Wafer scrubbing equipment

Abstract

The utility model discloses wafer scrubbing equipment which comprises a supporting disc which is rotatably connected in a liquid collecting disc. The cantilever is arranged at the upper end of the liquid collecting tray; the lifting air cylinder is longitudinally arranged on the cantilever; the scrubbing disc is rotationally connected to the upper portion of the supporting disc; a lower bearing seat is arranged at the inner bottom end of the liquid collecting disc; the supporting disc is rotationally connected to the upper portion of the lower bearing seat. A first water retaining ring is arranged at the lower end of the supporting disc; the first water retaining ring is arranged on the periphery of the lower bearing seat. The supporting disc and the scrubbing disc rotate to wipe the surface of the wafer, the cleaning efficiency is high, and no dead angle exists; the sand liquid cleaned from the wafer does not enter the movement gap and does not abrade the movement gap, so that the service life of the movement structure is prolonged; the upper end of the supporting disc can be compatible with wafers of different models by replacing positioning rings of different models.

Description

Technical Field

[0001] The utility model belongs to the technical field of cleaning equipment, and particularly relates to a wafer scrubbing device. Background Art

[0002] In the field of wafer glass product processing and manufacturing, after grinding and polishing, there are often a large amount of polishing sand residues on the surface of the wafer glass. Due to the very fine particle size of these polishing sands, they are very easy to agglomerate on the surface, forming dirt that is very difficult to clean. It is necessary to scrub off the sand liquid on the surface in time. Since it is a nano-level sand liquid, it is not easy to clean it thoroughly only by the process of water flushing. Therefore, a new simple scrubbing device is needed.

[0003] The Chinese patent document with the publication number CN116825614A discloses a wafer cleaning method, device and wafer processing equipment. Among them, the wafer cleaning method fixes the wafer on a vacuum adsorption table. During cleaning, through the rotation of the wafer and the cooperation of the cleaning mechanism, it fully ensures the full coverage cleaning of the top surface of the wafer. At the same time, the first cleaning mechanism uses two-fluid water for cleaning, which has a better cleaning effect compared to cleaning with only water or cleaning liquid. And after the two-fluid water cleaning, the wafer is further scrubbed by combining the scrubbing part with the cleaning liquid, effectively avoiding the risk of wafer scratching. At the same time, compared with flushing, the scrubbing cleaning quality is better, and making the length of the scrubbing part cover the wafer material body of the wafer can effectively improve the scrubbing efficiency and ensure full coverage of the top surface of the wafer material body during scrubbing. After scrubbing, it is rinsed again with two-fluid water and dried, effectively ensuring that the cleaning quality meets the requirements.

[0004] During the rotation of the wafer, the sand liquid attached to the surface of the wafer will inevitably fly outwards under the centrifugal force. In the above patent solution, many moving mechanisms such as the scrubbing assembly arranged above the wafer and the servo module arranged on both sides of the wafer for driving the scrubbing assembly to move horizontally and the tracks are arranged on the outer periphery of the wafer. The sand liquid flying outwards will also invade the moving gaps. The polishing sand mixed with the sand liquid originally used for polishing and grinding will cause great wear to the moving components due to the irregular and uneven movement in the moving gaps, greatly affecting the service life of the moving components. Summary of the Utility Model

[0005] In order to overcome the technical problem in the prior art that during the rotation cleaning of the wafer, sand liquid will fly out, the flying sand liquid invades the moving gaps of the cleaning device, and the uneven and irregular movement will cause wear of the cleaning device and reduce the service life of the cleaning device. An object of the utility model is to provide a wafer scrubbing device. By using a cantilever to arrange the scrubbing disc and the driving device of the scrubbing disc above the wafer, and at the same time arranging a first water retaining ring below the support disc to block the moving gap of the support disc, the purpose of preventing the sand liquid from invading the moving gaps of the scrubbing disc and the support disc is achieved, and the service life of the scrubbing device is prolonged.

[0006] To achieve the above object, the utility model adopts the following technical solutions: A wafer scrubbing device, including a support disk, the support disk is rotatably connected in a liquid collecting disk, and the wafer is placed on the upper end of the support disk; a cantilever, the cantilever is arranged on the upper end of the liquid collecting disk; a lifting cylinder, the lifting cylinder is longitudinally arranged on the cantilever; a scrubbing disk, the scrubbing disk is rotatably connected to the lower end of the moving end of the lifting cylinder and is located above the support disk; wherein, a lower bearing seat is arranged at the inner bottom end of the liquid collecting disk; the support disk is rotatably connected above the lower bearing seat; a first water retaining ring is arranged at the lower end of the support disk; the first water retaining ring is arranged on the outer circumference of the lower bearing seat; the lower end of the first water retaining ring is located above the inner bottom end of the liquid collecting disk.

[0007] There is no any motion mechanism and motion gap between the support disk and the scrubbing disk, and all the abrasive liquid scattered outward from the wafer enters into the liquid collecting disk. At the same time, the first water retaining ring blocks the motion gap between the lower bearing seat and the support disk, and the abrasive liquid falling into the liquid collecting disk will not splash or invade into the motion gap of the support disk. Thus, the service life of the motion mechanism between the scrubbing devices is guaranteed, that is, the service life of the scrubbing device is improved.

[0008] Further, the rotation axis of the scrubbing disk is parallel to and non-coincident with the rotation axis of the support disk; the scrubbing surface of the scrubbing disk covers the radius of the support disk.

[0009] The scrubbing disk and the support disk rotate synchronously, and the scrubbing surface covers the wafer without dead angle, thereby improving the scrubbing effect of the wafer.

[0010] Further, a concave circular groove is arranged at the upper end of the support disk; a positioning ring is detachably connected in the concave circular groove; the wafer is arranged in the positioning ring, and the outer wall of the wafer abuts against the inner wall of the positioning ring; the outer wall of the positioning ring abuts against the inner wall of the concave circular groove.

[0011] Specifically, the positioning ring has multiple models; each model of the positioning ring has a different inner diameter, corresponding to wafers of different sizes respectively.

[0012] On the premise of not changing the main structure of the scrubbing device, by replacing the positioning rings of different models, wafers of different models can be compatible, and there is no need to set the positioning and centering structure of the wafer, which improves the compatibility and also improves the convenience of wafer placement.

[0013] Specifically, a plurality of accommodating holes are arranged at the upper end of the support disk; a plurality of semi-circular holes are arranged on the inner wall of the positioning ring; the semi-circular holes are aligned with the corresponding accommodating holes.

[0014] After one side of the wafer is scrubbed, the other side needs to be scrubbed. The accommodation holes and the semi-circular holes facilitate manual removal of the wafer from the positioning ring.

[0015] Further, a mounting disk is rotatably connected to the moving end of the lifting cylinder; a tire coupling is arranged at the lower end of the mounting disk; the scrubbing disk is arranged at the lower end of the tire coupling; an upper motor for driving the mounting disk to rotate is arranged on the lifting cylinder.

[0016] When the lifting cylinder drives the scrubbing disk to slide longitudinally, the scrubbing disk abuts against the upper end of the wafer, and the tire coupling provides buffering for the scrubbing disk, preventing excessive pressure from crushing the wafer while ensuring sufficient scrubbing pressure.

[0017] Specifically, a second water retaining ring extending upward is arranged on the outer wall of the mounting disk; an upper bearing seat is arranged on the moving end of the lifting cylinder; an annular groove is coaxially arranged at the lower end of the upper bearing seat; the second water retaining ring is located in the annular groove.

[0018] The second water retaining ring does not contact the annular groove, and the second water retaining ring and the annular groove form a labyrinth structure to prevent sand liquid from entering the movement gap.

[0019] Specifically, a plurality of threaded pipes are arranged at the lower end of the mounting disk; the threaded pipes are uniformly distributed along the circumferential direction; the tire coupling is arranged at the lower end of the threaded pipes.

[0020] Further, a through hole is arranged in the middle of the liquid collecting disk; a bent plate bent upward is arranged on the inner wall of the through hole; a liquid collecting groove is formed between the bent plate and the inner wall of the liquid collecting disk; a table plate is arranged at the upper end of the bent plate; a frame is arranged at the lower end of the table plate; the cantilever and the downward support disk are arranged on the table plate.

[0021] The liquid collecting groove is used to collect the sand liquid flying out of the wafer, further preventing sputtering and splashing in the movement gap of the support disk. At the same time, the table plate increases the structural strength and also reduces the cost and manufacturing difficulty of the liquid collecting disk.

[0022] Specifically, four mounting columns are threadedly connected below the table plate; a lower mounting plate is arranged at the lower ends of the four mounting columns; a lower motor is arranged at the lower end of the lower mounting plate; the support disk is arranged on the output shaft of the lower motor.

[0023] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0024] 1. By the synchronous relative rotation of the support disk and the scrubbing disk, the surface of the wafer is wiped, effectively removing the sand liquid attached to the surface of the wafer, with high cleaning efficiency and no dead angle;

[0025] 2. The scrubbing disc and the corresponding motion mechanism for driving the scrubbing disc are located above the wafer. The movement gap of the support disc is blocked by the first water baffle ring, so that the sand liquid cleaned from the wafer will not enter the movement gap, and the movement gap will not be worn, improving the service life of the movement structure.

[0026] 3. By replacing the positioning rings of different models at the upper end of the support disc, wafers of different models can be compatible, improving the compatibility of the scrubbing equipment. Description of the Drawings

[0027] Figure 1 is a schematic structural diagram of the present utility model;

[0028] Figure 2 is a schematic cross-sectional structural diagram of the present utility model;

[0029] Figure 3 is a schematic structural diagram of the support disc and the corresponding drive structure of the present utility model;

[0030] Figure 4 is a schematic structural diagram of the scrubbing disc and the corresponding drive structure of the present utility model;

[0031] Figure 5 is a schematic installation structure diagram of the platen and the liquid collecting tray of the present utility model;

[0032] Figure 6 is a schematic structural diagram of the mounting post of the present utility model.

[0033] In the figure: 11, frame; 12, platen; 13, liquid collecting tray; 131, bending plate; 132, liquid collecting groove; 14, lower mounting plate; 15, mounting post; 151, threaded post; 152, threaded hole; 153, parallel notch; 21, cantilever; 211, adjustment groove; 22, lifting cylinder; 23, upper mounting plate; 31, support disc; 311, accommodation hole; 312, lower concave circular groove; 313, first water baffle ring; 32, positioning ring; 321, semi-circular hole; 33, lower bearing; 34, lower bearing seat; 35, lower motor; 351, lower motor shaft; 41, scrubbing disc; 42, tire coupling; 43, mounting disc; 431, second water baffle ring; 44, upper bearing seat; 441, annular groove; 45, upper bearing; 46, upper motor; 461, upper motor shaft; 47, threaded tube; 5, wafer. Detailed Embodiments

[0034] Next, in combination with the drawings and specific embodiments, the present utility model will be further described. It should be noted that on the premise of no conflict, the following described embodiments or technical features can be combined arbitrarily to form new embodiments.

[0035] In the description of the present utility model, it should be noted that for orientation terms, such as the terms "center", "horizontal", "vertical", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the indicated orientation and position relationship are based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present utility model.

[0036] In addition, such terms as "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise specifically defined.

[0037] In the present utility model, unless otherwise clearly specified and defined, such terms as "set", "installed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may also be a mechanical connection; it may be directly connected, or connected through an intermediate medium, and may be internally connected and communicated between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0038] See Figures 1-6 , a wafer scrubbing device, comprising a frame 11, a platen 12 provided at the upper end of the frame 11, and a rectangular liquid collecting tray 13 provided at the lower end of the platen 12; a through hole is provided in the middle of the liquid collecting tray 13; a bent plate 131 bent upward is provided on the inner wall of the through hole; a liquid collecting groove 132 is formed between the bent plate 131 and the inner wall of the liquid collecting tray 13; the upper end of the bent plate 131 is provided at the lower end of the platen 12; the liquid collecting groove 132 is located below the platen 12.

[0039] A lower bearing seat 34 is provided at the upper end of the platen 12; a lower bearing 33 is rotatably connected in the lower bearing seat 34; a lower motor shaft 351 is rotatably connected in the lower bearing 33; a support disk 31 is provided at the upper end of the lower motor shaft 351; four mounting columns 15 are threadedly connected to the lower end of the platen 12; lower mounting plates 14 are provided at the lower ends of the four mounting columns 15; a lower motor 35 is provided at the lower end of the lower mounting plate 14; the output shaft of the lower motor 35 is coaxially arranged with the lower motor shaft 351, and a coupling is provided between the two.

[0040] A first water retaining ring 313 is coaxially arranged at the lower end of the support disk 31; the first water retaining ring 313 is arranged on the outer circumference of the lower bearing seat 34; the lower end of the first water retaining ring 313 is located above the inner bottom end of the liquid collecting disk 13.

[0041] A concave circular groove 312 is arranged at the upper end of the support disk 31; a material with a relatively high cleanliness is pasted on the surface of the concave circular groove 312 to ensure cleanliness and not easily damage the surface; a positioning ring 32 is detachably connected in the concave circular groove 312; the wafer 5 is arranged in the positioning ring 32, and the outer wall of the wafer 5 abuts against the inner wall of the positioning ring 32; the outer wall of the positioning ring 32 abuts against the inner wall of the concave circular groove 312; the positioning ring 32 has multiple models; each model of the positioning ring 32 has a different inner diameter, corresponding to wafers 5 of different sizes respectively.

[0042] Two circles of accommodating holes 311 are arranged at the upper end of the support disk 31; each circle has a plurality of the accommodating holes 311; the accommodating holes 311 in each circle are evenly distributed along the circumferential direction; a plurality of semi-circular holes 321 are arranged on the inner wall of the positioning ring 32; the semi-circular holes 321 are aligned with the corresponding accommodating holes 311.

[0043] A threaded column 151 is coaxially arranged at the central position of the upper end of the mounting post 15; the threaded column 151 is threadedly connected to the lower end of the platen 12; a threaded hole 152 is coaxially arranged at the central position of the lower end of the mounting post 15; the lower mounting plate 14 is arranged in the threaded hole 152 through screws; two symmetrically arranged parallel notches 153 are arranged on the outer wall of the mounting post 15.

[0044] A cantilever 21 is arranged at the upper end of the platen 12; four adjusting grooves 211 are arranged at the lower end of the cantilever 21; the adjusting grooves 211 can adjust the relative position between the cantilever 21 and the support disk 31; a lifting cylinder 22 is arranged at one end of the cantilever 21 facing the support disk 31; an upper mounting plate 23 is arranged on the moving end of the lifting cylinder 22; a upper bearing seat 44 is arranged at the lower end of the upper mounting plate 23; an upper bearing 45 is rotatably connected in the upper bearing seat 44; an upper motor shaft 461 is rotatably connected in the upper bearing 45; an installation disk 43 is arranged at the lower end of the upper motor shaft 461; an upper motor 46 is arranged at the upper end of the upper mounting plate 23; the upper motor 46 is drivingly connected to the upper motor shaft 461.

[0045] Eight threaded pipes 47 evenly distributed along the circumferential direction are arranged at the lower end of the installation disk 43; a tire coupling 42 is arranged at the lower ends of the eight threaded pipes 47; a scrubbing disk 41 is arranged at the lower end of the tire coupling 42; scrubbing tools such as sponges are pasted at the lower end of the scrubbing disk 41.

[0046] The rotating shaft of the scrubbing disc 41 is parallel to but not coincident with the rotating shaft of the support disc 31; the scrubbing surface of the scrubbing disc 41 covers the radius of the support disc 31.

[0047] A second water retaining ring 431 extending upward is provided on the outer wall of the mounting disc 43; an annular groove 441 is coaxially provided at the lower end of the upper bearing seat 44; the second water retaining ring 431 is located in the annular groove 441.

[0048] Operation process: Place the glass wafer into the positioning ring 31 in the support disc 31. The lifting cylinder 22 drives the scrubbing disc 41 to descend until it abuts against the upper end of the wafer. The support disc 31 and the scrubbing disc 41 rotate synchronously and in opposite directions to scrub the wafer. After scrubbing is completed, the lifting cylinder 22 drives the scrubbing disc 31 to rise to the original height, turn over the glass wafer in the positioning ring 31, and again perform the above steps to scrub the other side of the wafer.

[0049] The above are only specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by any person skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.

Claims

1. A wafer scrubbing device, characterized in that: including a support disk rotatably connected within a liquid collecting disk, with a wafer placed on the upper end of the support disk; a cantilever provided at the upper end of the liquid collecting disk; a lifting cylinder longitudinally provided on the cantilever; a scrubbing disk rotatably connected to the lower end of the moving end of the lifting cylinder and located above the support disk; wherein, a lower bearing seat is provided at the inner bottom end of the liquid collecting disk; the support disk is rotatably connected above the lower bearing seat; a first water retaining ring is provided at the lower end of the support disk; the first water retaining ring is provided on the outer circumference of the lower bearing seat; the lower end of the first water retaining ring is located above the inner bottom end of the liquid collecting disk.

2. The scrubbing device according to claim 1, characterized in that: The rotation axis of the scrubbing disk is parallel and non - coincident with the rotation axis of the support disk; the scrubbing surface of the scrubbing disk covers the radius of the support disk.

3. The scrubbing device according to any one of claims 1-2, characterized in that: A concave circular groove is provided at the upper end of the support disk; a positioning ring is detachably connected within the concave circular groove; the wafer is provided within the positioning ring, with the outer wall of the wafer abutted against the inner wall of the positioning ring; the outer wall of the positioning ring is abutted against the inner wall of the concave circular groove.

4. The scrubbing device according to claim 3, characterized in that: The positioning ring has multiple models; each model of the positioning ring has a different inner diameter, corresponding to wafers of different sizes respectively.

5. The scrubbing device according to claim 3, wherein: Multiple accommodating holes are provided at the upper end of the support disk; multiple semi - circular holes are provided on the inner wall of the positioning ring; the semi - circular holes are aligned with the corresponding accommodating holes.

6. The scrubbing device according to any one of claims 1-2, characterized in that: A mounting disk is rotatably connected to the moving end of the lifting cylinder; a tire coupling is provided at the lower end of the mounting disk; the scrubbing disk is provided at the lower end of the tire coupling; an upper motor for driving the mounting disk to rotate is provided on the lifting cylinder.

7. The scrubbing device according to claim 6, characterized in that: A second water retaining ring extending upward is provided on the outer wall of the mounting disk; an upper bearing seat is provided on the moving end of the lifting cylinder; an annular groove is coaxially provided at the lower end of the upper bearing seat; the second water retaining ring is located within the annular groove.

8. The scrubbing device according to claim 6, characterized in that: Multiple threaded tubes are provided at the lower end of the mounting disk; the threaded tubes are evenly distributed along the circumferential direction; the tire coupling is provided at the lower end of the threaded tubes.

9. The scrubbing device according to any one of claims 1-2, characterized in that: A through - hole is provided in the middle of the liquid collecting disk; a bent plate bent upward is provided on the inner wall of the through - hole; a liquid collecting groove is formed between the bent plate and the inner wall of the liquid collecting disk; a table plate is provided at the upper end of the bent plate; a frame is provided at the lower end of the table plate; the cantilever and the downward support disk are provided on the table plate.

10. The scrubbing device according to claim 9, characterized in that: Four mounting columns are threadedly connected below the table plate; a lower mounting plate is provided at the lower ends of the four mounting columns; a lower motor is provided at the lower end of the lower mounting plate; the support disk is provided on the output shaft of the lower motor.

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