Power device, power device assembly and electric energy conversion equipment

Abstract

The utility model discloses a power device, a power device assembly and an electric energy conversion device, the power device comprises a circuit board and a semiconductor module, the semiconductor module is provided with a conduction part, the circuit board is provided with a first board surface and a second board surface which are opposite and is provided with a through hole, the second plate surface is a surface opposite to the semiconductor module and is electrically connected with a connecting piece, the conduction part penetrates through the through hole and is electrically connected with the connecting piece, and the area of the connecting piece is larger than that of an electric connection area on the conduction part. According to the utility model, the circuit board is provided with the through hole for the conduction part on the semiconductor module to pass through, the conduction part is electrically connected with the connecting piece on the second board surface to realize the connection of the circuit board and the semiconductor module, and the conduction part is not butted at a single position, so that the assembly difficulty of the circuit board and the semiconductor module is reduced; compared with a pinhole structure, the connecting piece is easier to process and operate, so that the electric connection effect of the circuit board and the semiconductor module can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, and particularly relates to a power device, a power device assembly and an electric energy conversion device. Background Art

[0002] A circuit board is a commonly used component in electronic devices. Currently, for a circuit board that needs to be connected to a semiconductor module, it is usually based on the pins protruding from the top of the semiconductor module, and corresponding pin holes are provided on the circuit board. After the pins of the semiconductor module are docked with the pin holes on the circuit board, a stable electrical connection structure is formed by welding to form a power device. During the installation process, it is difficult to position the pins of the semiconductor module with the installation holes on the circuit board, the assembly difficulty is high, and it is easy to cause poor contact and conductive failure problems due to operation reasons.

[0003] Therefore, how to reduce the assembly difficulty between the circuit board and the semiconductor module and improve the stable effect of electrical connection is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0004] In view of this, the purpose of the utility model is to provide a power device, a power device assembly and an electric energy conversion device to reduce the assembly difficulty between the circuit board and the semiconductor module in the power device and improve the stable effect of electrical connection between the two.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A power device includes a circuit board and a semiconductor module. The semiconductor module has a conduction part. The circuit board has opposite first and second board surfaces and is provided with a through hole that penetrates through. The second board surface is the side facing away from the semiconductor module and is electrically connected to a connecting part. The conduction part passes through the through hole and is electrically connected to the connecting part, and the area of the connecting part is larger than the electrical connection area on the conduction part.

[0007] Preferably, in the above power device, a plurality of conduction parts are provided and each conduction part is electrically connected to the connecting part.

[0008] Preferably, in the above power device, the opening area of the through hole on the first board surface of the circuit board is larger than the projected area of the area where the conduction part passes through the through hole on the first board surface of the circuit board.

[0009] Preferably, in the above power device, the conduction part is extended with a bending surface, and the bending surface is attached to and electrically connected to the first end surface of the connecting part. The first end surface is the end surface of the connecting part away from the circuit board.

[0010] Preferably, in the above-mentioned power device, the first end face and the bent face are both parallel to the second board surface.

[0011] Preferably, in the above-mentioned power device, a plurality of the connecting members are spaced apart on the same side of the circuit board to form a connecting seam, the conducting portion passes through the through hole and is inserted into the connecting seam, and the conducting portion is in interference fit with the connecting seam.

[0012] Preferably, in the above-mentioned power device, two sets of the connecting members are provided on opposite sides of the first board surface or the second board surface of the through hole, and the two sets of the connecting members are oppositely arranged to form a single connecting seam.

[0013] Preferably, in the above-mentioned power device, the connecting member includes a guiding section, and the guiding section is an inclined surface structure sloping towards the inlet end of the connecting seam.

[0014] A power device assembly includes a heat sink and the power device according to any one of the above embodiments.

[0015] An electric energy conversion device includes the power device assembly according to the above embodiment.

[0016] It can be seen from the above technical solutions that the power device provided by the present invention mainly includes a circuit board and a semiconductor module. The circuit board has a first board surface and a second board surface arranged oppositely, and a through hole penetrating the first board surface and the second board surface is specially designed on the circuit board to provide a necessary channel for the installation of the semiconductor module. It should be noted that the first board surface is the side facing the semiconductor module, and the second board surface is the side facing away from the semiconductor module and at least one connecting member is electrically connected to the second board surface. These connecting members are electrically connected to the circuit board, and a conducting portion correspondingly protrudes from the semiconductor module. And it should be noted that the area of the connecting member, that is, the area of the region for connecting the conducting portion, is larger than the electrical connection region on the conducting portion. At the same time, the electrical connection between the circuit board and the semiconductor module is specifically realized by the conducting portion passing through the through hole and being electrically connected to the connecting member. In this connection structure, the conducting portion does not have the only installation position of the pinhole docking structure in the prior art, but has an installation range of the connecting member extension structure. After the assembly personnel place the semiconductor module on one side of the first board surface of the circuit board and pass the conducting portion out from the through hole position, the conducting portion can be conductively connected to any position on the connecting member made of a conductor material. And the docking space between the conducting portion and the connecting member is large, and there are no components blocking around, which is easy to operate. Description of the Drawings

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Structural schematic diagram of the power device provided by the embodiment of the present invention;

[0019] Figure 2 Structural schematic diagram of the power device provided by another embodiment of the present invention;

[0020] Figure 3 For Figure 1 Schematic diagram of the circuit board structure in

[0021] Figure 4 Schematic diagram of the conduction part of the metal pin structure;

[0022] Figure 5 Schematic diagram of the conduction part of the metal sheet structure;

[0023] Figure 6 Schematic diagram of the structure when the conduction part is electrically connected to the first end face;

[0024] Figure 7 Schematic diagram of the structure when the conduction part is inserted between two connectors.

[0025] Among them, 10 - circuit board; 110 - via hole; 120 - connector; 130 - first board surface; 140 - second board surface; 1210 - first end face; 1220 - guiding section; 1230 - second end face; 130 - connection seam; 20 - semiconductor module; 210 - conduction part; 220 - metal pin; 230 - metal sheet; 30 - heat sink. Detailed implementation manners

[0026] The core of the present invention lies in disclosing a power device, a power device assembly and an electric energy conversion device to reduce the assembly difficulty between the circuit board and the semiconductor module and improve the stable effect of their electrical connection.

[0027] To enable those skilled in the art to better understand the solutions of the present invention, the following will describe the embodiments of the present invention with reference to the drawings. In addition, the embodiments shown below do not limit the content of the invention described in the claims in any way. Additionally, all the contents of the configurations shown in the following embodiments are not limited to what is necessary for the solution of the invention described in the claims.

[0028] Such as Figure 1 、Figure 2 and Figure 3 As shown in Figure 3 and , the power device provided by the embodiment of the present application mainly includes an electrically connected circuit board 10 and a semiconductor module 20. Here, the electrical connection means that the circuit board 10 and the semiconductor module 20 can achieve conduction and signal transmission. Specifically, referring to

[0029] , the circuit board 10 includes a first board surface 130 and a second board surface 140 arranged opposite to each other. At the same time, a through hole 110 penetrating through the first board surface 130 and the second board surface 140 is formed on the circuit board 10. At the same time, at least one connecting member 120 is provided on the second board surface 140, and any connecting member 120 is electrically connected to the circuit board 10, so that the connecting member 120 can be used as an extended structure of the circuit board 10. It should be noted that the connecting member 120 can be produced synchronously with the circuit board 10 as a standard part, or it can be an independent component structure and is selected to be installed at the corresponding position on the circuit board 10 according to the actual production conditions. Figure 3 Correspondingly, in the power device provided by the embodiment of the present application, the semiconductor module 20 extends out a conduction part 210. The conduction part 210 can be a structure such as a pin, a pin, a metal pin or a metal sheet used to connect the integrated circuit inside the package to an external circuit (such as a printed circuit board PCB) in a conductor package, so as to be electrically connected to the circuit board 10. The conduction part 210 is arranged through the through hole 110 and is electrically connected to at least one connecting member 120. The arrangement of the conduction part 210 passing through the through hole 110 is easy to operate, and the assembly personnel can conveniently perform the corresponding installation action. After the conduction part 210 passes through, the stable electrical connection between the conduction part 210 and the connecting member 120 is realized by means of welding, screw connection or pressing with a pressing piece. Compared with the existing pinhole docking installation form, it is easier to operate for the conduction part 210 to pass through the macroscopic structure of the through hole 110. At the same time, the docking of the conduction part 210 and the connecting member 120 can also be directly observed, which is convenient for inspection and replacement. It should be noted that preferably, the area of the region for power supply connection on the connecting member 120 is larger than the area of the region for electrical connection on the conduction part 210, so that there are more than one connection positions for the connection between the conduction part 210 and the connecting member 120 to reduce the connection difficulty. At the same time, in the embodiment of the present application, the through hole 110 is a structural hole with a size larger than the pinhole in the prior art. The relatively large-structured through hole 110 makes the setting of the connecting member 120 and its connection with the conduction part 210 more flexible. The connecting member 120 can be arranged at any position on the edge of the through hole 110, and only needs to ensure that it is close to the penetration area of the conduction part 210. And the conduction part 210 can continue to adjust its position after passing through the through hole 110, which has obvious advantages compared with the structure in the prior art that cannot be adjusted after insertion.

[0029]

[0030] ​It should be noted that, in order to ensure the electrical connection effect between the circuit board 10 and the semiconductor module 20, at least two connecting members 120 can be provided around a single via hole 110. Correspondingly, a single conduction portion 210 can be electrically connected to at least two connecting members 120 at different connection positions, so that the two connection positions on a single conduction portion 210 are backup to each other. When only a single connection position fails, the circuit board 10 and the semiconductor module 20 still maintain an effective electrical connection.

[0031] The power device provided by the embodiment of the present application mainly includes a circuit board 10 and a semiconductor module 20. The circuit board 10 has a first board surface and a second board surface 140 which are oppositely arranged. And a via hole 110 penetrating through the first board surface 130 and the second board surface 140 is specially designed on the circuit board 10, providing a necessary channel for the installation of the semiconductor module 20. It should be noted that the first board surface 130 is the side facing the semiconductor module 20, and the second board surface 140 is the side facing away from the semiconductor module, and at least one connecting member 120 is electrically connected on the second board surface 140. These connecting members 120 are electrically connected to the circuit board 10, and a conduction portion 210 correspondingly protrudes and is arranged on the semiconductor module 20. And it should be noted that the area of the connecting member 120, that is, the area of the region for connecting the conduction portion 210 is larger than the electrical connection region on the conduction portion 210. It should be noted that the electrical connection region on the conduction portion 210 specifically refers to the region on the conduction portion 210 for conducting with the connecting member 120 and realizing communication connection for signal transmission. At the same time, the electrical connection between the circuit board 10 and the semiconductor module 20 is specifically realized by the conduction portion 210 passing through the via hole 110 and being electrically connected to the connecting member 120. In this connection structure, the conduction portion 210 does not have the only installation position of the pinhole docking structure in the prior art, but has the installation range of the extending structure of the connecting member 120. The assembly personnel place the semiconductor module 20 on one side of the first board surface 130 of the circuit board 10, and after passing the conduction portion 210 out from the position of the via hole 110, the conduction portion 210 can be conductively connected to any position on the connecting member 120 made of a conductive material. And the docking space between the conduction portion 210 and the connecting member 120 is large, and there are no components blocking around, which is easy to operate.

[0032] Further, as Figure 6As shown, in the power device provided in the embodiment of the present application, a bent surface structure is extendedly provided on the conduction part 210. At the same time, after the conduction part 210 passes through the through hole 110, the bent surface contacts and makes electrical connection with the first end surface 1210 of the connecting part 120. The bent surface on the conduction part 210 can form a structure similar to a hook. Compared with the single-sided flat structure, it has two contact surfaces on different planes to contact the connecting part 120 and achieve electrical connection. On the one hand, the setting of the bent surface can improve the stability of the mechanical connection between the conduction part 210 and the connecting part 120, that is, reduce the risk of the conduction part 210 falling off from the connecting part 120 through the bending structure. On the other hand, the setting of the bent surface increases the contact area between the conduction part 210 and the connecting part 120, improves the path width of signal transmission, reduces the risk of poor contact, and ensures the stable effect of electrical connection. At the same time, it should be noted that the first end surface 1210 is the end surface of the connecting part 120 away from the circuit board 10.

[0033] In addition, it should be noted that, in some embodiments of the present application, the first end surface 1210 and the bent surface are both arranged in a parallel structure form with the second board surface 140. Specifically, the parallel arrangement of the first end surface 1210 and the second board surface 140 can make the connecting part 120 have a more regular structure, which forms a cuboid structure protruding relative to the second board surface 140, and is easy to produce, store and transport. At the same time, the bent surface also fits and docks with the first end surface 1210 in a structure perpendicular to the extension of the conduction part 210, ensuring the assembly convenience and stable effect of the docking of the two.

[0034] To further optimize the above technical solution, multiple conduction parts 210 can be provided on a single semiconductor module 20, and each conduction part 210 passes through the same through hole 110 and makes electrical connection with the connecting part 120. It should be noted that the multiple conduction parts 210 are spaced and independently arranged. At the same time, after only a single conduction part 210 of the semiconductor module 20 makes electrical connection with the connecting part 120, its electrical connection and assembly with the circuit board 10 can be realized. Therefore, the multiple conduction parts 210 can be used as backups for each other, and the connection stability between the semiconductor module 20 and the circuit board 10 can be improved; in addition, it should be noted that, to improve the assembly convenience between the semiconductor module 20 and the circuit board 10, the opening area of the through hole 110 on the first board surface 130 of the circuit board 10 in the embodiment of the present application is also larger than the projected area of the area where the conduction part 210 passes through the through hole 110 on the first board surface 130, so that there is enough floating space in the process of the through assembly of the conduction part 210, and the through action can be carried out smoothly, reducing its assembly difficulty.

[0035] On the basis of the above embodiments, the first end face 1210 is preferably arranged parallel to the circuit board 10. The connecting member 120 first includes a structure of a second end face 1230 perpendicular to the circuit board 10. After extension, the second end face 1230 is connected to the first end face 1210 parallel to the circuit board 10. On the one hand, the perpendicular structure of the first end face 1210 and the second end face 1230 enables the conduction part 210 to be designed as a more regular and easy-to-fabricate right-angle bending structure when setting the bending structure, and it is easier to achieve precise positioning and assembly. On the other hand, the parallel structure design of the first end face 1210 and the circuit board 10 enables the operator to use tools to perform connection operations on a plane parallel to the circuit board 10 when the conduction part 210 is connected to the first end face 1210, and there will be no other obstruction during the assembly process.

[0036] Further, as Figure 7 shown, in some other embodiments of the present application, a plurality of connecting members 120 are provided, and two of the connecting members 120 are arranged at intervals on the same side of the circuit board 10 to form a connection seam 130 through the gap between the two connecting members 120. At the same time, the conduction part 210 passes through the through hole 110 and is inserted into the connection seam 130. It should be noted that an interference fit relationship exists between the conduction part 210 and the connection seam 130 formed by the two connecting members 120, so that the conduction part 210 only needs to be inserted into the connection seam 130 to achieve its stable connection relationship with the connecting member 120, thereby realizing the electrical connection between the circuit board 10 and the semiconductor module 20. It should be noted that in this embodiment, since a single conduction part 210 is clamped by the connection seam 130 formed by the two connecting members 120 to complete the connection, the connecting members 120 on both sides can be used as spares for each other, and the conduction part 210 has two effective electrical connection paths. When any one of the connection points fails, the conduction part 210 can still maintain an electrical connection state with the connecting member 120, so that the circuit board 10 and the semiconductor module 20 maintain an electrical connection state, thereby improving the operating stability of the power device.

[0037] On the basis of the above embodiments, preferably, the connecting member 120 includes a structural design with a guiding section 1220. The guiding section 1220 is an inclined surface structure sloping towards the inlet end of the connecting seam 130. Here, the structure of the inlet end of the connecting seam 130 specifically refers to that the guiding sections 1220 on the two connecting members 120 have the smallest spacing at the inlet position closest to the connecting seam 130 and the largest spacing at a position far from the connecting seam 130, so that the two guiding sections 1220 cooperate to form an inclined surface structure with an opening facing the through hole 110. This inclined surface structure can be a V-shaped structure, and the inner wall of the V-shaped structure can be a plane or a curved surface, providing an effective guiding mechanism for the insertion of the conduction part 210, reducing the resistance and error during the assembly process. At the same time, damping structures such as reverse resistance blocks can be provided on the two guiding sections 1220 in the V-shaped structure, making it difficult for the conduction part 210 to be pulled out and maintaining the mechanical and electrical connection stability.

[0038] Further, as Figure 4 and Figure 5 shown, in the power device provided in the embodiment of the present application, the conduction part 210 can be a metal pin 220 or a metal sheet 230. Both the needle-shaped structure and the sheet-shaped structure can achieve electrical connection with the connecting member 120. At the same time, when the conduction part 210 is in a needle-shaped structure, multiple metal pins 220 can be arranged in parallel and are all electrically connected to the connecting member 120 to maintain the connection effect. When the conduction part 210 uses a metal sheet 230, it is preferably that the entire area of the metal sheet 230 is in contact with and electrically connected to the connecting part to maintain a good connection effect between the circuit board 10 and the semiconductor module 20.

[0039] It should be noted that on the basis of effectively transmitting electrical signals, the conduction part 210 of the metal pin 220 or the metal sheet 230 also has good heat dissipation performance in high-power applications, so as to extend the service life of the semiconductor module 20.

[0040] In order to meet the multiple installation requirements of the semiconductor module 20 or the installation needs at different positions on the circuit board 10, in some embodiments of the present application, a plurality of through holes 110 are arranged at intervals on the circuit board 10, and a connecting member 120 is arranged around each through hole 110, allowing the power device to support the simultaneous installation of multiple semiconductor modules 20, improving the integration and functionality of the circuit board 10. The arrangement of the plurality of through holes 110 and the connecting members 120 can provide more electrical connection points for the power device, enabling the component to adapt to more complex circuit designs and higher performance requirements.

[0041] Meanwhile, considering that contact is inevitable during the assembly of the circuit board 10 and the semiconductor module 20, in order to avoid collision damage between the circuit board 10 and the semiconductor module 20 during assembly, in some embodiments of the present application, a gasket is further provided on the side of the circuit board 10 facing the semiconductor module 20. The gasket is a raised structure based on the surface of the circuit board 10. The gasket can be made of a flexible material, such as rubber, etc., and contacts the semiconductor module 20 during the assembly of the circuit board 10 and the semiconductor module 20, or can be made of a rigid material to indicate that the semiconductor module 20 is inserted in place.

[0042] In addition, it should be noted that when the conduction part 210 is inserted in place, that is, when the conduction part 210 maintains a stable electrical connection with the connecting part 120, the semiconductor module 20 abuts against the gasket, so that the gasket serves as a protection structure to support and protect the area between the circuit board 10 and the semiconductor module 20, which helps to extend the service life of the semiconductor module 20 and improve the reliability of the entire power device.

[0043] Furthermore, in the power device provided in the embodiments of the present application, the circumferential edge position on the side of the through hole 110 facing the semiconductor module 20 is provided with a chamfered or rounded structure, which not only provides an aesthetic appearance, but also reduces the risk of bumping when the conduction part 210 passes through the through hole 110 through the chamfering or rounding treatment, and reduces the resistance and possible damage during insertion.

[0044] The embodiments of the present application also provide a power device assembly. The power device assembly includes the power device provided in any one of the above embodiments, and a radiator for dissipating heat from the power device. It should be noted that the radiator and the semiconductor module 20 in the power device are pre-assembled into an integrated structure. During the assembly process, the operator only needs to electrically connect the integrated radiator and the semiconductor module 20 to the circuit board 10. Due to the setting of the through hole 110 and the connecting part 120, the integrated radiator and the semiconductor module 20 can be conveniently assembled through electrical connection after passing through, rather than the precise docking and welding connection method in the prior art. It has good operability, and the pre-assembled radiator and semiconductor module 20 also reduce the beat of the power device assembly and improve the efficiency of on-line assembly.

[0045] In addition, the embodiments of the present application also provide an electric energy conversion device. The electric energy conversion device includes the power device assembly provided in the above embodiments. Since the power device assembly has the technical effects provided in the above embodiments, the electric energy conversion device also has the above technical effects, which will not be elaborated herein.

[0046] It should be noted that for the convenience of description, only the parts related to the relevant utility model are shown in the drawings. Without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0047] As shown in the present utility model and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. An element defined by the statement "comprising one..." does not exclude the existence of other identical elements in the process, method, article, or device that includes the element.

[0048] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0049] The above description is only for the preferred embodiments of the present utility model and the explanation of the applied technical principles, and is not intended to limit the present utility model. For those skilled in the art, the present utility model can have various modifications and variations. The scope of the utility model involved in the present utility model is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above inventive concept. For example, the technical solutions formed by the mutual replacement of the above features with the (but not limited to) technical features with similar functions disclosed in the present utility model.

Claims

1. A power device, characterized in that, It includes a circuit board and a semiconductor module. The semiconductor module has a conduction part. The circuit board has opposite first and second board surfaces and is provided with a through hole. The second board surface faces away from the semiconductor module and is electrically connected to a connecting part. The conduction part passes through the through hole and is electrically connected to the connecting part, and the area of the connecting part is larger than the electrical connection area on the conduction part.

2. The power device according to claim 1, wherein A plurality of the conduction parts are provided, and each of the conduction parts is electrically connected to the connecting part.

3. The power device according to claim 1, characterized in that, The opening area of the through hole on the first board surface of the circuit board is larger than the projected area on the first board surface of the area where the conduction part passes through the through hole.

4. The power device according to claim 1, characterized in that, The conduction part is extended with a bent surface, and the bent surface is attached to and electrically connected to the first end face of the connecting part. The first end face is the end face of the connecting part away from the circuit board.

5. The power device according to claim 4, characterized in that, Both the first end face and the bent surface are parallel to the second board surface.

6. The power device according to claim 1, characterized in that, A plurality of the connecting parts are arranged at intervals on the same side of the circuit board to form a connection seam. The conduction part passes through the through hole and is inserted into the connection seam, and the conduction part is in interference fit with the connection seam.

7. The power device according to claim 6, characterized in that, Two sets of the connecting parts are arranged on two opposite sides of the through hole on the first board surface or the second board surface, and the two sets of the connecting parts are arranged oppositely to form a single connection seam.

8. The power device according to claim 6, characterized in that The connecting part includes a guiding section, and the guiding section is an inclined surface structure sloping towards the entrance end of the connection seam.

9. A power device assembly, characterized in that, It includes a radiator and the power device according to any one of claims 1-8.

10. An electric energy conversion device, characterized in that, It includes the power device assembly according to claim 9.

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