Wafer adsorption device

Abstract

The utility model provides a wafer adsorption device, comprising a frame body, a vacuum chuck assembly, a rotation driving device and a vacuum pump, the vacuum chuck assembly comprises an adsorption disc and a supporting table, the supporting table is fixedly connected to the top of the frame body, the adsorption disc is rotatably connected to the supporting table and is connected with the output end of the rotation driving device, and the bottom of the adsorption disc is provided with an annular groove; a plurality of air suction holes are distributed in the annular groove at equal intervals, an air inlet hole communicated with the annular groove is formed in the supporting table, and the air inlet hole is communicated with a vacuum pump through a pipeline; a pipeline support is arranged in the frame body, a pipeline can be arranged along the pipeline support, the pipeline support comprises two parallel vertical beams, the bottoms of the two vertical beams are connected to the frame body, transverse frames are arranged on the tops of the two vertical beams, and a plurality of buckles used for fixing the pipeline are arranged on the vertical beams and the transverse frames. According to the adsorption device, the wafer can be stably adsorbed, the wafer can be driven to rotate automatically, pipelines of an internal gas circuit can be arranged in order, and winding is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of adsorption devices, and more specifically, to a wafer adsorption device. Background Art

[0002] A wafer is a basic raw material for manufacturing semiconductor devices. In the processing procedures such as grinding and polishing of wafers, it is not only necessary to stably fix the wafer, but also to enable the wafer to rotate by itself. At present, generally a vacuum adsorption device is used to adsorb and fix the wafer and drive the wafer to rotate by itself. When the vacuum adsorption device drives the wafer to rotate, the pipelines of the gas path are prone to entanglement. In addition, to improve the adsorption stability and balance, a plurality of air holes are generally opened in the vacuum chuck, and a plurality of gas paths are branched through an adapter and communicated with the air holes respectively. Therefore, a plurality of pipelines need to be connected inside, and the pipelines generally use flexible hoses. When a plurality of pipelines are connected, they are prone to cross each other, making the pipelines messy.

[0003] In view of this, the applicant has specifically proposed this application after studying the existing technologies. Summary of the Utility Model

[0004] The utility model provides a wafer adsorption device, aiming to improve at least one of the above technical problems.

[0005] To solve the above technical problems, the utility model provides a wafer adsorption device, which includes a frame body, a vacuum chuck assembly joined to the frame body, and a rotation driving device and a vacuum pump disposed in the frame body.

[0006] The vacuum chuck assembly includes an adsorption disc and a support table. The support table is fixedly connected to the top of the frame body. The adsorption disc is rotatably connected to the support table through a rotating shaft. The rotating shaft passes through the frame body and is connected to the output end of the rotation driving device. An annular groove is provided at the bottom of the adsorption disc, so that an annular air passage can be formed between the adsorption disc and the support table. A plurality of suction holes are arranged at equal intervals in the annular groove. At least two air inlet holes communicating with the annular air passage are provided in the support table. The air inlet holes are communicated with the vacuum pump through pipelines.

[0007] A pipeline support is provided in the frame body, and the pipeline can be arranged along the pipeline support. The pipeline support includes two parallel vertical beams. The bottoms of the two vertical beams are connected to the frame body, and a cross frame is provided at the top. The cross frame is connected to the top of the frame body. A plurality of buckles for fixing the pipeline are provided on both the vertical beams and the cross frame.

[0008] As a further optimization, a plurality of cross beams are further arranged between the two vertical beams, and the rotation driving device is connected to the cross beam.

[0009] As a further optimization, the vacuum pump is connected to the bottom of the frame through a fixing seat.

[0010] As a further optimization, there are three air inlets, and the three air inlets are arranged at equal intervals. A threaded joint is connected to the air inlet for connecting a pipeline.

[0011] As a further optimization, a bearing is sleeved on the rotating shaft, and the rotating shaft is rotatably connected in the supporting platform through the bearing.

[0012] As a further optimization, a pressure sensor and a three-way valve are further provided at the bottom of the frame. The three-way valve is connected to the vacuum pump, the air inlet and the pressure sensor through pipelines.

[0013] As a further optimization, a five-way pipe joint is provided on the vertical beam near the three-way valve, and the five-way pipe joint is connected to the three-way valve and the air inlet through pipelines.

[0014] As a further optimization, the rotation driving device is a motor.

[0015] As a further optimization, a connected mesh groove is provided on the top surface of the suction disc, the suction hole is located in the mesh groove, and the mesh groove can form a sealed adsorption air channel with the bottom of the wafer.

[0016] As a further optimization, the supporting platform and the top of the frame are fixedly connected by bolts.

[0017] By adopting the above technical solutions, the following technical effects can be achieved by the present utility model:

[0018] In a wafer adsorption device of the present application, the supporting platform is fixedly connected to the top of the frame, the suction disc is rotatably connected to the supporting platform through a rotating shaft, and the rotating shaft is connected to the output end of the rotation driving device, so that the rotation adsorption device can drive the suction disc to rotate. An annular groove is provided at the bottom of the suction disc, so that an annular air channel can be formed between the supporting platform and the suction disc. An air inlet communicating with the annular groove is provided on the supporting platform, and a suction hole communicating with the annular groove is provided on the suction disc, so that the suction disc can rotate while adsorbing the wafer and always maintain the state of air path connection. During rotation, the pipeline part is fixed and the problem of pipeline entanglement will not occur; by arranging a pipeline support in the frame and providing a buckle on the pipeline support, the pipeline can be laid along the pipeline support and fixed by the buckle, so that the internal pipelines can be neatly distributed, avoiding the pipelines from crossing each other and being messy, and also facilitating the disassembly and replacement of the pipelines. Description of the Drawings

[0019] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0020] Figure 1 is a schematic structural diagram of a wafer adsorption device of the present utility model from a first perspective;

[0021] Figure 2 is a schematic structural diagram of a wafer adsorption device of the present utility model from a second perspective;

[0022] Figure 3 is a schematic structural diagram of a vacuum chuck assembly;

[0023] Figure 4 is a cross-sectional view of the vacuum chuck assembly;

[0024] Figure 5 is a schematic structural diagram of a pipe support;

[0025] Figure 6 is a schematic diagram of pipeline connection;

[0026] Reference numerals in the figures: 1 - frame; 2 - vacuum chuck assembly; 21 - adsorption disc; 22 - support table; 23 - annular groove; 24 - suction hole; 25 - air inlet hole; 26 - rotating shaft; 27 - threaded joint; 28 - bearing; 29 - mesh groove; 3 - rotation driving device; 4 - vacuum pump; 41 - fixing seat; 5 - pipe support; 51 - vertical beam; 52 - horizontal frame; 53 - cross beam; 54 - buckle; 6 - pressure sensor; 7 - three-way valve; 8 - five-way pipe joint. Specific embodiments

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present utility model. Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the present utility model to be protected, but merely represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present utility model.

[0028] Embodiment

[0029] As shown by Figures 1 to 5 Figures 1 to 5

[0030] The vacuum chuck assembly 2 includes a suction disc 21 and a support table 22. The support table 22 is fixedly connected to the top of the frame body 1 by bolts. The suction disc 21 is rotatably connected to the support table 22 through a rotating shaft 26. The rotating shaft 26 passes through the frame body 1 and is connected to the output end of the rotary drive device 3. An annular groove 23 is provided at the bottom of the suction disc 21, so that an annular air passage can be formed between the suction disc 21 and the support table 22. A plurality of suction holes 24 are arranged equidistantly along the circumference in the annular groove 23. At least two air inlet holes 25 communicating with the annular air passage are provided in the support table 22. The air inlet holes 25 are communicated with the vacuum pump 4 through pipelines, so that the vacuum pump 4 can pump air to form a negative pressure, and thus the suction disc 21 can adsorb the wafer. The rotary drive device 3 can drive the suction disc 21 to rotate, and then drive the wafer to rotate itself. An annular air passage is formed between the suction disc 21 and the support table through the annular groove 23. When the suction disc 21 rotates, the suction holes 24 can always be in a communicating state with the pipeline part, and the pipeline part can be fixed. Therefore, the problem of pipeline entanglement caused by the rotation of the chuck will not occur.

[0031] A pipeline support 5 is provided in the frame body 1. The pipeline can be arranged along the pipeline support 5. The pipeline support 5 includes two parallel vertical beams 51. The bottoms of the two vertical beams 51 are connected to the frame body 1, and a cross frame 52 is provided at the top. The cross frame 52 is connected to the top of the frame body 1. A plurality of buckles 54 for fixing the pipeline are provided on both the vertical beams 51 and the cross frame 52. After the pipeline is arranged along the pipeline support 5, it can be fixed by the buckles, so that the internal pipelines can be neatly distributed, avoiding the internal pipelines from being messy and cross-entangled, and also facilitating the disassembly and replacement of the pipelines.

[0032] Furthermore, a plurality of cross beams 53 are further provided between the two vertical beams 51. The rotary drive device 3 is connected to the cross beam 53. In this application, the rotary drive device adopts a rotary motor, and the rotating shaft 26 is in transmission cooperation with the output shaft of the rotary motor through a spline.

[0033] The vacuum pump 4 is connected to the bottom of the frame body 1 through a fixing seat 41. A pressure sensor 6 and a three-way valve 7 are further provided at the bottom of the frame body 1. The three-way valve 7 is communicated with the vacuum pump 4, the air inlet hole 25 and the pressure sensor 6 through pipelines, so that the pressure sensor 6 can monitor the air pressure in the air circuit at all times. A five-way pipe joint 8 is provided on the vertical beam 51 close to the three-way valve 7. The five-way pipe joint 8 is communicated with the three-way valve 6 and the air inlet hole 25 through pipelines, and multiple air circuits are branched through the five-way pipe joint 8. Refer to Figure 6As shown, in the present application, the vacuum pump 4 is connected to the three-way valve 6 through a single pipeline. The other two interfaces of the three-way valve 6 are respectively connected to the pressure sensor 6 and the five-way pipe joint 8 through pipelines. Three of the interfaces of the five-way pipe joint 8 are respectively connected to three threaded joints 27 through pipelines, and the other joint is sealed.

[0034] Furthermore, the support table 22 is provided with a circular groove at the middle position, and the suction disc 22 can be fitted into the circular groove. At the position corresponding to the annular groove 23, the support table 22 is provided with three air inlet holes 25 equidistantly in the circumferential direction. Threaded joints 27 are provided on all three air inlet holes 25 for connecting pipelines. By evacuating the annular air passage through the three equidistantly arranged air inlet holes, a negative pressure can be formed more stably. Preferably, sealing rings can be provided on the inner and outer sides of the contact surface between the suction disc 21 and the support table 22 for sealing to improve the airtightness of the air path.

[0035] Furthermore, a bearing 28 is sleeved on the rotating shaft 26 and is rotatably connected in the support table 22 through the bearing 28, thereby reducing the friction between the side wall of the rotating shaft 26 and the support table 22 and reducing frictional wear.

[0036] Furthermore, a connected mesh groove 29 is formed on the top surface of the suction disc 22, and the air suction holes 24 are located in the mesh groove 29. When sucking the wafer, the bottom of the wafer can seal the mesh groove 29, so that the mesh groove 29 is in a negative pressure state, sucking the wafer, thereby increasing the suction area of the suction disc 22 and improving the suction stability.

[0037] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A wafer adsorption device, comprising a frame body, a vacuum chuck assembly joined to the frame body, and a rotary drive device and a vacuum pump disposed within the frame body, characterized in that: The vacuum chuck assembly includes an adsorption disc and a support table. The support table is fixedly connected to the top of the frame body. The adsorption disc is rotatably connected to the support table through a rotating shaft. The rotating shaft passes through the frame body and is connected to the output end of the rotary drive device. An annular groove is provided at the bottom of the adsorption disc, enabling an annular air passage to be formed between the adsorption disc and the support table. A plurality of suction holes are arranged at equal intervals in the annular groove. At least two air inlet holes communicating with the annular groove are provided within the support table. The air inlet holes are connected to the vacuum pump through pipelines; A pipeline support is provided within the frame body, and the pipeline can be arranged along the pipeline support. The pipeline support includes two parallel vertical beams. The bottoms of the two vertical beams are connected to the frame body, and a cross frame is provided at the top. The cross frame is connected to the top of the frame body. A plurality of buckles for fixing pipelines are provided on both the vertical beams and the cross frame.

2. The wafer adsorption device according to claim 1, characterized in that , A plurality of cross beams are further provided between the two vertical beams, and the rotary drive device is connected to the cross beams.

3. A wafer adsorption device according to claim 1, characterized in that , The vacuum pump is connected to the bottom of the frame body through a fixing seat.

4. A wafer adsorption device according to claim 1, wherein , Three air inlet holes are provided, and the three air inlet holes are arranged at equal intervals. A threaded joint is connected to the air inlet hole for connecting a pipeline.

5. A wafer adsorption device according to claim 1, characterized in that , A bearing is sleeved on the rotating shaft, and the rotating shaft is rotatably connected within the support table through the bearing.

6. The wafer adsorption device according to claim 1, wherein , A pressure sensor and a three-way valve are further provided at the bottom of the frame body. The three-way valve is connected to the vacuum pump, the air inlet hole, and the pressure sensor through pipelines.

7. The wafer adsorption device according to claim 6, characterized in that , A five-way pipe joint is provided on the vertical beam near the three-way valve. The five-way pipe joint is connected to the three-way valve and the air inlet hole through pipelines.

8. The wafer adsorption device according to claim 1, characterized in that , The rotary drive device is a motor.

9. A wafer adsorption device according to claim 1, characterized in that , A mesh groove communicating with each other is provided on the top surface of the adsorption disc, and the suction holes are located within the mesh groove. The mesh groove can form a sealed adsorption air passage with the bottom of the wafer.

10. A wafer adsorption device according to claim 1, characterized in that , The support table and the top of the frame body are fixedly connected by bolts.

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