Solder strip carrying device and solder strip arrangement system

Abstract

The welding strip carrying device comprises a driving mechanism, a mounting plate and a plurality of suction cups, the driving mechanism drives the mounting plate to move up and down, the suction cups are mounted on the mounting plate, an adsorption cavity is formed in the mounting plate, the suction cups communicate with the adsorption cavity, and at least two suction cups are matched with each other to suck one welding strip. The welding strip can be sucked up through the upward total adsorption force of the multiple suction nozzle openings acting on the welding strip. The solder strip arrangement system comprises a solder strip carrying device, a transfer table used for bearing solder strips, a bearing table used for bearing battery pieces and a traction mechanism, the solder strip carrying device is installed on the traction mechanism, and the traction mechanism drives the solder strip carrying device to move back and forth between the transfer table and the bearing table. And an ultrasonic cleaning tank is arranged between the transfer table and the bearing table. The welding strip arrangement structure has the advantages that the welding strip arrangement precision is high, the subfissure of the module battery is few, the alignment debugging requirement between the suction cup and the welding strip is low, and the suction cup is not prone to being blocked.

Description

Technical Field

[0001] This application belongs to the technical field of photovoltaic module production. Specifically, it relates to a solder ribbon handling device and a solder ribbon layout system. Background Art

[0002] Solder ribbon is an important material in the welding process of photovoltaic modules. The current of the solar cells is led out through the solder ribbon, and then the electrodes led out are effectively connected to the junction box in series or parallel. During the solder ribbon layout process, a clamping mechanism is installed on a traction mechanism. The clamping mechanism clamps the solder ribbon on a transfer table, and the traction mechanism moves the solder ribbon clamped by the clamping mechanism above the solar cells placed on a carrier table. Then the clamping mechanism releases the solder ribbon so that it is laid out on the solar cells.

[0003] Currently, the most commonly used clamping mechanism is a jaw, and most of them are only suitable for circular solder ribbons. During the process of clamping flat solder ribbons, the jaw applying forces to the left and right of the flat solder ribbon easily causes the solder ribbon to turn over, resulting in poor solder ribbon layout accuracy. In addition, the jaw mechanism is rigid and easily causes hidden cracks in the module solar cells. Moreover, the structure of the mechanism for the jaw to clamp the solder ribbon is relatively complex, and the alignment and debugging requirements between the jaw and the solder ribbon are high. Otherwise, the solder ribbon cannot be effectively clamped. Utility Model Content

[0004] In view of this, this application provides a solder ribbon handling device and a solder ribbon layout system. The solder ribbon is sucked by a suction nozzle, with high solder ribbon layout accuracy, few hidden cracks in the module solar cells, relatively low alignment and debugging requirements between the suction cup and the solder ribbon, and the problem of suction cup blockage is solved.

[0005] A solder ribbon handling device includes a driving mechanism, a mounting plate, and a plurality of suction cups. The driving mechanism drives the mounting plate to move up and down. The suction cups are mounted on the mounting plate. An adsorption cavity is formed inside the mounting plate, and the suction cups communicate with the adsorption cavity. At least two suction cups cooperate with each other to suck a solder ribbon;

[0006] The total upward adsorption force of the plurality of suction cups acting on the solder ribbon can suck up the solder ribbon.

[0007] Preferably, the suction nozzle opening of the suction cup is made of a flexible material.

[0008] Preferably, the solder ribbon handling device further includes a base and a buffer member. The mounting plate is mounted on the bottom of the base through the buffer member.

[0009] Preferably, the buffer member includes a linear bearing and a buffer spring. The linear bearing is mounted on the bottom of the base. One end of the buffer spring is connected to the mounting plate, and the other end passes through the linear bearing and is connected to the base.

[0010] Preferably, a connecting plate is provided on the top of the base, and the connecting plate is connected to the base by an angle adjustment bolt.

[0011] A solder ribbon arrangement system includes the solder ribbon handling device as described above, and further includes a transfer table for carrying the solder ribbon, a carrying table for carrying the solar cell, and a traction mechanism;

[0012] The solder ribbon handling device is installed on the traction mechanism, and the traction mechanism drives the solder ribbon handling device to move back and forth between the transfer table and the carrying table.

[0013] Preferably, an ultrasonic cleaning tank is provided between the transfer table and the carrying table.

[0014] Preferably, the ultrasonic cleaning tank is arranged closely adjacent to the carrying table.

[0015] Preferably, a plurality of bosses are provided on the upper surface of the transfer table, and one solder ribbon is carried by at least two of the bosses.

[0016] Preferably, a positioning mechanism and a pressing mechanism are further provided on the transfer table.

[0017] The beneficial effects of the present application are as follows:

[0018] 1. By sucking one solder ribbon with multiple suction cups, the state of the solder ribbon will not be changed due to external actions such as clamping, so as to realize the transfer of the solder ribbon from the transfer table to the solar cell on the carrying table. The solder ribbon arrangement accuracy is high, and the alignment and debugging requirements between the suction cup and the solder ribbon are relatively low.

[0019] 2. By regularly cleaning the suction cups through the ultrasonic cleaning tank, the problem of suction cup blockage is effectively solved.

[0020] 3. The suction nozzle opening is made of a flexible material, and the mounting plate and the base are connected by a buffer member, so that a buffering effect can be achieved both when the suction cup presses down on the solder ribbon and when the solder ribbon is pressed on the solar cell, thereby reducing the hidden cracks of the solar cell;

[0021] 4. Each solder ribbon is carried by at least two bosses, so that the solder ribbon does not directly contact the transfer table, and the downward adhesion force received by the solder ribbon is small, which is beneficial for the suction cup to suck up the solder ribbon. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0023] The structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the implementation conditions of this application. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that this application can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in this application.

[0024] Figure 1 is a schematic structural diagram of a solder tape handling device;

[0025] Figure 2 is Figure 1 a partial enlarged view of part A in

[0026] Figure 3 is a front view of the solder tape handling device;

[0027] Figure 4 is a schematic structural diagram of a solder tape arrangement system.

[0028] In the figure: 1 - mounting plate; 2 - suction cup; 21 - suction nozzle; 3 - solder tape; 4 - base; 41 - connecting plate; 42 - angle adjustment bolt; 43 - U-shaped adjustment fixing block; 5 - buffer member; 51 - linear bearing; 52 - buffer spring; 6 - transfer table; 7 - carrying table; 8 - ultrasonic cleaning tank; 9 - pneumatic joint. Specific Embodiments

[0029] Next, the embodiments in the present application will be clearly and completely described in conjunction with the attached drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0030] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below in conjunction with the attached drawings and specific embodiments.

[0031] The present application provides a solder tape handling device. Referring to Figures 1 - 3 , it includes a driving mechanism (not shown in the figure), a mounting plate 1, and a plurality of suction cups 2. The driving mechanism drives the mounting plate 1 to move up and down. The suction cups 2 are installed on the mounting plate 1. An adsorption cavity (not shown in the figure) is formed inside the mounting plate 1. The suction cups 2 communicate with the adsorption cavity. One solder tape 3 is sucked by the cooperation of at least two of the suction cups 2;

[0032] The total upward adsorption force of the plurality of suction cups 2 acting on the solder tape 3 can suck up the solder tape 3.

[0033] Multiple solder ribbon handling devices can be provided, and the driving mechanism can drive multiple solder ribbon handling devices to move up and down simultaneously, or one driving mechanism can drive one solder ribbon handling device to move up and down. One solder ribbon handling device transports a group of solder ribbons 3, and multiple solder ribbon handling devices operating simultaneously can transport multiple groups of solder ribbons 3 to the corresponding solar cells at the same time, with higher efficiency. The number of solder ribbons 3 included in each group of solder ribbons 3 is the same as the number of main grids of the solar cell.

[0034] When the mounting plate 1 is located above a group of solder ribbons 3, along the extending direction of the solder ribbons 3, there are at least two suction cups 2 above each solder ribbon 3. Preferably, there are at least three suction cups 2 above each solder ribbon 3, so that both ends and the middle of the solder ribbon 3 are sucked by the corresponding suction cups 2, or as Figure 3 shown, one suction cup 2 is correspondingly arranged at each end of the solder ribbon 3, and two suction cups 2 are correspondingly arranged in the middle of the solder ribbon 3. One solder ribbon 3 is sucked by four suction cups 2, so that the solder ribbon 3 can be sucked up better.

[0035] The mounting plate 1 is also provided with a pneumatic joint 9. The pneumatic joint 9 is communicated with the adsorption cavity, and the adsorption cavity is communicated with an external vacuum generating device (not shown in the figure) through the pneumatic joint 9. The vacuum generating device evacuates the adsorption cavity to generate negative pressure, so that the suction cup 2 sucks up the solder ribbon 3 below it.

[0036] It can be understood that the total upward adsorption force of multiple suction cups 2 acting on one solder ribbon 3 should be able to suck up the solder ribbon 3, and the solder ribbon 3 can still be sucked by the suction cups 2 during the movement of the solder ribbon 3.

[0037] The alignment and debugging requirements between the suction cup 2 and the solder ribbon 3 in this application are relatively low, and the solder ribbon arrangement accuracy is high.

[0038] As Figure 1 and Figure 3 shown, the solder ribbon handling device further includes a base 4 and a buffer member 5. The mounting plate 1 is mounted on the bottom of the base 4 through the buffer member 5.

[0039] The buffer member 5 includes a linear bearing 51 and a buffer spring 52. The linear bearing 51 is mounted on the bottom of the base 4. One end of the buffer spring 52 is connected to the mounting plate 1, and the other end passes through the linear bearing 51 and is connected to the base 4.

[0040] When sucking the solder tape 3, the driving mechanism drives the base 4 and the mounting plate 1 to move downward together. During the process that the suction cup 2 presses on the corresponding solder tape 3, the buffer spring 52 is compressed, thus playing a buffering role. When the solder tape 3 sucked by the suction cup 2 moves above the battery cell, during this process of sucking the solder tape, there is no external force changing the solder tape. The solder tape is in the same state on the turntable as it is when sucked up, without affecting the accuracy of the solder tape itself. During the process that the driving mechanism drives the suction cup 2 to move downward to place the solder tape 3 on the battery cell, the solder tape 3 can be directly pressed on the battery cell, so that the arrangement accuracy is higher. During this process, the buffer spring 52 can also play a buffering role. It can be understood that the nozzle opening 21 of the suction cup 2 (as Figure 2 shown) is made of flexible material, such as rubber material, so that the nozzle opening 21 has a certain softness to prevent the nozzle opening 21 from damaging the solder tape 3 or the battery cell during the process of sucking or placing the solder tape 3.

[0041] Continue to refer to Figure 1 , a connecting plate 41 is provided at the top of the base 4, and the connecting plate 41 is connected to the base 4 through an angle adjustment bolt 42. Before sucking the solder tape 3, the angle of the mounting plate 1 can be adjusted through the angle adjustment bolt 42 so that all the nozzle openings 21 on the mounting plate 1 are on the same horizontal line. In this way, during the process that the nozzle openings 21 suck the solder tape 3, it can be ensured that a group of solder tapes 3 can be sucked up simultaneously.

[0042] As Figure 4 shown, a solder tape arrangement system includes the solder tape handling device as described above, and also includes a turntable 6 for carrying the solder tape 3, a carrying platform 7 for carrying the battery cells, and a traction mechanism (not shown in the figure);

[0043] The solder tape handling device is installed on the traction mechanism, and the traction mechanism drives the solder tape handling device to move back and forth between the turntable 6 and the carrying platform 7.

[0044] In this embodiment, a U-shaped adjustment fixing block 43 is further fixedly installed at the top of the connecting plate 41, and each solder tape handling device is installed on the traction mechanism through the U-shaped adjustment fixing block 43. Specifically, a plurality of solder tape handling devices are installed on the traction mechanism. After the plurality of solder tape handling devices suck multiple groups of solder tapes 3, the traction mechanism moves the plurality of solder tape handling devices from above the turntable 6 to above the carrying platform 7, and then the driving mechanism drives the solder tape handling device to move downward, and the vacuum generating device is turned off to make the suction cup 2 release the solder tape 3, so that the solder tape 3 is placed on the battery cell. After multiple groups of solder tapes 3 are all placed at specific positions on the corresponding battery cells, the traction mechanism moves the plurality of solder tape handling devices from above the carrying platform 7 to above the turntable 6 to suck another multiple groups of solder tapes 3, and then repeats the above steps.

[0045] Continue to refer to Figure 4 , an ultrasonic cleaning tank 8 is provided between the transfer table 6 and the carrier table 7.

[0046] Since the soldering flux is coated on the solder tape 3, during the long-term suction and handling of the solder tape 3, the suction cup 2 is prone to blockage, resulting in a decrease in the vacuum adsorption effect and affecting the suction of the solder tape 3. In this embodiment, an ultrasonic cleaning tank 8 is provided between the transfer table 6 and the carrier table 7 to regularly clean the suction cup 2. Specifically, after the solder tape handling device operates for a certain period of time, the traction mechanism moves multiple solder tape handling devices above the ultrasonic cleaning tank 8, and then the driving mechanism drives the suction cup 2 to move downward until it is immersed in the cleaning agent contained in the ultrasonic cleaning tank, and the suction cup 2 is cleaned by ultrasonic waves, so that the soldering flux adhered to the inside of the suction cup 2 is washed away. It can be understood that all the suction cups 2 on multiple solder tape handling devices installed on the traction mechanism can be simultaneously ultrasonically cleaned in this embodiment.

[0047] In this embodiment, the ultrasonic cleaning tank 8 is arranged close to the carrier table 7.

[0048] During the process of handling the solder tape 3, it can be designed that the top of the ultrasonic cleaning tank 8 is lower than the horizontal plane where the upper surface of the carrier table 7 is located, so as to prevent the ultrasonic cleaning tank 8 from affecting the placement of the battery cell on the carrier table 7. When the suction cup 2 needs to be cleaned, the traction mechanism moves multiple solder tape handling devices above the ultrasonic cleaning tank 8, and the driving mechanism drives the suction cup 2 to move downward until it is immersed in the cleaning agent for ultrasonic cleaning. After cleaning, the driving mechanism drives the suction cup 2 to move upward, so that the suction cup 2 is separated from the ultrasonic cleaning tank 8.

[0049] Furthermore, a plurality of convex platforms (not shown in the figure) are provided on the upper surface of the transfer table 6, and one solder tape 3 is carried by at least two of the convex platforms.

[0050] Preferably, along the extension direction of the solder tape 3, at least three convex platforms are provided below each solder tape 3, so that both ends and the middle of each solder tape 3 are placed on the convex platforms.

[0051] Since the soldering flux is coated on the solder tape 3, placing the solder tape 3 on the transfer table 6 will cause the solder tape 3 to adhere to the transfer table 6, so that the solder tape 3 is subjected to a downward adhesion force. The setting of the convex platform makes only part of the entire solder tape 3 in contact with the convex platform, and the rest of the solder tape 3 is in a suspended state, which can reduce the downward adhesion force received by the solder tape 3 and make it easier for the suction cup 2 to pick up the solder tape 3.

[0052] In order to ensure the accurate placement position of the solder strip 3 on the transfer table 6 and avoid the position deviation of the solder strip 3 during the process of sucking the solder strip 3, in this embodiment, a plurality of positioning mechanisms (not shown in the figure) and pressing mechanisms (not shown in the figure) are further provided on the transfer table 6, so that each solder strip 3 has an accurate placement position and the position of each solder strip 3 will not deviate during the sucking process. Specifically, during the process of placing the solder strip 3 on the transfer table 6, it is positioned by the positioning mechanism. Before the suction cup 2 sucks the solder strip 3, the solder strip 3 is pressed on the convex platform by the pressing mechanism. After the suction cup 2 sucks the solder strip 3, the pressing mechanism is released, so that the solder strip 3 is separated from the convex platform.

[0053] The various embodiments in this specification are described in a progressive, or parallel, or a combination of progressive and parallel manners. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and reference can be made to the description of the method part for the relevant parts.

[0054] It should be noted that in the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present at the same time.

[0055] It should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that an article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such article or device. Without further limitation, the element defined by the statement "including one..." does not exclude the existence of another identical element in the article or device including the above elements.

[0056] The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A solder tape handling device, characterized in that, It includes a driving mechanism, a mounting plate (1) and a plurality of suction cups (2). The driving mechanism drives the mounting plate (1) to move up and down. The suction cups (2) are mounted on the mounting plate (1). An adsorption cavity is formed inside the mounting plate (1), and the suction cups (2) communicate with the adsorption cavity. At least two of the suction cups (2) cooperate with each other to suck up a solder strip (3). The total upward adsorption force exerted by the plurality of suction cups (2) on the solder strip (3) can suck up the solder strip (3).

2. The solder ribbon handling device according to claim 1, characterized in that, The nozzle opening (21) of the suction cup (2) is made of a flexible material.

3. The solder tape handling device according to claim 1, characterized in that, The solder strip handling device further includes a base (4) and a buffer member (5). The mounting plate (1) is mounted on the bottom of the base (4) through the buffer member (5).

4. The solder tape handling device according to claim 3, characterized in that The buffer member (5) includes a linear bearing (51) and a buffer spring (52). The linear bearing (51) is mounted on the bottom of the base (4). One end of the buffer spring (52) is connected to the mounting plate (1), and the other end passes through the linear bearing (51) and is connected to the base (4).

5. A solder tape handling device according to claim 3, characterized in that A connecting plate (41) is provided on the top of the base (4). The connecting plate (41) is connected to the base (4) by an angle adjustment bolt (42).

6. A solder tape arrangement system, characterized in that, It includes the solder strip handling device according to any one of claims 1-5, and further includes a transfer table (6) for carrying the solder strip (3), a carrying table (7) for carrying solar cells and a traction mechanism. The solder strip handling device is mounted on the traction mechanism, and the traction mechanism drives the solder strip handling device to move back and forth between the transfer table (6) and the carrying table (7).

7. The solder strip layout system according to claim 6, wherein, An ultrasonic cleaning tank (8) is provided between the transfer table (6) and the carrying table (7).

8. The solder strip arrangement system according to claim 7, characterized in that, The ultrasonic cleaning tank (8) is arranged closely adjacent to the carrying table (7).

9. A solder strip arrangement system according to claim 6, characterized in that, A plurality of protrusions are provided on the upper surface of the transfer table (6), and at least two of the protrusions carry one solder strip (3).

10. A solder tape arrangement system according to claim 9, characterized in that, A positioning mechanism and a pressing mechanism are further provided on the transfer table (6).

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