Module structure

Abstract

The utility model discloses a module structure which comprises a shell, a first cavity and a second cavity which are arranged up and down and communicated with each other are arranged in the shell, a first circuit board and a first copper bar are arranged in the first cavity, a second circuit board is arranged in the second cavity, the first copper bar is connected between the first circuit board and the second circuit board, and the second copper bar is connected between the first circuit board and the second circuit board. A second copper bar and a third copper bar which are connected with an external copper bar of the module structure are further arranged outside the shell, the second copper bar is arranged outside the shell corresponding to the first cavity and connected between the first circuit board and an external upper layer copper bar of the module structure, and the third copper bar is arranged outside the shell corresponding to the second cavity and connected between the first circuit board and the external upper layer copper bar of the module structure. And the third copper bar is connected between the second circuit board and the external lower-layer copper bar of the module structure. According to the technical scheme, the layout of the copper bars is optimized, the space is effectively utilized, the smoothness of electrical connection of the copper bars is improved, and electrical faults caused by limitation of the internal space of the shell are avoided.

Description

Technical Field

[0001] This application relates to the technical field of power modules, and particularly to a module structure. Background Art

[0002] Inside the power module, the circuit connections are mainly made by copper bars. Due to the limited space inside the power module, it is difficult to install the copper bars. Improper layout of the copper bars may lead to unsmooth electrical connections, prone to electrical failures, not meeting safety specifications, and may also result in low utilization rate of the space inside the power module. Summary of the Utility Model

[0003] An embodiment of this application provides a module structure, which can optimize the layout of copper bars, effectively utilize the space, improve the smoothness of the electrical connection of the copper bars, and avoid electrical failures caused by the limited space inside the housing.

[0004] An embodiment of this application provides a module structure, which includes: a housing. Inside the housing, there are a first chamber and a second chamber arranged vertically and communicating with each other. A first circuit board and a first copper bar are arranged in the first chamber, and a second circuit board is arranged in the second chamber. The first copper bar is connected between the first circuit board and the second circuit board. Outside the housing, there are also a second copper bar and a third copper bar connected to the external copper bars of the module structure. The second copper bar is arranged outside the housing corresponding to the first chamber and is connected between the first circuit board and the external upper copper bar of the module structure. The third copper bar is arranged outside the housing corresponding to the second chamber and is connected between the second circuit board and the external lower copper bar of the module structure.

[0005] The technical solution of this application optimizes the utilization of the space inside the housing and improves the integration degree inside the module structure by arranging the first copper bar, which is connected between the first circuit board in the first chamber and the second circuit board in the second chamber, and the first circuit board and the second circuit board are arranged vertically. Outside the housing, there are also a second copper bar connected to the external upper copper bar of the module structure and a third copper bar connected to the external lower copper bar of the module structure. The second copper bar is arranged outside the housing corresponding to the first chamber, and the third copper bar is arranged outside the housing corresponding to the second chamber, which is beneficial to improving the smoothness of the electrical connection and avoiding electrical failures caused by space limitations.

[0006] According to the foregoing embodiments of the first aspect of the present application, the orthographic projection of the second copper bar on the first circuit board falls into the middle position of the first circuit board, and the orthographic projection of the third copper bar on the second circuit board falls into the middle position of the second circuit board. In the above embodiments, by setting the orthographic projection of the second copper bar on the first circuit board to fall into the middle position of the first circuit board and the orthographic projection of the third copper bar on the second circuit board to fall into the middle position of the second circuit board, it is beneficial to make the electrical connection between the first circuit board and the second copper bar and between the second circuit board and the third copper bar more concentrated and stable, effectively reducing electrical interference and reducing the number of copper bars used.

[0007] According to the foregoing embodiments of the first aspect of the present application, the first copper bar has a first bending portion, a connecting portion, and a second bending portion connected in sequence. The first bending portion is correspondingly connected to the first circuit board, and the second bending portion is correspondingly connected to the second circuit board. In the above embodiments, by providing the first copper bar with the first bending portion and the second bending portion, the connection angle of the first copper bar is optimized, the space occupied inside the housing is reduced, the stability of the electrical connection between the first circuit board and the second circuit board is improved, and it helps to maintain good electrical performance in a complex environment.

[0008] According to the foregoing embodiments of the first aspect of the present application, a first mounting plate and a mounting assembly are further provided in the first chamber. The first mounting plate includes a first surface close to the top of the housing, and the first circuit board is disposed on the first surface. The mounting assembly is connected to the outer periphery of the first mounting plate and the inner wall of the first chamber to mount the first mounting plate in the first chamber. In the above embodiments, by setting the first circuit board to be mounted on the first mounting plate and the first mounting plate to be mounted on the inner wall of the first chamber through the mounting assembly, the firmness of the first circuit board installation can be enhanced, and the risk of the first circuit board loosening caused by vibration or impact is reduced.

[0009] According to the foregoing embodiments of the first aspect of the present application, the mounting assembly includes: a plurality of connecting members and at least one bracket. The plurality of connecting members are sequentially disposed on one side of the first mounting plate to mount the first mounting plate in the first chamber. The bracket is disposed between at least one connecting member and the first mounting plate. In the above embodiments, in the state where the first mounting plate is connected to the inner wall of the first chamber, by providing the bracket, the bracket can share the weight of the first mounting plate with the plurality of connecting members to enhance the stability of the connection between the first mounting plate and the inner wall of the first chamber.

[0010] According to the foregoing embodiments of the first aspect of the present application, a resistor and a contactor are further provided on the first mounting plate, and the resistor and the contactor are located on the same side of the first circuit board. In the above embodiments, by setting the resistor and the contactor to be located on the same side of the first circuit board, it helps to simplify the electrical connection, reduce the layout complexity, improve the smoothness of the electrical connection, and improve the maintenance efficiency.

[0011] According to the foregoing embodiments of the first aspect of the present application, the first chamber further includes: a first heat dissipation component, which includes a first heat dissipation member and a second heat dissipation member, and the first heat dissipation member and the second heat dissipation member are respectively disposed on opposite sides of the first circuit board. In the above embodiment, by arranging the first heat dissipation member and the second heat dissipation member on opposite sides of the first circuit board respectively, the heat dissipation efficiency of the first circuit board can be effectively improved, the layout inside the first chamber is optimized, and the compactness is improved.

[0012] According to the foregoing embodiments of the first aspect of the present application, the second chamber further includes: a second heat dissipation component and a wind blocking member. The second heat dissipation component includes a third heat dissipation member and a fourth heat dissipation member, and the third heat dissipation member and the fourth heat dissipation member are respectively located on opposite sides of the second circuit board. The wind blocking member is disposed between the second circuit board and the fourth heat dissipation member, and the wind blocking member can block the gas blown out by the third heat dissipation member to the fourth heat dissipation member, so that the third heat dissipation member and the fourth heat dissipation member can respectively dissipate heat from different regions inside the second chamber. In the above embodiment, by arranging the wind blocking member between the second circuit board and the fourth heat dissipation member, the wind blocking member can block the gas blown out by the third heat dissipation member to the fourth heat dissipation member, so that the gases blown out by the third heat dissipation member and the fourth heat dissipation member form two separate regions that do not interfere with each other, which is beneficial to ensuring the cooling requirement and improving the heat dissipation efficiency of the second circuit board.

[0013] According to the foregoing embodiments of the first aspect of the present application, the wind blocking member is an epoxy insulating wind blocking plate. In the above embodiment, by arranging the wind blocking member as an epoxy insulating wind blocking plate, it is beneficial to ensure the safety regulations requirements of multiple copper bars around the wind blocking member in the second chamber.

[0014] According to any of the foregoing embodiments of the first aspect of the present application, the protection level inside the first chamber is greater than the protection level inside the second chamber. In the above embodiment, by setting the protection level inside the first chamber to be greater than the protection level inside the second chamber, it is beneficial to ensure the safety of the module structure in a high-risk environment, adapt to various application scenarios, and enhance the adaptability of the module structure. Description of the Drawings

[0015] Figure 1 It is a schematic structural diagram of an embodiment of the module structure of the present application;

[0016] Figure 2 It is a side view of an embodiment of the module structure of the present application;

[0017] Figure 3 It is a top view of the internal structure of the housing of an embodiment of the module structure of the present application;

[0018] Figure 4 is Figure 3 The cross-sectional structural diagram of the A-A plane in

[0019] Figure 5 This is a front view of the first copper busbar in an embodiment of the module structure of this application;

[0020] Figure 6 A top view of the first copper busbar in an embodiment of the module structure of the present application;

[0021] Figure 7 for Figure 3 A magnified structural diagram of the installation components;

[0022] Figure 8 This is a bottom view of the internal structure of the shell of one embodiment of the module structure of the present application.

[0023] Description of Figure Numbers:

[0024] Shell-100;

[0025] First chamber - 110, second chamber - 120, second copper bar - 130, third copper bar - 140;

[0026] First circuit board 111, first copper busbar 112, first mounting plate 113, mounting assembly 114, resistor 115, contactor 116, first heat sink assembly 117, second circuit board 121, second heat sink assembly 122, wind shield 123, adapter copper busbar 124;

[0027] First bending portion 1121, connecting portion 1122, second bending portion 1123, connecting end 1124, connecting hole 1125, first surface 1131, connecting member 1141, bracket 1142, first heat dissipating member 1171, second heat dissipating member 1172, third heat dissipating member 1221, fourth heat dissipating member 1222;

[0028] The side with higher protection level is S1, and the side with lower protection level is S2. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0030] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, the descriptions involving "first", "second", etc. in this application are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0032] The embodiment of this application provides a module structure, which can optimize the layout of copper bars, effectively utilize space, improve the smoothness of the electrical connection of copper bars, and avoid electrical failures caused by the limitation of the internal space of the housing.

[0033] As Figures 1 to 2 shown, the embodiment of this application provides a module structure. The module structure includes: a housing 100. As Figure 4 shown, the interior of the housing 100 includes a first chamber 110 and a second chamber 120 that are arranged vertically and communicate with each other. In the embodiment of this application, the protection level in the first chamber 110 is higher than that in the second chamber 120. The first chamber 110 is the high protection level side S1, and the second chamber 120 is the low protection level side S2. By setting the protection level in the first chamber 110 to be higher than that in the second chamber 120, it is beneficial to ensure the safety of the module structure in a high-risk environment, adapt to various application scenarios, and enhance the adaptability of the module structure. It can be understood that in other embodiments, those skilled in the art can also divide different protection level sides inside the housing 100 according to the actual protection level of the internal drive power components.

[0034] As Figures 3 to 4 shown, a first circuit board 111 and a first copper bar 112 are arranged in the first chamber 110. As Figure 6 shown, a second circuit board 121 is arranged in the second chamber 120. As Figure 4 shown, the first copper bar 112 is connected between the first circuit board 111 and the second circuit board 121. By setting the first copper bar 112, the first copper bar 112 is connected between the first circuit board 111 located in the first chamber 110 and the second circuit board 121 located in the second chamber 120. The first circuit board 111 and the second circuit board 121 are arranged vertically, optimizing the utilization of the internal space of the housing 100 and improving the integration degree inside the module structure.

[0035] As Figure 2As shown, a second copper busbar 130 and a third copper busbar 140 connected to the external copper busbar of the module structure are also provided outside the housing 100. The external copper busbar is also divided into upper and lower layers. The second copper busbar 130 is arranged outside the housing 100 corresponding to the first chamber 110. The second copper busbar 130 is connected between the first circuit board 111 and the external upper-layer copper busbar of the module structure. The third copper busbar 140 is arranged outside the housing 100 corresponding to the second chamber 120. The third copper busbar 140 is connected between the second circuit board 121 and the external lower-layer copper busbar of the module structure, which is beneficial to improving the smoothness of electrical connection and avoiding electrical failures caused by space limitations.

[0036] By optimizing the copper busbar layout, the space inside the housing 100 can be effectively utilized to ensure smooth connection between the first copper busbar 112 and the first circuit board 111 and the second circuit board 121, smooth connection between the second copper busbar 130 and the first circuit board 111 and the external upper-layer copper busbar of the module structure, and smooth connection between the third copper busbar 140 and the second circuit board 121 and the external lower-layer copper busbar of the module structure, improving the smoothness of the electrical connection of the copper busbar and avoiding electrical failures caused by space limitations inside the housing 100.

[0037] In the embodiment of the present application, as Figure 2 shown, the orthographic projection of the second copper busbar 130 on the first circuit board 111 falls into the middle position of the first circuit board 111, and the orthographic projection of the third copper busbar 140 on the second circuit board 121 falls into the middle position of the second circuit board 121, which is beneficial to making the electrical connection between the first circuit board 111 and the second copper busbar 130 and between the second circuit board 121 and the third copper busbar 140 more concentrated and stable, effectively reducing electrical interference, reducing the number of copper busbars used, and optimizing the copper busbar layout.

[0038] It should be noted that in the embodiment of the present application, an internal drive power element is further included inside the module structure, and the internal drive power element is connected to the first circuit board 111 and the second circuit board 121.

[0039] As Figures 4 to 5 shown, the first copper busbar 112 has a first bending portion 1121, a connecting portion 1122, and a second bending portion 1123 connected in sequence. The first bending portion 1121 is correspondingly connected to the first circuit board 111, and the second bending portion 1123 is correspondingly connected to the second circuit board 121. The first copper busbar 112 is arranged in a Z-shaped bend. The first bending portion 1121 and the second bending portion 1123 are beneficial for making a transition connection between the first circuit board 111 at a high position and the second circuit board 121 at a low position, optimizing the connection angle of the first copper busbar 112, reducing the space occupied inside the housing 100, improving the stability of the electrical connection between the first circuit board 111 and the second circuit board 121, and helping to maintain good electrical performance in a complex environment.

[0040] As shown Figure 5 in the figure, one end of the first bending part 1121 connected to the first circuit board and one end of the second bending part 1123 connected to the second circuit board respectively include connection ends 1124. As shown Figure 6 in the figure, the first copper bar 112 further includes connection holes 1125. The connection holes 1125 are arranged at the connection ends 1124, and connection screws are detachably arranged in the connection holes 1125 to connect the connection ends 1124 to the first circuit board 111 and the second circuit board 121 respectively.

[0041] As shown Figure 3 in the figure, a first mounting plate 113 and a mounting assembly 114 are further arranged in the first chamber 110. The first mounting plate 113 includes a first surface 1131 near the top of the housing 100, and the first circuit board 111 is arranged on the first surface 1131. It can be understood that multiple first circuit boards 111 can be sequentially arranged on the first surface 1131. The mounting assembly 114 is connected to the outer periphery of the first mounting plate 113 and the inner wall of the first chamber 110 to mount the first mounting plate 113 in the first chamber 110. The mounting assembly 114 includes: a plurality of connecting members 1141 and at least one bracket 1142. The plurality of connecting members 1141 are sequentially arranged on one side of the first mounting plate 113 to mount the first mounting plate 113 in the first chamber 110. The bracket 1142 is arranged between at least one connecting member 1141 and the first mounting plate 113. By arranging the first circuit board 111 on the first mounting plate 113 and mounting the first mounting plate 113 on the inner wall of the first chamber 110 through the mounting assembly 114, the firmness of the installation of the first circuit board 111 can be enhanced, and the risk of loosening of the first circuit board 111 caused by vibration or impact can be reduced. In the state where the first mounting plate 113 is connected to the inner wall of the first chamber 110, by arranging the bracket 1142, the bracket 1142 can share the weight of the first mounting plate 113 together with the plurality of connecting members 1141 to enhance the stability of the connection between the first mounting plate 113 and the inner wall of the first chamber 110.

[0042] In some embodiments of the present application, the connecting member 1141 is a profiled steel bar. In other embodiments, those skilled in the art can also set other forms of connecting members 1141 according to actual situations, such as bolt-nut, rivet connection, etc.

[0043] As shown Figure 7As shown, in the embodiment of the present application, the first mounting plate 113 is arranged in the first chamber 110 through six hexagonal steel bars. Threads are provided at the ends of the hexagonal steel bars connected to the first mounting plate 113 and the inner wall of the first chamber 110, which facilitates installation inside the first chamber 110. In the state where the first mounting plate 113 is connected to the inner wall of the first chamber 110, when the hexagonal steel bars are subjected to the weight of the first mounting plate 113 and other external forces during connection, the direction of the external force is the same as the tangent direction of the thread. This force application method may cause wear or loosening at the threaded connection of the hexagonal steel bars, thus affecting the stability and safety of the connection. By providing a bracket 1142 between at least one connecting member 1141 and the first mounting plate 113, the bracket 1142 can share the weight of the first mounting plate 113 together with multiple connecting members 1141, avoiding excessive friction between the threads. In this embodiment, the mounting assembly 114 includes two brackets 1142, and the two brackets 1142 are symmetrically arranged on the upper side of the first mounting plate 113 to further enhance the stability of the first mounting plate 113.

[0044] As Figure 3 shown, in an embodiment of the present application, a resistor 115 and two contactors 116 are further provided on the first mounting plate 113. The resistor 115 and the two contactors 116 are located on the same side of the first circuit board 111. In the embodiment of the present application, as Figure 3 shown, the resistor 115 and the two contactors 116 are both arranged on the right side of the first circuit board 111, which helps to simplify the electrical connection, reduce the layout complexity, improve the smoothness of the electrical connection, and improve the maintenance efficiency. In other embodiments, the resistor 115 and the contactors 116 may also be arranged on other sides of the first circuit board 111, such as the upper side, the left side, etc. The present application does not limit the positions of the resistor 115 and the contactors 116 on the first circuit board 111.

[0045] As Figure 3 shown, the first chamber 110 further includes: a first heat dissipation assembly 117, and the first heat dissipation assembly 117 includes a first heat dissipation member 1171 and a second heat dissipation member 1172. The first heat dissipation member 1171 and the second heat dissipation member 1172 are respectively arranged on opposite sides of the first circuit board 111. In the embodiment of the present application, as Figure 3As shown, the first heat dissipation component 1171 is located on the left side of the first circuit board 111, and the second heat dissipation component 1172 is located on the right side of the first circuit board 111. The first heat dissipation component 1171 and the second heat dissipation component 1172 are respectively heat dissipation fans. By arranging the first heat dissipation component 1171 and the second heat dissipation component 1172 on the opposite sides of the first circuit board 111 respectively, the heat dissipation efficiency of the first circuit board 111 can be effectively improved, the layout inside the first chamber 110 is optimized, and the compactness is improved. In other embodiments, the first heat dissipation component 1171 may also be arranged on the upper side of the first circuit board 111, and the second heat dissipation component 1172 may be arranged on the lower side of the first circuit board 111. The present application does not limit the positions of the first heat dissipation component 1171 and the second heat dissipation component 1172.

[0046] As Figure 8 shown, the second chamber 120 further includes: a second heat dissipation assembly 122 and a wind shield 123. The second heat dissipation assembly 122 includes a third heat dissipation component 1221 and a fourth heat dissipation component 1222. The third heat dissipation component 1221 and the fourth heat dissipation component 1222 are respectively located on the opposite sides of the second circuit board 121. In the embodiment of the present application, as Figure 8 shown, the third heat dissipation component 1221 is located on the left side of the second circuit board 121, and the fourth heat dissipation component 1222 is located on the right side of the second circuit board 121. The third heat dissipation component 1221 and the fourth heat dissipation component 1222 are respectively heat dissipation fans. The wind shield 123 is arranged between the second circuit board 121 and the fourth heat dissipation component 1222. The wind shield 123 can block the gas blown out by the third heat dissipation component 1221 to the fourth heat dissipation component 1222, so that the gas blown out by the third heat dissipation component 1221 and the fourth heat dissipation component 1222 forms two separate non-interfering regions, respectively dissipating heat from different regions in the second chamber 120, which is beneficial to ensuring the cooling requirement. In other embodiments, the third heat dissipation component 1221 may also be arranged on the upper side of the second circuit board 121, and the fourth heat dissipation component 1222 may be arranged on the lower side of the second circuit board 121. The present application does not limit the positions of the third heat dissipation component 1221 and the fourth heat dissipation component 1222.

[0047] In the embodiment of the present application, the wind shield 123 is an epoxy insulating wind shield, which is beneficial to ensuring the safety regulations requirements of multiple busbars around the wind shield 123 in the second chamber 120 and is beneficial to improving electrical safety. In other embodiments, those skilled in the art may also select wind shields 123 made of other materials according to actual needs, such as fiberglass plastics, rubber, etc., to provide electrical isolation and protection.

[0048] As Figure 8 shown, a transfer busbar 124 is further arranged in the second chamber 120. The transfer busbar 124 is connected between the second circuit board 121 and the third busbar 140 to ensure the smoothness of the electrical connection of the busbars.

[0049] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structural transformation made by using the content of the specification and drawings of the present application under the inventive concept of the present application, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A module structure, characterized in that, The module structure includes: A housing (100), the interior of the housing (100) includes a first chamber (110) and a second chamber (120) which are arranged vertically and communicate with each other. A first circuit board (111) and a first copper bar (112) are arranged in the first chamber (110), and a second circuit board (121) is arranged in the second chamber (120). The first copper bar (112) is connected between the first circuit board (111) and the second circuit board (121); Outside the housing (100), a second copper bar (130) and a third copper bar (140) connected to the external copper bar of the module structure are further provided. The second copper bar (130) is arranged outside the housing (100) corresponding to the first chamber (110), and the second copper bar (130) is connected between the first circuit board (111) and the external upper copper bar of the module structure. The third copper bar (140) is arranged outside the housing (100) corresponding to the second chamber (120), and the third copper bar (140) is connected between the second circuit board (121) and the external lower copper bar of the module structure.

2. The module structure according to claim 1, wherein The orthographic projection of the second copper bar (130) on the first circuit board (111) falls into the middle position of the first circuit board (111), and the orthographic projection of the third copper bar (140) on the second circuit board (121) falls into the middle position of the second circuit board (121).

3. The module structure according to claim 1, wherein, The first copper bar (112) has a first bending part, a connecting part and a second bending part connected in sequence. The first bending part is correspondingly connected to the first circuit board, and the second bending part is correspondingly connected to the second circuit board.

4. The module structure according to claim 1, wherein, In the first chamber (110), there is also provided: A first mounting plate (113), the first mounting plate (113) includes a first surface (1131) close to the top of the housing (100), and the first circuit board (111) is arranged on the first surface (1131); and A mounting component (114), the mounting component (114) is connected between the outer periphery of the first mounting plate (113) and the inner wall of the first chamber (110) to mount the first mounting plate (113) in the first chamber (110).

5. The module structure according to claim 4, characterized in that, The mounting component (114) includes: A plurality of connecting pieces (1141), the plurality of connecting pieces (1141) are sequentially arranged on one side of the first mounting plate (113) to mount the first mounting plate (113) in the first chamber (110); and At least one bracket (1142), the bracket (1142) is arranged between at least one of the connecting pieces (1141) and the first mounting plate (113).

6. The module structure according to claim 4, characterized in that A resistor (115) and a contactor (116) are further arranged on the first mounting plate (113), and the resistor (115) and the contactor (116) are located on the same side of the first circuit board (111).

7. The module structure according to claim 1, characterized in that, In the first chamber (110), there is also included: The first heat dissipation component (117), the first heat dissipation component (117) includes a first heat dissipation member (1171) and a second heat dissipation member (1172), and the first heat dissipation member (1171) and the second heat dissipation member (1172) are respectively disposed on opposite sides of the first circuit board (111).

8. The module structure according to claim 1, wherein, The second chamber (120) further includes: A second heat dissipation component (122), the second heat dissipation component (122) includes a third heat dissipation member (1221) and a fourth heat dissipation member (1222), and the third heat dissipation member (1221) and the fourth heat dissipation member (1222) are respectively located on opposite sides of the second circuit board (121); and A wind shield (123), the wind shield (123) is disposed between the second circuit board (121) and the fourth heat dissipation member (1222), and the wind shield (123) can block the gas blown out by the third heat dissipation member (1221) to the fourth heat dissipation member (1222), so that the third heat dissipation member (1221) and the fourth heat dissipation member (1222) can respectively dissipate heat from different regions in the second chamber (120).

9. The module structure according to claim 8, wherein, The wind shield (123) is an epoxy insulating wind shield board.

10. The module structure according to any one of claims 1 to 9, characterized in that, The protection level in the first chamber (110) is higher than the protection level in the second chamber (120).

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