Intelligent packaging module with pins at top and heat dissipation at bottom
By designing an intelligent packaging module for heat dissipation at the bottom of the top foot, using a multi-layer PCB board and a conductive sleeve structure to connect peripheral devices, the heat dissipation and area problems of chip packaging in the existing technology are solved, and efficient heat dissipation and high-integration chip packaging are achieved.
Patent Information
- Application Number
- CN202422452053.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-11
AI Technical Summary
The existing chip packaging technology has problems such as large drive loop parasitism, large switching losses, large chip area, and poor heat dissipation capabilities, and cannot support high-power applications.
Design an intelligent packaging module for heat dissipation at the bottom of the top foot, adopting a built-in multi-layer PCB board, which integrates the target power chip and peripheral working devices through multi-layer traces, uses Pin pin and conductive sleeve structure to connect peripheral devices, and dissipates heat through a radiator or DBC double-sided copper-clad ceramic substrate.
Effectively control the area of the packaging module, improve work efficiency and heat dissipation effect, reduce parasitic losses, enhance current capabilities, and is suitable for more application scenarios.
Smart Images
Figure CN223181135U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an intelligent packaging module with pins at the top and heat dissipation at the bottom, belonging to the technical field of chip packaging modules. Background Art
[0002] Chip packaging technology is a process technology that wraps memory chips to avoid contact between the chips and the outside world and prevent damage to the chips from the outside. Currently, the common forms of packaging modules are as Figure 1 , Figure 2 , Figure 3 shown, among which, Figure 1 is the housing and top pin structure (Housing&TOP Pin), with only power chips (IGBT / SBD / MOS, etc.) inside. The pins are welded on a ceramic substrate, the pins come out from the top, and a plastic shell (Casing) is used as the housing for protection, and silicone grease is filled inside; Figure 2 is the IPM structure, generally having two boards, one is a ceramic substrate for welding the main chip, and the other is a PCB for welding the drive and passive devices; Figure 3 is the flat packaging of various chips and passive devices on the PCB, without an insulation and heat dissipation structure, and is generally used in low-voltage scenarios.
[0003] However, in actual applications, the above existing technical solutions still have certain deficiencies. Among them, Figure 1 the solution shown only integrates power devices, with the drive and passive devices external. The parasitic of the drive circuit is large and the switching loss is large; Figure 2 in the solution shown, the circuit between the chips is long, the parasitic is large, the switching loss is large, and the chips and passive devices adopt a flat structure, resulting in a large area of the product; Figure 3 in the solution shown, the chips adopt a flat structure, resulting in a large area of the product, and the heat dissipation ability is poor, and the surface-mounted pins have limited dimensions and cannot support high-power applications. Summary of the Utility Model
[0004] The technical problem to be solved by the utility model is to provide an intelligent packaging module with pins at the top and heat dissipation at the bottom, solve the deficiencies of the existing technology, and while realizing external peripheral working devices, efficiently realize heat dissipation and improve work efficiency.
[0005] The present utility model adopts the following technical solutions to solve the above technical problems: The present utility model designs an intelligent packaging module with feet protruding from the top and heat dissipation at the bottom, which is used for system packaging of each target power chip and each surrounding working device respectively connected to it in operation. It includes a multi-layer PCB board with at least two layers of wiring built-in. Among them, various external connectors are arranged on the upper surface of the multi-layer PCB board. The bottom layer of wiring in the multi-layer PCB board is exposed on the lower surface of the multi-layer PCB board. A layout area is formed between one group of adjacent two layers of wiring in the multi-layer PCB board, and the remaining groups of adjacent two layers of wiring are electrically connected. The upper and lower two layers of wiring corresponding to the layout area are electrically connected through a first copper pillar. Each target power chip is arranged in the layout area of the multi-layer PCB board. Each contact on each target power chip is electrically connected to other corresponding target power chips or various external connectors on the upper surface of the multi-layer PCB board through each layer of wiring in the multi-layer PCB board, and each external connector is electrically connected to each surrounding working device. The working heat dissipation surfaces of each target power chip are respectively in contact with the adjacent layer of wiring facing them, and through the connection between the adjacent layers of wiring, the working heat of each target power chip is conducted to the bottom layer of wiring and dissipated to the external space.
[0006] As a preferred technical solution of the present utility model: It further includes various Pin pins. The external connector includes a first pad and a second copper pillar. The number of Pin pins is equal to the number of second copper pillars, and each Pin pin corresponds to each second copper pillar one by one. Each first pad and each second copper pillar are respectively arranged on the upper surface of the multi-layer PCB board, and each second copper pillar is perpendicular to the upper surface of the multi-layer PCB board. The structures of each Pin pin are the same. Each Pin pin respectively includes a thimble part and a hollow conductive sleeve part. In the structure of each Pin pin, the top of the conductive sleeve part is closed, the bottom of the conductive sleeve part is open to communicate with the internal space, the inner diameter of the bottom opening of the conductive sleeve part is adapted to the outer diameter of the horizontal cross-section of the corresponding second copper pillar, and one end of the thimble part is fixedly connected to the top of the conductive sleeve part from the outside of the conductive sleeve part. Each Pin pin respectively sleeved the bottom opening of its conductive sleeve part on the corresponding second copper pillar, and each surrounding working device is electrically connected by each first pad and the thimble part of each Pin pin.
[0007] As a preferred technical solution of the present utility model: the structures of the ejector pins among the respective Pin pins are the same. Each ejector pin respectively includes a conductive rod, a conductive limiting member, and an oval-shaped annular conductive member. In the structure of each ejector pin, one end of the conductive rod is fixedly connected to the top of the conductive sleeve member outside the conductive sleeve member, one side of the conductive limiting member is fixedly connected to the other end of the conductive rod, the annular conductive member is an elastic deformation structure. Based on the two sides corresponding to the two ends of the short axis of the ellipse on the annular conductive member being pressed, the annular conductive member extends and elastically deforms along the direction of the two ends of the long axis of the ellipse. The end corresponding to one end of the long axis of the ellipse on the annular conductive member is fixedly connected to the other side of the conductive limiting member. Each peripheral working device electrically connected to each Pin pin is respectively sleeved on the annular conductive member of the ejector pin in the corresponding Pin pin, and the sleeved peripheral working device is limited by the corresponding conductive limiting member.
[0008] As a preferred technical solution of the present utility model: it further includes various metal parts arranged on the upper surface of the multi-layer PCB board, and each metal part is electrically connected downward to the traces in the multi-layer PCB board, and external device components are connected through the metal parts on the upper surface of the multi-layer PCB board.
[0009] As a preferred technical solution of the present utility model: it further includes a radiator. The exposed bottom traces on the lower surface of the multi-layer PCB board are connected to the radiator through a heat-conducting material layer, and the radiator further dissipates the heat dissipated by the bottom traces.
[0010] As a preferred technical solution of the present utility model: it further includes a DBC double-sided copper-clad ceramic substrate. The exposed bottom traces on the lower surface of the multi-layer PCB board are connected to one copper layer on one side of the DBC double-sided copper-clad ceramic substrate through a highly heat-conductive and conductive welding material. The heat dissipated by the bottom traces in the multi-layer PCB board reaches the DBC double-sided copper-clad ceramic substrate through the highly heat-conductive and conductive welding material, and the heat is dissipated from the other copper layer on the DBC double-sided copper-clad ceramic substrate to the external space.
[0011] As a preferred technical solution of the present utility model: it further includes various second solder pads arranged on the lower surface of the multi-layer PCB board, and each second solder pad is electrically connected upward to the traces in the multi-layer PCB board, and peripheral working devices are connected through the second solder pads on the lower surface of the multi-layer PCB board.
[0012] As a preferred technical solution of the present utility model: a plastic sealing layer is arranged on the lower surface of the multi-layer PCB board, and the plastic sealing layer wraps around the side of the DBC double-sided copper-clad ceramic substrate for one week and the surfaces of the peripheral working devices connected by the second solder pads. The surface of the DBC double-sided copper-clad ceramic substrate facing away from the multi-layer PCB board is exposed to the external space.
[0013] As a preferred technical solution of the present utility model: the highly heat-conductive and conductive welding material is any one of solder, silver glue, and sintered silver.
[0014] As a preferred technical solution of the present utility model: the peripheral working devices include a drive control chip and various passive components.
[0015] For the intelligent packaging module with top pins and bottom heat dissipation of the present utility model, compared with the prior art by adopting the above technical solution, it has the following technical effects:
[0016] The present utility model designs an intelligent packaging module with top pins and bottom heat dissipation, with a multi-layer PCB board with built-in multi-layer wiring, and each target power chip is arranged in the interlayer. Cooperating with the conductivity and thermal conductivity under the electrical connection between each layer of wiring, on the one hand, each external component on the upper surface of the multi-layer PCB board is connected to each peripheral working device, and on the other hand, heat is dissipated outward from the lower surface of the peripheral working device. Through high integration, while effectively controlling the top view area of the packaging module, the working efficiency and heat dissipation effect are improved, and various external component structures are designed in the application to suit the connection methods of various types of peripheral working devices. Moreover, an external heat dissipation device is used to further improve the heat dissipation effect; the overall design scheme has low parasitics, higher efficiency, stronger current-carrying capacity, and can be applied to more application combination scenarios, effectively improving the working efficiency. Description of the Drawings
[0017] Figure 1 is a schematic diagram of the prior art shell and thimble structure;
[0018] Figure 2 is a schematic diagram of the prior art IPM structure;
[0019] Figure 3 is a schematic diagram of the prior art flat packaging structure of various chips and passive devices on a PCB;
[0020] Figure 4 is a schematic diagram of the first embodiment of the intelligent packaging module with top pins and bottom heat dissipation designed by the present utility model;
[0021] Figure 5 is a schematic diagram of the second embodiment of the intelligent packaging module with top pins and bottom heat dissipation designed by the present utility model.
[0022] Among them, 1. Target power chip, 2. Wiring, 3. Multi-layer PCB board, 4. First copper column, 5. Pin, 5-1. Conductive sleeve part, 5-2. Conductive rod, 5-3. Conductive limit part, 5-4. Ring-shaped conductive part, 6. First pad, 7. Second copper column, 8. Metal part, 9. Radiator, 10. Thermal conductive material layer, 11. High thermal conductive and conductive welding material, 12. DBC double-sided copper-clad ceramic substrate, 13. Second pad, 14. Plastic encapsulation layer, 15. Peripheral working device. Detailed Embodiment
[0023] The following further elaborates on the specific implementation manners of the present utility model in conjunction with the accompanying drawings of the specification.
[0024] The present utility model designs an intelligent packaging module with feet emerging from the top and heat dissipation at the bottom, which is used to realize system packaging for each target power chip 1 and each peripheral working device 15 such as a drive control chip and various passive components that are respectively connected to it for operation. In actual applications, such as Figure 4 and Figure 5 shown, the specific design includes a multi-layer PCB board 3 with at least two layers of traces 2 built-in; among them, various external connectors are arranged on the upper surface of the multi-layer PCB board 3, the bottom layer of traces 2 in the multi-layer PCB board 3 is exposed on the lower surface of the multi-layer PCB board 3, a layout area is formed between one group of adjacent two layers of traces 2 in the multi-layer PCB board 3, the remaining groups of adjacent two layers of traces 2 are electrically connected, and the upper and lower layers of traces 2 corresponding to the layout area are electrically connected through the first copper pillar 4; each target power chip 1 is arranged in the layout area of the multi-layer PCB board 3, and each contact point on each target power chip 1 is electrically connected to other corresponding target power chips 1 or various external connectors on the upper surface of the multi-layer PCB board 3 through each layer of traces 2 in the multi-layer PCB board 3, and each peripheral working device 15 is electrically connected by each external connector; the working heat dissipation surfaces of each target power chip 1 are respectively in contact with the adjacent layer of traces 2 facing them, and through the connection between the adjacent layers of traces 2, the working heat of each target power chip 1 is conducted to the bottom layer of traces 2 and dissipated to the external space.
[0025] For the basic scheme of the above-designed intelligent packaging module, a further design also includes various Pin pins 5. The external connectors include a first pad 6 and a second copper pillar 7. As Figure 4 and Figure 5 shown, the number of Pin pins 5 is equal to the number of second copper pillars 7, and each Pin pin 5 respectively corresponds to each second copper pillar 7 one by one; each first pad 6 and each second copper pillar 7 are respectively arranged on the upper surface of the multi-layer PCB board 3, and each second copper pillar 7 is respectively perpendicular to the upper surface of the multi-layer PCB board 3; the structures of each Pin pin 5 are the same, and each Pin pin 5 respectively includes a top pin part and a hollow conductive sleeve part 5-1. In the structure of each Pin pin 5, the top of the conductive sleeve part 5-1 is closed, the bottom of the conductive sleeve part 5-1 is open to communicate with the internal space, the inner diameter of the bottom opening of the conductive sleeve part 5-1 is adapted to the outer diameter of the horizontal cross-section of the corresponding second copper pillar 7, and one end of the top pin part is fixedly connected to the top of the conductive sleeve part 5-1 from the outside of the conductive sleeve part 5-1; each Pin pin 5 respectively sleeves the bottom opening of its conductive sleeve part 5-1 on the corresponding second copper pillar 7, and each peripheral working device 15 is electrically connected by each first pad 6 and the top pin part of each Pin pin 5.
[0026] Regarding the Pin pins 5 involved here, in actual applications, it is designed that the structures of the top pin parts in each Pin pin 5 are the same, asFigure 4 and Figure 5 As shown, each thimble component is specifically designed to include a conductive rod 5-2, a conductive limiting component 5-3, and an oval-shaped annular conductive component 5-4. In the structure of each thimble component, one end of the conductive rod 5-2 is fixedly connected to the top of the conductive sleeve component 5-1 outside the conductive sleeve component 5-1. One side of the conductive limiting component 5-3 is fixedly connected to the other end of the conductive rod 5-2. The annular conductive component 5-4 is an elastic deformation structure. Based on the pressure on both sides of the annular conductive component 5-4 corresponding to the two ends of the short axis of its ellipse, the annular conductive component 5-4 undergoes elastic deformation along the direction of the two ends of its long axis. The end corresponding to one end of the long axis of the annular conductive component 5-4 is fixedly connected to the other side of the conductive limiting component 5-3. Each peripheral working device 15 electrically connected to each Pin 5 is respectively sleeved on the annular conductive component 5-4 of the thimble component in the corresponding Pin 5, and the sleeved peripheral working device 15 is limited by the corresponding conductive limiting component 5-3.
[0027] Regarding the Pin 5, in practical applications, as Figure 5 shown, in practical applications, it may also only include the conductive sleeve component 5-1 and the conductive rod 5-2, that is, simply fixedly connect one end of the conductive rod 5-2 to the top of the conductive sleeve component 5-1 outside the conductive sleeve component 5-1. Then, the peripheral working device 15 electrically connected to this Pin 5 is directly sleeved on the conductive rod 5-2 for electrical connection.
[0028] For the Pin 5 designed by the present utility model, in terms of heat dissipation, two embodiments are designed in practical applications. Among them, in Embodiment 1, as Figure 4 shown, a heat sink 9 is introduced. The bottom layer traces 2 exposed on the lower surface of the multi-layer PCB board 3 are connected to the heat sink 9 through the heat conductive material layer 10, and the heat sink 9 further dissipates the heat dissipated by the bottom layer traces 2.
[0029] In Embodiment 2, as Figure 5 shown, a DBC double-sided copper-clad ceramic substrate 12 is designed to be added. The bottom layer traces 2 exposed on the lower surface of the multi-layer PCB board 3 are connected to one copper layer on the DBC double-sided copper-clad ceramic substrate 12 through the highly heat conductive and electrically conductive welding material 11. The heat dissipated by the bottom layer traces 2 in the multi-layer PCB board 3 reaches the DBC double-sided copper-clad ceramic substrate 12 through the highly heat conductive and electrically conductive welding material 11, and the heat is dissipated from the other copper layer on the DBC double-sided copper-clad ceramic substrate 12 to the external space; the highly heat conductive and electrically conductive welding material 11 used here specifically adopts any one of solder, silver paste, and sintered silver.
[0030] And on the basis of the Embodiment 2 solution, as Figure 5As shown in the figure, various second pads 13 disposed on the lower surface of the multi-layer PCB board 3 are further designed, and each second pad 13 is electrically connected upward to the trace 2 in the multi-layer PCB board 3. The peripheral working devices 15 are connected by the second pads 13 on the lower surface of the multi-layer PCB board 3. A plastic encapsulation layer 14 is provided on the lower surface of the multi-layer PCB board 3. The plastic encapsulation layer 14 wraps around the side of the DBC double-sided copper-clad ceramic substrate 12 for one week and the surfaces of the peripheral working devices 15 connected by the second pads 13. The surface of the DBC double-sided copper-clad ceramic substrate 12 facing away from the multi-layer PCB board 3 is exposed to the external space.
[0031] Based on the above-described embodiments of the intelligent packaging module, in practical applications, various metal parts 8 disposed on the upper surface of the multi-layer PCB board 3 are further provided, and each metal part 8 is electrically connected downward to the trace 2 in the multi-layer PCB board 3. The external device components are connected by the metal parts 8 on the upper surface of the multi-layer PCB board 3.
[0032] The intelligent packaging module designed with top pins and bottom heat dissipation by the above technical solution uses a multi-layer PCB board 3 with internal multi-layer traces 2, and each target power chip 1 is interlayered. With the conductivity and thermal conductivity under the electrical connection between the multi-layer traces 2, on the one hand, each external component on the upper surface of the multi-layer PCB board 3 is connected to each peripheral working device 15, and on the other hand, heat is dissipated outward from the lower surface of the peripheral working device 15. Through high integration, while effectively controlling the top view area of the packaging module, the working efficiency and heat dissipation effect are improved. In addition, various external component structures are designed in the application to suit the connection methods of various types of peripheral working devices 15, and an external heat dissipation device is used to further improve the heat dissipation effect. The overall design scheme has low parasitics, higher efficiency, stronger current-carrying capacity, and can be applied to more application combination scenarios, effectively improving the working efficiency.
[0033] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the art.
Claims
1. An intelligent packaging module with top feet and bottom heat dissipation, which is used to realize system packaging for each target power chip (1) and each peripheral working device (15) that is respectively connected to it for work, and is characterized in that: It includes a multi-layer PCB board (3) with at least two built-in layers of traces (2); among them, various external components are arranged on the upper surface of the multi-layer PCB board (3), the bottom layer of traces (2) in the multi-layer PCB board (3) is exposed on the lower surface of the multi-layer PCB board (3), a layout area is formed between one group of adjacent two layers of traces (2) in the multi-layer PCB board (3), the remaining groups of adjacent two layers of traces (2) are electrically connected, and the upper and lower layers of traces (2) corresponding to the layout area are electrically connected through the first copper pillar (4); each target power chip (1) is arranged in the layout area of the multi-layer PCB board (3), and each contact on each target power chip (1) is electrically connected to other corresponding target power chips (1) or various external components on the upper surface of the multi-layer PCB board (3) through each layer of traces (2) in the multi-layer PCB board (3), and each external component is electrically connected to each surrounding working device (15); the working heat dissipation surfaces of each target power chip (1) are respectively in contact with the adjacent layer of traces (2) facing them, and through the connection between the adjacent layers of traces (2), the working heat of each target power chip (1) is conducted to the bottom layer of traces (2) and dissipated to the external space.
2. The intelligent packaging module with top feet and bottom heat dissipation according to claim 1, characterized in that: It also includes various Pin pins (5), the external components include the first pads (6) and the second copper pillars (7), the number of Pin pins (5) is equal to the number of the second copper pillars (7), and each Pin pin (5) corresponds to each second copper pillar (7) one by one; each first pad (6) and each second copper pillar (7) are respectively arranged on the upper surface of the multi-layer PCB board (3), and each second copper pillar (7) is respectively perpendicular to the upper surface of the multi-layer PCB board (3); the structures of each Pin pin (5) are the same, and each Pin pin (5) respectively includes a thimble part and a hollow conductive sleeve part (5-1). In the structure of each Pin pin (5), the top of the conductive sleeve part (5-1) is closed, the bottom of the conductive sleeve part (5-1) is open to communicate with the internal space, the inner diameter of the bottom opening of the conductive sleeve part (5-1) is adapted to the outer diameter of the horizontal cross-section of the corresponding second copper pillar (7), and one end of the thimble part is fixedly connected to the top of the conductive sleeve part (5-1) from the outside of the conductive sleeve part ( (5-1); each Pin pin (5) respectively sleeved the bottom opening of its conductive sleeve part (5-1) on the corresponding second copper pillar (7), and each first pad (6) and the thimble part of each Pin pin (5) are electrically connected to each surrounding working device (15).
3. The intelligent packaging module with top feet and bottom heat dissipation according to claim 2, characterized in that: The structures of the thimble parts in each Pin (5) are the same. Each thimble part respectively includes a conductive rod (5-2), a conductive limiting part (5-3), and an oval-shaped annular conductive part (5-4). In the structure of each thimble part, one end of the conductive rod (5-2) is fixedly connected to the top of the conductive sleeve part (5-1) externally by the conductive sleeve part (5-1). One side of the conductive limiting part (5-3) is fixedly connected to the other end of the conductive rod (5-2). The annular conductive part (5-4) is an elastic deformation structure. Based on the pressure on both sides corresponding to the two ends of the short axis of the ellipse on the annular conductive part (5-4), the annular conductive part (5-4) undergoes elastic deformation along the direction of the two ends of the long axis of the ellipse. The end corresponding to one end of the long axis of the ellipse on the annular conductive part (5-4) is fixedly connected to the other side of the conductive limiting part (5-3). Each peripheral working device (15) electrically connected to each Pin (5) is respectively sleeved on the annular conductive part (5-4) of the thimble part in the corresponding Pin (5), and the sleeved peripheral working device (15) is limited by the corresponding conductive limiting part (5-3).
4. The intelligent packaging module with top feet and bottom heat dissipation according to claim 1, characterized in that: It further includes each metal part (8) arranged on the upper surface of the multi-layer PCB board (3), and each metal part (8) is electrically connected downward to the trace (2) in the multi-layer PCB board (3), and external device components are connected through each metal part (8) on the upper surface of the multi-layer PCB board (3).
5. The intelligent packaging module with top feet and bottom heat dissipation according to claim 1, characterized in that: It further includes a radiator (9). The bottom trace (2) exposed on the lower surface of the multi-layer PCB board (3) is connected to the radiator (9) through a heat-conducting material layer (10), and the radiator (9) further dissipates the heat dissipated by the bottom trace (2).
6. The intelligent packaging module with top feet and bottom heat dissipation according to claim 1, characterized in that: It further includes a DBC double-sided copper-clad ceramic substrate (12). The bottom trace (2) exposed on the lower surface of the multi-layer PCB board (3) is connected to one copper layer on one side of the DBC double-sided copper-clad ceramic substrate (12) through a highly heat-conductive and conductive welding material (11). The heat dissipated by the bottom trace (2) in the multi-layer PCB board (3) reaches the DBC double-sided copper-clad ceramic substrate (12) through the highly heat-conductive and conductive welding material (11), and the heat is dissipated to the external space through the other copper layer on the DBC double-sided copper-clad ceramic substrate (12).
7. The intelligent packaging module with top foot outlet and bottom heat dissipation according to claim 6, characterized in that: It further includes each second pad (13) arranged on the lower surface of the multi-layer PCB board (3), and each second pad (13) is electrically connected upward to the trace (2) in the multi-layer PCB board (3), and the peripheral working device (15) is connected through each second pad (13) on the lower surface of the multi-layer PCB board (3).
8. The intelligent packaging module with top foot outlet and bottom heat dissipation according to claim 7, characterized in that: A plastic encapsulation layer (14) is arranged on the lower surface of the multi-layer PCB board (3). The plastic encapsulation layer (14) wraps around the side of the DBC double-sided copper-clad ceramic substrate (12) for one week and the surfaces of the peripheral working devices (15) connected by each second pad (13). The surface of the DBC double-sided copper-clad ceramic substrate (12) facing away from the multi-layer PCB board (3) is exposed to the external space.
9. The intelligent packaging module with top feet and bottom heat dissipation according to claim 6, wherein: The highly heat-conductive and conductive welding material (11) is any one of solder, silver glue, and sintered silver.
10. The intelligent packaging module with top feet and bottom heat dissipation according to any one of claims 1 to 9, characterized in that: The peripheral working device (15) includes a drive control chip and various passive components.