Material kicking device, conveying equipment and silicon wafer guiding machine

Abstract

The utility model provides a material kicking device, conveying equipment and a silicon wafer guiding machine, and the material kicking device comprises a conveying assembly which is suitable for conveying materials; the driving assembly is connected with the conveying assembly, and the driving assembly is suitable for driving at least part of the conveying assembly to move between a first position and a second position; when at least part of the conveying assembly is located at the first position, the conveying assembly is configured to be capable of conveying materials on a first path; when at least part of the conveying assembly is located at the second position, the conveying assembly is configured to be capable of conveying materials on a second path so as to remove the materials from the first path; and the material collecting assembly is arranged on the downstream portion of the conveying assembly, and the material collecting assembly is suitable for collecting the materials removed by the conveying assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell preparation, and more specifically, to a kicking device, a conveying device and a wafer guiding machine. Background Art

[0002] In the production of solar cells, kicking out unqualified wafers is crucial for ensuring product quality. However, existing kicking devices mainly rely on multi-axis robotic arms and suction cups, which not only increase the complexity of the equipment, but also easily cause further damage when dealing with fragile cracked wafers. In addition, the speed of the robotic arm and the adsorption force of the suction cup limit the sorting speed and it is difficult to meet the high-yield requirements. Summary of the Utility Model

[0003] The utility model provides a new technical solution for a kicking device, which can at least solve the technical problem of the complex structure of the existing kicking device.

[0004] The utility model also provides a new technical solution for a conveying device.

[0005] The utility model also provides a new technical solution for a wafer guiding machine.

[0006] According to a first aspect of the utility model, there is provided a kicking device, comprising: a conveying assembly adapted to convey materials; a driving assembly connected to the conveying assembly, the driving assembly being adapted to drive at least a part of the conveying assembly to move between a first position and a second position; wherein when at least a part of the conveying assembly is in the first position, the conveying assembly is configured to be able to convey materials along a first path; when at least a part of the conveying assembly is in the second position, the conveying assembly is configured to be able to convey materials along a second path so as to kick out the materials from the first path; a material receiving assembly provided downstream of the conveying assembly, the material receiving assembly being adapted to collect the materials kicked out by the conveying assembly.

[0007] Optionally, the driving assembly includes: a base, at least a part of the conveying assembly being movably provided between the first position and the second position on the base; a driving member provided on the base, the driving member being connected to the conveying assembly to drive at least a part of the conveying assembly to move.

[0008] Optionally, at least a part of the conveying assembly is pivotally provided between the first position and the second position on the base.

[0009] Optionally, the driving member is configured as a telescopic cylinder, a first end of the telescopic cylinder being pivotally connected to the base, and a second end of the telescopic cylinder being pivotally connected to at least a part of the conveying assembly.

[0010] Optionally, the conveying assembly includes: a frame, the driving member is connected to the frame; a first pulley set rotatably provided on the frame, and the frame is rotatably provided on the base about the axis of the first pulley set; a second pulley set, the second pulley set and the second pulley set are distributed along the length direction of the frame, and the second pulley set is rotatably provided on the frame; an endless conveyor belt sleeved on the first pulley set and the second pulley set; and a motor provided on the base or the frame, and the motor is in transmission connection with the first pulley set.

[0011] Optionally, the conveying assembly further includes: a pushing member provided on the frame, the pushing member is located at one end of the frame close to the second pulley set, and the pushing member is adapted to lift the material on the endless conveyor belt.

[0012] Optionally, the material receiving assembly includes: a material receiving box provided downstream of the conveying assembly, a feeding port is provided on one side of the material receiving box close to the conveying assembly, and the material receiving box is adapted to collect the kicked-out material; and the material receiving box is inclined, the side of the material receiving box close to the conveying assembly is at a high position, and the side of the material receiving box away from the conveying assembly is at a low position.

[0013] Optionally, the material receiving assembly further includes: a fixing seat, the material receiving box is pivotally provided on the fixing seat so that the inclination angle of the material receiving box can be adjusted; a locking member adapted to cooperate with the fixing seat to lock the inclination angle of the material receiving box.

[0014] Optionally, an avoidance opening is provided on one side of the material receiving box close to the conveying assembly, and the avoidance opening is adapted to avoid the conveying assembly.

[0015] Optionally, when at least a part of the conveying assembly is in the second position, the conveying surface of the endless conveyor belt and the inner bottom surface of the material receiving box are located in the same plane.

[0016] According to a second aspect of the present invention, there is provided a conveying device including the kicking device described in any one of the above.

[0017] According to a third aspect of the present invention, there is provided a silicon wafer guiding machine including the kicking device described in any one of the above, or the above-mentioned conveying device.

[0018] According to the kick-out device of the present utility model, the driving assembly can drive at least part of the conveying assembly to move between a first position and a second position, so that the conveying assembly can not only convey qualified wafers, but also kick out unqualified wafers from the conveying path of the qualified wafers. Compared with the prior art, the kick-out device of the present utility model has a simple structure, lower subsequent maintenance costs, and does not require wafer suction operation, which can reduce the fragmentation rate of wafers, is conducive to kicking out unqualified wafers into the receiving assembly, and effectively improves the efficiency of wafer sorting.

[0019] Other features and advantages of the present utility model will become clear from the following detailed description of the exemplary embodiments of the present utility model with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings incorporated in and constituting a part of this specification illustrate embodiments of the present utility model and, together with the description, serve to explain the principles of the present utility model.

[0021] Figure 1 is a schematic structural diagram of a kick-out device according to an embodiment provided by the present utility model;

[0022] Figure 2 is a partial structural diagram of a kick-out device according to an embodiment provided by the present utility model;

[0023] Figure 3 is a schematic structural diagram of a receiving assembly of a kick-out device according to an embodiment provided by the present utility model.

[0024] REFERENCE NUMERALS

[0025] 100, kick-out device;

[0026] 10, conveying assembly; 11, frame; 12, first pulley set; 13, second pulley set;

[0027] 14, endless conveyor belt; 141, first sub-conveyor belt; 142, second sub-conveyor belt;

[0028] 15, motor; 16, pushing member;

[0029] 20, driving assembly; 21, base; 22, driving member;

[0030] 30, receiving assembly; 31, receiving box; 311, avoidance opening; 312, connecting plate; 32, fixing seat. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] Various exemplary embodiments of the present utility model will now be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present utility model.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present utility model or its application or use.

[0033] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0034] In all examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of exemplary embodiments may have different values.

[0035] It should be noted that: like reference numerals and letters denote like items in the following drawings; thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0036] First, the kicking device 100 according to an embodiment of the present utility model will be specifically described below with reference to the accompanying drawings.

[0037] As Figures 1 to 3 shown, the kicking device 100 according to an embodiment of the present utility model includes: a conveying assembly 10, a driving assembly 20, and a material receiving assembly 30.

[0038] Specifically, the conveying assembly 10 is adapted to convey materials. The driving assembly 20 is connected to the conveying assembly 10, and the driving assembly 20 is adapted to drive at least a part of the conveying assembly 10 to move between a first position and a second position. When at least a part of the conveying assembly 10 is in the first position, the conveying assembly 10 is configured to be able to convey materials along a first path. When at least a part of the conveying assembly 10 is in the second position, the conveying assembly 10 is configured to be able to convey materials along a second path to kick the materials out of the first path. The material receiving assembly 30 is disposed downstream of the conveying assembly 10, and the material receiving assembly 30 is adapted to collect the materials kicked by the conveying assembly 10.

[0039] In other words, as Figures 1 to 3As shown, the kicking device 100 according to an embodiment of the present invention mainly includes a conveying component 10, a driving component 20 and a receiving component 30. Among them, the conveying component 10 is configured to be able to convey materials (such as silicon wafers) along a first path or a second path. The first path is the conveying path for qualified materials, and the second path is the conveying path for unqualified products (i.e., the kicking path). The driving component 20 is connected to at least part of the conveying component 10, and the driving component 20 is configured to be able to drive at least part of the conveying component 10 to move between a first position and a second position. The receiving component 30 is arranged downstream of the conveying component 10.

[0040] It should be noted that at least part of the conveying component 10 is, for example, but not limited to, the whole of the conveying component 10, or a part of the conveying component 10 (which can be understood as the first part of the conveying component 10). Hereinafter, taking at least part of the conveying component 10 as the first part of the conveying component 10 as an example for specific description.

[0041] When the first part of the conveying component 10 moves to the first position, the conveying component 10 can convey materials along the first path. When the first part of the conveying component 10 moves to the second position, the receiving component 30 corresponds to the position of the conveying component 10, and the conveying component 10 can convey materials along the second path, so that the materials can be kicked off from the first path and the kicked-off materials can be collected into the receiving component 30.

[0042] Therefore, the kicking device 100 provided by the embodiment of the present invention can drive at least part of the conveying component 10 to move between the first position and the second position through the arranged driving component 20, so that the conveying component 10 can not only realize the conveying of qualified silicon wafers, but also kick off unqualified silicon wafers from the conveying path of qualified silicon wafers. Compared with the prior art, the kicking device 100 of the present invention has a simple structure, lower subsequent maintenance costs, and does not require suction operation of wafers, which can reduce the fragmentation rate of wafers, is beneficial to kicking off unqualified silicon wafers into the receiving component 30, and effectively improves the sorting efficiency of silicon wafers.

[0043] According to an embodiment of the present invention, the driving component 20 includes: a base 21 and a driving member 22. At least part of the conveying component 10 is movably arranged on the base 21 between the first position and the second position. The driving member 22 is arranged on the base 21, and the driving member 22 is connected to the conveying component 10 to drive at least part of the conveying component 10 to move.

[0044] Specifically, as Figure 1 and Figure 2As shown, the driving component 20 mainly includes a base 21 and a driving member 22. The base 21 can provide an installation position for the conveying component 10 and the driving member 22. The first part of the conveying component 10 is movably connected to the base 21. Thus, by moving the first part of the conveying component 10, the position of the first part of the conveying component 10 can be changed. One position of the first part of the conveying component 10 relative to the base 21 can be the first position, and another position of the first part of the conveying component 10 relative to the base 21 can be the second position. The driving member 22 is arranged on the base 21, and the output end of the driving member 22 is connected to the first part of the conveying component 10, so that the driving member 22 can drive the first part of the conveying component 10 to move relative to the base 21, thereby realizing the switching of the first part of the conveying component 10 between the first position and the second position.

[0045] In this embodiment, the connection manner between the first part of the conveying component 10 and the base 21 is, for example, but not limited to, a sliding connection and a pivot connection, and can be specifically determined according to actual requirements.

[0046] In some embodiments of the present utility model, at least part of the conveying component 10 is pivotally arranged on the base 21 between the first position and the second position.

[0047] That is to say, as Figure 1 and Figure 2 shown, the first part of the conveying component 10 is pivotally connected to the base 21 through a first pivot shaft, so that the first part of the conveying component 10 can be switched between the first position and the second position by pivoting. This structural design is not only simple in structure, but also can significantly reduce the space occupation, so that the conveying component 10 can effectively perform the work of conveying qualified silicon wafers and kicking out unqualified silicon wafers even in a limited space.

[0048] According to an embodiment of the present utility model, the driving member 22 is configured as a telescopic cylinder. The first end of the telescopic cylinder is pivotally connected to the base 21, and the second end of the telescopic cylinder is pivotally connected to at least part of the conveying component 10.

[0049] Specifically, as Figure 1 and Figure 2 shown, the driving member 22 is a telescopic cylinder. The telescopic cylinder is, for example, but not limited to, a pneumatic cylinder or an electric cylinder. The first end of the telescopic cylinder is pivotally connected to the base 21 through a second pivot shaft, and the axial direction of the second pivot shaft is the same as the axial direction of the first pivot shaft. The second end of the telescopic cylinder, that is, the output end, is pivotally connected to the first part of the conveying component 10 through a third pivot shaft. Similarly, the axial direction of the third pivot shaft is the same as the axial direction of the first pivot shaft.

[0050] In this embodiment, by controlling the telescopic cylinder to expand and contract, the first part of the conveying assembly 10 can be driven to move between the first position and the second position. The structure is simple, easy to maintain, and has high reliability. At the same time, the triangular structure formed by the driving member 22, the base 21, and the first part of the conveying assembly 10 significantly improves the overall stability, thereby ensuring the reliability of the conveying assembly 10 during operation.

[0051] In some embodiments of the present utility model, the conveying assembly 10 includes: a frame 11, a first pulley set 12, a second pulley set 13, an endless conveyor belt 14, and a motor 15. The driving member 22 is connected to the frame 11. The first pulley set 12 is rotatably provided on the frame 11. The frame 11 is rotatably provided on the base 21 around the axis of the first pulley set 12. The second pulley set 13 and the second pulley set 13 are distributed along the length direction of the frame 11. The second pulley set 13 is rotatably provided on the frame 11. The endless conveyor belt 14 is sleeved on the first pulley set 12 and the second pulley set 13. The motor 15 is provided on the base 21 or the frame 11, and the motor 15 is in transmission connection with the first pulley set 12.

[0052] In other words, as Figure 1 and Figure 2 shown, the conveying assembly 10 mainly includes a frame 11, a first pulley set 12, a second pulley set 13, an endless conveyor belt 14, and a motor 15. The frame 11 is pivotally connected to the base 21 through a first pivot shaft. The axis of the first pivot shaft is collinear with the axis of the first pulley set 12. The first pulley set 12 and the second pulley set 13 are respectively rotatably connected to the frame 11 along their own axes, and the first pulley set 12 and the second pulley set 13 are spaced apart along the length direction of the frame 11. The endless conveyor belt 14 is sleeved on the first pulley set 12 and the second pulley set 13, so that when the first pulley set 12 and the second pulley set 13 rotate, the endless conveyor belt 14 can be driven to rotate around the first pulley set 12 and the second pulley set 13, thereby conveying the silicon wafers along the length direction of the frame 11.

[0053] In one example, the motor 15 is fixedly connected to the base 21, and the motor 15 is in transmission connection with the first pulley set 12 through a transmission assembly, so that the load-bearing weight of the frame 11 can be reduced, which is beneficial to selecting a smaller power for the driving member 22, thereby reducing the production cost.

[0054] In another example, the motor 15 is fixedly connected to the frame 11, and the motor 15 is in transmission connection with the first pulley set 12 through a transmission assembly.

[0055] Specifically, as Figure 1 and Figure 2As shown, the transmission assembly includes a first transmission wheel, a second transmission wheel and a transmission belt. The first transmission wheel is fixed to the output end of the motor 15, the second transmission wheel is coaxially arranged with the first pulley group 12 and fixedly connected thereto, and the transmission belt is sleeved on the first transmission wheel and the second transmission wheel and meshes with them, so that the motor 15 can drive the second transmission wheel to rotate through the first transmission wheel and the transmission belt, and then drive the first pulley group 12 to rotate, so that the annular conveyor belt 14 can transport silicon wafers along the length of the frame 11.

[0056] It should be noted that the frame 11 and the portion pivoting together with the frame 11 constitute the first portion of the conveying assembly 10 , and will not be further described in this embodiment.

[0057] In some optional examples of the present invention, the first pulley group 12 mainly includes a first pulley, a second pulley and a connecting shaft, the first pulley is fixedly connected to the first end of the connecting shaft, the second pulley is fixedly connected to the second end of the connecting shaft, the connecting shaft is rotatably connected to the frame 11 around its own axis, and the first transmission wheel is fixedly connected to the connecting shaft; the second pulley group 13 mainly includes a third pulley and a fourth pulley, the third pulley and the first pulley are located on one side of the frame 11, the second pulley and the fourth pulley are located on the other side of the frame 11, and the third pulley and the fourth pulley are respectively rotatably connected to the frame 11 around their own axes; the annular conveyor belt 14 includes a first sub-conveyor belt 141 and a second sub-conveyor belt 142, wherein the first sub-conveyor belt 141 is sleeved on the first pulley and the third pulley, and the second sub-conveyor belt 142 is sleeved on the second pulley and the fourth pulley.

[0058] In this example, the first transmission wheel can drive the first pulley and the second pulley to rotate through the connecting shaft, thereby driving the first sub-conveyor belt 141 and the second sub-conveyor belt 142 to rotate synchronously, so that the first sub-conveyor belt 141 and the second sub-conveyor belt 142 can convey silicon wafers.

[0059] According to one embodiment of the present invention, the conveying assembly 10 further includes: a pushing member 16, which is provided on the frame 11 and located at one end of the frame 11 close to the second pulley set 13. The pushing member 16 is suitable for lifting the material on the endless conveyor belt 14.

[0060] That is to say, if Figure 1 As shown, one end of the frame 11 close to the second pulley group 13 is fixedly connected to a pushing member 16, which can be a cylinder. The extension and contraction direction of the cylinder is the same as the thickness direction of the frame 11, so that the silicon wafers on the circular conveyor belt 14 can be lifted by the pushing member 16, which is conducive to the rapid separation of the silicon wafers from the circular conveyor belt 14 and can effectively improve the kicking efficiency.

[0061] In some embodiments of the present utility model, the material receiving assembly 30 includes: a material receiving box 31, which is arranged downstream of the conveying assembly 10. An inlet is provided on the side of the material receiving box 31 close to the conveying assembly 10, and the material receiving box 31 is adapted to collect the kicked-off materials; moreover, the material receiving box 31 is inclined, with the side close to the conveying assembly 10 being the high position and the side far from the conveying assembly 10 being the low position.

[0062] Specifically, as Figure 1 and Figure 3 shown, the material receiving assembly 30 mainly includes an inclined material receiving box 31. The material receiving box 31 is arranged downstream of the conveying assembly 10. An inlet is provided on the side of the material receiving box 31 close to the conveying assembly 10, and the side of the material receiving box 31 close to the conveying assembly 10 is the high position, while the side far from the conveying assembly 10 is the low position. This allows the silicon wafers kicked off by the conveying assembly 10 to smoothly flow into the material receiving box 31, effectively reducing the risk of silicon wafer accumulation and blockage, and facilitating the reliable completion of the kicking process by the conveying assembly 10.

[0063] According to an embodiment of the present utility model, the material receiving assembly 30 further includes: a fixed seat 32 and a locking member. The material receiving box 31 is pivotally arranged on the fixed seat 32 so that the inclination angle of the material receiving box 31 can be adjusted, and the locking member is adapted to cooperate with the fixed seat 32 to lock the inclination angle of the material receiving box 31.

[0064] That is to say, as Figure 1 and Figure 3 shown, the material receiving assembly 30 may further include a fixed seat 32 and a locking member. Among them, the fixed seat 32 can provide an installation position for the material receiving box 31. Specifically, a connecting plate 312 is fixedly connected to the bottom of the material receiving box 31. The connecting plate 312 is pivotally connected to the fixed seat 32 through a fourth pivot shaft. The connecting plate 312 is also provided with an arc-shaped groove extending circumferentially around the fourth pivot shaft, and the axial direction of the fourth pivot shaft is the same as that of the first pivot shaft; the locking member can be a bolt. One end of the bolt can pass through the arc-shaped groove and be threadedly connected to the fixed seat 32. When the locking member is in an untightened state, the inclination angle of the material receiving box 31 can be adjusted, and when the locking member is tightened to the fixed seat 32, the inclination angle of the material receiving box 31 is in a locked state.

[0065] In this embodiment, the inclination angle of the material receiving box 31 can be adjusted according to actual needs to meet the collection requirements of different materials.

[0066] In some embodiments of the present utility model, an avoidance opening 311 is provided on the side of the material receiving box 31 close to the conveying assembly 10, and the avoidance opening 311 is adapted to avoid the conveying assembly 10.

[0067] Specifically, as Figure 1As shown in the figure, the receiving box 31 is provided with an avoidance opening 311. The avoidance opening 311 is located on the side of the receiving box 31 close to the conveying assembly 10, and the size and position of the avoidance opening 311 correspond to the position of the conveying assembly 10. When the first part of the conveying assembly 10 moves, it can provide an avoidance space for it, so that the end of the endless conveyor belt 14 far from the base 21 can move to a lower position, thereby reducing the distance between the silicon wafers on the endless conveyor belt 14 and the bottom of the receiving box 31, and further effectively avoiding the silicon wafers from colliding with the receiving box 31 and being broken.

[0068] In some alternative examples of the present invention, one receiving box 31 corresponds to two conveying assemblies 10, that is, the receiving box 31 can collect the silicon wafers kicked out by the two conveying assemblies 10.

[0069] According to an embodiment of the present invention, when at least part of the conveying assembly 10 is in the second position, the conveying surface of the endless conveyor belt 14 and the inner bottom surface of the receiving box 31 are in the same plane.

[0070] That is to say, when the first part of the conveying assembly 10 is in the second position, the conveying surface of the endless conveyor belt 14 and the inner bottom surface of the receiving box 31 are in the same plane, so as to ensure that the silicon wafers can be smoothly transferred from the endless conveyor belt 14 to the receiving box 31, and further avoid the silicon wafers from being broken.

[0071] The embodiment of the present invention also provides a conveying device, including the kicking device 100 described in any of the above embodiments. Since the kicking device 100 according to the embodiment of the present invention has the above technical effects, the conveying device according to the embodiment of the present invention also has the corresponding technical effects, which will not be elaborated in this embodiment.

[0072] The embodiment of the present invention also provides a silicon wafer guiding machine, including the kicking device 100 or the conveying device described in any of the above embodiments. Since the kicking device 100 according to the embodiment of the present invention has the above technical effects, the silicon wafer guiding machine according to the embodiment of the present invention also has the corresponding technical effects, which will not be elaborated in this embodiment.

[0073] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A kicking device, characterized in that, Comprising: A conveying component (10), the conveying component (10) being adapted to convey materials; A driving component (20), the driving component (20) being connected to the conveying component (10), the driving component (20) being adapted to drive at least part of the conveying component (10) to move between a first position and a second position; Wherein, when at least part of the conveying component (10) is in the first position, the conveying component (10) is configured to be able to convey materials along a first path; When at least part of the conveying component (10) is in the second position, the conveying component (10) is configured to be able to convey materials along a second path to kick out the materials from the first path; A material receiving component (30), the material receiving component (30) being arranged downstream of the conveying component (10), the material receiving component (30) being adapted to collect the materials kicked out by the conveying component (10).

2. The kicking device according to claim 1, wherein The driving component (20) includes: A base (21), at least part of the conveying component (10) being movably arranged between the first position and the second position on the base (21); A driving member (22), the driving member (22) being arranged on the base (21), the driving member (22) being connected to the conveying component (10) to drive at least part of the conveying component (10) to move.

3. The kicker device according to claim 2, wherein, At least part of the conveying component (10) is pivotally arranged between the first position and the second position on the base (21).

4. The kicker device according to claim 3, wherein, The driving member (22) is configured as a telescopic cylinder, a first end of the telescopic cylinder being pivotally connected to the base (21), and a second end of the telescopic cylinder being pivotally connected to at least part of the conveying component (10).

5. The kicker device according to claim 3, characterized in that, The conveying component (10) includes: A frame (11), the driving member (22) being connected to the frame (11); A first pulley set (12), the first pulley set (12) being rotatably arranged on the frame (11), the frame (11) being rotatably arranged on the base (21) around the axis of the first pulley set (12); A second pulley set (13), the second pulley set (13) being distributed along the length direction of the frame (11) with the second pulley set (13), the second pulley set (13) being rotatably arranged on the frame (11); An endless conveyor belt (14), the endless conveyor belt (14) being sleeved on the first pulley set (12) and the second pulley set (13); A motor (15), the motor (15) being arranged on the base (21) or the frame (11), the motor (15) being in transmission connection with the first pulley set (12).

6. The kicking device according to claim 5, characterized in that, The conveying component (10) further includes: A pushing member (16), the pushing member (16) being arranged on the frame (11), the pushing member (16) being located at one end of the frame (11) close to the second pulley set (13), the pushing member (16) being adapted to lift the materials on the endless conveyor belt (14).

7. The kicking device according to claim 5, wherein, The material receiving component (30) includes: A receiving box (31), the receiving box (31) is arranged downstream of the conveying assembly (10), a feeding port is arranged on one side of the receiving box (31) close to the conveying assembly (10), and the receiving box (31) is adapted to collect the kicked-off materials; Moreover, the receiving box (31) is arranged obliquely, the side of the receiving box (31) close to the conveying assembly (10) is at a high position, and the side of the receiving box (31) away from the conveying assembly (10) is at a low position.

8. The kicker device according to claim 7, characterized in that, The receiving assembly (30) further includes: A fixed seat (32), the receiving box (31) is pivotally arranged on the fixed seat (32) so that the inclination angle of the receiving box (31) can be adjusted; A locking member, the locking member is adapted to cooperate with the fixed seat (32) to lock the inclination angle of the receiving box (31).

9. The kicker device according to claim 7, wherein An avoidance opening (311) is arranged on one side of the receiving box (31) close to the conveying assembly (10), and the avoidance opening (311) is adapted to avoid the conveying assembly (10).

10. The kicker device according to claim 7, characterized in that, When at least a part of the conveying assembly (10) is in the second position, the conveying surface of the endless conveyor belt (14) and the inner bottom surface of the receiving box (31) are in the same plane.

11. A conveying device, characterized in that, Including the kicking device according to any one of claims 1 to 10.

12. A silicon wafer guiding machine, characterized in that, Including the kicking device according to any one of claims 1 to 10, or the conveying device according to claim 11.

Images