Sampling device for suspended particle detection

Abstract

The utility model provides a sampling device for suspended particle detection, which relates to the technical field of medical environment detection and comprises a sampling head, a bent extension tube, a sampling device body, a connecting pipeline and detection equipment, the sampling device body comprises a cooling pipe, a temperature sensor, a plurality of TEC semiconductor refrigeration piles, a heat dissipation system, a display panel, a control switch, a power jack and a shell; the sampling head is connected with the bent extension tube, the bent extension tube is connected with the cooling tube, the temperature sensors are mounted at the positions of an air inlet and an air outlet of the cooling tube, and the control switch controls the starting number of the TEC semiconductor refrigeration stacks according to real-time temperature data of the temperature sensors; the TEC semiconductor refrigeration piles are arranged on the outer surface of the cooling pipe in an attached mode. And the plurality of TEC semiconductor refrigeration stacks dissipate heat through a heat dissipation system with an air pump. According to the utility model, daily monitoring and on-line monitoring can be carried out on the medicine production environment, the pollution risk is reduced, and the detection level is improved.

Description

Technical Field

[0001] The utility model provides a sampling device for detecting suspended particles, which relates to the technical field of pharmaceutical environment detection. Background Art

[0002] The Good Manufacturing Practice for Drugs in China requires that there are clear requirements for the dynamic monitoring of suspended particles in the clean environment of sterile drug production. It is necessary to confirm and conduct risk assessment on the air purification system according to the cleanliness level to avoid particulate contamination and microbial contamination. A total particle number environmental monitoring plan should be established, and the obtained data should be used to evaluate the potential contamination risk and ensure that the aseptic operation environment is maintained in a verified state.

[0003] The suspended particle detection equipment commonly equipped by domestic drug production enterprises and testing institutions samples at normal temperature. The normal working temperature is 10 - 40°C. Therefore, in the prior art, there is no equipment capable of confirming and monitoring the environment with a temperature higher than the normal working temperature in the pharmaceutical production process.

[0004] Therefore, it is urgent to solve the technical problem that the existing laser particle counter cannot detect suspended particles in the air under high-temperature conditions. The explanation of high-temperature conditions is as follows: In view of the high temperature in the high-temperature influence factor test in the stability test of previous editions of the Chinese Pharmacopoeia, it usually refers to 60°C; the expression of 110°C - 121°C for moist heat sterilization is the high-temperature condition, which can denature the proteins and nucleic acids in the microbial cells and effectively kill microorganisms. In addition, the current edition of the Pharmaceutical GMP Guide and equipment instructions, etc., all divide the detection object of this application, that is, the tunnel oven structure, into three parts: a preheating section, a high-temperature section, and a cooling section. The temperature of the high-temperature section is generally 280°C - 350°C and is used for sterilization.

[0005] The present invention utilizes the existing detection equipment for the above high-temperature conditions and adds a sampling device body capable of playing a cooling role to well solve this problem. Content of the Utility Model

[0006] To solve the above technical problems, the utility model provides a sampling device for detecting suspended particles, including: a sampling head, a bent extension tube, a sampling device body, a connecting pipeline, and a detection device;

[0007] The sampling device body includes: a cooling tube, a temperature sensor, several TEC semiconductor refrigeration stacks, a heat dissipation system, a display panel, a control switch, a power jack, and a housing;

[0008] The sampling head is connected to the bent extension tube for collecting suspended particles; the bent extension tube is connected to the sampling device body;

[0009] The cooling pipe serves as a channel for collecting suspended particles and cools the collected suspended particles simultaneously. Temperature sensors are installed at the inlet and outlet positions of the pipeline of the cooling pipe, and the temperature sensors provide real-time temperature data;

[0010] The several TEC semiconductor refrigeration stacks are closely arranged on the outer surface of the cooling pipe. The several TEC semiconductor refrigeration stacks are connected in the form of a parallel circuit, and a boat-shaped power switch is arranged on each branch of the parallel circuit to control the operation of the TEC semiconductor refrigeration stack on the branch;

[0011] The heat dissipation system includes an air pump and a plurality of heat sinks symmetrically arranged on both sides of the cooling pipe; the heat generated by the several TEC semiconductor refrigeration stacks is dissipated through the heat dissipation system;

[0012] The display panel displays the real-time temperature data of the temperature sensors;

[0013] The control switch controls the number of started TEC semiconductor refrigeration stacks according to the real-time temperature data;

[0014] The power jack is used to connect to an external power supply to supply power to the sampling device body;

[0015] The housing fixes, protects and supports the sampling device body. The surface of the housing is provided with a control switch, a display panel and a plurality of heat dissipation holes, and the inside of the housing is used to fix the air pump;

[0016] The sampling device body is connected to the detection device through a connecting pipeline;

[0017] The detection device is used to detect the number of particles of the collected suspended particles.

[0018] In a preferred embodiment, the sampling head is conical and made of aluminum alloy; both the inner and outer openings at the bottom of the sampling head can be used for connection. When the sampling head is connected to the bent extension pipe, the sampling head is connected to the top thread of the bent extension pipe through the internal hole thread at the bottom; when the sampling head is connected to the flexible hose, the sampling head is connected to the flexible hose through the protrusion at the outer pipe orifice.

[0019] In a preferred embodiment, the bent extension pipe consists of two parts, the upper part is the bent part made of aluminum alloy, and the lower part is the non-bendable straight pipe part made of 316L stainless steel. The bent part and the straight pipe part are connected by threads, and the inside of the bent extension pipe is smooth without dead ends; the bottom of the bent extension pipe is connected to the top of the cooling pipe of the sampling device body by threads.

[0020] In a preferred embodiment, the cooling pipe is made of 316L stainless steel. Both the inner and outer ports at the air inlet end of the cooling pipe can be used for connection. When the cooling pipe is connected to the bent extension pipe, the cooling pipe is connected to the bottom thread of the bent extension pipe through the internal hole thread at the top; when the cooling pipe is connected to the flexible pipe, the cooling pipe is directly connected to the flexible pipe through the protrusion at the outer pipe orifice. The inside of the cooling pipe is smooth without dead ends, and the cooling pipe is coaxially arranged with the outer shell of the sampling device body.

[0021] In a preferred embodiment, each TEC semiconductor refrigeration stack adopts an annular structure. The TEC semiconductor refrigeration stack includes a cold end, a heat insulation layer, and a hot end. The cold end is attached to the outer surface of the cooling pipe, and several TEC semiconductor refrigeration stacks are coaxially sleeved on the outer periphery of the cooling pipe; the heat insulation layer between the cold end and the hot end serves to isolate the heat exchange of cold and hot air at both ends; the hot end is connected to a plurality of heat sinks.

[0022] In a preferred embodiment, the power of each TEC semiconductor refrigeration stack is 30 - 70W, and the temperature transfer capacity is 30 - 70°C. When the real-time temperature data is below 100°C, the control switch activates 1 TEC semiconductor refrigeration stack. When the real-time temperature data is 100 - 200°C, the control switch activates multiple TEC semiconductor refrigeration stacks.

[0023] In a preferred embodiment, the heat dissipation system consists of multiple groups of heat sinks and air pumps symmetrically arranged on both sides of the cooling pipe. The air pumps are fixed inside the outer shell, and the air is driven by the air pumps to exchange the heat of the heat sinks with the external air.

[0024] In a preferred embodiment, the multiple heat dissipation holes are distributed at both ends of the outer shell and are used for the exchange of external cold air and internal hot air when the air pumps are working.

[0025] In a preferred embodiment, the connecting pipeline consists of an electric wire line and an air pipe. The electric wire line is used for power supply connection between the sampling device body and the detection equipment. One end of the electric wire line is connected to the power socket on the air outlet side of the sampling device body, and the other end of the electric wire line is connected to the power supply; the air pipe is used to transport the suspended particles cooled by the sampling device body to the detection equipment.

[0026] Compared with the prior art, the present utility model has the following beneficial technical effects:

[0027] 1. The present utility model can provide hardware support for production enterprises and testing institutions to improve the testing means and testing level in different temperature environments, and initiate the exploration of particle pollution conditions under high-temperature conditions.

[0028] 2. It meets the requirements of existing regulations and testing standards, conducts online monitoring of the production environment, effectively gives early warnings to prevent risks, and at the same time also has the ability to conduct dynamic confirmation, with broad application prospects.

[0029] 3. Through the design of the heat dissipation system and several TEC semiconductor refrigeration stacks, it is possible to detect suspended particles in the air under different high-temperature conditions in the existing pharmaceutical process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a connection schematic diagram of the sampling device of the present utility model;

[0031] Figure 2 It is an external view schematic diagram of the sampling device body of the present utility model;

[0032] Figure 3 It is a schematic diagram of the sampling head;

[0033] Figure 4 It is a connection structure schematic diagram of the bottom of the sampling head and the air inlet end of the cooling pipe;

[0034] Figure 5 It is a schematic diagram of the bent part of the bent extension pipe;

[0035] Figure 6 It is a schematic diagram of the straight part of the bent extension pipe;

[0036] Figure 7 It is a layout schematic diagram of multiple TEC semiconductor refrigeration stacks inside the sampling device body of the present utility model;

[0037] Figure 8 It is a cross-sectional schematic diagram of the sampling device body of the present utility model;

[0038] Reference numerals: 1. Sampling head; 2. Bent extension pipe; 3. Sampling device body; 4. Connection pipeline; 5. Detection equipment; 6. Cooling pipe; 7. Air pump; 8. Display panel; 9. Control switch; 10. Outer shell; 11. Power jack; 12. TEC semiconductor refrigeration stack; 13. Cold end; 14. Thermal insulation layer; 15. Hot end; 16. Heat sink. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] The following further describes the specific embodiments of the present utility model in conjunction with the drawings, and clearly and completely describes the technical solutions in the embodiments of the present utility model.

[0040] As Figure 1 shown, the sampling device of the present utility model includes: a sampling head, a bent extension pipe, a sampling device body, a connection pipeline, and detection equipment. The sampling head is connected to the bent extension pipe for collecting suspended particles; the bent extension pipe is connected to the sampling device body; the sampling device body is connected to the detection equipment through the connection pipeline; the detection equipment is used to detect the number of particles of the collected suspended particles.

[0041] As Figure 2As shown in the figure, it is a schematic diagram of the appearance of the sampling device body. The sampling device body includes: a cooling pipe, a display panel, a control switch, a power jack, and a housing. Inside the sampling device body, there are also a temperature sensor, several TEC semiconductor refrigeration stacks, and a heat dissipation system.

[0042] As Figure 3 shown, the sampling head is conical, made of aluminum alloy, and the inner wall is smooth without dead ends.

[0043] As Figure 4 shown in the figure is a schematic diagram of the connection structure between the bottom of the sampling head and the air inlet end of the cooling pipe. Both the inner and outer openings at the bottom of the sampling head can be used for connection. When the sampling head is connected to the bent extension pipe, the sampling head is connected to the top thread of the bent extension pipe through the internal hole thread at the bottom; when the sampling head is connected to the flexible hose, the sampling head is connected to the flexible hose through the protrusion at the outer pipe opening. Both the inner and outer openings at the air inlet end of the cooling pipe can be used for connection. When the cooling pipe is connected to the bent extension pipe, the cooling pipe is connected to the bottom thread of the bent extension pipe through the internal hole thread at the top; when the cooling pipe is connected to the flexible hose, the cooling pipe is directly connected to the flexible hose through the protrusion at the outer pipe opening.

[0044] As Figure 5 and Figure 6 shown in the figure, the bent extension pipe includes a bent pipe part ( Figure 5 ) and a straight pipe part ( Figure 6 ). The bent pipe part is made of aluminum alloy, and the straight pipe part is made of 316L stainless steel. The bent pipe part and the straight pipe part are connected into a whole through threads, and the inside of the bent extension pipe is smooth without dead ends; there are threads on the outside of the top and bottom of the bent extension pipe, which is convenient for connection with the sampling head and the cooling pipe.

[0045] The cooling pipe is a channel for collecting suspended particles and simultaneously cools the collected suspended particles. The cooling pipe is made of 316L stainless steel, and the inside of the cooling pipe is smooth without dead ends; the cooling pipe is coaxial with the housing of the sampling device body.

[0046] Temperature sensors are installed at the air inlet and outlet positions of the cooling pipe. The temperature sensors provide real-time temperature data, and the control switch controls the number of started TEC semiconductor refrigeration stacks according to the real-time temperature data of the temperature sensors.

[0047] Preferably, when the real-time temperature data is below 100°C, the control switch starts 1 TEC semiconductor refrigeration stack. When the real-time temperature data is 100 - 200°C, the control switch starts 2 to 3 TEC semiconductor refrigeration stacks. Among them, the control switch uses a KCD1 boat-shaped switch, and the temperature sensor uses a PT100 thermal resistance temperature sensor.

[0048] The power of each TEC semiconductor refrigeration stack is 70W, and the temperature transfer capacity of a single TEC semiconductor refrigeration stack is 70°C.

[0049] Preferably, the housing of the sampling device body is provided with heat dissipation holes that facilitate the entry of cooling air for temperature reduction and heat dissipation.

[0050] Preferably, the connecting pipeline is composed of an electric wire line and an air pipe. The electric wire line is used for power supply connection between the sampling device body and the detection device. One end of the electric wire line is connected to the power socket on the air outlet side of the sampling device body, and the other end of the electric wire line is connected to the power supply; the air pipe is used to transmit the suspended particles cooled by the sampling device body to the detection device.

[0051] As Figure 7 shown, the TEC semiconductor refrigeration stack adopts a circular ring-shaped TEC semiconductor refrigeration stack. Multiple circular ring-shaped TEC semiconductor refrigeration stacks are coaxially and fittingly sleeved on the outer surface of the cooling pipe. A heat insulation layer is provided between the cold end and the hot end. The heat insulation layer is coaxial with the cooling pipe and covers the whole body to isolate the heat exchange between the cold and hot ends.

[0052] As Figure 8 shown, the center of the cross-sectional view of the sampling device body is the cooling pipe, and outward are successively the cold end, the heat insulation layer, and the hot end of the TEC semiconductor refrigeration stack.

[0053] The heat dissipation system is composed of multiple groups of heat sinks and air pumps symmetrically arranged on both sides of the cooling pipe. The air pumps are fixed to the inner side of the housing, and the heat sinks are connected to the housing. Each TEC semiconductor refrigeration stack dissipates heat through the heat dissipation system, and the air pumps drive the air to exchange the heat of the heat sinks with the external air.

[0054] Preferably, the design method of the TEC semiconductor refrigeration stack can be adjusted according to actual needs, and a square TEC semiconductor refrigeration stack can be fittingly arranged on the outer surface of the cooling pipe.

[0055] The TEC semiconductor refrigeration stack of the present utility model, also called a thermoelectric refrigerator, is a heat dissipation device made by using the Peltier effect or the thermoelectric effect. A pair of units composed of a P-type semiconductor and an N-type semiconductor are placed in the circuit. When an electric current is applied, electron-hole pairs will be generated at one end, the internal energy decreases, the temperature drops, and a cold end is formed; at the other end, due to the recombination of electron-hole pairs, the internal energy increases, the temperature rises, and a hot end is formed. The temperature difference between the cold and hot ends generated by a single pair of PN units is limited. Multiple pairs of PN units can be connected in series or in parallel in the circuit, and then encapsulated with ceramic plates up and down to form a TEC device. One end of the TEC device is the cold end and the other end is the hot end.

[0056] The temperature difference between the cold and hot ends of a single TEC semiconductor refrigeration stack can reach 60°C to 70°C, and the cold end temperature can reach -20°C to -10°C. If a larger temperature difference is desired and the cold end temperature is to be made lower, several TEC semiconductor refrigeration stacks can be stacked and used.

[0057] The cooling pipe is connected to the TEC semiconductor refrigeration stack in a suitable manner. Preferably, multiple groups of TEC semiconductor refrigeration stacks can be connected in series as needed.

[0058] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. A sampling device for detecting suspended particles, characterized in that, Including: Sampling head, bent extension tube, sampling device body, connecting pipeline and detection equipment; The sampling device body includes: a cooling tube, a temperature sensor, several TEC semiconductor refrigeration stacks, a heat dissipation system, a display panel, a control switch, a power jack and a housing; The sampling head is connected to the bent extension tube and is used for collecting suspended particles; the bent extension tube is connected to the sampling device body; The cooling tube is a channel for collecting suspended particles and simultaneously cools the collected suspended particles. Temperature sensors are installed at the inlet and outlet positions of the pipeline of the cooling tube, and the temperature sensors provide real-time temperature data; The several TEC semiconductor refrigeration stacks are disposed in close contact with the outer surface of the cooling tube. The several TEC semiconductor refrigeration stacks are connected in the form of a parallel circuit, and a boat-shaped power switch is provided for each branch of the parallel circuit to control the operation of the TEC semiconductor refrigeration stack on the branch; The heat dissipation system includes an air pump and a plurality of heat sinks symmetrically disposed on both sides of the cooling tube; the heat generated by the several TEC semiconductor refrigeration stacks is dissipated through the heat dissipation system; The display panel displays the real-time temperature data of the temperature sensor; The control switch controls the number of TEC semiconductor refrigeration stacks started according to the real-time temperature data; The power jack is used to connect to an external power supply to supply power to the sampling device body; The housing fixedly protects and supports the sampling device body. The surface of the housing is provided with a control switch, a display panel and a plurality of heat dissipation holes, and the inside of the housing is used to fix the air pump; The sampling device body is connected to the detection equipment through a connecting pipeline; The detection equipment is used to detect the number of particles of the collected suspended particles.

2. The sampling device for suspended particle detection according to claim 1, characterized in that, The sampling head is conical and is made of aluminum alloy; both the inner and outer openings at the bottom of the sampling head can be used for connection. When the sampling head is connected to the bent extension tube, the sampling head is connected to the top thread of the bent extension tube through the internal hole thread at the bottom; when the sampling head is connected to a hose, the sampling head is connected to the hose through the protrusion at the outer pipe orifice.

3. The sampling device for suspended particle detection according to claim 1, characterized in that, The bent extension tube is composed of two parts, the upper part is the bent part, which is made of aluminum alloy, and the lower part is the non-bendable straight tube part, which is made of 316L stainless steel. The bent part and the straight tube part are connected by threads, and the inside of the bent extension tube is smooth and free of dead ends; the bottom of the bent extension tube is threadedly connected to the top of the cooling tube of the sampling device body.

4. The sampling device for suspended particle detection according to claim 1, characterized in that, The cooling tube is made of 316L stainless steel. Both the inner and outer openings at the inlet end of the cooling tube can be used for connection. When the cooling tube is connected to the bent extension tube, the cooling tube is connected to the bottom thread of the bent extension tube through the internal hole thread at the top; when the cooling tube is connected to a hose, the cooling tube is directly connected to the hose through the protrusion at the outer pipe orifice. The inside of the cooling tube is smooth and free of dead ends, and the cooling tube is coaxially arranged with the housing of the sampling device body.

5. The sampling device for suspended particle detection according to claim 1, characterized in that, Each TEC semiconductor refrigeration stack adopts an annular structure. The TEC semiconductor refrigeration stack includes a cold end, a heat insulation layer, and a hot end. The cold end is attached to the outer surface of the cooling pipe, and several TEC semiconductor refrigeration stacks are coaxially sleeved on the outer periphery of the cooling pipe. The heat insulation layer between the cold end and the hot end serves to isolate the heat exchange of cold and hot air at both ends. The hot end is connected to a plurality of heat sinks.

6. The sampling device for suspended particle detection according to claim 1, wherein The power of each TEC semiconductor refrigeration stack is 30 - 70W, and the temperature transfer capacity is 30 - 70°C. When the real-time temperature data is below 100°C, the control switch activates 1 TEC semiconductor refrigeration stack. When the real-time temperature data is 100 - 200°C, the control switch activates multiple TEC semiconductor refrigeration stacks.

7. The sampling device for suspended particle detection according to claim 1, wherein The heat dissipation system consists of multiple groups of heat sinks and air pumps symmetrically arranged on both sides of the cooling pipe. The air pumps are fixed inside the housing, and the air pumps drive air to exchange the heat of the heat sinks with the external air.

8. The sampling device for suspended particle detection according to claim 1, characterized in that, The multiple heat dissipation holes are distributed at both ends of the housing and are used for the exchange of external cold air and internal hot air when the air pumps are working.

9. The sampling device for suspended particle detection according to claim 1, wherein, The connecting pipeline consists of an electric wire circuit and an air pipe. The electric wire circuit is used for the power supply connection between the sampling device body and the detection device. One end of the electric wire circuit is connected to the power socket on the air outlet side of the sampling device body, and the other end of the electric wire circuit is connected to the power supply. The air pipe is used to transfer the suspended particles cooled by the sampling device body to the detection device.

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