Wafer centering device

Abstract

The utility model discloses a wafer centering device which comprises two bearing platforms used for supporting a wafer, the two bearing platforms are arranged at intervals and symmetrically support the wafer, and the distance between the two bearing platforms is larger than the radius of the wafer and smaller than three quarters of the diameter of the wafer; and a space is reserved between the two bearing platforms, so that film taking manipulators with different shapes are compatible and applicable.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a wafer centering device. Background Art

[0002] In semiconductor manufacturing processes, rotating machines are often used to drive the wafer to rotate together. Before the wafer enters the rotating machine, centering operations are generally required. In the prior art, the centering mechanism usually includes a central disk in the middle and centering jaws at both ends. The space reserved for the wafer picking manipulator is small. Usually, the centering mechanism for one type of wafer can only be compatible with one type of wafer picking manipulator, and the application scenarios of the centering mechanism are single. Summary of the Utility Model

[0003] One of the purposes of the utility model is to provide a wafer centering device to solve the technical problems in the prior art that the centering mechanism has a small reserved space and cannot be compatible with multiple wafer picking manipulators.

[0004] To achieve one of the above-mentioned purposes of the utility model, an embodiment of the utility model provides a wafer centering device, which includes two bearing platforms for supporting the wafer. The two bearing platforms are arranged at intervals and symmetrically support the wafer. The distance between the two bearing platforms is greater than the radius of the wafer and less than three-quarters of the diameter of the wafer.

[0005] As a further improvement of an embodiment of the utility model, the two bearing platforms are centrosymmetrically arranged about the center of the wafer.

[0006] As a further improvement of an embodiment of the utility model, each bearing platform has a fitting portion that fits with the surface of the wafer. The distance between the two ends of each fitting portion is greater than half of the radius of the wafer and less than the radius of the wafer.

[0007] As a further improvement of an embodiment of the utility model, each bearing platform has a fitting portion that fits with the surface of the wafer. The fitting portion includes at least two vacuum adsorption holes for vacuum-adsorbing the surface of the wafer.

[0008] As a further improvement of an embodiment of the utility model, the fitting portion includes a sealing gasket corresponding to each vacuum adsorption hole.

[0009] As a further improvement of an embodiment of the utility model, each bearing platform has a support portion connecting the fitting portion. The support portion has a vacuum connection socket communicating with the vacuum adsorption hole, and each vacuum connection socket is located outside the support portion.

[0010] As a further improvement of one embodiment of the present invention, the wafer centering device includes two centering jaws for cooperating with the wafer, each of the centering jaws having an arc-shaped clamping surface that matches the outer edge of the wafer; the two centering jaws are arranged at intervals and are centrally symmetrical about the center of the wafer, and the center line between the two supporting platforms coincides with the center line between the two symmetrical jaws.

[0011] As a further improvement of an embodiment of the present invention, the clamping surface corresponds to a central angle, and the range of the central angle is 60° to 90°.

[0012] As a further improvement of one embodiment of the present invention, the wafer centering device includes two centering jaws that are spaced apart and arranged in a centrally symmetrical manner, and a movable mechanism that cooperates with one of the centering jaws; the movable mechanism includes a fixed block arranged on the side of the centering jaw away from the wafer, and an elastic member arranged between the fixed block and the centering jaw, and the fixed block is stationary relative to the supporting platform.

[0013] As a further improvement of an embodiment of the present invention, the movable mechanism includes a guide column arranged between the fixed block and the centering clamping claw, and the axial direction of the guide column is the same as the deformation direction of the elastic member.

[0014] Compared with the existing technology, the utility model provides a wafer alignment device, including two support platforms that are arranged at intervals and symmetrically support the wafer. The distance between the two support platforms is greater than the radius of the wafer and less than three-quarters of the diameter of the wafer; space is reserved between the two support platforms to be compatible with wafer-taking robots of different shapes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of a wafer centering device in one embodiment of the present invention.

[0016] Figure 2 This is a three-dimensional diagram of a wafer hidden by a wafer centering device in one embodiment of the present invention.

[0017] Figure 3 It is a side view of a wafer centering device in one embodiment of the present invention.

[0018] Figure 4 This is an exploded view of a wafer centering device in one embodiment of the present invention.

[0019] Figure 5 It is an exploded view of the movable mechanism in one embodiment of the present invention.

[0020] Figure 6 It is a top view of a wafer centering device in one embodiment of the present invention.

[0021] Figure 7 It is a cross-sectional view of a wafer alignment device in an embodiment of the present utility model.

[0022] Figure 8 It is a cross-sectional view of the wafer alignment device from another angle in an embodiment of the present utility model. Specific Embodiments

[0023] The present utility model will be described in detail below in conjunction with the specific embodiments shown in the drawings. However, these embodiments do not limit the present utility model, and any structural, method, or functional transformation made by those of ordinary skill in the art based on these embodiments is included within the protection scope of the present utility model.

[0024] It should be noted that the term "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or device. In addition, the terms "first", "second", "third", "fourth", etc. are used only for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0025] The term "connected", "connected to" or any other variant is intended to cover various relative positions of existing connection relationships, so as to include direct connection or indirect connection. Among them, direct connection can be formed through a gas pipeline, and indirect connection can be a connection relationship constructed through devices such as valve bodies and sensors, can be a connection relationship constructed through gas pipeline components such as a brake control unit, or can be a connection relationship constructed through any other medium such as air.

[0026] Please refer to Figure 1-2 As shown, it is a schematic structural diagram of a wafer alignment device 100 provided by an embodiment of the present utility model, and a wafer 200 is located inside the wafer alignment device 100. The wafer alignment device 100 is used to align the wafer during the transfer process of the wafer 200 to prevent the wafer 200 from being eccentric when entering the rotating machine platform subsequently.

[0027] In one embodiment, the wafer alignment device 100 includes two carrier platforms 10 for supporting the wafer 100 and two alignment jaws 30. Among them, the carrier platform 10 is used to cooperate with the surface of the wafer 200 to support the wafer 200, and the alignment jaw 30 is used to cooperate with the outer edge of the wafer 200 to clamp and align the wafer 200.

[0028] In one embodiment, the two carrying platforms 10 are spaced apart and symmetrically support the wafer 200. The distance between the two carrying platforms 10 is greater than the radius R of the wafer and less than three-quarters of the diameter of the wafer. In this way, sufficient space is reserved between the two carrying platforms 10, which can be compatible with different-shaped wafer pick-up manipulators.

[0029] Specifically, the two carrying platforms 10 are centrosymmetrically arranged about the center of the wafer 100, with good symmetry, and the supporting force received by the wafer 200 is more balanced and stable.

[0030] Each carrying platform 10 has a fitting portion 11 that fits with the surface of the wafer. The distance between the two ends of each fitting portion 11 is greater than half of the radius R of the wafer and less than the radius R of the wafer. If the distance between the two ends of the fitting portion 11 is too large, the occupied space will increase; if the distance is too small, the supporting range will be too small.

[0031] In one embodiment, each carrying platform 10 extends linearly, the two carrying platforms 10 are parallel to each other, the fitting portion 11 is rectangular, and the distance between the two ends of the fitting portion 11 is the length of the fitting portion 11.

[0032] In other embodiments, each carrying platform 10 may extend in an arc shape, the fitting portion 11 is arc-shaped, and the distance between the two ends of the fitting portion 11 is the chord length of the corresponding arc.

[0033] In yet another embodiment, each carrying platform 10 extends in a zigzag shape. For example, the fitting portion 11 is V-shaped, and the distance between the two ends of the fitting portion 11 is the straight-line distance between the two endpoints.

[0034] The fitting portion 11 includes at least two vacuum adsorption holes 110 for vacuum-adsorbing the surface of the wafer and a sealing gasket 111 correspondingly arranged for each vacuum adsorption hole. The carrying platform 10 is designed with a vacuum function to prevent the wafer 200 waiting after centering from having displacement; adding the sealing gasket 111 strengthens the sealing performance of the vacuum adsorption.

[0035] Specifically, the vacuum sealing gasket 111 is made of an anti-static material of PTFE, with a moderate hardness range and a roughness range of 1 - 1.5 um, bringing a good sealing effect and an anti-slip effect.

[0036] Combined with Figure 4 As shown, when the fitting portion 11 is rectangular, vacuum adsorption holes 110 are respectively arranged at the two ends of the fitting portion 11 to vacuum-adsorb the surface of the wafer, so that the wafer 200 is fixed in the wafer centering device 100. In other embodiments, multiple vacuum adsorption holes 110 can also be added to the fitting portion 11.

[0037] Combined with Figure 3As shown, each of the carrier platforms 10 has a support portion 13 connected to the fitting portion 11. The support portion 13 has a vacuum socket 130 communicating with the vacuum suction holes 110. Each of the vacuum sockets 130 is located outside the support portion 13 and does not occupy the space inside the carrier platform 10.

[0038] In one embodiment, in combination Figure 7-8 As shown, the carrier platform 10 is integrally in an I-shape. The carrier platform 10 itself is also a symmetric structure. The fitting portion 11 extends horizontally. The support portion 13 includes a vertically extending support body 131 and a fixing portion 132 located at the bottom of the support body 131. The fixing portion 132 is used for fixed cooperation with an external structure.

[0039] The vacuum socket 130 is provided on the outside of the support body 131. An air extraction channel is provided inside the support body 131 and the fitting portion 11 for gas transmission. The vacuum socket 130 and the vacuum suction holes 110 are respectively two ports of the air extraction channel.

[0040] The vacuum socket 130 is provided at the middle part of the support body 131 and close to the fixing portion 132. Therefore, the gas from the two vacuum suction holes 110 converges from both ends to the middle and then converges downward, and thus is drawn out from the vacuum socket 130.

[0041] In other embodiments, regardless of the shape of the carrier platform 10 designed, as long as an air extraction channel is formed inside, vacuum adsorption on the surface of the wafer can be achieved.

[0042] The wafer centering device 100 includes a vacuum pipeline 50 connected to the vacuum socket 130. Since air extraction cannot be directly performed inside the carrier platform 10, an external vacuum pipeline 50 is used to evacuate the air extraction channel.

[0043] The wafer centering device 100 includes a pressure detection device provided at the connection between the vacuum pipeline 50 and the vacuum socket 130. By detecting the pressure state at this place, it is judged whether the air extraction channel is in a vacuum state or in a vacuum leakage state.

[0044] In one embodiment, the wafer centering device 100 includes two centering jaws 30 for cooperating with the wafer 200. Each of the centering jaws 30 has an arc-shaped clamping surface 31 matching the outer edge of the wafer 200. In this way, the two centering jaws 30 center the wafer by clamping the outer edge of the wafer 200.

[0045] Specifically, the clamping surface 31 corresponds to a central angle, and the range of the central angle is 60° to 90°. The central angle range corresponding to the outer edge of the wafer clamped by the two clamping surfaces 31 is 120°-180°. The clamping range is moderate, which is conducive to the centering positioning of the wafer 200.

[0046] The two centering jaws 30 are spaced apart and symmetrically arranged about the center C of the wafer, so that the clamping force on the wafer 200 is balanced, and the wafer is not easily displaced or damaged.

[0047] The center line between the two carrying platforms 10 coincides with the center line between the two symmetrical grippers 30. Specifically, the two carrying platforms 10 are symmetrical about the center C, and the two symmetrical grippers 30 are also symmetrical about the center C. Moreover, each carrying platform 10 and the symmetrical grippers 30 correspond to substantially the same position range of the wafer along the circumferential direction. In this way, the space occupied by the carrying platforms 10 along the circumferential direction largely overlaps with the space occupied by the symmetrical grippers 30 along the circumferential direction, thereby reserving more space for the wafer removal robot.

[0048] In one embodiment, the wafer centering device 100 includes a movable mechanism 40 that cooperates with one of the centering jaws 30, and the movable mechanism 40 includes a fixed block 41 arranged on the side of the centering jaw 30 away from the wafer, and an elastic member 42 arranged between the fixed block 41 and the centering jaw 30, and the fixed block 41 is stationary relative to the supporting platform 10.

[0049] Combine Figure 5-6 As shown, the fixed block 41 should be relatively fixed to the external structure, and the carrying platform 10 is also relatively fixed to the external structure. The fixed block 41 and the carrying platform 10 are relatively stationary. In other words, when the wafer 200 does not rotate, the fixed block 41 is stationary relative to the wafer.

[0050] An elastic member 42 is disposed between the fixed block 41 and the centering jaws 30. When the wafer 200 is placed in the wafer centering device 100, the presence of the elastic member 42 allows the centering jaws 30 to move radially relative to the wafer. The elastic member 42 is a spring, and the direction of the spring's force is the line connecting the centers of the two support platforms 10, which is also the line connecting the centers of the two symmetrical jaws 30.

[0051] When wafer 200 is placed, the centering jaws 30 can slightly avoid the wafer 200 to prevent damage from excessive interference. Understandably, the range of movement of the centering jaws 30 is very small, between 1-3 mm, to meet the high precision requirements of the wafer centering process. After the wafer is placed, the elastic member 42 returns to its original shape, driving the centering jaws 20 back to their original position, gripping the outer edge of the wafer.

[0052] In one embodiment, the movable mechanism 40 includes a guiding column 43 disposed between the fixed block 41 and the centering jaw 30, and the axial direction of the guiding column 43 is the same as the deformation direction of the elastic member 42.

[0053] In other words, the direction in which the elastic member 42 applies force to the symmetric jaw 30 is also the direction in which the guiding column 43 guides the symmetric jaw 30. When the elastic member 42 drives the centering jaw 30 to move, the guiding column 43 guides the moving direction of the centering jaw 30 to prevent deviation, so as to meet the requirements of high precision in the wafer centering process.

[0054] The beneficial effects of the present utility model are as follows: sufficient space is reserved between the two spaced-apart carrying platforms 10 to be compatible with different-shaped wafer picking robots; the two carrying platforms 10 and the two symmetric jaws 30 are both centrosymmetrically arranged, and the adsorption force and the clamping force can both be kept balanced; an active mechanism 40 is provided on one of the symmetric jaws 30, and the symmetric jaw 30 can slightly avoid the wafer 200 to prevent damage caused by hard interference.

[0055] It can be formed corresponding to any of the technical solutions provided above, and will not be elaborated here.

[0056] It should be understood that although this specification is described according to embodiments, not each embodiment only includes an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0057] The series of detailed descriptions listed above are only specific descriptions of the feasible embodiments of the present utility model, and they are not intended to limit the protection scope of the present utility model. Any equivalent embodiments or modifications made without departing from the technical spirit of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer alignment device, characterized in that, include: Two supporting platforms are used to support the wafer, the two supporting platforms are arranged at intervals and symmetrically support the wafer, and the distance between the two supporting platforms is greater than the radius of the wafer and less than three-quarters of the diameter of the wafer; the wafer centering device includes two centering jaws that are spaced apart and centrally symmetrically arranged, and a movable mechanism that cooperates with one of the centering jaws; the movable mechanism includes a fixed block arranged on the side of the centering jaw away from the wafer, and an elastic member arranged between the fixed block and the centering jaw, and the fixed block is stationary relative to the supporting platform; the movable mechanism includes a guide column arranged between the fixed block and the centering jaw, and the axial direction of the guide column is the same as the deformation direction of the elastic member.

2. The wafer alignment device according to claim 1, characterized in that, The two carrying platforms are centrally symmetrically arranged about the center of the wafer.

3. The wafer alignment device according to claim 1, characterized in that, Each of the carrying platforms has a bonding portion matched with the surface of the wafer, and the distance between two ends of each of the bonding portions is greater than half the radius of the wafer and smaller than the radius of the wafer.

4. The wafer alignment device according to claim 1, characterized in that, Each of the carrying platforms has a bonding portion matched with the surface of the wafer, and the bonding portion includes at least two vacuum adsorption holes for vacuum adsorption of the surface of the wafer.

5. The wafer alignment device according to claim 4, characterized in that, The fitting portion includes a sealing pad correspondingly arranged at each of the vacuum adsorption holes.

6. The wafer alignment device according to claim 4, wherein Each of the carrying platforms has a supporting portion connected to the laminating portion, and the supporting portion has a vacuum socket connected to the vacuum adsorption hole, and each of the vacuum sockets is located on the outside of the supporting portion.

7. The wafer alignment device according to claim 2, characterized in that, The wafer centering device includes two centering jaws for cooperating with the wafer, each of the centering jaws having an arc-shaped clamping surface that matches the outer edge of the wafer; the two centering jaws are arranged at intervals and are centrally symmetrical about the center of the wafer, and the center line between the two supporting platforms coincides with the center line between the two centering jaws.

8. The wafer alignment device according to claim 7, characterized in that, The clamping surface corresponds to a central angle, and the central angle ranges from 60° to 90°.

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