Wave soldering cooling mechanism

Abstract

The utility model discloses a wave-soldering cooling mechanism, and relates to the field of wave-soldering cooling. The wave-soldering cooling mechanism comprises an air guide pipe provided with an air outlet through groove and a cooling pipe arranged in the air guide pipe, the first end of the air guide pipe and the first end of the cooling pipe are both fixedly connected with a sealing cover, and an air guide cavity is formed between the air guide pipe and the cooling pipe; at least one heat conduction strip is fixedly arranged on the outer pipe wall of the cooling pipe, liquid cooling pipes which are spirally arranged in an equal-diameter mode are fixedly arranged along the inner pipe wall of the cooling pipe, the two ends of each liquid cooling pipe are arranged outside the gas guide pipe, and a gas blocking cover is fixedly arranged at the second end of the cooling pipe. According to the invention, it can be ensured that the led-out gas has a low temperature, and the PCB is rapidly and fully cooled by the gas, so that the problem that the temperature of the PCB is slowly reduced due to the fact that cold air is heated through an air blowing mechanism in the prior art can be solved.

Description

Technical Field

[0001] The present application relates to the field of wave soldering cooling technology, and in particular to a wave soldering cooling mechanism. Background Art

[0002] Cooling during wave soldering is a critical step in ensuring soldering quality and is crucial for controlling the temperature of the PCB after soldering. During the soldering process, the PCB absorbs significant heat. If this heat isn't dissipated quickly, it can degrade the performance of the solder joints and even damage sensitive components. Proper cooling also helps reduce thermal stress, preventing PCB deformation or cracking. It also promotes stable solidification of the solder joints, improving their long-term reliability.

[0003] Currently, post-wave soldering cooling typically uses air cooling, which lowers the temperature of the PCB by blowing cool air. However, since wave soldering equipment generates a significant amount of heat during the soldering process, the air blowing mechanism itself operates in a high-temperature environment. In the high overall temperature of the wave soldering equipment, the air blowing mechanism absorbs significant heat, causing the air to rapidly heat up as it passes through it. Consequently, the air is at a high temperature when it is blown out, failing to adequately cool the PCB. If the air is not sufficiently cool, it cannot effectively absorb and remove the heat from the PCB. This can result in a slow temperature drop after soldering, increasing production cycle time and potentially compromising the quality of the final product. Therefore, this challenge in the wave soldering cooling process needs to be overcome through technological innovation and improved cooling methods. Utility Model Content

[0004] In order to solve the problem in the prior art that the temperature of the PCB board decreases slowly due to the cold air being heated by the blowing mechanism, the present application provides a wave soldering cooling mechanism, the specific solution of which is as follows:

[0005] The wave soldering cooling mechanism includes an air duct provided with an air outlet groove and a cooling pipe arranged in the air duct, the first end of the air duct and the first end of the cooling pipe are both fixedly connected to the sealing cover, an air duct cavity is provided between the air duct and the cooling pipe, at least one heat conducting strip is fixedly provided on the outer tube wall of the cooling pipe, and liquid cooling pipes with equal diameter spiral arrangement are fixedly provided along the inner tube wall of the cooling pipe, both ends of the liquid cooling pipe are arranged outside the air duct, and an air blocking cover is fixedly provided on the second end of the cooling pipe.

[0006] Preferably, the outer wall of the cooling tube is fixed with two gas-blocking strips capable of restricting the passage of gas, a gas-blocking cavity is formed between the two gas-blocking strips, the air outlet groove is connected to the gas-blocking cavity, and a baffle is fixed at the second end of the two gas-blocking strips near the air guide tube.

[0007] Preferably, the air-blocking strip is in close fit with the air guide tube and the sealing cover respectively, and the air-blocking strip is provided with at least one air guide hole.

[0008] Preferably, the air-blocking strip is in close fit with the sealing cover, and there is a gap between the air-blocking strip and the air guide tube.

[0009] Preferably, the air-blocking strip is in close fit with the air guide tube, and there is an air guide port between the air-blocking strip and the sealing cover.

[0010] Preferably, both ends of the liquid cooling tube pass through the sealing cover and are arranged outside the air guide tube.

[0011] One or more technical solutions provided in the present application have at least the following technical effects or advantages:

[0012] 1. By arranging the liquid cooling tube and the heat conduction strip, the introduced gas is cooled for the second time or the introduced gas is kept at the original temperature, so that the temperature of the exported gas can be ensured to be low, thereby enabling the PCB board to be cooled quickly and sufficiently;

[0013] 2. The liquid cooling tubes arranged in an equal-diameter spiral arrangement can improve the heat exchange efficiency and enable the coolant in the liquid cooling tubes to fully exchange heat with the gas;

[0014] 3. The arrangement of the air-blocking strip increases the gas residence time, so that the liquid cooling tube can fully cool the gas;

[0015] 4. Both ends of the liquid cooling tube are arranged outside the air guide tube, which facilitates the introduction and export of the coolant.

[0016] The above description is only an overview of the technical solutions of the present application. In order to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specific embodiments of the present application are specifically given. It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present application, nor is it used to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings described below are only exemplary, and for those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0018] Figure 1 It is a schematic structural view of a perspective of the wave soldering cooling mechanism of the present application.

[0019] Figure 2 It is a schematic structural diagram of another perspective of the wave soldering cooling mechanism of the present application.

[0020] Figure 3 It is a schematic diagram of the equal-diameter spiral arrangement of some liquid cooling pipes of the present application.

[0021] In the figure: 1 - air guide pipe; 11 - air outlet through groove; 2 - cooling pipe; 21 - heat conduction strip; 22 - liquid cooling pipe; 23 - air blocking cover; 3 - air blocking strip; 31 - baffle; 32 - air guide port; 4 - sealing cover. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings of the present application. Obviously, the described embodiments of the present application are only part of the embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0023] Combined with Figures 1 to 3 , the wave soldering cooling mechanism includes an air guide pipe 1 provided with an air outlet through groove 11 and a cooling pipe 2 arranged inside the air guide pipe 1. The first ends of both the air guide pipe 1 and the cooling pipe 2 are fixedly connected to a sealing cover 4. There is an air guiding cavity between the air guide pipe 1 and the cooling pipe 2. At least one heat conduction strip 21 is fixedly provided on the outer wall of the cooling pipe 2. Referring to Figure 3 , an equal-diameter spiral arrangement of liquid cooling pipes 22 is fixedly provided along the inner wall of the cooling pipe 2. Both ends of the liquid cooling pipe 22 are arranged outside the air guide pipe 1. An air blocking cover 23 is fixedly provided at the second end of the cooling pipe 2.

[0024] Specifically, referring to Figure 1 and Figure 2 , two air blocking strips 3 that can restrict the passage of gas are fixedly provided on the outer wall of the cooling pipe 2. An air blocking cavity is formed between the two air blocking strips. The air outlet through groove 11 is communicated with the air blocking cavity. Baffles 31 are fixedly provided at the second end of the two air blocking strips 3 close to the air guide pipe 1.

[0025] Optionally, the air blocking strips 3 are closely attached to both the air guide pipe 1 and the sealing cover 4, and at least one air guide hole is provided on the air blocking strips 3.

[0026] Optionally, the air blocking strips 3 are closely attached to the sealing cover 4, and there is a gap between the air blocking strips 3 and the air guide pipe 1.

[0027] Specifically, referring to Figure 1 , the air blocking strips 3 are closely attached to the air guide pipe 1, and there is an air guide port 32 between the air blocking strips 3 and the sealing cover 4.

[0028] Specifically, both ends of the liquid cooling pipe 22 pass through the sealing cover 4 and are arranged outside the air guide pipe 1.

[0029] During actual operation, gas is introduced from the second end of the air guide pipe 1. Due to the presence of the baffle 31 and the air blocking cover 23, the gas can only enter the air guide cavity first; one end of the liquid cooling pipe 22 introduces coolant, and the other end discharges coolant. The gas in the air guide cavity is secondarily cooled through the liquid cooling pipe 22 and the heat conducting strip 21; finally, the gas enters the air blocking cavity through the air guide port 32 and is discharged through the air outlet through groove 11.

[0030] In summary, the present application can ensure that the discharged gas has a relatively low temperature, enabling the gas to quickly and fully cool the PCB board. Therefore, it can solve the problem in the prior art that the cold air is heated by the blowing mechanism, resulting in a slow decrease in the temperature of the PCB board.

[0031] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0032] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalent technologies, the present application is also intended to include these changes and modifications.

Claims

1. Wave soldering cooling mechanism, characterized in that, It includes an air guide pipe provided with an air outlet through groove and a cooling pipe arranged inside the air guide pipe. The first end of the air guide pipe and the first end of the cooling pipe are both fixedly connected to a sealing cover. There is an air guiding cavity between the air guide pipe and the cooling pipe. At least one heat conducting strip is fixedly arranged on the outer pipe wall of the cooling pipe. A liquid cooling pipe arranged in an equal-diameter spiral arrangement is fixedly arranged along the inner pipe wall of the cooling pipe. Both ends of the liquid cooling pipe are arranged outside the air guide pipe. A gas blocking cover is fixedly arranged at the second end of the cooling pipe.

2. The wave soldering cooling mechanism according to claim 1, wherein Two gas blocking strips capable of restricting the passage of gas are fixedly arranged on the outer pipe wall of the cooling pipe. A gas blocking cavity is formed between the two gas blocking strips. The air outlet through groove is communicated with the gas blocking cavity. Baffles are fixedly arranged at the two gas blocking strips near the second end of the air guide pipe.

3. The wave soldering cooling mechanism according to claim 2, characterized in that, The gas blocking strips are respectively in close fit with the air guide pipe and the sealing cover. The gas blocking strip is provided with at least one air guide hole.

4. The wave soldering cooling mechanism according to claim 2, wherein The gas blocking strip is in close fit with the sealing cover. There is a gap between the gas blocking strip and the air guide pipe.

5. The wave soldering cooling mechanism according to claim 2, wherein, The gas blocking strip is in close fit with the air guide pipe. There is an air guiding port between the gas blocking strip and the sealing cover.

6. The wave soldering cooling mechanism according to claim 1, characterized in that, Both ends of the liquid cooling pipe pass through the sealing cover and are arranged outside the air guide pipe.

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