Integrated cold and hot plate equipment for semiconductor and three-dimensional gluing and developing system

Abstract

The utility model belongs to the technical field of semiconductors, and particularly relates to integrated cold and hot plate equipment for semiconductors and a three-dimensional gluing and developing system, the integrated cold and hot plate equipment for semiconductors comprises a rack, the rack is provided with a first station and at least one second station, a sample holding transportation heat preservation cover is movably arranged above the second station, clamps the wafer and conveys the wafer between the first station and the second station, and the sample holding transportation heat preservation cover plays a heat preservation role when the hot disc of the second station works. According to the utility model, the working point positions of the wafer transfer robot are reduced, and the overall working efficiency of equipment is improved; through the compact design, the three-dimensional space of equipment can be reasonably utilized, the structure is compact, the occupied area is reduced, and a thought is provided for a three-dimensional machine table.

Description

Technical Field

[0001] The utility model relates to an integrated hot and cold plate device for semiconductors and a stereoscopic coating and developing system, belonging to the technical field of semiconductors. Background Technique

[0002] Coating and developing processing is an important process in semiconductor material processing, which mainly includes the following steps: Substrate treatment: A clean substrate (i.e., a wafer) needs to be heated on a hot plate at 150 - 200 °C for 2 - 3 minutes to remove the water vapor on the substrate surface. For contaminated or used wafers, they need to be thoroughly cleaned and then dried. Applying a bottom anti-reflective coating (HMDS, hexamethyldisilazane): HMDS changes the surface of the wafer from hydrophilic to hydrophobic through a chemical reaction, thereby ensuring good adhesion between the wafer and the photoresist. HMDS has two coating methods: spin coating and vapor coating. Spin coating the photoresist (Spin COT): Spin coating the photoresist on the wafer after applying the bottom anti-reflective coating. Soft baking (Soft Bake or PAB): Soft baking the wafer coated with the photoresist to remove the solvent in the photoresist and improve the adhesion between the photoresist and the substrate. Cooling plate (Cooling Plate): After baking and before exposure, using a cooling plate to cool the wafer to stabilize the wafer temperature and ensure the exposure accuracy. Exposure: Using a lithography machine to transfer the designed pattern onto the wafer coated with the photoresist. Post-exposure bake (Post Exposure Bake): After exposure, baking the wafer to enhance the adhesion between the photoresist and the pattern. Development (Developer): Using a developer to remove the unexposed photoresist to form the required pattern. Hard baking (Hard Bake): Hard baking the developed wafer to further stabilize the photoresist pattern. According to specific process requirements, other steps such as etching, cleaning, and detection may also be included.

[0003] Every step in the entire process of coating and developing processing is crucial and has an important impact on the final product quality and performance. Among them, the adhesion between the substrate and the photoresist is particularly critical. However, the adhesion between the substrate and the photoresist is very sensitive to changes, and very small details in the cleaning process will affect the adhesion between the substrate and the photoresist, thereby affecting the final product. For some special substrates, such as sapphire and III-V group substrates, their adhesion performance with the photoresist is relatively poor, and an adhesion promoter may be needed to improve the adhesion.

[0004] However, the existing equipment for substrate processing generally has a separate hot plate and cold plate. The transfer of the substrate between the hot plate and the cold plate is achieved by a manipulator. The heating time of the hot plate is relatively long. When the hot plate is heating, the manipulator and the cold plate can only wait idle, resulting in low production efficiency. Moreover, for substrates that require an adhesion promoter to improve adhesion, the existing equipment cannot meet this processing requirement. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present utility model provides an integrated hot and cold plate device for semiconductors and a three-dimensional coating and developing system.

[0006] The technical solution of the present utility model for solving the above technical problems is as follows:

[0007] An integrated hot and cold plate device for semiconductors includes a frame. A first station and at least one second station are provided on the frame. A cold plate is provided at the first station, and a hot plate is provided at the second station. A sample-holding transport insulation cover is movably provided above the second station. The sample-holding transport insulation cover clamps a wafer and transports it between the first station and the second station, and provides an insulation function when the hot plate at the second station is working.

[0008] The beneficial effects of the integrated hot and cold plate device for semiconductors of the present utility model are as follows: The present utility model realizes the transfer of the wafer between the cold plate at the first station and the hot plate at the second station through the sample-holding transport insulation cover. The wafer handling robot only needs to pick up and place the wafer at the first station, without having to undertake the wafer handling work between the first station and the second station, reducing the working points of the wafer handling robot and improving the overall working efficiency of the equipment. Through a compact design, the present utility model can reasonably utilize the three-dimensional space of the equipment, with a compact structure and reduced floor area, providing an idea for a three-dimensional machine platform.

[0009] On the basis of the above technical solution, the present utility model can also be improved as follows:

[0010] Further, the sample-holding transport insulation cover is movably installed on the frame through a sliding carriage. The sample-holding transport insulation cover includes a cover body, and a sample-holding component is provided inside the cover body.

[0011] The beneficial effect of adopting the above further technical solution is that the wafer is clamped by the sample-holding component, and the sample-holding transport insulation cover is movably installed on the frame through the sliding carriage, so that the wafer can be clamped and transported between the first station and the second station.

[0012] Furthermore, the sample holding assembly includes an arc-shaped sample holding arm, which is movably installed in the cover body through a sample holding driving mechanism. The two ends of the sample holding arm are hinged with sample holding pieces, and long holes are provided on the sample holding pieces. A limiting pin is provided in the cover body corresponding to the long holes, and the limiting pin is inserted into the long holes.

[0013] The beneficial effects of adopting the above further technical solution are as follows: The sample holding arm is driven to move by the sample holding driving mechanism, thereby driving the sample holding pieces to move. Since the long holes of the sample holding pieces are limited by the limiting pins, the sample holding pieces will not move as a whole along with the movement of the sample holding arm. Instead, under the limitation of the limiting pins, they rotate around the hinge points with the sample holding arm, so that the ends of the two sample holding pieces at both ends of the sample holding arm rotate to the bottom of the wafer, and the wafer is clamped on the sample holding pieces, which is convenient for clamping and transporting the wafer.

[0014] Furthermore, an arc-shaped sample holding groove is provided below the middle of the sample holding arm.

[0015] The beneficial effects of adopting the above further technical solution are as follows: The sample holding groove cooperates with the two sample holding pieces to clamp the wafer together, so that the clamping of the wafer is more stable and not easy to shake and fall.

[0016] Furthermore, the sample holding driving mechanism is a sample holding driving cylinder. The cylinder body of the sample holding driving cylinder is installed on the cover body, and the end of the piston rod of the sample holding driving cylinder is connected to the sample holding arm.

[0017] The beneficial effects of adopting the above further technical solution are as follows: The piston rod of the sample holding driving cylinder extends to drive the sample holding arm to move, thereby driving the sample holding pieces at both ends to rotate and clamp the wafer.

[0018] Furthermore, a slide rail is provided on the frame, the carriage is installed on the slide rail, and the sample holding and transporting heat insulation cover is installed on the carriage.

[0019] Furthermore, a cover body lifting mechanism is provided on the cross beam, and the cover body lifting mechanism drives the cover body to lift.

[0020] Furthermore, there are three second workstations. Among them, hot plates are provided on all three second workstations, or hot plates are provided on two of the second workstations, and an adhesion increasing plate is provided on one of the second workstations.

[0021] The beneficial effects of adopting the above further technical solutions are as follows: integrating three hot plates and one cold plate increases the utilization rate of unit space and improves production efficiency; only one manipulator can complete the handling of wafers at three stations, reducing the number of robots and the number of robot teaching points, saving teaching points for the later robot debugging of the equipment, reducing the equipment debugging time, and indirectly improving the equipment production speed; one of the hot plates is replaced with an adhesion-increasing plate, and the adhesion-increasing process can be applied, so that the entire process is realized on one structure.

[0022] Further, wafer lifting mechanisms are provided on the cold plate, the hot plates, and the adhesion-increasing plate, and the wafer lifting mechanisms drive the wafers on the cold plate, the hot plates, or the adhesion-increasing plate to lift and lower.

[0023] Further, the wafer lifting mechanism is a PIN needle.

[0024] The beneficial effects of adopting the above further technical solutions are that the wafers are lifted and lowered through the wafer lifting mechanism. The wafers are lifted to facilitate the holding component to hold the wafers, and the wafers are lowered to facilitate the cooling and heating of the cold plate and the hot plates. A three-dimensional spin coating and developing system includes the integrated hot and cold plate equipment for semiconductors as described above.

[0025] Further, it specifically includes a cassette storage unit, a predetermination unit, a spin coating and developing unit, a manipulator, and an OVEN unit;

[0026] The cassette storage unit is used for storing multiple cassettes and for simultaneous production;

[0027] The predetermination unit is used for correcting the center position of the wafer and identifying the wafer notch. The predetermination unit includes a vacuum turntable, an optical sensor, and a CCD camera (i.e., a charge-coupled device camera);

[0028] The spin coating and developing unit includes a spin coating process unit and a developing process unit, and the spin coating process unit and the developing process unit respectively include multiple layers of independently arranged working spaces;

[0029] The OVEN unit includes a frame body. The frame body has multiple layers. On each layer of the frame body, there is the integrated hot and cold plate equipment for semiconductors as described above. On the second station of at least one layer of the integrated hot and cold plate equipment for semiconductors, there is an attachment plate;

[0030] The manipulator is arranged between the cassette storage unit, the predetermination unit, the spin coating and developing unit, and the OVEN unit, and a vacuum adsorption mechanism is arranged on the manipulator.

[0031] The beneficial effects of the three-dimensional glue coating and developing system of the present utility model are as follows: By adding a pre-positioning unit, the transfer unit is reduced, thereby lowering the cost of the equipment. Only one handling robot is needed for the handling and transfer of wafers, reducing the number of robots and repeated positioning, improving production efficiency, and reducing the self-weight and floor area of the equipment. The manipulator uses vacuum adsorption clamping, which is not easy to damage the wafers. The glue coating and developing units are vertically distributed, reducing the floor area and improving space utilization. In short, by adopting the structure of the present utility model, the space utilization rate can be improved, the process units can be integrated, the points for the robot to transfer wafers can be reduced, and through three-dimensional stacking, multiple units can simultaneously carry out the process flow, improving the production efficiency of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a three-dimensional structural schematic diagram of the integrated hot and cold plate equipment for semiconductors of the present utility model;

[0033] Figure 2 is a top view of the integrated hot and cold plate equipment for semiconductors of the present utility model;

[0034] Figure 3 is a three-dimensional structural schematic diagram of the sample holding and transporting heat preservation cover;

[0035] Figure 4 is a three-dimensional structural schematic diagram of the sample holding arm;

[0036] Figure 5 is a structural schematic diagram of the three-dimensional glue coating and developing system of the present utility model.

[0037] The reference numerals are recorded as follows: 100, cassette storage unit; 200, pre-determination unit; 300, glue coating and developing unit; 400, manipulator; 500, OVEN unit; 501, frame; 502, first working station; 503, second working station; 504, sample holding and transporting heat preservation cover; 505, cover body; 506, sample holding arm; 507, sample holding groove; 508, sample holding piece; 509, long hole; 510, limit pin; 511, sample holding driving cylinder; 512, carriage; 513, cross beam; 514, cover body lifting mechanism. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] The principles and features of the present utility model will be described below with reference to the accompanying drawings. The examples given are only for explaining the present utility model and are not intended to limit the scope of the present utility model.

[0039] Embodiment 1

[0040] Refer to Figures 1-4, A semiconductor integrated hot and cold plate device, including a frame 501, on which a first station 502 and at least one second station 503 are provided. A cold plate is provided on the first station 502, and a hot plate is provided on the second station 503. In this embodiment, there are three second stations 503, and hot plates are provided on all three second stations 503. Above the second station 503, a sample-holding transport heat-insulating cover 504 is movably provided. The sample-holding transport heat-insulating cover 504 clamps the wafer and transports it between the first station 502 and the second station 503, and the sample-holding transport heat-insulating cover 504 provides a heat-insulating function when the hot plate at the second station 503 is working.

[0041] The sample-holding transport heat-insulating cover 504 is movably installed on the frame 501 through a carriage 512. The sample-holding transport heat-insulating cover 504 includes a cover body 505, and a sample-holding assembly is provided inside the cover body 505. The sample-holding assembly includes an arc-shaped sample-holding arm 506, and the sample-holding arm 506 is movably installed inside the cover body 505 through a sample-holding driving mechanism. At both ends of the sample-holding arm 506, sample-holding pieces 508 are hinged. Below the middle of the sample-holding arm 506, an arc-shaped sample-holding groove 507 is provided. Long holes 509 are provided on the sample-holding pieces 508, and limit pins 510 corresponding to the long holes 509 are provided inside the cover body 505. The limit pins 510 are inserted into the long holes 509. The sample-holding driving mechanism is a sample-holding driving cylinder 511. The cylinder body of the sample-holding driving cylinder 511 is installed on the cover body 505, and the end of the piston rod of the sample-holding driving cylinder 511 is connected to the sample-holding arm 506.

[0042] Two slide rails are provided on the frame 501. The two slide rails are symmetrically arranged corresponding to the second station 503, and the two slide rails are arranged towards the first station 502. The carriage 512 is installed on the slide rails, and the sample-holding transport heat-insulating cover 504 is installed on the carriage 512. The carriage 512 includes two sliding beams, and a cross beam 513 is provided between the two sliding beams. The two sliding beams are respectively slidably installed on the two slide rails, and the cover body 505 is installed below the cross beam 513.

[0043] The carriage 512 is driven by a conveying power structure. The conveying power mechanism includes a driving motor and a belt (not shown in the figure). The driving motor drives the belt to drive. A limit sensor is also provided on the frame 501 to confirm whether the wafer reaches the target position through the limit sensor.

[0044] A cover lifting mechanism 514 is provided on the cross beam 513. The cover lifting mechanism 514 drives the cover 505 to lift and lower. In this embodiment, the cover lifting mechanism 514 is a cover lifting cylinder for the cover 505. The cylinder block of the cover lifting cylinder for the cover 505 is installed on the cross beam 513 of the carriage 512, and the end of the piston rod of the cover lifting cylinder for the cover 505 is connected to the cover 505.

[0045] Wafer lifting mechanisms are provided on both the cold plate and the hot plate. The wafer lifting mechanisms drive the wafers on the cold plate, the hot plate or the adhesion increasing plate to lift and lower. As a preference of the present utility model, the wafer lifting mechanisms in this embodiment are PIN needles.

[0046] The working principle of the integrated cold and hot plate equipment for semiconductors in this embodiment:

[0047] The manipulator 400 clamps the wafer to the cold plate PIN needles at the first station 502. The PIN needles remain in the raised state. The sample holding and transporting heat preservation cover 504 moves from the hot plate at the second station 503 to above the cold plate at the first station 502. The cover lifting mechanism 514 drives the cover 505 to descend to a specific height and clamps the wafer through the internal sample holding components. Specifically, the piston rod of the sample holding driving cylinder 511 extends, driving the sample holding arm 506 to move forward, thereby driving the ends of the sample holding pieces 508 at both ends to rotate inward to the lower part of the wafer, and the sample holding grooves 507 on the clamping arms support the edge of the wafer.

[0048] The cover lifting mechanism 514 drives the cover 505 to rise and reset, and clamps the wafer through the clamping pieces and the sample holding grooves 507. Driven by the conveying power structure, the sample holding and transporting heat preservation cover 504 returns to the hot plate at the second station 503. The PIN needles of the hot plate rise to carry the wafer. The piston rod of the sample holding driving cylinder 511 contracts, driving the sample holding arm 506 to move backward, thereby driving the ends of the sample holding pieces 508 at both ends to rotate outward to release the clamping of the wafer. Subsequently, the PIN needles of the hot plate fall, and the hot plate performs the heating process. At this time, the sample holding and transporting heat preservation cover 504 covers above the hot plate, which can provide a heat preservation effect and improve the heating effect of the wafer.

[0049] Another hot plate at the second station 503 and the sample holding and transporting heat preservation cover 504 repeat the above process, and at most three wafers can be accommodated to perform the hot plate heating process simultaneously.

[0050] After the heating is completed, the PIN needles of the hot plate rise, and the wafer is clamped by the sample holding and transporting heat preservation cover 504 to the cold plate for cooling. Subsequently, the manipulator 400 takes out the processed wafer, and the process ends.

[0051] Embodiment 2

[0052] An integrated hot and cold plate device for semiconductors. Different from Embodiment 1, hot plates are provided on two of the second stations 503, and a tackifying plate is provided on one of the second stations 503. A wafer lifting mechanism is provided on the tackifying plate, and the wafer lifting mechanism drives the wafer on the tackifying plate to lift and lower. The wafer lifting mechanism is a PIN needle.

[0053] Others are the same as those in Embodiment 1 and will not be elaborated here.

[0054] Embodiment 3

[0055] See Figure 5 , a three-dimensional spin coating and developing system, including a cassette storage unit 100, a predetermination unit 200, a spin coating and developing unit 300, a manipulator 400, and an OVEN unit 500;

[0056] The cassette storage unit 100 is used for storing multiple cassettes and simultaneously carrying out production;

[0057] The predetermination unit 200 is used for correcting the center position of the wafer and identifying the wafer notch. The predetermination unit 200 includes a vacuum turntable, an optical sensor, and a CCD camera. The wafer is adsorbed by the vacuum turntable, translated and rotated to adjust the wafer notch, and the optical sensor cooperates with the CCD camera for alignment;

[0058] The spin coating and developing unit 300 includes a spin coating process unit and a developing process unit, and the spin coating process unit and the developing process unit respectively include multiple layers of independently arranged working spaces;

[0059] The OVEN unit 500 includes a frame body. The frame body has multiple layers, and on each layer of the frame body, there is an integrated hot and cold plate device for semiconductors as described in Embodiment 1 or 2. Among them, at least one layer is provided with an integrated hot and cold plate device for semiconductors as described in Embodiment 2, that is, an additional plate is provided on the second station 503;

[0060] The manipulator 400 is arranged between the cassette storage unit 100, the predetermination unit 200, the spin coating and developing unit 300, and the OVEN unit 500, and a vacuum adsorption mechanism is provided on the manipulator 400.

[0061] The process flow of the three-dimensional spin coating and developing system in this embodiment:

[0062] The wafers are pre-loaded in cassettes and placed in the cassette storage unit 100. Multiple cassettes can be placed simultaneously to enable a large number of wafers to carry out the process flow simultaneously;

[0063] The manipulator 400 picks up a wafer and places it in the pre-positioning unit, and the pre-positioning unit completes the positioning of the wafer; the manipulator 400 places the positioned wafer on a cold plate of one layer of the OVEN unit 500, and then the internal mechanism of the OVEN unit 500 places the wafer on a hot plate for drying and preheating;

[0064] During the preheating of the wafer, the manipulator 400 performs the suction and positioning work of the next wafer;

[0065] When the wafer preheating is completed, the manipulator 400 places the wafer into the coating unit of the coating and developing unit 300 for the coating process;

[0066] During the coating process, the manipulator 400 continues to perform the suction and positioning work of the next wafer;

[0067] After the coating process is completed, the wafer is placed by the manipulator 400 on a layer with a tackifying plate of the OVEN unit 500, and the internal mechanism of the OVEN unit 500 places the wafer on the tackifying plate for heating and tackifying processes, and this process flow is carried out inside the OVEN unit 500;

[0068] During the preheating and tackifying process, the manipulator 400 continues to perform the suction, positioning, preheating and coating process flows of other wafers;

[0069] After the process of the OVEN unit 500 is completed, the manipulator 400 sends the wafer to the developing unit of the coating and developing unit 300 for the developing process, and after completion, sends the wafer to the OVEN unit 500, and the internal mechanism of the OVEN unit 500 places the wafer on a hot plate for drying;

[0070] The process flow of a single wafer is completed, and it can be transferred by the manipulator 400 to the next process or returned to the cassette storage unit 100.

[0071] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An integrated hot and cold plate device for semiconductors, comprising a frame (501), characterized in that, The frame (501) is provided with a first station (502) and at least one second station (503). A cold plate is provided at the first station (502), and a hot plate is provided at the second station (503). Above the second station (503), a sample-holding transport heat-insulating cover (504) is movably provided. The sample-holding transport heat-insulating cover (504) clamps a wafer and transports it between the first station (502) and the second station (503), and the sample-holding transport heat-insulating cover (504) provides a heat-insulating function when the hot plate at the second station (503) is working.

2. The integrated hot and cold plate device for semiconductor according to claim 1, characterized in that, The sample-holding transport heat-insulating cover (504) is movably installed on the frame (501) through a carriage (512). The sample-holding transport heat-insulating cover (504) includes a cover body (505), and a sample-holding assembly is provided inside the cover body (505).

3. The integrated hot and cold plate device for semiconductor according to claim 2, wherein The sample-holding assembly includes an arc-shaped sample-holding arm (506). The sample-holding arm (506) is movably installed inside the cover body (505) through a sample-holding driving mechanism. Sample-holding pieces (508) are hingedly installed at both ends of the sample-holding arm (506). Long holes (509) are provided on the sample-holding pieces (508), and limit pins (510) corresponding to the long holes (509) are provided inside the cover body (505). The limit pins (510) are inserted into the long holes (509).

4. The integrated hot and cold plate device for semiconductor according to claim 3, characterized in that, The sample-holding driving mechanism is a sample-holding driving cylinder (511). The cylinder body of the sample-holding driving cylinder (511) is installed on the cover body (505), and the end of the piston rod of the sample-holding driving cylinder (511) is connected to the sample-holding arm (506).

5. The integrated hot and cold plate device for semiconductor according to claim 4, characterized in that, Sliding rails are provided on the frame (501). The carriage (512) is installed on the sliding rails, and the sample-holding transport heat-insulating cover (504) is installed on the carriage (512).

6. The integrated hot and cold plate device for semiconductor according to claim 5, characterized in that The carriage (512) includes two sliding beams. The two sliding beams are respectively slidably installed on the two sliding rails. A cross beam (513) is provided between the two sliding beams, and a cover body lifting mechanism (514) is provided on the cross beam (513). The cover body lifting mechanism (514) drives the cover body (505) to lift.

7. The integrated hot and cold plate device for semiconductor according to claim 6, characterized in that, There are three second stations (503). Among them, hot plates are provided on all three second stations (503), or hot plates are provided on two of the second stations (503), and an adhesion-increasing plate is provided on one of the second stations (503).

8. The integrated hot and cold plate device for semiconductor according to claim 7, characterized in that, Wafer lifting mechanisms are provided on the cold plate, the hot plate, and the adhesion-increasing plate. The wafer lifting mechanisms drive the wafers on the cold plate, the hot plate, or the adhesion-increasing plate to lift.

9. A three-dimensional glue-coating and developing system, characterized in that, It includes the integrated cold and hot plate equipment for semiconductors as described in any one of claims 1-8.

10. The three-dimensional glue coating and developing system according to claim 9, wherein Specifically, it includes a cassette storage unit (100), a pre-setting unit (200), a coating and developing unit (300), a manipulator (400), and an OVEN unit (500); The cassette storage unit (100) is used for storing multiple cassettes and conducting production simultaneously; The predetermined unit (200) is used to correct the center position of the wafer and identify the notch of the wafer. The predetermined unit (200) includes a vacuum turntable, an optical sensor and a CCD camera; The coating and developing unit (300) includes a coating process unit and a developing process unit. The coating process unit and the developing process unit respectively include multiple layers of independently arranged working spaces; The OVEN unit (500) includes a frame body. The frame body is provided with multiple layers. On each layer of the frame body, there is a semiconductor integrated hot and cold plate device as described in any one of claims 1-8. An additional plate is provided at the second station (503) of at least one layer of the semiconductor integrated hot and cold plate device; The manipulator (400) is arranged between the cassette storage unit (100), the predetermined unit (200), the coating and developing unit (300) and the OVEN unit (500). A vacuum adsorption mechanism is provided on the manipulator (400).

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