Testing device
By integrating the test base into the control module, digital signal transmission is realized, the problems of analog signal attenuation and noise interference are solved, the circuit board complexity and cost are reduced, and the layout space is increased.
Patent Information
- Application Number
- CN202421899890.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-07-31
- Filing Date
- 2024-08-07
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-08-07
AI Technical Summary
In the existing preburning test, analog signals are easily attenuated and disturbed by noise during the transmission process, resulting in detection failure. At the same time, the existing structure is too large and the layout is complex.
The test base is integrated into the control module, including a control unit and a storage unit, and can reduce analog signal attenuation and noise interference through digital signal transmission, and reduce circuit board trace complexity and cost.
Improves the stability of signal processing, reduces the complexity and cost of the circuit board, and increases layout space.
Smart Images
Figure CN223166865U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a testing device, particularly a testing device for burn-in testing. Background Art
[0002] At present, during the quality control stage before semiconductor components (such as wafers, chips, or packaging modules) are shipped, a burn-in test is required. This burn-in test uses high temperature, high pressure, high humidity, etc. to accelerate the aging or perform reliability tests such as destructive tests on the semiconductor components to be shipped, in order to detect defective semiconductor components and eliminate them.
[0003] As Figure 1 shown, when conducting a traditional burn-in test, the device under test is mainly placed in the burn-in test socket 11, and the burn-in test socket 11, control unit 12, and storage unit 13 are connected to a daughter board 14, and then the daughter board 14 is connected to a mother board 15, so that the external detection instructions can be transmitted to the mother board 15, daughter board 14, and burn-in test socket 11. At the same time, the burn-in test socket 11 transmits the sensed analog signal to an external analog / digital converter (A / D Converter) to be converted into a digital signal for the control unit 12 to decode and the storage unit 13 to store, and then the data required for various reliability tests is transmitted back for subsequent analysis and processing.
[0004] However, because the analog signal is transmitted through connectors to the daughter board and mother board during the transmission process, the analog signal is prone to attenuation or noise interference, resulting in distortion of the read data (such as temperature data), causing risks such as detection failure. At the same time, the existing burn-in test socket, control unit, and storage unit must be individually placed on the daughter board and then on the mother board, which not only causes the problem of the overall structure being too large, but also leads to complex wiring on the daughter board and mother board, and at the same time affects the layout space of the daughter board and mother board.
[0005] Therefore, how to overcome the above-mentioned various problems of the prior art has actually become an urgent issue to be solved currently. Utility Model Content
[0006] In view of the above-mentioned various deficiencies of the prior art, this application provides a testing device for burn-in testing of a device under test, which includes: a test socket, including a base and a cover body for carrying the device under test; and a control module, which is integrated on the test socket and electrically connected to the test socket, and includes a control unit and a storage unit.
[0007] In the aforementioned testing device, the test socket is connected and electrically connected to a mother board.
[0008] In the aforementioned testing device, the test socket is provided with a plurality of sensors.
[0009] In the aforementioned test device, the cover changes between an open position and a closed position relative to the base.
[0010] In the aforementioned test device, the cover has a contact portion and a heat dissipation portion.
[0011] In the aforementioned test device, the control module is disposed on the side of the test base.
[0012] In the aforementioned test device, the control unit and the storage unit are disposed on a carrier board and electrically connected to the carrier board.
[0013] In the aforementioned test device, the control unit is a microprocessor or a field programmable gate array, and the storage unit is an electrically erasable programmable read-only memory.
[0014] In the aforementioned test device, the control module is electrically connected to the motherboard through spring conductive pins.
[0015] In the aforementioned test device, the control unit receives the sensing signal of the test base and issues a control signal accordingly.
[0016] In the aforementioned test device, the control unit combines an analog / digital signal conversion unit to directly convert the analog signal of the sensing signal into a digital signal.
[0017] As can be seen from the above, the test device of the present application embeds or integrates a control module into the test base, combines a control unit and a storage unit, and transmits the signal to an external processing device through a digital signal bus, so as to reduce problems such as analog signal attenuation and noise interference. At the same time, the test device transmits digital signals, which not only reduces the complexity and cost of circuit board wiring, increases the circuit board layout space, but also solves the disadvantage that the existing pre-burning test base, control unit, and storage unit need to be individually connected to the daughter board and then placed on the motherboard, resulting in an overly large overall structure. Description of the Drawings
[0018] Figure 1 It is a schematic configuration diagram of an existing pre-burning test base.
[0019] Figure 2 It is a side view schematic diagram of the configuration of the test device of the present application.
[0020] Figure 3 It is a top view schematic diagram of the configuration of the test device of the present application.
[0021] Figure 4 It is a side view schematic diagram of the control module of the test device of the present application.
[0022] Figure 5 It is a schematic diagram of the application architecture of the test device of the present application.
[0023] Description of Main Component Symbols
[0024] 11 Pre-burning Test Socket
[0025] 12 Control Unit
[0026] 13 Storage Unit
[0027] 14 Daughter Board
[0028] 15 Mother Board
[0029] 2 Test Device
[0030] 21 Test Socket
[0031] 211 Base
[0032] 212 Cover
[0033] 2121 Contact Part
[0034] 2122 Heat Dissipation Part
[0035] 213 Pivoting Structure
[0036] 214 Sensor
[0037] 22 Control Module
[0038] 220 Carrier Board
[0039] 221 Control Unit
[0040] 222 Storage Unit
[0041] 223 Spring Conductive Contact Pin
[0042] 3 Circuit Board
[0043] 4 Processing Device. Detailed Implementation Modes
[0044] The following describes the implementation modes of the present application through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.
[0045] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation conditions of this application. Therefore, they do not have any technical substance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that this application can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in this application. At the same time, terms such as "upper" and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope of implementation of this application. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope of implementation of this application.
[0046] Figure 2 and Figure 3 are a side view schematic diagram and a top view schematic diagram of the configuration of the test device of this application. In this embodiment, the test device 2 is used for the reliability test (such as a pre-burn test) of a device under test (not shown in the figure), and the device under test is, for example, a wafer, a chip, or a package.
[0047] The test device 2 includes a test socket 21 and a control module 22, and the test device 2 is connected and electrically connected to a circuit board (such as a motherboard) 3.
[0048] The test socket 21 includes a base 211 and a cover 212, which are used to carry at least one or more devices under test. At the same time, the test socket 21 is provided with at least one or more sensors (such as sensors provided on the cover to sense the temperature of the device under test) to capture the sensing signals (such as temperature signals) of the device under test.
[0049] The cover 212 is pivotally connected to the base 211. The bottom of the base 211 can be electrically connected to the circuit board 3 through, for example, conductive pins, and the base 211 has a receiving groove for placing the device under test. In this embodiment, the cover 212 is connected to the base 211 through a pivoting structure 213. In other embodiments, the cover 212 can also be movably connected to the base 211 through other mechanisms (such as slide rails, etc.), so that the cover 212 can change between an open position and a closed position relative to the base 211, thereby exposing or covering the device under test.
[0050] The cover 212 has a contact portion 2121 and a heat dissipation portion 2122. When the cover 212 is in the closed position, the contact portion 2121 can contact the device under test, and the contact portion 2121 is a heat-conducting metal. Thus, the heat generated by the device under test during the test can be conducted to the heat dissipation portion 2122, which is, for example, a heat sink fin group, through the contact portion 2121, so that the device under test can be cooled. The heat dissipation portion 2122 can be further connected to a fan and / or a heat pipe to promote cooling.
[0051] The control module 22 is integrated on the test socket 21 and electrically connected to the test socket 21. In this embodiment, the control module 22 is disposed on the side of the test socket 21.
[0052] Please also refer to Figure 4 , which is a side view schematic diagram of the control module 22 of the test device 2 of the present application. The control module 22 includes a carrier board 220, a control unit 221 and a storage unit 222 disposed on the carrier board 220. The control unit 221 can be electrically connected to the test socket 21 and the storage unit 222.
[0053] The control unit 221 is, for example, a microcontroller unit (MCU) or a field programmable gate array (FPGA). The storage unit 222 is, for example, an electrically erasable programmable read-only memory (EEPROM), and the control unit 221 and the storage unit 222 are electrically connected to the carrier board 220. Among them, the control module 22 (carrier board 220) can be electrically connected to the circuit board (mother board) 3 through, for example, a spring conductive contact pin 223.
[0054] Please also refer to Figure 5 , which is an application architecture schematic diagram of the test device 2 of the present application. Among them, the control unit 221 can receive the sensing signal of the test socket 21 (such as the temperature signal of the sensor 214) and issue a control signal accordingly (such as a temperature control signal). Further, the control unit 221 can be combined with an analog / digital (A / D) signal conversion unit to directly convert the analog signal of the sensing signal into a digital signal, and then the digital signal can be directly transmitted to an external processing device (such as a computer device) 4. In addition, the storage unit 222 can be used to store identification information of the test socket 21 and information such as usage time. Accordingly, the test device 2 integrates the test socket 21 and the control module 22, and can perform analog / digital (A / D) signal conversion internally and transmit through digital signals, increasing the stability of subsequent signal processing and reading.
[0055] Therefore, the test device of the present application embeds or integrates the control module into the test socket, combines the control unit and the storage unit, and transmits through the digital signal bus to an external processing device, so as to reduce problems such as analog signal attenuation and noise interference. At the same time, the test device transmits digital signals, which not only reduces the complexity and cost of circuit board wiring, increases the circuit board layout space, but also solves the disadvantage that the existing pre-burning test socket, control unit, and storage unit need to be individually connected to the daughter board and then placed on the mother board, resulting in an overly large overall structure.
[0056] The above embodiments are only used to exemplarily illustrate the principles and effects of the present application, rather than to limit the present application. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the rights protected by the present application shall be as listed in the claims.
Claims
1. A testing device for pre-burning test of a to-be-tested object, characterized in that Comprising: A test socket, including a base and a cover, for carrying a device under test; And A control module, integrated on the test socket and electrically connected to the test socket, and including a control unit and a storage unit.
2. The testing device according to claim 1, wherein The test socket is connected and electrically connected to a motherboard.
3. The testing device according to claim 1, characterized in that, The test socket is provided with sensors.
4. The test device according to claim 1, characterized in that, The cover varies between an open position and a closed position relative to the base.
5. The test device according to claim 1, wherein The cover has a contact portion and a heat dissipation portion.
6. The test device according to claim 1, wherein The control module is provided on the side of the test socket.
7. The testing device according to claim 1, characterized in that, The control unit and the storage unit are provided on a carrier board and electrically connected to the carrier board.
8. The test device according to claim 1, characterized in that The control unit is a microprocessor or a field programmable gate array, and the storage unit is an electrically erasable programmable read-only memory.
9. The test device according to claim 1, wherein The control module is electrically connected to the motherboard through spring conductive pins.
10. The test device according to claim 1, characterized in that The control unit receives the sensing signal of the test socket and issues a control signal accordingly.
11. The testing device according to claim 10, characterized in that, The control unit combines an analog / digital signal conversion unit to directly convert the analog signal of the sensing signal into a digital signal.