Double-color mold structure based on injection molding ejection balance technology

Abstract

The utility model discloses a double-color mold structure based on an injection molding ejection balance technology, and relates to the technical field of double-color molds. The double-color mold structure based on the injection molding ejection balance technology comprises an injection molding base, a mold structure is arranged on the injection molding base, the mold structure comprises an ejection assembly and a glue inlet assembly, the ejection assembly comprises a conduction blocking plate, the conduction blocking plate is arranged in the middle of the glue inlet assembly, and an ejection opening is formed in the conduction blocking plate; a plurality of groups of ejection ports are arranged on the conduction barrier plate in an array manner, an ejection pad is arranged in each ejection port, the bottom part of each ejection pad is connected with a telescopic rod, and each telescopic rod is provided with a corresponding memory spring. According to the utility model, the automatic ejection of the injection-molded part in the mold cavity after injection molding is completed is realized through the ejection assembly, manual observation and monitoring are not needed, the adhesion of the injection-molded part and the ejection assembly caused by too long time is avoided, and the production efficiency of the mold is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of two-color molds, in particular to a two-color mold structure based on injection molding ejection balance technology. Background Technique

[0002] At present, people's requirements for the appearance of products are getting higher and higher. With the continuous development of molds, more and more products of different color types are being used by people. In the prior art, most two-color molds use a single gate for feeding. When the liquid glue enters the mold, the feeding is often unbalanced, resulting in the glue flowing to one side during injection molding, and the qualified rate of the products molded in the mold cavity is low.

[0003] For example, the two-color mold based on injection molding ejection balance technology disclosed in Chinese Patent Publication No. CN215550634U supports the device by installing support legs at the four corners of the bottom of the bottom mold and then fixedly installing a support bottom plate at the bottoms of the multiple support legs. By installing a hydraulic rod at the center of the top of the support bottom plate, then installing a top plate at the output end of the top of the hydraulic rod, and then installing multiple ejector rods on the top of the top plate, the multiple ejector rods extend to the inner bottom of the mold cavity through the opened ejection holes, so as to eject and demold the product after the product is manufactured.

[0004] However, before demolding, during the process of reducing the temperature to solidify the internal glue to achieve the injection molding purpose, since the mold cavity is not visible from the outside, the ejector rods need to be manually confirmed and observed before ejection, and then the hydraulic rod is started. This process is cumbersome and affects the injection molding efficiency. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a two-color mold structure based on injection molding ejection balance technology, which solves the problems raised in the above background technique.

[0006] To achieve the above object, the utility model is realized through the following technical solutions: A two-color mold structure based on injection molding ejection balance technology, including an injection molding base, a mold structure is arranged on the injection molding base, the mold structure includes an ejection assembly and a feeding assembly, the ejection assembly is installed in the feeding assembly, and the feeding assembly is installed on the injection molding base;

[0007] The ejection assembly includes a conduction barrier plate for blocking and transferring temperature, the conduction barrier plate is arranged in the middle of the feeding assembly, and a top outlet is arranged on the conduction barrier plate. There are several groups of top outlets and they are arranged in an array on the conduction barrier plate. A top pad is arranged in each top outlet, a telescopic rod is connected to the bottom of each top pad, and each telescopic rod is provided with a corresponding memory spring.

[0008] A further improvement to the technical solution of the present invention is that the conductive baffle is limitedly installed within the glue inlet assembly, the conductive baffle is movably connected to a corresponding ejection pad via an ejection outlet, the ejection pad is fixedly connected to the telescopic rod, and the memory spring is sleeved on the telescopic rod. Preferably, the memory spring is selected in this embodiment based on the first domestic and international implementation of a tooling-free batch heat treatment process for Nitinol elastic elements. The memory spring process is mature and fully adapted to the actual effects of this device. Therefore, the memory spring is selected as a nickel-titanium memory spring. The memory spring softens when heated, causing the telescopic rod to contract. When pre-cooled, the memory spring hardens and its elastic potential energy rebounds, causing the telescopic rod to extend.

[0009] A further improvement of the technical solution of the present utility model is that: the bottom of each telescopic rod is provided with the same support seat, the bottom of the support seat is provided with a support rod, the support rod is vertically fixedly installed on the bottom of the feed assembly, and the conductive baffle plate divides the feed assembly into a mold cavity above the conductive baffle plate and an ejection cavity below the conductive baffle plate.

[0010] A further improvement of the technical solution of the present invention is that: the same U-shaped tube is introduced into the mold cavity and the ejection cavity, and a temperature regulating tube is provided at the other end of the U-shaped tube. Preferably, in this embodiment, the U-shaped tube heats or cools the mold cavity and the ejection cavity at the same time, so that the ejection cavity and the mold cavity are heated at the same time before injection molding, and glue is continuously added to the mold cavity. At this time, the memory spring softens and gradually returns to the ejection outlet until the memory spring is in the ejection outlet. After completion, the glue feeding unit fuses the glue in the two molds. After the fusion is completed, the mold cavity is quickly cooled. At this time, the ejection cavity cools along with the mold cavity, and the memory spring hardens, eventually causing the telescopic rod to extend out of the ejection outlet, and its ejection pad ejects the injection molded part in the mold cavity, completing the demolding.

[0011] Therefore, the utility model realizes automatic ejection of the injection molded part in the mold cavity after the injection molding is completed through the ejection assembly, without the need for human observation and monitoring, thus avoiding the adhesion of the injection molded part and the ejection assembly caused by too long a time, and improving the production efficiency of the mold.

[0012] A further improvement to the technical solution of this utility model is that the glue feed assembly includes mold slots symmetrically distributed on the injection molding base, two mold slots are provided within the mold slots, and a mold seat with a conductive baffle is installed on one side of each balancing slot. Each mold seat is topped with a corresponding detachable top mold seat, and a glue partition is located between the two balancing slots. A hydraulic cylinder is installed on top of the glue partition for lifting. Accordingly, in this embodiment, the glue partition is a component that blocks the glue pouring between the two mold seats. After the glue in the mold seat is fully poured, the glue partition is withdrawn by the hydraulic cylinder. At this point, the glue in the two areas merges, ensuring a balanced glue feed process and thus ensuring the qualified rate of the molded products.

[0013] A further improvement of the technical solution of the present utility model lies in that each of the top die seats is installed on the injection molding base in a limited manner, and the two sets of die cavity seats are fixedly connected to the injection molding base. The balance partition groove is slidably connected to the glue liquid partition plate, and the glue liquid partition plate is fixedly connected to the telescopic end of the hydraulic cylinder.

[0014] Beneficial effects

[0015] The present utility model provides a two-color mold structure based on the ejection balance technology of injection molding. Compared with the prior art, it has the following beneficial effects:

[0016] 1. The two-color mold structure based on the ejection balance technology of injection molding realizes the automatic ejection of the injection molded parts in the die cavity after injection molding through the ejection assembly, without the need for manual observation and monitoring, avoiding the adhesion between the injection molded parts and the ejection assembly caused by too long time, and improving the production efficiency of the mold.

[0017] 2. The two-color mold structure based on the ejection balance technology of injection molding blocks the glue liquid poured between the two mold seats through the glue liquid partition plate in the glue feeding assembly. After the glue liquid in the mold seat is poured, the glue liquid partition plate is withdrawn by the lifting of the hydraulic cylinder, and the glue liquids in the two regions are fused together to ensure the balance of the glue feeding process, thereby ensuring the qualified rate of the mold products. Description of the drawings

[0018] Figure 1 It is a schematic structural diagram of the whole of the present utility model; 1]

[0019] Figure 2 It is a schematic diagram of the ejection assembly of the present utility model;

[0020] Figure 3 It is a schematic diagram of the glue feeding assembly of the present utility model;

[0021] Figure 4 It is a schematic structural diagram of the mold structure of the present utility model.

[0022] In the figure: 1. Injection molding base; 201. Conduction resistance partition plate; 202. Ejection port; 203. Ejection pad; 204. Telescopic rod; 205. Memory spring; 206. Support seat; 207. Support rod; 208. U-shaped tube; 209. Temperature adjustment tube; 301. Die cavity seat; 302. Balance partition groove; 303. Mold seat; 304. Top die seat; 305. Glue liquid partition plate; 306. Hydraulic cylinder. Specific implementation manners

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] The present utility model provides two technical solutions:

[0025] Figures 1-3 The first implementation manner is shown: a two-color mold structure based on injection molding ejection balance technology, including an injection base 1, a mold structure is provided on the injection base 1, the mold structure includes an ejection assembly and a gating assembly, the ejection assembly is installed in the gating assembly, and the gating assembly is installed on the injection base 1;

[0026] The ejection assembly includes a conduction barrier plate 201 for blocking and transferring temperature, the conduction barrier plate 201 is disposed in the middle of the gating assembly, and an ejection port 202 is provided on the conduction barrier plate 201. There are several groups of ejection ports 202 and they are arranged in an array on the conduction barrier plate 201. An ejection pad 203 is provided in each ejection port 202, and a telescopic rod 204 is connected to the bottom of each ejection pad 203, and a corresponding memory spring 205 is provided for each telescopic rod 204.

[0027] The conduction barrier plate 201 is limited and installed in the gating assembly. The conduction barrier plate 201 is movably connected to the corresponding ejection pad 203 through the ejection port 202, and the ejection pad 203 is fixedly connected to the telescopic rod 204, and the memory spring 205 is sleeved on the telescopic rod 204. Preferably, the selection of the memory spring 205 in this embodiment is based on the first realization of the nickel-titanium elastic element non-tool batch heat treatment process at home and abroad. The process of the memory spring 205 is mature and fully adapts to the actual effect of the device. Therefore, the memory spring 205 is selected as a nickel-titanium memory spring. The memory spring 205 becomes soft when heated, causing the telescopic rod 204 to contract, and when pre-cooled, the memory spring becomes hard and its elastic potential energy rebounds, causing the telescopic rod 204 to elongate.

[0028] The bottom of each telescopic rod 204 is provided with the same support seat 206, the bottom of the support seat 206 is provided with a support rod 207, the support rod 207 is vertically and fixedly installed at the bottom of the feeding assembly, and the conduction barrier plate 201 divides the feeding assembly into a mold cavity above the conduction barrier plate 201 and an ejection cavity below the conduction barrier plate 201.

[0029] Figures 2-4The second embodiment is shown. The main difference from the first embodiment is that the same U-shaped tube 208 is introduced into both the die cavity and the ejection cavity. The other end of the U-shaped tube 208 is provided with a temperature adjustment tube 209. Preferably, in this embodiment, the U-shaped tube 208 heats or cools the die cavity and the ejection cavity simultaneously. Therefore, the ejection cavity and the die cavity are heated simultaneously before injection molding. The glue liquid is continuously poured into the die cavity. At this time, the memory spring 205 becomes soft and gradually returns into the ejection port 202 until the memory spring 205 is within the ejection port 202. After that, the feeding unit fuses the glue liquid in the two die cavities. After the fusion is completed, the die cavity is quickly cooled. At this time, the ejection cavity follows the die cavity to cool, and the memory spring 205 becomes hard. Finally, the telescopic rod 204 extends out of the ejection port 202, and the ejection pad 203 ejects the injection molded part in the die cavity to complete the demolding.

[0030] Therefore, the utility model realizes the automatic ejection of the injection molded part in the die cavity after injection molding through the ejection assembly, without the need for manual observation and monitoring, avoiding the adhesion between the injection molded part and the ejection assembly caused by too long time, and improving the production efficiency of the mold.

[0031] The feeding assembly includes die seats 301 symmetrically distributed on the injection molding base 1. A balance partition groove 302 is arranged in each of the two die seats 301. A mold base 303 for installing the conduction partition plate 201 is arranged on one side of each balance partition groove 302. A corresponding separable top mold seat 304 is arranged on the top of each mold base 303. A glue liquid partition plate 305 is arranged between the two balance partition grooves 302. A hydraulic cylinder 306 for lifting is arranged on the top of the glue liquid partition plate 305. Correspondingly, in this embodiment, the glue liquid partition plate 305 is a component for blocking the glue liquid poured between the two mold bases 303. After the glue liquid in the mold base 303 is poured, the glue liquid partition plate 305 is pulled out by the lifting of the hydraulic cylinder 306. At this time, the glue liquid in the two regions is fused to ensure the balance of the feeding process, thereby ensuring the qualification rate of the mold products.

[0032] Each top mold seat 304 is limit installed on the injection molding base 1, and both groups of die seats 301 are fixedly connected to the injection molding base 1. The balance partition groove 302 is slidably connected to the glue liquid partition plate 305, and the glue liquid partition plate 305 is fixedly connected to the telescopic end of the hydraulic cylinder 306.

[0033] At the same time, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art, and the model parameters of each electrical appliance are not specifically limited, and conventional equipment can be used.

[0034] In use, the glue liquid is injected into the mold cavity in the mold base 303. After the injection is completed, the hydraulic cylinder 306 is started. During the process of the glue liquid partition 305 rising and falling, the glue liquid in the two regions is fused with each other. During the process of completely extracting the glue liquid partition 305, the U-shaped tube 208 is used to heat the mold cavity and the ejection cavity. At this time, the memory spring 205 becomes soft and gradually returns into the ejection port 202. After the glue liquid is fused, the U-shaped tube 208 is used to cool the mold cavity and the ejection cavity. At this time, as the ejection cavity cools, the memory spring 205 becomes hard, and finally the telescopic rod 204 extends out of the ejection port 202, and its ejection pad 203 ejects the injection molded part in the mold cavity to complete the demolding.

[0035] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Two-color mold structure based on ejection balance technology for injection molding, including an injection molding base (1), characterized in that: The injection molding base (1) is provided with a mold structure, which includes an ejection assembly and a glue injection assembly. The ejection assembly is installed inside the glue injection assembly, and the glue injection assembly is installed on the injection molding base (1). The ejection assembly includes a conduction and heat insulation plate (201) for blocking and transferring temperature. The conduction and heat insulation plate (201) is arranged in the middle of the glue injection assembly, and an ejection port (202) is arranged on the conduction and heat insulation plate (201). There are several groups of ejection ports (202) arranged in an array on the conduction and heat insulation plate (201). An ejection pad (203) is arranged in each ejection port (202), and a telescopic rod (204) is connected to the bottom of each ejection pad (203). A corresponding memory spring (205) is arranged on each telescopic rod (204).

2. The two-color mold structure based on the ejection balance technology of injection molding according to claim 1, characterized in that: The conduction and heat insulation plate (201) is installed in the glue injection assembly in a limited way. The conduction and heat insulation plate (201) is movably connected to the corresponding ejection pad (203) through the ejection port (202). The ejection pad (203) is fixedly connected to the telescopic rod (204), and the memory spring (205) is sleeved on the telescopic rod (204).

3. The two-color mold structure based on the ejection balance technology of injection molding according to claim 1, characterized in that: The bottom of each telescopic rod (204) is provided with the same support seat (206). A support rod (207) is arranged at the bottom of the support seat (206). The support rod (207) is vertically and fixedly installed at the bottom of the feeding assembly. The conduction and heat insulation plate (201) divides the feeding assembly into a mold cavity above the conduction and heat insulation plate (201) and an ejection cavity below the conduction and heat insulation plate (201).

4. The two-color mold structure based on the ejection balance technology of injection molding according to claim 3, wherein: The same U-shaped tube (208) is introduced into both the mold cavity and the ejection cavity. The other end of the U-shaped tube (208) is provided with a temperature regulating tube (209).

5. The two-color mold structure based on the ejection balance technology of injection molding according to claim 1, characterized in that: The glue injection assembly includes mold cavity seats (301) symmetrically distributed on the injection molding base (1). A balance partition groove (302) is arranged in each of the two mold cavity seats (301). A mold seat (303) for installing the conduction and heat insulation plate (201) is arranged on one side of each balance partition groove (302). A corresponding separable top mold seat (304) is arranged at the top of each mold seat (303). A glue liquid partition plate (305) is arranged in the middle of the two balance partition grooves (302). A hydraulic cylinder (306) for lifting is arranged at the top of the glue liquid partition plate (305).

6. The two-color mold structure based on the ejection balance technology of injection molding according to claim 5, characterized in that: Each top mold seat (304) is installed on the injection molding base (1) in a limited way. The two groups of mold cavity seats (301) are fixedly connected to the injection molding base (1). The balance partition groove (302) is slidably connected to the glue liquid partition plate (305). The glue liquid partition plate (305) is fixedly connected to the telescopic end of the hydraulic cylinder (306).

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