MOS tube forming tool

Abstract

The utility model relates to the field of MOS tube forming, in particular to an MOS tube forming tool which comprises an upper die assembly and a lower die assembly which are arranged correspondingly, and is characterized in that the upper die assembly comprises an upper die plate; an upper mold pressing plate used for fixing the MOS tube pins and an upper mold punching plate used for bending the MOS tube pins are arranged on the upper mold plate in parallel, the upper mold pressing plate is connected with the upper mold plate through a first elastic reset device, and the upper mold punching plate is fixedly connected with the upper mold plate; the lower die assembly comprises a lower die plate, the lower die assembly is provided with a containing groove used for containing the MOS tube, and the lower die plate on one side of the containing groove is further provided with a limiting protrusion. According to the utility model, the use is convenient, the production efficiency is greatly improved, the production cost is reduced, the limiting bulges and the accommodating grooves with corresponding sizes and shapes are replaced as required so as to adapt to different packaging sizes, different forming shapes and forming size requirements, the welding quality and the size precision can be improved, and the forming consistency is good.

Description

Technical Field

[0001] The utility model relates to the field of MOS tube forming, in particular to a MOS tube forming tool. Background Art

[0002] When MOS tubes are soldered on PCBs, the pins must be formed according to the pad position and size. Due to the characteristics of soldering, the precision requirements for the distance between the pins and the device body and the pin height are very high when forming the MOS tubes.

[0003] Currently, small and medium-sized electronic manufacturers mainly form MOS tubes manually using tools such as needle-nose pliers. This method has large quality fluctuations and a high rework rate. Some electronic manufacturers with stronger manufacturing capabilities currently use dedicated tooling to form MOS tubes. This method is not widely applicable due to differences in MOS tube package size, pin forming shape and forming size, and has high tooling manufacturing and management costs. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a MOS tube forming tool that is easy to use, greatly improves production efficiency, reduces production costs, and is adaptable to different package sizes, different forming shapes and forming size requirements.

[0005] The utility model discloses a MOS tube forming tool, comprising an upper die assembly and a lower die assembly corresponding to each other, wherein the upper die assembly comprises an upper die plate, on which an upper die pressing plate for fixing the MOS tube pins and an upper die punching plate for bending the MOS tube pins are arranged in parallel, the upper die pressing plate is connected to the upper die plate via a first elastic reset device, and the upper die punching plate is fixedly connected to the upper die plate;

[0006] The lower mold assembly includes a lower mold plate, which is provided with a receiving groove for receiving the MOS tube. A limiting protrusion is also provided on the lower mold plate on one side of the receiving groove. The limiting protrusion is arranged opposite to the upper mold plate on the upper mold plate, and the limiting protrusion is staggered with the upper mold punching plate.

[0007] When the upper die plate moves toward the lower die plate, the upper die punch plate and the limiting protrusion are misaligned to squeeze and bend the MOS tube pins.

[0008] Preferably, the upper template is connected to the lower template via a second elastic reset device.

[0009] Preferably, the second elastic reset device includes a plurality of second connecting guide pillars uniformly distributed along the circumference of the lower template on a side of the lower template facing the upper template, one end of the second connecting guide pillar is fixedly connected to the lower template, and the other end of the second connecting guide pillar passes through a corresponding through hole provided on the upper template and is connected to a limiting nut;

[0010] A limiting ring platform is arranged on the second connecting guide post, and a second return spring is sleeved on the second connecting guide post between the limiting ring platform and the upper template. One end of the second return spring abuts against the limiting ring platform, and the other end abuts against the upper template.

[0011] Preferably, the first elastic return device includes a first connecting guide post. One end of the first connecting guide post is fixedly connected to the end face of the upper die pressing plate away from the working surface of the upper die pressing plate. The other end of the first connecting guide post passes through the upper template and is connected with a nut. A first return spring is sleeved on the first connecting guide post between the upper template and the upper die pressing plate. One end of the first return spring abuts against the upper die pressing plate, and the other end abuts against the upper template.

[0012] Preferably, the upper die punching plate is fixedly connected to the upper template through connecting bolts.

[0013] Preferably, a upper die handle for connecting with the upper die core of the hydraulic press is also fixedly connected to the surface of the upper template away from the lower template.

[0014] Preferably, a clamping plate for fixedly connecting with the working table of the hydraulic press is also fixedly connected to the surface of the lower template away from the upper template. The lower template is fixedly connected through a plurality of support rods arranged between the clamping plate and the lower template bracket and evenly distributed along the circumference of the lower template.

[0015] Preferably, a groove is arranged on the lower template, a receiving plate is inlaid in the groove, receiving grooves are arranged on the receiving plate, and the limiting protrusions are also inlaid on the lower template.

[0016] Preferably, both the upper die punching plate and the upper die pressing plate on the upper template are annular, and the upper die punching plate is located inside the upper die pressing plate;

[0017] Both the receiving groove and the limiting protrusion on the lower template are annular, and the ring where the receiving groove is located is outside the ring where the limiting protrusion is located.

[0018] The utility model is convenient to use, greatly improves the production efficiency, reduces the production cost, replaces the limiting protrusions and receiving grooves with corresponding sizes and shapes according to needs to adapt to different packaging sizes, different forming shapes and forming size requirements, can improve the welding quality and dimensional accuracy, and has good forming consistency.

[0019] The utility model selects limiting protrusions and receiving grooves with different sizes to realize the forming of MOS tubes with different packaging sizes.

[0020] After the MOS tube is formed by the utility model, the dimensional accuracy of the pins is guaranteed, and the welding quality is reliable; the forming consistency is good and the quality is stable.

[0021] It takes about 12 minutes to manually form a device. The utility model can form multiple devices at a time, and it takes about 1 minute to form once, greatly improving the forming efficiency and saving labor costs.

[0022] According to statistics, the welding success rate can reach over 97% by using the device of the utility model. Brief Description of the Drawings

[0023] Figure 1 It is a schematic structural view of the utility model.

[0024] Figure 2 It is a perspective view of the utility model.

[0025] Figure 3 It is a schematic structural view of the upper film assembly.

[0026] Figure 4 It is a schematic view of another perspective of the upper die assembly.

[0027] Figure 5 It is a schematic structural view of the lower die assembly.

[0028] Figure 6 For Figure 5 top view.

[0029] Reference numerals in the drawings: 1 - upper template, 2 - lower template, 3 - upper die punching plate, 4 - upper die pressing plate, 5 - limiting protrusion, 6 - second connecting guide post, 7 - second return spring, 8 - first return spring, 9 - upper die shank, 10 - clamping plate, 11 - accommodating groove. Detailed Description of the Embodiment

[0030] A MOS tube forming tooling of the utility model includes an upper die assembly and a lower die assembly which are arranged corresponding to each other. The upper die assembly includes an upper template 1. On the upper template 1, an upper die pressing plate 4 for fixing the pins of the MOS tube and an upper die punching plate 3 for bending the pins of the MOS tube are arranged in parallel. The upper die pressing plate 4 is connected to the upper template 1 through a first elastic return device, and the upper die punching plate 3 is fixedly connected to the upper template 1;

[0031] The lower die assembly includes a lower template 2. On the lower die assembly, an accommodating groove 11 for accommodating the MOS tube is arranged. A limiting protrusion 5 is further arranged on the lower template 2 on one side of the accommodating groove 11. The limiting protrusion 5 is arranged opposite to the upper die pressing plate 4 on the upper template 1, and the limiting protrusion 5 is arranged in a dislocation manner with the upper die punching plate 3;

[0032] When the upper template 1 moves towards the lower template 2, the upper die punching plate 3 and the limiting protrusion 5 are squeezed in a dislocation manner to bend the pins of the MOS tube.

[0033] During use, place the MOS transistor to be processed in the accommodation groove 11, select the limiting protrusion 5 with the required size and shape, and move the upper template 1 towards the lower template 2, so that the upper die punching plate 3 and the limiting protrusion 5 are misaligned and extruded to bend the MOS transistor leads.

[0034] In one embodiment, the upper template 1 is connected to the lower template 2 through a second elastic reset device.

[0035] The second elastic reset device includes a plurality of second connecting guide posts 6 evenly distributed along the circumference of the lower template 2 on the surface of the lower template 2 facing the upper template 1. One end of the second connecting guide post 6 is fixedly connected to the lower template 2, and the other end of the second connecting guide post 6 passes through a corresponding through hole on the upper template 1 and is connected with a limit nut;

[0036] A limit ring platform is arranged on the second connecting guide post 6, and a second return spring 7 is sleeved on the second connecting guide post 6 between the limit ring platform and the upper template 1. One end of the second return spring 7 abuts against the limit ring platform, and the other end abuts against the upper template 1.

[0037] In one embodiment, the first elastic reset device includes a first connecting guide post. One end of the first connecting guide post is fixedly connected to the end surface of the upper die pressing plate 4 away from the working surface of the upper die pressing plate 4. The other end of the first connecting guide post passes through the upper template 1 and is connected with a nut. A first return spring 8 is sleeved on the first connecting guide post between the upper template 1 and the upper die pressing plate 4. One end of the first return spring 8 abuts against the upper die pressing plate 4, and the other end abuts against the upper template 1.

[0038] The upper die punching plate 3 is fixedly connected to the upper template 1 through a connecting bolt.

[0039] In one embodiment, an upper die handle 9 for connecting with the upper die core of the hydraulic press is also fixedly connected to the surface of the upper template 1 away from the lower template 2.

[0040] A clamping plate 10 for fixedly connecting with the workbench of the hydraulic press is also fixedly connected to the surface of the lower template 2 away from the upper template 1. The lower template 2 is fixedly connected through a plurality of support rods arranged between the clamping plate 10 and the lower template 2 bracket and evenly distributed along the circumference of the lower template 2.

[0041] A groove is arranged on the lower template 2, and a receiving plate is inlaid in the groove. The accommodation grooves 11 are all arranged on the receiving plate, and the limiting protrusions 5 are also inlaid on the lower template 2.

[0042] In one embodiment, both the upper die punching plate 3 and the upper die pressing plate 4 on the upper template 1 are annular, and the upper die punching plate 3 is located inside the upper die pressing plate 4;

[0043] The accommodating groove 11 and the limiting protrusion 5 on the lower template 2 are both annular, and the ring where the accommodating groove 11 is located is outside the ring where the limiting protrusion 5 is located.

[0044] The usage method and steps of the present utility model are as follows:

[0045] (1) Assembly of the MOS tube forming device

[0046] According to the size of the tube bending tooling, the clamping plate 10 of the present utility model is installed on the working table of the light manual press through screws, and the die handle is installed on the upper die core of the light manual press.

[0047] (2) Pressing mechanism

[0048] Place the MOS tube to be formed into the accommodating groove 11. Hold the operation handle of the hydraulic press by hand. During the process of pressing the handle downwards, the hydraulic press slider transmits the pressure to the die handle of the present utility model. When the handle continues to be pressed downwards, the upper template 1 moves towards the lower template 2. First, the second return spring 7 deforms until the upper die pressing plate 4 presses the pins of the MOS tube to ensure that the MOS tube body will not be damaged by force. Continue to press the handle forcefully. At this time, the first return spring 8 on the upper die pressing plate 4 begins to deform. Continue to press the handle until the operation handle reaches the closed position. At this time, the upper die punching plate 3 presses and forms the pins of the MOS tube.

[0049] (3) Usage steps

[0050] a. After the MOS tube forming device is assembled, empty-press the operation handle of the hydraulic press twice to ensure that the present utility model is flexible and unobstructed before use.

[0051] b. Place the MOS tube to be formed into the accommodating groove 11 from the side of the present utility model to avoid safety accidents. Multiple MOS tubes can be placed each time.

[0052] c. Hold the operation handle of the hydraulic press by hand and press it to the closed position, then release the handle and take out the formed MOS tube. Embodiment

[0053] Embodiment 1

[0054] For about 500 products of a certain product of our company, the time cycle of manual forming is difficult to meet the requirements, and the qualified rate of welding quality is relatively low. Through verification and production, the present utility model can quickly carry out the MOS tube forming work of the product. The production efficiency is increased from forming 1 in 12 minutes to forming 6 in 1 minute, and the one-time qualified rate of MOS tube forming is increased from 20% to 98%. At the same time, the welding quality of subsequent devices is ensured, and the effect is good.

[0055] Embodiment 2

[0056] The single output of a certain product of our company is about 300 units. It is difficult to meet the cycle requirements by using manual forming. By replacing the accommodating plate and the limiting protrusion 5 in this utility model to match the required shape and size, MOS tube forming is carried out, with a relatively high efficiency improvement, the cycle is shortened by 80%, and the first-pass qualification rate of MOS tube forming reaches 97.5%, with good results.

Claims

1. A MOS transistor forming tooling, comprising an upper die assembly and a lower die assembly which are correspondingly arranged, characterized in that, The upper die assembly includes an upper template. An upper die pressing plate for fixing the pins of the MOS transistor and an upper die punching plate for bending the pins of the MOS transistor are arranged in parallel on the upper template. The upper die pressing plate is connected to the upper template through a first elastic reset device, and the upper die punching plate is fixedly connected to the upper template; The lower die assembly includes a lower template. A receiving groove for receiving the MOS transistor is arranged on the lower die assembly. A limiting protrusion is further arranged on the lower template on one side of the receiving groove. The limiting protrusion is arranged opposite to the upper die pressing plate on the upper template, and the limiting protrusion is arranged offset from the upper die punching plate; When the upper template moves towards the lower template, the upper die punching plate and the limiting protrusion are squeezed and offset to bend the pins of the MOS transistor.

2. The MOS transistor forming tooling according to claim 1, characterized in that, The upper template is connected to the lower template through a second elastic reset device.

3. The MOS transistor forming tooling according to claim 2, wherein The second elastic reset device includes a plurality of second connecting guide posts evenly distributed along the circumference of the lower template on the side of the lower template facing the upper template. One end of the second connecting guide post is fixedly connected to the lower template, and the other end of the second connecting guide post passes through a corresponding through hole on the upper template and is connected with a limiting nut; A limiting ring platform is arranged on the second connecting guide post. A second reset spring is sleeved on the second connecting guide post between the limiting ring platform and the upper template. One end of the second reset spring abuts against the limiting ring platform, and the other end abuts against the upper template.

4. The MOS transistor forming tooling according to claim 1, characterized in that, The first elastic reset device includes a first connecting guide post. One end of the first connecting guide post is fixedly connected to the end face of the upper die pressing plate away from the working face of the upper die pressing plate. The other end of the first connecting guide post passes through the upper template and is connected with a nut. A first reset spring is sleeved on the first connecting guide post between the upper template and the upper die pressing plate. One end of the first reset spring abuts against the upper die pressing plate, and the other end abuts against the upper template.

5. The MOS transistor forming tooling according to claim 1, characterized in that, The upper die punching plate is fixedly connected to the upper template through a connecting bolt.

6. The MOS transistor forming tooling according to claim 1, wherein A upper die shank for connecting with the upper die core of the hydraulic press is further fixedly connected to the side of the upper template away from the lower template.

7. The MOS transistor forming tooling according to claim 1, characterized in that, A clamping plate for fixedly connecting with the workbench of the hydraulic press is further fixedly connected to the side of the lower template away from the upper template. The lower template is fixedly connected through a plurality of support rods arranged between the clamping plate and the lower template bracket and evenly distributed along the circumference of the lower template.

8. The MOS transistor forming tooling according to claim 1, wherein A groove is arranged on the lower template. A receiving plate is inlaid in the groove. The receiving grooves are all arranged on the receiving plate, and the limiting protrusions are also inlaid on the lower template.

9. The MOS transistor forming tooling according to claim 1, wherein The upper die punching plate and the upper die pressing plate on the upper template are both annular, and the upper die punching plate is located inside the upper die pressing plate; The receiving groove and the limiting protrusion on the lower template are both annular, and the ring where the receiving groove is located is outside the ring where the limiting protrusion is located.

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