Degumming device for semiconductor wafer

Abstract

The semiconductor wafer degumming device comprises an equipment box and a processing shell fixedly installed on the upper end face of the equipment box, the processing shell comprises a top shell part and a matching shell, the matching shell is integrally formed and arranged at the front end of the top shell part, and a plurality of ultraviolet lamps are fixedly installed in the matching shell. And a working table is further installed between the equipment box and the matching shell, the working table is fixedly connected with the equipment box, and a wafer placement frame is rotationally installed in the working table. The processing shell is designed into a structure in which the top shell part is matched with the matching shell, so that the processing shell can correspond to one wafer positioning groove in the wafer placement frame through the matching shell during use, and the wafer in the wafer positioning groove can be irradiated and processed through an ultraviolet lamp in the matching shell; and a plurality of wafer positioning grooves are designed on the wafer placing rack, so that an operator can place the wafers in batches conveniently, and then sequential automatic processing is realized through an angle motor.

Description

Technical Field

[0001] The utility model relates to the field of wafer degumming devices, and specifically relates to a degumming device for semiconductor wafers. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, that is, a wafer. The main processing methods of wafers are single-piece processing and batch processing, that is, processing one or more wafers simultaneously. During the wafer processing, a semiconductor wafer degumming device is required to perform degumming treatment on it.

[0003] The existing Chinese patent with the publication number CN215220669U discloses an automatic degumming device for semiconductor wafers, belonging to the field of semiconductor wafer equipment, including a base. One end of the base is equipped with a heating chamber, and the other end of the base is equipped with a degumming chamber. A lifting mechanism A is installed on the heating chamber, and a lifting mechanism B is installed on the degumming chamber. The internal component structures of the lifting mechanism A and the lifting mechanism B are the same. The lifting mechanism A is composed of a turntable, a rotating shaft, a sleeve, a support rod, and a fixed shaft.

[0004] Regarding the above related technologies, it is found that the degumming devices used for existing semiconductor wafers all adopt the method of single-piece picking and placing processing for degumming. The operator first places the semiconductor wafer to be degummed in the equipment. After the irradiation processing is completed, it is taken out for manual degumming, and then the processing of the next semiconductor wafer is carried out. It cannot be processed in batches, and the operation is relatively cumbersome. Content of the Utility Model

[0005] The purpose of the utility model is to provide a degumming device for semiconductor wafers, aiming to achieve batch demoulding processing.

[0006] The utility model is implemented as follows: A degumming device for semiconductor wafers includes an equipment box and a processing shell fixedly installed on the upper end surface of the equipment box. The processing shell includes a top shell part and a mating shell. The mating shell is integrally formed at the front end of the top shell part, and a plurality of ultraviolet lamps are fixedly installed inside the mating shell. An operating table is also installed between the equipment box and the mating shell. The operating table is fixedly connected to the equipment box, and a wafer placement rack is rotatably installed in the operating table. An angle motor for driving the wafer placement rack to rotate is fixedly installed at the lower end of the operating table.

[0007] Preferably, a placement groove for installing the wafer placement rack is opened at the upper end of the operating table, and the output shaft of the angle motor extends from the central groove of the operating table into the placement groove.

[0008] Preferably, the wafer placement rack includes an annular rack and a placement plate. The annular rack is installed in the placement groove, and the center of the annular rack is fixedly installed on the output shaft of the angle motor. The placement plate is fixedly installed on the upper end surface of the annular rack.

[0009] Preferably, a plurality of wafer positioning grooves are evenly formed in the circumferential direction on the placement plate, an annular support plate is arranged in the wafer positioning groove, and the annular support plate is integrally formed with the placement plate.

[0010] Preferably, a rotating shaft seat corresponding to the wafer positioning groove is arranged on the lower end surface of the placement plate, the rotating shaft seat is fixedly connected with the placement plate, and a flipping bracket is rotatably installed on the rotating shaft seat.

[0011] Preferably, the flipping bracket includes a sleeve, a short plate, a long plate and a cylindrical support rod. The sleeve is sleeved on the rotating shaft seat, the short plate and the long plate are respectively arranged on both sides of the sleeve, and the sleeve, the short plate and the long plate are integrally formed. The cylindrical support rod is fixedly installed at the head of the long plate.

[0012] Preferably, a plurality of vertical pressing rods corresponding to the short plates are installed on the placement plate. The vertical pressing rods are slidably connected with the placement plate, a rod cap is fixedly installed at the head of the vertical pressing rod, and a support spring is further arranged at the lower end of the rod cap.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: In this application, the processing shell is designed into a structure in which the top shell part and the matching shell are matched. When in use, it is easy to make the matching shell correspond to a wafer positioning groove on the wafer placement rack, so that the wafer in the wafer positioning groove can be irradiated and processed by the ultraviolet lamp in the matching shell. By designing a plurality of wafer positioning grooves on the wafer placement rack, it is convenient for the operator to place the wafers in batches, and then the angle motor is used to realize automatic processing in sequence, thereby reducing the operation frequency of the operator. At the same time, the setting of the flipping bracket and the vertical pressing rod ensures more convenient operation when taking out the wafers, and has the advantages of convenient batch processing and easy operation. Description of the Drawings

[0014] Figure 1 is a three-dimensional view of the overall structure of the present utility model;

[0015] Figure 2 is Figure 1 a three-dimensional view of the device shown when the wafer placement rack is not installed;

[0016] Figure 3 is an upper three-dimensional view of the wafer placement rack of the present utility model;

[0017] Figure 4 is a lower three-dimensional view of the wafer placement rack of the present utility model;

[0018] Figure 5 is Figure 3 a top view of the device shown;

[0019] In the figure: 1, equipment box; 2, processing shell; 21, top shell part; 22, mating shell; 3, operating table; 31, placement groove; 4, wafer placement rack; 41, annular rack; 42, placement plate; 421, wafer positioning groove; 422, annular support plate; 43, rotating shaft seat; 44, flipping bracket; 441, sleeve; 442, short board; 443, long board; 444, cylindrical support rod; 45, vertical pressure rod; 451, rod cap; 452, support spring; 5, angle motor. Detailed implementation manners

[0020] In the present utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "connection", "fixation" and other terms shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0021] The following will be further described in conjunction with the accompanying drawings and specific embodiments:

[0022] Referring to Figure 1 、 Figure 2 and Figure 3 As shown, a debonding device for semiconductor wafers includes an equipment box 1 and a processing shell 2 fixedly installed on the upper end surface of the equipment box 1. The processing shell 2 includes a top shell part 21 and a mating shell 22. The mating shell 22 is integrally formed at the front end of the top shell part 21, and a plurality of ultraviolet lamps are fixedly installed inside the mating shell 22. An operating table 3 is also installed between the equipment box 1 and the mating shell 22. The operating table 3 is fixedly connected to the equipment box 1, and a wafer placement rack 4 is rotatably installed in the operating table 3. An angle motor 5 for driving the wafer placement rack 4 to rotate is fixedly installed at the lower end of the operating table 3. Through the setting of the equipment box 1, it is convenient for the equipment to be stably placed on the ground for use. At the same time, by fixedly installing the processing shell 2 on its upper end surface and designing the processing shell 2 into a structure in which the top shell part 21 and the mating shell 22 cooperate, it is easy to cooperate with the wafer placement rack 4 in the operating table 3 through the mating shell 22 at the front end of the top shell part 21 when in use, ensuring that the ultraviolet lamps in the mating shell 22 irradiate the semiconductor wafers in the wafer placement rack 4 for debonding, achieving the purpose of rapid debonding by using the curing effect of ultraviolet light. At the same time, multiple semiconductor wafers to be processed can be placed on the wafer placement rack 4 each time. In this way, the angle motor 5 can be used to control the wafer placement rack 4 to rotate different wafer placement racks 4 at regular intervals, and then different semiconductor wafers are sequentially matched with the ultraviolet lamps to realize batch debonding treatment.

[0023] Referring to Figure 2As shown in the figure, a placement groove 31 for installing the wafer placement rack 4 is provided at the upper end of the workbench 3, and the output shaft of the angle motor 5 extends from the central groove of the workbench 3 into the placement groove 31. By providing the placement groove 31 at the upper end of the workbench 3, it is ensured that the wafer placement rack 4 can be stably installed and used in the placement groove 31. When the angle motor 5 is started, the wafer placement rack 4 can be driven to rotate and adjust.

[0024] Refer to Figure 3 , Figure 4 and Figure 5 As shown in the figure, the wafer placement rack 4 includes an annular rack 41 and a placement disk 4, the annular rack 41 is installed in the placement groove 31, and the center of the annular rack 41 is fixedly installed on the output shaft of the angle motor 5, and the placement disk 42 is fixedly installed on the upper end surface of the annular rack 41. A plurality of wafer positioning grooves 421 are evenly provided on the placement disk 42 along the circumferential direction, and an annular support plate 422 is provided in the wafer positioning groove 421, and the annular support plate Figure 5 422 is integrally formed with the placement disk 42.

[0025] Refer to Figure 3 , Figure 4 and Figure 5 As shown in the figure, by setting the structure of the wafer placement rack 4, it is ensured that the placement disk 42 can be supported and installed by the annular rack 41 during use, and it is ensured that the placement disk 42 can be stably placed in the placement groove 31 through the annular rack 41 during use. In this way, the wafer to be debonded can be placed through the wafer positioning grooves 421 on the placement disk 42. After the wafer to be debonded is placed in the wafer positioning grooves 421, it can be supported by the annular support plate 422, thereby ensuring the stable placement of the wafer.

[0026] Refer to Figure 3 , Figure 4 and Figure 5As shown in the figure, a rotating shaft seat 43 corresponding to the wafer positioning groove 421 is provided on the lower end surface of the placing plate 42. The rotating shaft seat 43 is fixedly connected to the placing plate 42, and a flipping bracket 44 is rotatably installed on the rotating shaft seat 43. By fixedly installing the rotating shaft seat 43 on the lower end surface of the placing plate 42, it is convenient to position and install the flipping bracket 44 through the rotating shaft seat 43 during use. After the middle part of the flipping bracket 44 is rotatably installed on the rotating shaft seat 43, one end can be operated to drive the other end to flip synchronously. The flipping bracket 44 includes a sleeve 441, a short plate 442, a long plate 443, and a cylindrical supporting rod 444. The sleeve 441 is sleeved on the rotating shaft seat 43. The short plate 442 and the long plate 443 are respectively arranged on both sides of the sleeve 441, and the sleeve 441, the short plate 442, and the long plate 443 are integrally formed. The cylindrical supporting rod 444 is fixedly installed at the head of the long plate 443. By designing the flipping bracket 44 into a structure with the sleeve 441, the short plate 442, the long plate 443, and the cylindrical supporting rod 444 cooperating with each other, it can be sleeved on the rotating shaft seat 43 through the sleeve 441 during use. By fixedly installing the cylindrical supporting rod 444 at the head of the long plate 443, it can be ensured that the cylindrical supporting rod 444 is arranged at the lower end of the wafer. Then, after the wafer is irradiated and processed, the flipping bracket 44 can be rotated to eject the wafer from the wafer positioning groove 421 through the cylindrical supporting rod 444, which is easy to take out and operate. A number of vertical pressing rods 45 corresponding to the short plate 442 are installed on the placing plate 42. The vertical pressing rods 45 are slidably connected to the placing plate 42, and a rod cap 451 is fixedly installed at the head of the vertical pressing rod 45. A supporting spring 452 is further arranged at the lower end of the rod cap 451. By arranging the vertical pressing rod 45 directly below the short plate 442, the flipping bracket 44 can be pushed to rotate when the vertical pressing rod 45 is pressed. The rod cap 451 and the supporting spring 452 are arranged to ensure quick reset after pressing.

[0027] Working principle: When degumming processing is required, a number of wafers are sequentially placed in the wafer positioning grooves 421 on the wafer placing rack 4, and then the equipment is started to be used for normal irradiation processing. After the equipment is started, the ultraviolet lamp in the processing shell 2 is automatically turned on. In this way, the angle motor 5 can be started sequentially according to the preset time interval, and the angle rotated each time is just to move different wafers to directly below the matching shell 22, so that batch-by-batch irradiation processing can be realized. After a batch of processing is completed, the operator can replace them in batches, which can greatly reduce the operation frequency of the operator. When the operator needs to take out the wafers, the operator can press the rod cap 451 at the corresponding position, and the rod cap 451 and the vertical pressing rod 45 are used to press and hold the flipping bracket 44 to rotate, and then the wafer can be ejected from the wafer placement 421 through the cylindrical supporting rod 444, which is convenient for the operator to take out and operate better.

[0028] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A semiconductor wafer degumming device, comprising an equipment box (1) and a processing shell (2) fixedly installed on the upper end face of the equipment box (1), characterized in that, The processing shell (2) includes a top shell part (21) and a mating shell (22). The mating shell (22) is integrally formed at the front end of the top shell part (21), and a plurality of ultraviolet lamps are fixedly installed inside the mating shell (22). An operating table (3) is also installed between the equipment box (1) and the mating shell (22). The operating table (3) is fixedly connected to the equipment box (1), and a wafer placement rack (4) is rotatably installed in the operating table (3). An angle motor (5) for driving the rotation of the wafer placement rack (4) is fixedly installed at the lower end of the operating table (3).

2. The debonding device for a semiconductor wafer according to claim 1, characterized in that, A placement groove (31) for installing the wafer placement rack (4) is formed at the upper end of the operating table (3). The output shaft of the angle motor (5) extends from the central groove of the operating table (3) into the placement groove (31).

3. The debonding device for a semiconductor wafer according to claim 2, characterized in that, The wafer placement rack (4) includes an annular rack (41) and a placement plate (42). The annular rack (41) is installed in the placement groove (31), and the center of the annular rack (41) is fixedly installed on the output shaft of the angle motor (5). The placement plate (42) is fixedly installed on the upper end surface of the annular rack (41).

4. A debonding device for a semiconductor wafer according to claim 3, characterized in that, A plurality of wafer positioning grooves (421) are uniformly formed in the circumferential direction on the placement plate (42). An annular support plate (422) is arranged in the wafer positioning grooves (421), and the annular support plate (422) is integrally formed with the placement plate (42).

5. A debonding device for a semiconductor wafer according to claim 4, wherein, A rotating shaft seat (43) corresponding to the wafer positioning grooves (421) is arranged on the lower end surface of the placement plate (42). The rotating shaft seat (43) is fixedly connected to the placement plate (42), and a flipping bracket (44) is rotatably installed on the rotating shaft seat (43).

6. A debonding device for a semiconductor wafer according to claim 5, wherein, The flipping bracket (44) includes a sleeve (441), a short plate (442), a long plate (443), and a cylindrical support rod (444). The sleeve (441) is sleeved on the rotating shaft seat (43). The short plate (442) and the long plate (443) are respectively arranged on both sides of the sleeve (441), and the sleeve (441), the short plate (442), and the long plate (443) are integrally formed. The cylindrical support rod (444) is fixedly installed at the head of the long plate (443).

7. The debonding device for a semiconductor wafer according to claim 6, characterized in that, A plurality of vertical pressing rods (45) corresponding to the short plates (442) are installed on the placement plate (42). The vertical pressing rods (45) are slidably connected to the placement plate (42), and a rod cap (451) is fixedly installed at the head of the vertical pressing rod (45). A support spring (452) is also arranged at the lower end of the rod cap (451).

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