Leveling device and thin film deposition equipment applying same

Abstract

The utility model discloses a leveling device and thin film deposition equipment applying the same, the leveling device comprises a first adjusting block, a second adjusting block, a fixing assembly and an adjusting assembly, the fixing assembly passes through the first adjusting block and the second adjusting block to form a fixing point, and the adjusting assembly passes through the first adjusting block and the second adjusting block to form an adjusting point; the adjusting assembly can enable the first adjusting block to move up and down at the adjusting point so as to change the relative height between the adjusting point and the fixing point, and then the levelness of the heating disc located on the first adjusting block is adjusted. When the levelness of the disc is not good and the heating disc located above the adjusting point inclines downwards, the first adjusting block moves upwards at the adjusting point through the adjusting assembly so as to compensate for the downward inclination distance; on the contrary, the first adjusting block is made to move downwards at the adjusting point through the adjusting assembly so as to compensate the upward inclination distance. The leveling device provided by the utility model can be used for adjusting the inclined heating disc to ensure the flatness of the upper surface of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film deposition equipment, in particular to a leveling device and a thin film deposition equipment applying the same. Background Art

[0002] Thin film deposition is an important part in wafer processing and manufacturing. A thin film is formed on the wafer surface through a thin film deposition equipment. A chemical vapor thin film deposition equipment is one of them. The wafer is placed in a reaction chamber, reaction gases enter the reaction chamber through a gas distribution plate, and a radio frequency device is used to plasma the reaction gases. A heating plate in the reaction chamber provides the temperature required for the wafer reaction, so that a thin film is deposited on the wafer.

[0003] In the prior art, a shower plate is located above the wafer, and reaction gases are sprayed from top to bottom onto the wafer carried on the heating plate. If the parallelism between the heating plate and the shower plate and the parallelism of the heating plate to the ground cannot be guaranteed, it will affect the thermal field, flow field and radio frequency plasma field in the reaction chamber, and then cause the upper surface of the wafer to be uneven. After deposition, the thin film on its surface is uneven. Undoubtedly, such a wafer is a defective product. Therefore, it is crucial to ensure the horizontalness of the upper surface of the heating plate. Summary of the Utility Model

[0004] An embodiment of the utility model provides a leveling device and a thin film deposition equipment applying the same, which solve the technical problem that the thin film deposition on the wafer is uneven due to the wafer being placed on the surface of a heating plate with poor levelness.

[0005] To solve the above problems, according to one aspect of the present application, the utility model provides a leveling device. The leveling device includes a first adjustment block, a second adjustment block, a fixing component and an adjustment component. The first adjustment block and the second adjustment block are arranged opposite to each other up and down. The fixing component forms a fixing point after passing through the first adjustment block and the second adjustment block. The adjustment component forms an adjustment point after passing through the first adjustment block and the second adjustment block. The adjustment component can move the first adjustment block up and down at the adjustment point to change the relative height between the adjustment point and the fixing point, so as to adjust the levelness of the heating plate located on the first adjustment block.

[0006] In some embodiments, the fixing component includes a ball head bolt, a first locking unit and a second locking unit. The head of the ball head bolt is located inside the first adjustment block and is locked by the first locking unit. The tail of the ball head bolt extends out of the second adjustment block and is locked by the second locking unit.

[0007] In some embodiments, the first locking unit includes a first locking nut and a pressing bolt. The bottom of the pressing bolt cooperates with the head of the ball head bolt, and the first locking nut is sleeved on the end of the pressing bolt.

[0008] In some embodiments, the first locking unit further includes a steel sleeve. The steel sleeve is embedded in the first adjusting block, and after the pressing bolt passes through the steel sleeve, its bottom cooperates with the head of the ball head bolt.

[0009] In some embodiments, the first locking unit further includes a positioning pin. After the steel sleeve and the first adjusting block are in interference fit, they are fixed by the positioning pin.

[0010] In some embodiments, the second locking unit includes a second locking nut and a fixing nut. The fixing nut is sleeved on the tail of the ball head bolt and is locked by the second locking nut.

[0011] In some embodiments, the adjusting assembly includes an adjusting screw, a third locking unit, and a fourth locking unit. The adjusting screw passes through the first adjusting block and the second adjusting block, and its upper end extends out of the first adjusting block and is fixed by the third locking unit, and its lower end extends out of the second adjusting block and is fixed by the fourth locking unit;

[0012] and / or the third locking unit and / or the fourth locking unit is a nut.

[0013] In some embodiments, one set of the fixing assemblies is provided, and two sets of the adjusting assemblies are provided to form one fixing point and two adjusting points. One fixing point and two adjusting points can form a triangle.

[0014] According to another aspect of the present application, the present utility model provides a thin film deposition device, which includes a heating plate, a frame, and the above leveling device. The heating plate is connected to the first adjusting block, and the second adjusting block is connected to the side of the frame.

[0015] In some embodiments, the adjusting assembly is located on one side away from the frame.

[0016] Compared with the prior art, the leveling device of the present utility model has the following beneficial effects:

[0017] A leveling device provided by the present utility model, the leveling device includes a first adjustment block, a second adjustment block, a fixing component and an adjustment component. The first adjustment block and the second adjustment block are arranged opposite to each other up and down. The fixing component passes through the first adjustment block and the second adjustment block to form a fixing point, and the adjustment component passes through the first adjustment block and the second adjustment block to form an adjustment point. The adjustment component can move the first adjustment block up and down at the adjustment point to change the relative height between the adjustment point and the fixing point, thereby adjusting the levelness of the heating plate located on the first adjustment block.

[0018] For better description below, the disc is divided into a first part corresponding to the fixing point up and down and a second part corresponding to the adjustment point up and down. When the levelness of the disc is poor and the second part is tilted downward, the first adjustment block is moved upward at the adjustment point through the adjustment component to make up for the tilted distance downward, thereby making the disc level. When the levelness of the disc is poor and the second part is tilted upward, the first adjustment block is moved downward at the adjustment point through the adjustment component to make up for the tilted distance upward, thereby making the disc level. That is to say, the leveling device provided in this embodiment can adjust the heating plate with different tilting directions to ensure its levelness, so that it will not affect the thermal field, flow field and radio frequency plasma field in the reaction chamber, and further ensure that the upper surface of the wafer is flat. After deposition, the thin film on its surface is uniform, solving the technical problem of uneven wafer thin film deposition caused by placing the wafer on the surface of a heating plate with poor levelness.

[0019] The thin film deposition equipment provided by the present utility model is designed based on the above leveling device, and its beneficial effects refer to the beneficial effects of the above leveling device, which will not be elaborated here one by one.

[0020] The above description is only an overview of the technical solution of the present utility model. In order to be able to understand the technical means of the present utility model more clearly and implement it according to the content of the specification, the following takes the preferred embodiments of the present utility model and describes them in detail with reference to the accompanying drawings as follows. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings required for the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other accompanying drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a schematic structural diagram of a leveling device provided by an embodiment of the present utility model;

[0023] Figure 2This is a structural schematic diagram of a leveling device provided by an embodiment of the present utility model from another angle;

[0024] Figure 3 This is a bottom view of a leveling device provided by an embodiment of the present utility model;

[0025] Figure 4 It is a side view of a leveling device provided by an embodiment of the present utility model;

[0026] Figure 5 yes Figure 4 Cross-sectional view in the AA direction;

[0027] Figure 6 yes Figure 4 Cross-sectional view in the middle BB direction;

[0028] Figure 7 This is another side view of a leveling device provided by an embodiment of the present utility model;

[0029] Figure 8 yes Figure 7 Cross-sectional view in CC direction;

[0030] Figure 9 This is a leveling principle diagram of a leveling device provided in an embodiment of the utility model.

[0031] Reference numerals:

[0032] 1. First adjustment block; 2. Second adjustment block; 3. Fixing assembly; 31. Ball stud; 32. First locking unit; 33. Second locking unit; 321. First locking nut; 322. Pressure bolt; 323. Steel sleeve; 324. Locating pin; 331. Second locking nut; 332. Fixing nut; 333. Gasket; 4. Adjusting assembly; 41. Adjusting screw; 42. Third locking unit; 43. Fourth locking unit; 5. Fixing point; 6. Adjustment point; 7. Heating plate. DETAILED DESCRIPTION

[0033] To further illustrate the technical means and effects employed by the present invention to achieve its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention is provided in conjunction with the accompanying drawings and preferred embodiments. In the following description, different references to "one embodiment" or "embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics of one or more embodiments may be combined in any suitable manner.

[0034] In the description of the present invention, it should be made clear that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence; the terms "vertical", "transverse", "longitudinal", "front", "back", "left", "right", "up", "down", "horizontal", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, and do not mean that the devices or elements referred to must have a specific direction or position, and therefore cannot be understood as limitations on the present invention.

[0035] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; and direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0036] Chemical Vapor Deposition (CVD) and Plasma Enhanced Chemical Vapor Deposition (PECVD) equipment are key equipment for semiconductor chip production. The core issue of CVD and PECVD equipment is how to ensure the uniformity and repeatability of material growth. The heating plate is an important component of the equipment, and the temperature of the heating plate surface is adjusted by the built-in heating element.

[0037] Traditional heating plates generally consist of a circular plate and a hollow shaft at the bottom of the plate. A heating resistor is embedded inside the plate, and the resistor extends from the bottom end of the hollow shaft. Currently, a circular hole with a diameter much larger than the hollow shaft is provided at the center of the bottom of the reaction chamber. The bottom end of the hollow shaft extends into the circular hole, and a set of fixtures are used around the circular hole to fix the bottom of the hollow shaft, thereby securing the heating plate. However, the specifications of the heating plate are closely related to the specifications of the wafer. Different heating plates are required to heat different wafers, meaning that different heating plates have different shapes and sizes. Therefore, when a set of fixtures is used to fix and clamp the heating plate, on the one hand, after each fixture is assembled and installed, the horizontality of the upper surface of the heating plate is fixed, and if the upper surface of the heating plate is slightly tilted, the horizontality cannot be changed. On the other hand, it cannot adapt to heating plates of different specifications. In other words, there are currently difficulties in leveling the upper surface of the heating plate.

[0038] In view of the above problems, the utility model realizes the adjustment of the levelness of the surface of the heating plate through a leveling device. The heating plate is fixed on the leveling device, and the levelness of the heating plate is adjusted by changing the levelness of the leveling device.

[0039] In order to better understand the above technical solution, the following will combine the accompanying drawings of the specification and specific implementation manners to elaborate on the above technical solution in detail.

[0040] Embodiment 1

[0041] An embodiment of the utility model provides a leveling device, as Figures 1-9 shown. The leveling device includes a first adjustment block 1, a second adjustment block 2, a fixing component 3 and an adjustment component 4. The first adjustment block 1 and the second adjustment block 2 are arranged opposite to each other up and down. The fixing component 3 passes through the first adjustment block 1 and the second adjustment block 2 to form a fixing point 5. The adjustment component 4 passes through the first adjustment block 1 and the second adjustment block 2 to form an adjustment point 6. The adjustment component 4 can move the first adjustment block 1 up and down at the adjustment point 6 to change the relative height between the adjustment point 6 and the fixing point 5, thereby adjusting the levelness of the heating plate 7 located on the first adjustment block 1.

[0042] Specifically, the general outlines of the first adjustment block 1 and the second adjustment block 2 are triangular structures with a certain thickness. The fixing component 3 passes through the first adjustment block 1 and the second adjustment block 2 to form a fixing point 5. At the fixing point 5, the first adjustment block 1 and the second adjustment block 2 are connected. The adjustment component 4 passes through the first adjustment block 1 and the second adjustment block 2 to form an adjustment point 6. At the adjustment point 6, the first adjustment block 1 and the second adjustment block 2 are connected and the first adjustment block 1 can move up and down relative to the second adjustment block 2. During the movement, the first adjustment block 1 at the fixing point 5 rotates relative to the second adjustment block 2 to prevent the first adjustment block 1 and the second adjustment block 2 from separating.

[0043] During specific use, the heating plate 7 comprises a circular plate and a hollow shaft at its base. The hollow shaft is rigidly connected to a first adjustment block 1, and a second adjustment block 2 is connected to the frame of the PECVD apparatus, which is fixed to the ground. For better description, the circular plate is divided into a first portion corresponding to the upper and lower fixed points 5 and a second portion corresponding to the upper and lower adjustment points 6. When the circular plate is not level and the second portion tilts downward, the adjustment assembly 4 causes the first adjustment block 1 to move upward at the adjustment point 6 to compensate for the downward tilt, thereby leveling the circular plate. When the circular plate is not level and the second portion tilts upward, the adjustment assembly 4 causes the first adjustment block 1 to move downward at the adjustment point 6 to compensate for the upward tilt, thereby leveling the circular plate. In other words, the leveling device provided in this embodiment can adjust the heating plate 7 at different tilts to ensure its levelness without affecting the thermal field, flow field, and RF plasma field within the reaction chamber, thereby ensuring a flat top surface of the wafer and a uniform thin film after deposition.

[0044] In a specific embodiment, Figure 8 As shown, the fixing assembly 3 includes a ball stud 31, a first locking unit 32 and a second locking unit 33. The head of the ball stud 31 is located in the first adjustment block 1 and is locked by the first locking unit 32. The tail of the ball stud 31 extends out of the second adjustment block 2 and is locked by the second locking unit 33.

[0045] PECVD equipment and CVD equipment have very limited space. Semiconductor equipment is operated in clean rooms, and the unit area cost is relatively high. Therefore, the equipment must occupy as little space as possible, and therefore the equipment must be as compact as possible. The ball stud 31 includes a spherical structure at the head and a bolt structure at the tail. In this embodiment, the end of the bolt structure away from the spherical structure is inserted into the second adjustment block 2 and extends to the second adjustment block 2. After the end of the bolt structure close to the spherical structure is inserted into the first adjustment block 1, the spherical structure allows the head of the ball stud 31 to be stuck in the first adjustment block 1. In other words, the diameters of the mounting holes of the first adjustment block 1 are different, so the head of the ball stud 31 cannot be separated from the first adjustment block 1 through the smaller diameter mounting hole. This embodiment makes the entire leveling device compact through the integrated structure of the ball stud 31.

[0046] In addition, in this embodiment, the tail of the ball stud 31 extends out of the second adjustment block 2 and is locked by the second locking unit 33, and the head of the ball stud 31 is locked by the first locking unit 32. In this way, the instability of the heating plate 7 caused by the shaking of the leveling device during use is avoided.

[0047] In a specific embodiment, Figure 8As shown, the first locking unit 32 includes a first locking nut 321 and a pressing bolt 322. The bottom of the pressing bolt 322 is engaged with the head of the ball head bolt 31, and the first locking nut 321 is sleeved on the end of the pressing bolt 322. The first end of the pressing bolt 322 is inserted into the first adjustment block 1, and the second end of the pressing bolt 322 extends out of the second adjustment block 2. Moreover, the first end of the pressing bolt 322 has an arc-shaped groove that matches the head of the ball head bolt 31. During the installation process, after the pressing bolt 322 is engaged with the ball head bolt 31, with a certain installation torque, it is ensured that the pressing bolt 322 has a certain pre-tightening force, and then the pressing bolt 322 is locked by the first locking nut 321. The setting of the pre-tightening force can solve the clearance problem, ensure that there is no clearance in the ball head bolt 31, and further ensure the stability of the leveling device.

[0048] In a specific embodiment, as Figure 8 shown, the first locking unit 32 further includes a steel sleeve 323. The steel sleeve 323 is embedded in the first adjustment block 1, and after the pressing bolt 322 passes through the steel sleeve 323, its bottom is engaged with the head of the ball head bolt 31. The steel sleeve 323 and the ball head bolt 31 can be made of special wear-resistant alloys, thereby improving the service life. In addition, the first locking unit 32 further includes a positioning pin 324. After the steel sleeve 323 and the first adjustment block 1 are in interference fit, they are fixed by the positioning pin 324, and the positioning pin 324 passes through the steel sleeve 323.

[0049] As Figure 8 shown, the second locking unit 33 includes a second locking nut 331 and a fixing nut 332. The fixing nut 332 is sleeved on the tail of the ball head bolt 31 and is locked by the second locking nut 331. In addition, the second locking unit 33 further includes a gasket 333. The gasket 333, the fixing nut 332, and the second locking nut 331 are sequentially sleeved on the tail of the ball head bolt 31.

[0050] During the specific use and installation process, first install the ball head bolt 31, rotate the ball head bolt 31 to control the gap between the first adjustment block 1 and the second adjustment block 2. During this process, there is an inner hexagon on the tail of the ball head bolt 31, which is convenient for installation; install the fixing nut 332 with a certain torque to fix the head of the ball head bolt 31, and then install the second locking nut 331 to lock the fixing nut 332 to prevent it from loosening; then install the pressing bolt 322 with a certain torque. The pre-tightening force of the pressing bolt 322 makes the actual clearance of the ball hinge formed by the ball head bolt 31 negative, which can compensate for a certain amount of wear. Then, lock the pressing bolt 322 through the first locking nut 321 to prevent it from loosening.

[0051] In a specific embodiment, as Figure 5As shown, the adjustment assembly 4 includes an adjustment screw 41, a third locking unit 42, and a fourth locking unit 43. The adjustment screw 41 passes through the first adjustment block 1 and the second adjustment block 2, and its upper end extends out of the first adjustment block 1 and is fixed by the third locking unit 42, and its lower end extends out of the second adjustment block 2 and is fixed by the fourth locking unit 43. Additionally, the third locking unit 42 and / or the fourth locking unit 43 is a nut. When the level of the heating plate 7 needs to be adjusted, loosen the third locking unit 42 and the fourth locking unit 43, rotate the adjustment screw 41 to a suitable position, and then lock the third locking unit 42 and the fourth locking unit 43.

[0052] In a specific embodiment, one set of the fixing assemblies 3 is provided, and two sets of the adjustment assemblies 4 are provided, as Figure 3 and Figure 9 shown, to form one fixing point 5 and two adjustment points 6. One fixing point 5 and two adjustment points 6 can enclose a triangle. In this embodiment, as Figure 9 shown, one fixing point 5 and two adjustment points 6 are located at the three fixed points of the first adjustment block 1 and the second adjustment block 2 of the triangular structure; by adjusting the relative height between the two adjustment points 6, that is, the heights adjusted by the two adjustment points 6 are different, at this time, the level of the heating plate 7 in the X direction can be adjusted (when adjusting, it is equivalent to the heating plate 7 rotating around the Y axis), and by adjusting the relative height between the two adjustment points 6 and the fixing point 5, that is, adjusting the height of one of the adjustment points 6, or synchronously adjusting the heights of the two adjustment points 6, at this time, the level of the heating plate 7 in the Y direction can be adjusted (when adjusting, it is equivalent to the heating plate 7 rotating around the X axis).

[0053] The leveling device provided in this embodiment has a compact structure and small occupied space, and is suitable for semiconductor devices with a tight space at the lower part of the chamber, requiring a compact and easily adjustable leveling mechanism. Additionally, during the installation process, since the first locking unit is installed with a certain torque, it ensures that there is no play in the ball head bolt, thereby ensuring the stability of the leveling device. And the relative positions and quantities of the fixing point 5 and the adjustment points 6 enable the leveling device to be adjusted in two directions of the X axis and the Y axis, further ensuring the levelness.

[0054] Embodiment 2

[0055] This embodiment provides a thin film deposition device, which includes a heating disk 7, a frame, and the leveling device described in Example 1. The heating disk 7 is connected to the first adjustment block 1, and the second adjustment block 2 is connected to the side of the frame. The heating disk 7 includes a circular disk and a hollow shaft at the bottom of the disk. A resistance wire for heating is embedded in the inside of the disk, and the resistance wire is led out from the bottom end of the hollow shaft. The bottom of the hollow shaft is rigidly connected to the upper surface of the first adjustment block 1. The frame is located on one side of the heating disk 7 and is connected to the second adjustment block 2 through a connector.

[0056] In this specific embodiment, the adjustment assembly 4 is located away from the frame. That is, the fixing point 5 is located between the frame and the hollow shaft, at the rear, so it requires minimal manipulation. The adjustment point 6 is located at the front, making adjustment more convenient. Furthermore, the primary structure at fixing point 5 is a ball stud 31. The integrated ball hinge structure formed by ball stud 31 makes the entire structure more compact, allowing installation in confined spaces.

[0057] In summary, it is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous technical features can be freely combined and superimposed.

[0058] The above are merely preferred embodiments of the present invention and do not constitute any form of limitation to the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A leveling device, characterized in that, The leveling device includes a first adjustment block, a second adjustment block, a fixing component, and an adjustment component. The first adjustment block and the second adjustment block are arranged opposite to each other vertically. The fixing component passes through the first adjustment block and the second adjustment block to form a fixing point, and the adjustment component passes through the first adjustment block and the second adjustment block to form an adjustment point. The adjustment component can move the first adjustment block up and down at the adjustment point to change the relative height between the adjustment point and the fixing point, thereby adjusting the levelness of the heating plate located on the first adjustment block.

2. The leveling device according to claim 1, characterized in that, The fixing component includes a ball head bolt, a first locking unit, and a second locking unit. The head of the ball head bolt is located within the first adjustment block and is locked by the first locking unit, and the tail of the ball head bolt extends out of the second adjustment block and is locked by the second locking unit.

3. The leveling device according to claim 2, characterized in that, The first locking unit includes a first locking nut and a pressing bolt. The bottom of the pressing bolt cooperates with the head of the ball head bolt, and the first locking nut is sleeved on the end of the pressing bolt.

4. The leveling device according to claim 3, wherein The first locking unit further includes a steel sleeve. The steel sleeve is embedded in the first adjustment block, and after the pressing bolt passes through the steel sleeve, its bottom cooperates with the head of the ball head bolt.

5. The leveling device according to claim 4, characterized in that, The first locking unit further includes a positioning pin. After the steel sleeve and the first adjustment block are in interference fit, they are fixed by the positioning pin.

6. The leveling device according to claim 2, characterized in that The second locking unit includes a second locking nut and a fixing nut. The fixing nut is sleeved on the tail of the ball head bolt and is locked by the second locking nut.

7. The leveling device according to claim 1, characterized in that The adjustment component includes an adjustment screw, a third locking unit, and a fourth locking unit. The adjustment screw passes through the first adjustment block and the second adjustment block, and its upper end extends out of the first adjustment block and is fixed by the third locking unit, and its lower end extends out of the second adjustment block and is fixed by the fourth locking unit. And / or the third locking unit and / or the fourth locking unit is / are nuts.

8. The leveling device according to claim 1, characterized in that, One set of the fixing components is provided, and two sets of the adjustment components are provided to form one fixing point and two adjustment points. One fixing point and two adjustment points can form a triangle.

9. A thin film deposition device, characterized in that, The thin film deposition device includes a heating plate, a frame, and the leveling device according to any one of claims 1-8. The heating plate is connected to the first adjustment block, and the second adjustment block is connected to the side of the frame.

10. The thin film deposition apparatus according to claim 9, wherein The adjustment component is located on the side away from the frame.

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