[0035] Among them, the first mechanical arm 100 is responsible for driving the first polishing mechanism 110 (including the first polishing wheel 111 and the second polishing wheel 112) to move to the designated polishing area of the non-standard frame, and adjusting the position, angle and pressure of the polishing wheel according to the shape of the frame. The first mechanical arm 100 is a multi-degree-of-freedom mechanical arm (such as a 6-axis or collaborative robot), which has high-precision positioning and flexible control capabilities, and can adapt to the special-shaped profile (such as arc-shaped edge and bevel edge) of the non-standard frame, ensuring that the polishing wheel is closely attached to the surface of the frame.

[0036] The first polishing mechanism 110 integrates the first polishing wheel 111 (rough polishing wheel) and the second polishing wheel 112 (middle polishing wheel), which are controlled by independent driving systems (such as servo motors) and can be adjusted in speed (controlled by servo motor), pressure and motion trajectory (the pressure of the polishing wheel on the non-standard frame can be controlled by pressing the first mechanical arm 100), realizing the hierarchical polishing of "rough first and fine later". The first polishing wheel 111 (rough polishing wheel) and the second polishing wheel 112 (middle polishing wheel) are arranged oppositely, and the first polishing wheel 111 and the second polishing wheel 112 can be switched by rotating the first polishing mechanism 110.

[0037] The non-standard frame is rough-polished using a first polishing wheel 111 (rough polishing wheel) to produce an intermediate frame. A first robotic arm 100 moves along a pre-set trajectory (e.g., along the outer contour or inner edge of the frame) to apply the first polishing wheel 111 to the surface to be polished (e.g., the front or side). For irregularly shaped areas (e.g., rounded corners), the robotic arm automatically adjusts the polishing wheel angle (e.g., tilting 15°-30°) to ensure perfect coverage. The first polishing wheel 111 is started at a first rotational speed, while the robotic arm applies a first initial pressure, bringing the rough polishing wheel into close contact with the frame surface. The abrasive (e.g., silicon carbide) removes surface imperfections through a cutting action, producing uniform, shallow scratches. Polishing results are monitored in real time using a monitoring device (e.g., a visual sensor or surface roughness tester). If local defects remain (e.g., deep cuts), the robotic arm automatically increases the dwell time or pressure in that area. If the cuts are too deep (impairing the efficiency of subsequent intermediate polishing), the pressure is reduced or the rotational speed is increased (as needed within the abrasive tolerances). When surface defects are basically removed (such as no obvious burrs or knife marks confirmed by visual inspection), and the surface roughness reaches the preset roughness, rough polishing is completed and the "middle frame" is obtained.

[0038] The middle frame is then subjected to a second polishing wheel 112 (intermediate polishing wheel) for intermediate polishing, resulting in the first frame. The first robotic arm 100 rotates the first polishing mechanism 110, pivoting the first and second polishing wheels 111, 112 so that the second polishing wheel 112 is positioned above the middle frame and in contact with it. The second polishing wheel 112 rotates at a second speed, and the robotic arm applies a second initial pressure, causing the aluminum oxide abrasive to fill the rough polishing scratches through micro-cutting and polishing, while also lightly polishing the surface. For localized scratches remaining after rough polishing (such as corners), the robotic arm automatically reduces its movement speed, extending the contact time of the intermediate polishing wheel in those areas. For smooth areas (such as flat surfaces), the movement speed is increased to improve efficiency. When the intermediate polishing wheel reduces the surface scratch depth to below a preset depth and the surface roughness meets the intermediate polishing standard, intermediate polishing is complete, resulting in the "first frame."

[0039] The tiered polishing process with coarse and medium polishing wheels ensures a balance between polishing efficiency and quality. The high cutting force of the coarse polishing wheel quickly removes most defects, reducing the load and wear on the subsequent medium polishing wheel. The medium polishing wheel only needs to address minor remaining defects, shortening the overall polishing time. The multi-degree-of-freedom design of the first robotic arm 100 adapts to non-standard frame shapes (such as variable cross-sections and bevels). Combined with the independent control of the dual polishing wheels, this ensures uniform polishing of complex areas.

[0040] In some optional embodiments, the first frame obtained after the non-standard frame is polished once by the first polishing unit comprises: determining a first polishing path and a second polishing path according to the first preset position, wherein the first polishing path represents a movement path of the first polishing wheel 111, and the second polishing path represents a movement path of the second polishing wheel 112; obtaining frame information representing material information and preset polishing degree information of the non-standard frame; determining a first polishing curve atlas and a second polishing curve atlas according to the first polishing path, the second polishing path, and the frame information, wherein the first polishing curve atlas represents a first polishing time, a first polishing pressure, and a first polishing rotating speed of the first polishing wheel 111 on the first polishing path, and the second polishing curve atlas represents a second polishing time, a second polishing pressure, and a second polishing rotating speed of the second polishing wheel 112 on the second polishing path; driving the first polishing wheel 111 to move along the first polishing path by the first mechanical arm 100, and controlling the first polishing wheel 111 to perform rough polishing on the non-standard frame for the first polishing time, the first polishing pressure, and the first polishing rotating speed according to the first polishing curve atlas, so as to obtain the intermediate frame; and driving the second polishing wheel 112 to move along the second polishing path by the first mechanical arm 100, and controlling the second polishing wheel 112 to perform medium polishing on the intermediate frame for the second polishing time, the second polishing pressure, and the second polishing rotating speed according to the second polishing curve atlas, so as to obtain the first frame.

[0041] Specifically, the first preset position of the present application is the initial fixed position of the non-standard frame in the rough polishing module (such as being fixed on the reference surface of the first fixing unit 200, or being fixed in the mold groove of the first fixing unit 200, and the specific first preset position is not limited).

[0042] Firstly, the moving track of the rough polishing wheel is planned according to the fixed position (first preset position) of the non-standard frame, so as to cover all the polishing surfaces (such as the front surface, side surface, round corner, etc.) of the non-standard frame and avoid the fixed clamps (mold grooves or clamping fixtures) or weak areas (such as groove edges) of the frame. Then, based on the positioning data of the frame in the first fixed unit 200 (such as the 3D profile of the non-standard frame obtained by laser scanning), the boundaries of the polishing area (such as the upper surface edge, inner chamfer, etc.) are extracted. Finally, the historical optimization data of polishing is generated according to the historical polishing data, and the polishing is optimized according to the historical optimization data (that is, the polishing area to be optimized is determined according to the historical polishing data, and the optimization polishing pressure, optimization polishing time and optimization polishing speed of the polishing area to be optimized are determined according to the specific polishing pressure, polishing time and polishing speed in the historical polishing data), such as optimizing the polishing pressure and polishing time of a corner area according to the historical optimization data.

[0043] Second polishing path (middle polishing wheel moving path): The middle polishing wheel needs to be fine processed for local defects (such as deep scratches) or transition areas (such as the junction of the plane and the round corner) after rough polishing, so the path needs to partially overlap or locally encrypt the rough polishing path. The surface defects or polishing degree after rough polishing are identified by a detection device (such as a visual sensor arranged on the first mechanical arm 100), so as to determine the polishing parameters of each area on the surface (that is, the polishing pressure, polishing time and polishing speed in each area) according to the polishing degree or surface defects.

[0044] The moving direction of the middle polishing wheel is usually perpendicular to the rough polishing wheel or the polishing texture of the middle polishing wheel is perpendicular to the polishing texture of the rough polishing wheel, so as to avoid single polishing texture direction on the frame (reduce uneven light reflection) and improve the polishing degree.

[0045] The material information of the frame information is the material of the non-standard frame (such as aluminum alloy, stainless steel, engineering plastic), and different materials determine the hardness, wear resistance and adaptability to abrasive of the non-standard frame, so as to adjust the polishing parameters accordingly: such as high surface hardness of hard materials (such as stainless steel), rough polishing needs greater pressure and lower speed to enhance the cutting force; the middle polishing needs to appropriately reduce the pressure to avoid excessive wear of the abrasive; soft materials (such as aluminum alloy) are easy to produce surface scratches, so the rough polishing pressure needs to be reduced to avoid crushing the material; the middle polishing needs to increase the speed to accelerate the flow of abrasive and reduce the scratches.

[0046] The polishing curve atlas of the present application is a mapping relationship atlas of "path-parameter", which binds each position point (defined by path coordinates) on the path with specific polishing time, pressure and speed, to ensure the predictability and controllability of the polishing process.

[0047] The first polishing curve map is generated: according to the total path length and the movement speed of the mechanical arm, the total polishing time is calculated; for defect-intensive areas (such as long sides), the corresponding preset residence time is increased; according to the polishing pressure range determined by the frame information, a preset high pressure is used in the initial stage to quickly remove defects; the pressure is gradually reduced in the later stage to avoid over-polishing; the rotational speed is kept stable throughout the process to ensure stable cutting force.

[0048] The second polishing curve map is generated: the total time is shorter than that of rough polishing (1 / 2-2 / 3 of rough polishing), and the specific polishing time is determined according to the specific polishing degree, and more time is allocated to key areas (such as defect-intensive sections) (such as 30% of the total time); low pressure is maintained throughout the process to avoid crushing the medium-grit abrasive (such as aluminum oxide); high rotational speed (n=1000-1500 rpm) is maintained throughout the process to utilize the flow of abrasive caused by high-speed rotation of the polishing wheel to refine surface scratches; for brittle materials, the rotational speed needs to be reduced (such as 800-1000 rpm) to avoid edge collapse.

[0049] The polishing is performed by the first mechanical arm 100 driving the polishing wheel. The first mechanical arm 100 serves as an execution mechanism to accurately control the movement and parameter output of the polishing wheel according to the generated curve map, ensuring the matching of "path-parameters". The mechanical arm monitors its position (such as joint angle) in real time through the encoder, compares it with the preset first polishing path (coordinate sequence), adjusts the joint torque through the PID controller, ensures the movement of the polishing wheel along the planned path, and the specific control is not described here. According to the first polishing curve map, the servo motor of the mechanical arm adjusts in real time; the contact force between the polishing wheel and the frame is monitored through the pressure sensor (such as strain sensor), if the actual pressure deviates from the target value (such as target , the measured ), the output force of the mechanical arm is adjusted; the rotational speed of the rough polishing wheel is adjusted through the motor driver (such as target 600 rpm, measured 550 rpm) to ensure stable cutting force. The online detection device (such as laser thickness gauge or vision camera) collects the surface roughness (Ra value) and scratch depth of the frame in real time, if the Ra value of a certain area does not meet the standard, the mechanical arm automatically prolongs the residence time of that area (such as 5 seconds).

[0050] The path of the intermediate polishing wheel partially overlaps with that of the rough polishing wheel (such as moving in the vertical direction), the mechanical arm ensures smooth transition of the path through the motion planning algorithm (such as spline interpolation) to avoid vibration caused by sudden turning; according to the second polishing curve map, the mechanical arm is controlled synchronously: an "incremental pressure" strategy (initial pressure , gradually increased to ) is adopted to avoid abrasive splashing caused by sudden loading; the motor frequency of the intermediate polishing wheel is adjusted through the frequency converter to achieve precise control of the rotational speed; for the intermediate polishing target , the online detection device focuses on monitoring the local scratches (such as depth > If the problem is not eliminated, the robot arm automatically increases the rotation speed of the area (e.g., from 1300 rpm to 1400 rpm) or prolongs the contact time (e.g., by 2 seconds).

[0051] In step S300, the two first frames are fixed at the second preset position by the second fixing unit 300.

[0052] Specifically, referring to Figure 4 The first frame has an opening, and the two first frames are buckled through the opening. The second fixing unit 300 is provided with a mold groove matched with the two first frames (i.e., the third frame 310 and the fourth frame 320) after buckling, or a specific fixed clamping assembly. After the two first frames are placed on the second fixing unit 300, the second preset position of the two first frames is fixed due to the mold groove or the specific position of the fixed clamping assembly.

[0053] In step S400, the second polishing unit is controlled to synchronously perform secondary polishing on the two first frames to obtain the second frame.

[0054] Specifically, the single polishing mechanism of the second polishing unit moves along the two buckled first frames and synchronously completes the secondary polishing (fine polishing) of the two first frames during the movement, thereby improving the polishing efficiency.

[0055] In some optional embodiments, the second polishing unit includes a second robot arm, and a second polishing mechanism connected to the second robot arm, and the second polishing mechanism includes a polishing disc 400. The control of the second polishing unit to synchronously perform secondary polishing on the two first frames to obtain the second frame includes: generating a third polishing path according to the second preset position; and driving the polishing disc 400 to move along the third polishing path by the second robot arm, so that the polishing disc 400 synchronously performs secondary polishing on the two first frames to obtain the second frame.

[0056] Specifically, referring to Figure 5 and Figure 6, the second mechanical arm can move freely in space, ensuring the freedom of the second polishing mechanism, and the second polishing mechanism completes polishing by installing a polishing disc 400; different polishing discs 400 (such as coarse granularity and ultra-fine granularity) can be switched through a quick-change interface; the second mechanical arm converts the coordinate sequence of the third polishing path into the angle command of each joint through inverse kinematics calculation, and drives the polishing disc 400 to move along the planned trajectory. Through a polishing disc 400, two first frames that are buckled are polished twice (fine polishing) during movement, and the position of the polishing disc 400 is adjusted in real time to ensure the polishing synchronization of the two first frames, so that the fine polishing of the two first frames is completed synchronously, and the fine polishing efficiency is high.

[0057] In some optional embodiments, the second mechanical arm is further provided with a laser ranging unit, and the driving of the polishing disc 400 along the third polishing path by the second mechanical arm comprises: during the driving of the polishing disc 400 along the third polishing path by the second mechanical arm: detecting the relative distance between the two first frames in real time by the laser ranging unit; configuring the middle position of the relative distance as a standard path; adjusting the position of the polishing disc 400 by the second mechanical arm, so that the rotation center of the polishing disc 400 coincides with the standard path.

[0058] Specifically, the laser ranging unit of the application comprises a laser emitter, a receiver and a signal processor: the laser emitter emits infrared laser with stable wavelength to avoid environmental light interference; the receiver receives reflected laser and converts it into an electrical signal, and the laser emitter and the laser receiver are at the same position or integrated together; the signal processor calculates the distance by phase comparison method or pulse timing method.

[0059] The standard path is the ideal moving trajectory of the rotation center of the polishing disc 400, that is, the center line between the two adjacent edges (such as the upper edge of the third frame 310 and the lower edge of the fourth frame 320, which are the edges of the third frame 310 and the fourth frame 320 after buckling) of the two first frames after buckling. The relative distance obtained by the laser ranging unit can dynamically calculate this middle position. After obtaining the relative distance between the third frame 310 and the fourth frame 320 and the corrected standard path by laser ranging, the posture and position of the polishing disc 400 are adjusted by the second mechanical arm, so that the rotation center coincides with the standard path. The second mechanical arm realizes real-time monitoring of the relative distance between the two first frames and dynamic calculation of the middle position by integrating the laser ranging unit, and adjusts the position of the polishing disc 400 by the motion control of the mechanical arm, so that the rotation center coincides with the standard path. The rotation center of the polishing disc 400 coincides with the middle path, which ensures that the polishing thickness of the mating surface of the two frames is consistent, not only improves the polishing efficiency, but also ensures the polishing consistency of the two first frames.

[0060] In some optional embodiments, the laser ranging unit comprises a first laser device 410 and a second laser device 420, the first laser device 410 is arranged on a first side of the polishing disc 400, the second laser device 420 is arranged on a second side of the polishing disc 400, a connecting straight line between the first laser device 410 and the second laser device 420 passes through the rotation center of the polishing disc 400, the relative distance between the two first frames is detected in real time by the laser ranging unit, comprising: emitting a first excitation light by the first laser device 410, and receiving a first reflected light between the first excitation light and the first frame; determining a first distance from the first laser device 410 to the first frame on the side of the first laser device 410 according to the first reflected light; emitting a second excitation light by the second laser device 420, and receiving a second reflected light between the second excitation light and the first frame; determining a second distance from the second laser device 420 to the first frame on the side of the second laser device 420 according to the second reflected light; and subtracting the straight line distance of the connecting straight line from the first distance and the second distance respectively to obtain the relative distance.

[0061] Specifically, referring to FIG. 7, the first laser device 410 (left) and the second laser device 420 (right) of the laser ranging unit are symmetrically arranged on the two sides of the polishing disc 400, and the connecting straight line (i.e. the straight line connecting the centers of the two laser devices) passes through the rotation center (denoted as point A) of the polishing disc 400. The emission directions of the first laser device 410 and the second laser device 420 are both parallel to the polishing disc 400, and the emitted excitation light passes through the gap between the substrate of the second fixing unit 300 and the polishing disc 400 to reach the third frame 310 or the fourth frame 320.

[0062] The length (denoted as L) of the connecting straight line is the distance between the centers of the two laser devices; the measurement range of each laser device covers the edge region of the corresponding side frame, for example, the left laser covers the edge of the left frame (the third frame 310), and the right laser covers the edge of the right frame (the fourth frame 320). The laser ranging unit measures the distance from the first laser device 410 to the left frame (denoted as L1) ) and the distance from the second laser device 420 to the right frame (denoted as L2) ) respectively through the closed loop process of “emission-reflection-reception”. The first laser device 410 (left) emits a beam of wavelength-stable laser light (such as 635 nm infrared light), which forms a parallel light beam through a collimating lens, irradiates to the edge of the mating surface of the left first frame; the mating surface of the left frame reflects the laser light, and the reflected light converges to a photodetector (such as an APD avalanche photodiode) through the receiving lens of the first laser device 410, and is converted into an electrical signal, so that the first distance L1 is calculated by the corresponding signal processor. The second laser device 420 measures the second distance of the right side frame, and the measurement process is similar to that of the first laser device 410, which will not be described here. Based on the geometric relationship between the connecting straight line and the double distances, the relative distance (denoted as ) of the two first side frames (i.e., the third side frame 310 and the fourth side frame 320) is defined as the positional deviation (such as the left-right offset) thereof in the direction perpendicular to the polishing direction. In combination with the layout of the double laser devices and the measurement values, the relative distance can be derived through the following geometric relationship: assuming that the rotation center of the polishing disc 400 is A, the first distance from the edge point B of the mating surface of the left side frame (the third side frame 310) to the center of the first laser device 410 is , the second distance from the edge point C of the mating surface of the right side frame (the fourth side frame 320) to the center of the second laser device 420 is , and the relative distance is . Referring to Figure 8 , if the two side frames have no offset (i.e., only the third side frame 310 or the fourth side frame 320 has an edge, which is the edge of the third side frame 310 and the fourth side frame 320 that is not buckled), then , at this time ; otherwise . It can be clearly seen from Figure 7 that when the rotation center A is located at the middle position of , the B point on the third side frame 310 and the C point on the fourth side frame 320 are located on the same concentric circle on the polishing disc 400, thereby ensuring the uniformity of polishing of the third side frame 310 and the fourth side frame 320.

[0063] In some optional embodiments, in order to ensure the calculation accuracy of the relative distance, potential errors in the laser ranging process need to be compensated and calibrated: geometric error compensation of laser emission and reception. Angle deviation correction: if there is a small angle (such as ) between the laser beam and the side frame mating surface, the receiving position of the reflected light will be offset, resulting in a distance measurement error . By pre-calibrating the incident angle of the laser beam and introducing an angle compensation factor in the calculation, the error can be reduced. Environmental interference compensation: the propagation speed of laser in air is affected by temperature, and the speed of light c is corrected in real time by integrating a temperature sensor; the refractive index of air is also related to air pressure, which is further corrected by an air pressure sensor; slight vibration of the mechanical arm can cause laser beam jitter, which is controlled by integrating an inertial stabilization platform (such as a gyroscope + piezoelectric ceramic) in the laser device to control the vibration error. Periodically calibrate the distance L between the double laser devices using a high-precision three-coordinate measuring instrument to correct the mechanical drift after long-term use; in combination with a vision camera (which captures the edge profile of the side frame) and laser ranging data, the calculation result of the relative distance is verified through an image registration algorithm (such as SIFT feature matching) to improve reliability.

[0064] In some optional embodiments, after the position of the polishing disc 400 is adjusted by the second mechanical arm so that the center of rotation of the polishing disc 400 coincides with the standard path, the method further comprises: obtaining a first polishing degree of the first frame and a second polishing degree of the second frame; and determining a third polishing time, a third polishing pressure and a third polishing rotation speed of the polishing disc 400 according to the first polishing degree, the second polishing degree and the relative distance.

[0065] Specifically, after the position of the polishing disc 400 is adjusted (i.e., the center of rotation of the polishing disc 400 coincides with the standard path), the third polishing time, the third polishing pressure and the third polishing rotation speed of the polishing disc 400 are dynamically calculated according to the current polishing degree (the first polishing degree) and the target polishing degree (the second polishing degree) of the two first frames and the relative distance, so as to ensure that the surface quality of the two frames meets the standard after synchronous polishing.

[0066] The surface roughness (Ra) ) of the frame is reduced from the first polishing degree (Ra1) ) to the second polishing degree (Ra2 ). In this process, the relative distance (D ) reflects the position deviation of the two frames and determines the uniformity of the coverage of the polishing disc 400 on the two frames. The deviation is compensated by adjusting the parameters to avoid local over-polishing or under-polishing. That is, different position deviations result in different coverage areas, which in turn result in different polishing effects on the third frame 310 and the fourth frame 320. Therefore, the polishing time, the polishing pressure and the polishing rotation speed need to be adjusted for the third frame 310 and the fourth frame 320 with different relative distances, so as to ensure that the polishing degree is uniform in the process of polishing the third frame 310 and the fourth frame 320 by the polishing disc 400, and the uniformity of the polishing degree is good. It is known that if different areas of the third frame 310 and the fourth frame 320 have different polishing degree requirements, the differential polishing control can also be achieved by adjusting the polishing parameters (i.e., the third polishing time, the third polishing pressure and the third polishing rotation speed) of the polishing disc 400.

[0067] The difference (D ) between the first polishing degree (Ra1 ) and the second polishing degree (Ra2 ) determines the total amount of material to be removed (cutting amount), and thus determines the corresponding polishing time or pressure. According to the above content, the relative distance (D ) affects the contact uniformity between the polishing pad 400 and the two frames, and the deviation also needs to be compensated by adjusting the polishing parameters. The material properties of the third frame 310 and the fourth frame 320 and the parameters of the polishing pad 400 (such as abrasive grit size and hardness) determine the material removal rate per unit time.

[0068] Based on the above correlation logic, the polishing parameters (third polishing time, pressure, rotation speed) can be calculated using the following empirical formula or physical model: The third polishing time ( ) determination: polishing time and the amount of material to be removed ( ) and inversely proportional to the material removal rate (MRR). MRR is determined by the current pressure ( )、Speed( )、Abrasive particle size( ) and material hardness ( ) are jointly determined, and the formula can be expressed as:

[0069] in, is the empirical coefficient (related to the structure of the polishing plate 400), is the index ( ).

[0070] because The relationship with MRR can be approximated as ,therefore:

[0071] If the target is known (As from down to , ), which can be pre-stored through historical process data Value, such as aluminum alloy + aluminum oxide abrasive ; Combined with current pressure , speed And the abrasive particle size G (such as 800 mesh), the time can be calculated .

[0072] The third polishing pressure ( ) Determination: Pressure directly affects the contact area and cutting force between the polishing disc 400 and the frame. To compensate for the relative distance The uneven coverage caused by Adjust pressure distribution:

[0073] in, is the standard pressure without deviation, is the pressure compensation coefficient.

[0074] The third polishing rotation speed ( ) Determination: The rotation speed affects the cutting efficiency and surface texture direction of the polishing disc 400. To avoid the relative distance The polishing lines are inconsistent, and the speed needs to be adjusted according to the hardness of the material and the characteristics of the abrasive:

[0075] in, is the standard speed, is the speed compensation coefficient.

[0076] After determining the third polishing parameters (third polishing time, pressure, and rotation speed), the second robotic arm needs to dynamically adjust the polishing parameters of the polishing plate 400 through real-time feedback. The specific process is as follows: Retrieve the current polish of the first frame from the database ( ) and the target polish of the second frame ( ),calculate ; Get the current relative distance through the laser ranging unit ( Input material properties (such as aluminum alloy) and polishing disc 400 parameters (such as 800 mesh aluminum oxide abrasive), and call the pre-stored process model to calculate The second robot arm drives the polishing plate 400 to move along the third path and outputs Parameters are sent to the servo control system; online detection devices (such as online roughness testers, visual cameras) collect real-time data of the polishing area The value and scratch depth are fed back to the controller. If the value does not meet the standard, the controller automatically prolongs the residence time of the polishing disc 400 in the area, increases the rotation speed or increases the pressure; if the relative distance If there is a change (such as frame displacement due to thermal deformation), the laser ranging unit remeasures and updates , controller synchronous adjustment and .

[0077] In some optional embodiments, the second robotic arm is provided with a polishing liquid delivery conduit, through which the polishing liquid is delivered between the polishing plate 400 and the first frame, thereby enhancing the polishing effect with the polishing liquid and cooling the first frame, thereby reducing the risk of deformation of the first frame due to high temperature. After polishing, the polishing liquid is recovered to a circulation device, which cools the polishing liquid and adds appropriate abrasive particles, chemical additives, pH adjusters, etc., so that the polishing liquid is circulated to the second robotic arm, thereby recycling the polishing liquid and avoiding waste of the polishing liquid.

[0078] In some optional embodiments, the determining the third polishing time, the third polishing pressure and the third polishing rotation speed of the polishing disc 400 according to the first polishing degree, the second polishing degree and the relative distance comprises: configuring a polishing degree difference between the second polishing degree and the first polishing degree as a target polishing degree; determining a polishing area between the polishing disc 400 and the first frame according to the relative distance; determining the third polishing time, the third polishing pressure and the third polishing rotation speed according to the polishing area and the target polishing degree.

[0079] Specifically, after the relative distance is obtained by the laser ranging unit, the effective coverage range (effective coverage width ) of the polishing area can be calculated by combining the physical size (diameter D) of the polishing disc 400:

[0080] The polishing area can be determined by the effective coverage width That is, when the polishing area is the entire polishing disc 400, that is, the entire polishing disc 400 polishes the first frame. The larger the polishing area is, the faster the polishing disc 400 polishes the first frame. Therefore, according to the corresponding polishing area, the corresponding third polishing time, third polishing pressure and third polishing rotation speed can be adjusted, so as to ensure that the polishing of the frame (two interlocking third frame 310 and fourth frame 320) is uniform, that is, the polishing degree of each part is equal to the target polishing degree.

[0081] The embodiment of the present application has the following beneficial effects: the non-standard frame is fixed at the first preset position by the first fixing unit 200; the first frame is obtained by polishing the non-standard frame once by the first polishing unit, and the once polishing includes rough polishing and medium polishing; the two first frames are fixed at the second preset position after being interlocked by the second fixing unit 300; and the second frame is obtained by synchronously polishing the two first frames twice by the second polishing unit. In the technical solution of the embodiment, the first polishing unit can perform rough polishing and medium polishing on the non-standard frame before fine polishing, so as to ensure the polishing precision, and the second polishing unit can perform fine polishing on the two first frames interlocked and placed at the second preset position synchronously, so as to complete the fine polishing of the two first frames at one time and improve the fine polishing efficiency of the frame. Therefore, the polishing precision and polishing efficiency of the non-standard frame can be improved.

[0082] In addition, one embodiment of the present invention provides a polishing device for a non-standard frame, the device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor.

[0083] The processor and the memory may be connected via a bus or other means.

[0084] It should be noted that the computer in this embodiment may correspond to include: Figure 1 The memory and processor in the embodiment shown can constitute Figure 1 Part of the system architecture platform in the illustrated embodiment, both belong to the same inventive concept, so both have the same implementation principles and beneficial effects, and will not be described in detail here.

[0085] The non-transient software program and instructions required to implement the uplink co-channel interference elimination method of the above embodiment are stored in the memory. When executed by the processor, the polishing method of the non-standard frame of the above embodiment is executed, for example, the above-described Figure 2 Method steps S100 to S600 in .

[0086] In addition, one embodiment of the present invention further provides a computer-readable storage medium storing computer-executable instructions. When the computer-executable instructions are used to execute the polishing method of the non-standard frame of the polishing device of the non-standard frame, for example, the above-described Figure 2 Method steps S100 to S400 in .

[0087] As will be appreciated by one of ordinary skill in the art, all or some of the steps, systems, etc. in the methods disclosed above can be embodied in software, firmware, hardware, and / or suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, as hardware, or as an integrated circuit, such as an application- specific integrated circuit. Such software can be distributed on computer readable media, which can comprise computer storage media (or non-transitory media), and communication media (or transitory media). As is well known to those of ordinary skill in the art, the term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Further, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal, such as a carrier wave or other transport mechanism, and includes any information delivery media.

[0088] The above description is that of the preferred embodiments of the application. Various modifications and changes can be made thereto without departing from the spirit and scope of the application as set forth in the claims.

Claims

1. A method of polishing a non-standard frame, characterized by, The application is applied to a frame polishing device, the frame polishing device comprises a rough polishing module and a fine polishing module, the rough polishing module comprises a first fixing unit and a first polishing unit, the fine polishing module comprises a second fixing unit and a second polishing unit, and the polishing method of the non-standard frame comprises the following steps: fixing the non-standard frame at a first preset position through the first fixing unit; obtaining a first frame by performing one-time polishing on the non-standard frame through the first polishing unit, wherein the one-time polishing comprises rough polishing and middle polishing; fixing two first frames at a second preset position after being buckled through the second fixing unit; obtaining a second frame by synchronously performing two-time polishing on the two first frames through the second polishing unit.

2. The non-standard bezel polishing method of claim 1, wherein, The first polishing unit comprises a first mechanical arm, a first polishing mechanism is connected to the first mechanical arm, the first polishing mechanism comprises a first polishing wheel and a second polishing wheel; the first frame is obtained by performing one-time polishing on the non-standard frame through the first polishing unit, which comprises the following steps: obtaining an intermediate frame by performing rough polishing on the non-standard frame through the first polishing wheel; obtaining the first frame by performing middle polishing on the intermediate frame through the second polishing wheel, wherein the polishing degree of the first frame is greater than that of the intermediate frame.

3. The non-standard bezel polishing method of claim 2, wherein, The first frame is obtained by performing one-time polishing on the non-standard frame through the first polishing unit, which comprises the following steps: determining a first polishing path and a second polishing path according to the first preset position, wherein the first polishing path represents the movement path of the first polishing wheel, and the second polishing path represents the movement path of the second polishing wheel; obtaining frame information, wherein the frame information represents the material information and the preset polishing degree information of the non-standard frame; determining a first polishing curve atlas and a second polishing curve atlas according to the first polishing path, the second polishing path and the frame information, wherein the first polishing curve atlas represents the first polishing time, the first polishing pressure and the first polishing rotating speed of the first polishing wheel on the first polishing path, and the second polishing curve atlas represents the second polishing time, the second polishing pressure and the second polishing rotating speed of the second polishing wheel on the second polishing path; driving the first polishing wheel to move along the first polishing path through the first mechanical arm, and controlling the first polishing wheel to perform rough polishing on the non-standard frame at the first polishing time, the first polishing pressure and the first polishing rotating speed according to the first polishing curve atlas, so as to obtain the intermediate frame; driving the second polishing wheel to move along the second polishing path through the first mechanical arm, and controlling the second polishing wheel to perform middle polishing on the intermediate frame at the second polishing time, the second polishing pressure and the second polishing rotating speed according to the second polishing curve atlas, so as to obtain the first frame.

4. The non-standard bezel polishing method of claim 1, wherein, The second polishing unit comprises a second mechanical arm, and a second polishing mechanism is connected to the second mechanical arm, wherein the second polishing mechanism comprises a polishing disc; and the control of the second polishing unit to perform secondary polishing on the two first frames simultaneously to obtain second frames comprises: generating a third polishing path according to the second preset position; driving the polishing disc to move along the third polishing path by the second mechanical arm, so that the polishing disc performs secondary polishing on the two first frames simultaneously to obtain second frames.

5. The method of claim 4, wherein the non-standard bezel is polished by a method comprising: The second mechanical arm is further provided with a laser ranging unit, and the driving of the polishing disc to move along the third polishing path by the second mechanical arm comprises: during the driving of the polishing disc to move along the third polishing path by the second mechanical arm: real-time detection of the relative distance between the two first frames by the laser ranging unit; configuration of the middle position of the relative distance as a standard path; adjustment of the position of the polishing disc by the second mechanical arm, so that the rotation center of the polishing disc coincides with the standard path.

6. The non-standard bezel polishing method of claim 5, wherein, The laser ranging unit comprises a first laser device and a second laser device, the first laser device is arranged on a first side of the polishing disc, the second laser device is arranged on a second side of the polishing disc, a connecting straight line between the first laser device and the second laser device passes through the rotation center of the polishing disc, and the real-time detection of the relative distance between the two first frames by the laser ranging unit comprises: emission of first excitation light by the first laser device, and reception of first reflected light between the first excitation light and the first frame located on the side of the first laser device; determination of a first distance from the first laser device to the first frame located on the side of the first laser device according to the first reflected light; emission of second excitation light by the second laser device, and reception of second reflected light between the second excitation light and the first frame located on the side of the second laser device; determination of a second distance from the second laser device to the first frame located on the side of the second laser device according to the second reflected light; subtraction of the straight line distance of the connecting straight line from the first distance and the second distance respectively to obtain the relative distance.

7. The non-standard bezel polishing method of claim 5, wherein, After the adjustment of the position of the polishing disc by the second mechanical arm, so that the rotation center of the polishing disc coincides with the standard path, the method further comprises: acquisition of a first polishing degree of the first frame and a second polishing degree of the second frame; determination of a third polishing time, a third polishing pressure and a third polishing rotation speed of the polishing disc according to the first polishing degree, the second polishing degree and the relative distance.

8. The polishing method for a non-standard frame according to claim 7, characterized in that: The determination of the third polishing time, the third polishing pressure and the third polishing rotation speed of the polishing disc according to the first polishing degree, the second polishing degree and the relative distance comprises: configuration of a target polishing degree according to the polishing degree difference between the second polishing degree and the first polishing degree; determination of a polishing area between the polishing disc and the first frame according to the relative distance; The third polishing time, the third polishing pressure and the third polishing rotation speed are determined according to the polishing area and the target polishing degree.

9. A non-standard frame polishing apparatus, characterized by, The application relates to a polishing method for a non-standard frame. The application relates to a polishing method for a non-standard frame.

10. A computer storage medium, characterized in that The application relates to a polishing method for a non-standard frame.

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