LED packaging device

Abstract

The utility model relates to the technical field of semiconductor light emitting, and discloses an LED packaging device, which comprises a support, an LED light emitting chip, a light-transmitting glue layer, a lens and a cavity structure. The LED light-emitting chip is arranged on the support. The lower surface of the light-transmitting glue layer at least covers the upper surface of the LED light-emitting chip. The lens includes a lower optical interface and an upper optical interface. The cavity structure is arranged on the periphery of the light-transmitting glue layer and between the lens and the support. And the outer contours of the upper surfaces of the light-transmitting glue layer and the LED light-emitting chip are respectively circular and rectangular. The length of the upper surface of the light-transmitting glue layer in the D-axis direction is L1, the length of the diagonal line of the LED light-emitting chip 2 is H1, and L1 is smaller than or equal to H1. According to the utility model, through the arrangement of the light-transmitting glue layer on the D-axis structure, the D-axis light receiving capability is improved, the central light intensity is improved, and the divergence angle of the D-axis is reduced. Through personalized arrangement of the X axis, the Y axis and the D axis, the divergence angles of light on the D axis, the X axis and the Y axis are similar, light emitting is uniform, the light energy utilization rate is high, and the optical shaping effect is good.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light-emitting, and particularly relates to an LED packaging device. Background Art

[0002] Existing LED light-emitting chips are usually rectangular. The divergence angle of the emitted light of the LED light-emitting chip in the diagonal direction of the rectangle is larger than that in the direction of the two sides. In some application scenarios, it is required that the divergence angles of the light field in the diagonal direction and the two sides of the rectangle are similar and the light output is uniform. At the same time, the existing LED packaging device has poor optical shaping ability and low light energy utilization rate.

[0003] Based on the above, the utility model provides an LED packaging device with high light energy utilization rate, good optical shaping effect, and similar divergence angles of light in the diagonal direction and the side length direction of the rectangle of the LED light-emitting chip. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an LED packaging device, aiming at solving the problems of low efficiency of exciting phosphor, low light efficiency, and large system volume in the existing technology.

[0005] The utility model is realized as follows. The LED packaging device includes:

[0006] A bracket;

[0007] An LED light-emitting chip disposed on the bracket;

[0008] A light-transmitting glue layer, the lower surface of which at least covers the upper surface of the LED light-emitting chip;

[0009] A lens disposed on the bracket. The lens includes a lower optical interface for inputting light and an upper optical interface for outputting light. The lower optical interface is in close contact with the upper surface of the light-transmitting glue layer;

[0010] A cavity structure disposed around the light-transmitting glue layer, between the lens and the bracket;

[0011] The length of the upper surface of the light-transmitting glue layer in the D-axis direction is L1, and the diagonal length of the LED light-emitting chip is H1, satisfying L1≤H1;

[0012] The X-axis, Y-axis, and Z-axis are three-dimensional rectangular coordinate axes. The X-axis and Y-axis are respectively parallel to two sides of the LED light-emitting chip, the Z-axis is parallel to the optical axis, and the D-axis is parallel to a diagonal of the LED light-emitting chip.

[0013] Further, the contour line of the side surface of the light-transmitting glue layer in the plane where the D-axis and the Z-axis are located is a straight line parallel to the optical axis, or the contour line of the side surface of the light-transmitting glue layer in the plane where the D-axis and the Z-axis are located is a straight line or a curve that gradually approaches the optical axis from the LED light-emitting chip to the lens.

[0014] Further, the lengths of the upper surface of the light-transmitting glue layer in the X-axis and Y-axis directions are L2 and L3, and the two side lengths of the LED light-emitting chip in the X-axis and Y-axis directions are H2 and H3, respectively, satisfying L2≥H2 and L3≥H3.

[0015] Further, the contour line of the side surface of the light-transmitting glue layer in the plane where the X-axis and the Z-axis are located is a straight line parallel to the optical axis; or the contour line of the side surface of the light-transmitting glue layer in the plane where the X-axis and the Z-axis are located is an inclined straight line or a curve that gradually moves away from the optical axis from the LED light-emitting chip to the lens.

[0016] Further, the contour line of the side surface of the light-transmitting glue layer in the plane where the Y-axis and the Z-axis are located is a straight line parallel to the optical axis, or the contour line of the side surface of the light-transmitting glue layer in the plane where the Y-axis and the Z-axis are located is an inclined straight line or a curve that gradually moves away from the optical axis from the LED light-emitting chip to the lens.

[0017] Further, the outer contours of the upper surfaces of the light-transmitting glue layer and the LED light-emitting chip are respectively set to be circular and rectangular.

[0018] Further, the upper optical interface is a plane or a curved surface.

[0019] Further, the lower optical interface is a plane or a curved surface.

[0020] Compared with the prior art, an LED packaging device provided by the present utility model has the following beneficial effects:

[0021] The light-emitting surface size of the rectangular LED light-emitting chip 2 in the D-axis is the largest, and the divergence angle is the largest, while the light-emitting surface size in the X-axis and Y-axis directions is small, and the divergence angle is small. For the above, the present utility model makes different settings in the D-axis and the X-axis and Y-axis to meet the needs of the application scenario.

[0022] In the D-axis direction: the length L1 of the upper surface of the light glue layer 3 is less than or equal to the diagonal length H1 of the LED light-emitting chip 2, referring to Figure 1-2 . Referring to Figure 7-8, after the large-angle light at the edge emitted by the LED light-emitting chip 2 reaches the side surface of the light-transmitting glue layer 3 on the D axis and undergoes refraction, it enters the cavity structure 5 (gas layer), then enters the lens 4, and is emitted after two refraction effects of the lower optical interface 41 and the upper optical interface 42 of the lens 4. The side surface of the light-transmitting glue layer 3 of the present invention can refract the incident light at a large angle at the edge upward in the D-axis direction, improving the light efficiency; at the same time, through three refraction effects, the light-receiving ability of the D axis is enhanced, the central light intensity can be increased, and the divergence angle of the D axis can be reduced.

[0023] In the X-axis and Y-axis directions: The lengths of the upper surface of the light-transmitting glue layer 3 in the X-axis and Y-axis directions are L2 and L3, and the two sides of the LED light-emitting chip 2 in the X-axis and Y-axis directions are H2 and H3, respectively, satisfying L2≥H2 and L3≥H3.

[0024] When L2 = H2 and L3 = H3, referring to Figure 8 , the beneficial effects are the same as those in the above case of L1 = H1 for the D axis, and will not be elaborated here.

[0025] When L2 > H2 and L3 > H3, referring to Figure 9 , the large-angle light at the edge of the LED light-emitting chip 2 is incident on the side surfaces of the light-transmitting glue layer 3 in the X-axis and Y-axis directions, undergoes total reflection, and directly enters the lens 4, and is emitted after the refraction effects of the lower optical interface 41 and the upper optical interface 42, that is, the large-angle light at the edge is emitted at a certain divergence angle after one reflection and two refractions.

[0026] The X-axis, Y-axis, and D-axis can be combined and adapted according to the needs of the application scenario. The personalized settings make the divergence angles of the light in the D-axis, X-axis, and Y-axis similar and the light output uniform after the light acts on the light-transmitting glue layer 3 and the lens 4, can make full use of the large-angle light at the edge, and has a high light energy utilization rate and good optical shaping effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic cross-sectional structure diagram of the LED packaging device provided by the present invention in the plane where the D axis and the Z axis are located;

[0028] Figure 2 is a schematic cross-sectional structure diagram of another LED packaging device provided by the present invention in the plane where the D axis and the Z axis are located;

[0029] Figure 3 is a schematic cross-sectional structure diagram of the LED packaging device provided by the present invention in the plane where the X axis and the Z axis are located;

[0030] Figure 4 is a schematic cross-sectional structure diagram of another LED packaging device provided by the present invention in the plane where the X axis and the Z axis are located;

[0031] Figure 5It is a schematic cross-sectional structure diagram of the LED packaging device provided by the present utility model in the plane where the Y-axis and Z-axis are located;

[0032] Figure 6 It is a schematic cross-sectional structure diagram of another LED packaging device provided by the present utility model in the plane where the Y-axis and Z-axis are located;

[0033] Figure 7 It is an optical path diagram of the LED packaging device provided by the present utility model in the plane where the D-axis and Z-axis are located;

[0034] Figure 8 It is an optical path diagram of another LED packaging device provided by the present utility model in the plane where the D-axis and Z-axis are located;

[0035] Figure 9 It is an optical path diagram of the LED packaging device provided by the present utility model in the plane where the X-axis and Z-axis are located;

[0036] Figure 10 It is a top view of the LED packaging device provided by the present utility model;

[0037] Figure 11 It is a top view of the LED packaging device of Embodiment 1 provided by the present utility model;

[0038] Figure 12 It is a top view of the LED packaging device of Embodiment 2 provided by the present utility model;

[0039] Figure 13 It is a top view of the LED packaging device of Embodiment 3 provided by the present utility model;

[0040] Figure 14 It is a top view of the LED packaging device of Embodiment 4 provided by the present utility model;

[0041] In the figure: 1 - bracket; 2 - LED light-emitting chip; 3 - light-transmitting glue layer; 4 - lens; 41 - lower optical interface; 42 - upper optical interface; 5 - cavity structure; 6 - gold wire. Detailed implementation manners

[0042] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0043] The implementation of the present utility model will be described in detail below with reference to specific embodiments.

[0044] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0045] Referring to Figure 1-14 as shown, it is a preferred embodiment provided by the present invention.

[0046] The LED packaging device of the present invention includes a bracket 1, an LED light-emitting chip 2, a light-transmitting glue layer 3, a lens 4 and a cavity structure 5. Referring to Figure 1 and Figure 10 . The LED light-emitting chip 2 is arranged on the bracket 1. The lower surface of the light-transmitting glue layer 3 at least covers the upper surface of the LED light-emitting chip 2.

[0047] The lens 4 is arranged on the bracket 1. The bottom around the lens 4 is connected to the upper surface of the bracket 1. The LED light-emitting chip 2 and the light-transmitting glue layer 3 are encapsulated between the bracket 1 and the lens 4. The lens 4 includes a lower optical interface 41 for inputting light and an upper optical interface 42 for outputting light. Part of the lower optical interface 41 is in close contact with the upper surface of the light-transmitting glue layer 3. There is a cavity structure 5 around the lens 4 and the light-transmitting glue layer 3.

[0048] The lower surface of the light-transmitting glue layer 3 at least completely covers the upper surface of the LED light-emitting chip 2. The length of the upper surface of the light-transmitting glue layer 3 in the D-axis direction is L1, and the diagonal length of the LED light-emitting chip 2 is H1, satisfying L1 ≤ H1. Referring to Figure 1-2 .

[0049] It is preset that the X-axis, Y-axis, and Z-axis are spatial rectangular coordinate axes. The X-axis and Y-axis are respectively parallel to two sides of the LED light-emitting chip 2, the Z-axis is parallel to the optical axis, and the D-axis is parallel to a diagonal of the LED light-emitting chip 2.

[0050] The shape of the side surface of the light-transmitting glue layer 3: 1. The contour line of the side surface of the light-transmitting glue layer 3 in the plane where the D-axis and Z-axis are located is a straight line parallel to the optical axis. Referring to Figure 2 ; 2. The contour line of the side surface of the light-transmitting glue layer 3 in the plane where the D-axis and Z-axis are located is an inclined straight line or curve that gradually approaches the optical axis of the LED light-emitting chip 2 in the direction from the LED light-emitting chip 2 to the lens 4. Referring to Figure 1When the upper surface of the light-transmitting adhesive layer 3 is a flat surface, the cross-sectional shape of the light-transmitting adhesive layer 3 in the plane where the D axis and the Z axis are located is a quasi-rectangle or a quasi-trapezoid.

[0051] The light-emitting surface size of the rectangular LED light-emitting chip 2 in the D axis is the largest, and the divergence angle is the largest. Refer to Figure 7-8 , after the large-angle light at the edge emitted by the LED light-emitting chip 2 reaches the side surface of the light-transmitting adhesive layer 3 on the D axis and undergoes refraction, it enters the lens 4 through the cavity structure 5, and then exits after two refraction effects of the lower optical interface 41 and the upper optical interface 42 of the lens 4. The side surface of the light-transmitting adhesive layer 3 of the present invention can refract the incident light at the large angle at the edge upward in the D axis direction, improving the light efficiency; at the same time, through three refraction effects, the light-receiving ability of the D axis is enhanced, the central light intensity can be increased, and the divergence angle of the D axis can be reduced.

[0052] Optimization scheme: The lengths of the upper surface of the light-transmitting adhesive layer 3 in the X-axis and Y-axis directions are L2 and L3, and the two side lengths of the LED light-emitting chip 2 in the X-axis and Y-axis directions are H2 and H3, respectively, satisfying L2≥H2 and L3≥H3.

[0053] Refer to Figure 3-4 , the shape of the side surface of the light-transmitting adhesive layer 3 in the plane where the X axis and the Z axis are located:

[0054] 1. The contour line of the side surface of the light-transmitting adhesive layer 3 in the plane where the X axis and the Z axis are located is a straight line parallel to the optical axis, refer to Figure 4 . The setting method is the same as that of the D axis, and the optical path diagram refers to Figure 8 , improving the light efficiency while enhancing the light-receiving ability of the X axis, increasing the central light intensity, and reducing the divergence angle of the X axis.

[0055] 2. The contour line of the side surface of the light-transmitting adhesive layer 3 in the plane where the X axis and the Z axis are located is an inclined straight line or curve that gradually moves away from the optical axis of the LED light-emitting chip 2 in the direction from the LED light-emitting chip 2 to the lens 4, refer to Figure 3 . The side surface of the light-transmitting adhesive layer 3 is set as a reflecting surface for reflecting the large-angle light at the edge in the X-axis direction. Refer to Figure 9 , the light of the LED light-emitting chip 2 is incident on the side surface of the X axis of the light-transmitting adhesive layer 3, is reflected and then enters the lens 4, and exits after passing through the refraction effects of the lower optical interface 41 and the upper optical interface 42, that is, the large-angle light at the edge exits at a certain divergence angle after one reflection and two refractions. The divergence angle of the original emitted light of the LED light-emitting chip 2 is larger in the D axis than in the X axis. By setting different structures for the side surfaces of the light-transmitting adhesive layer 3 on the D axis and the X axis, the divergence angles of the light exiting in the D axis and the X axis after passing through the light-transmitting adhesive layer 3 and the lens 4 are made similar.

[0056] When the upper surface of the light-transmitting adhesive layer 3 is a flat surface, the cross-sectional shape of the light-transmitting adhesive layer 3 in the plane where the X axis and the Z axis are located is a quasi-rectangle or a quasi-trapezoid.

[0057] Reference Figure 5-6 , the shape of the side surface of the light-transmitting adhesive layer 3 in the plane where the Y-axis and Z-axis are located:

[0058] 1. The contour line of the side surface of the light-transmitting adhesive layer 3 in the plane where the Y-axis and Z-axis are located is a straight line parallel to the optical axis. Refer to Figure 6 . The setting method is the same as that of the D-axis, and the optical path diagram refers to Figure 8 . While improving the light efficiency, it enhances the light collection ability of the Y-axis, increases the central light intensity, and reduces the divergence angle of the Y-axis.

[0059] 2. The contour line of the side surface of the light-transmitting adhesive layer 3 in the plane where the Y-axis and Z-axis are located is an inclined straight line or curve that gradually moves away from the optical axis of the LED light-emitting chip 2 in the direction from the LED light-emitting chip 2 to the lens 4. Refer to Figure 5 . The side surface of the light-transmitting adhesive layer 3 in the Y-axis direction is set as a reflecting surface for reflecting large-angle light. Refer to the X-axis optical path diagram - Figure 9 . The light emitted from the LED light-emitting chip 2 is incident on the side surface of the Y-axis of the light-transmitting adhesive layer 3, is reflected and then enters the lens 4, and is emitted after passing through the refraction of the lower optical interface 41 and the upper optical interface 42. That is, after one reflection and two refractions of the large-angle light at the edge, the light is emitted at a certain divergence angle. The divergence angle of the original emitted light of the LED light-emitting chip 2 is greater in the D-axis than in the Y-axis. By setting different structures for the side surfaces of the light-transmitting adhesive layer 3 in the D-axis and Y-axis, the divergence angles of the light emitted in the D-axis and Y-axis after passing through the light-transmitting adhesive layer 3 and the lens 4 are made similar.

[0060] When the upper surface of the light-transmitting adhesive layer 3 is a plane, the shape of the cross-section of the light-transmitting adhesive layer 3 in the plane where the Y-axis and Z-axis are located is a quasi-rectangle or a quasi-trapezoid.

[0061] The divergence angle of the light emitted by the LED light-emitting chip 2 is greater in the D-axis than in the X-axis and Y-axis. By setting different structures for the side surfaces of the light-transmitting adhesive layer 3 in the D-axis, X-axis, and Y-axis, the divergence angles of the light in the D-axis, X-axis, and Y-axis after passing through the light-transmitting adhesive layer 3 and the lens 4 tend to be close. Preferably, the outer contours of the upper surfaces of the light-transmitting adhesive layer 3 and the LED light-emitting chip 2 are respectively set as a circle and a rectangle.

[0062] Example 1: Refer to Figure 11 , the LED packaging device of the present utility model includes a bracket 1, an LED light-emitting chip 2, a light-transmitting adhesive layer 3, a lens 4, and a cavity structure 5. The LED light-emitting chip 2 is disposed on the bracket 1. The lower surface of the light-transmitting adhesive layer 3 at least covers the upper surface of the LED light-emitting chip 2. The lens 4 is disposed on the bracket 1. The LED light-emitting chip 2 and the light-transmitting adhesive layer 3 are encapsulated between the bracket 1 and the lens 4.

[0063] The lens 4 includes a lower optical interface 41 for inputting light rays and an upper optical interface 42 for outputting light rays. The middle region of the lower optical interface 41 is closely attached to the upper surface of the light-transmitting adhesive layer 3. There is a cavity structure 5 surrounding the lens 4 and the light-transmitting adhesive layer 3 around the periphery.

[0064] The outer contours of the upper surfaces of the light-transmitting adhesive layer 3 and the LED light-emitting chip 2 are respectively set as circular and rectangular. The lengths of the upper surface of the light-transmitting adhesive layer 3 in the D-axis, X-axis, and Y-axis directions are L1, L2, and L3. The diagonal length of the LED light-emitting chip 2 is H1, and the two side lengths in the X-axis and Y-axis directions are H2 and H3 respectively. It satisfies L1 < H1, L2 > H2, L3 > H3, referring to Figure 11 .

[0065] Example Two: Referring to Figure 12 , the main difference from the setting in Example One is that it satisfies L1 = H1, L2 > H2, L3 > H3, referring to Figure 12 . Other settings are the same as those in Example One.

[0066] Example Three: Referring to Figure 13 , the main difference from the setting in Example One is that L1 < H1, L2 = H2, L3 = H3, referring to Figure 13 . Other settings are the same as those in Example One.

[0067] Example Four: Referring to Figure 14 , the main difference from the setting in Example One is that L1 < H1, L2 = H2, L3 > H3, referring to Figure 11 . Other settings are the same as those in Example One.

[0068] Furthermore, the upper optical interface 42 is a plane or a curved surface, preferably a convex curved surface. The lower optical interface 41 is a plane or a curved surface, preferably a plane. The present invention further includes a gold wire 6 for connecting the bracket 1 and the LED light-emitting chip 2. A part of the gold wire 6 is disposed in the cavity structure 5, and the other part is disposed in the light-transmitting adhesive layer 3.

[0069] The above is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An LED packaging device, characterized in that, Comprising: a bracket (1); an LED light-emitting chip (2), which is disposed on the bracket (1); a light-transmitting glue layer (3), the lower surface of which at least covers the upper surface of the LED light-emitting chip (2); a lens (4), which is disposed on the bracket (1), the lens (4) includes a lower optical interface (41) for inputting light and an upper optical interface (42) for outputting light, and the lower optical interface (41) is in close contact with the upper surface of the light-transmitting glue layer (3); a cavity structure (5), which is disposed around the light-transmitting glue layer (3) and between the lens (4) and the bracket (1); The length of the upper surface of the light-transmitting glue layer (3) in the D-axis direction is L1, and the diagonal length of the LED light-emitting chip (2) is H1, satisfying L1 ≤ H1; The X-axis, Y-axis, and Z-axis are three-dimensional rectangular coordinate axes. The X-axis and Y-axis are respectively parallel to two sides of the LED light-emitting chip (2), the Z-axis is parallel to the optical axis, and the D-axis is parallel to a diagonal of the LED light-emitting chip (2).

2. The LED packaging device according to claim 1, wherein The contour line of the side surface of the light-transmitting glue layer (3) in the plane where the D-axis and Z-axis are located is a straight line parallel to the optical axis, or the contour line of the side surface of the light-transmitting glue layer (3) in the plane where the D-axis and Z-axis are located is a straight line or curve that gradually approaches the optical axis from the LED light-emitting chip (2) to the lens (4).

3. The LED packaging device according to claim 1, wherein, The lengths of the upper surface of the light-transmitting glue layer (3) in the X-axis and Y-axis directions are L2 and L3, and the two side lengths of the LED light-emitting chip (2) in the X-axis and Y-axis directions are H2 and H3 respectively, satisfying L2 ≥ H2 and L3 ≥ H3.

4. The LED packaging device according to claim 3, wherein The contour line of the side surface of the light-transmitting glue layer (3) in the plane where the X-axis and Z-axis are located is a straight line parallel to the optical axis; or the contour line of the side surface of the light-transmitting glue layer (3) in the plane where the X-axis and Z-axis are located is an inclined straight line or curve that gradually moves away from the optical axis from the LED light-emitting chip (2) to the lens (4).

5. The LED packaging device according to claim 3, wherein, The contour line of the side surface of the light-transmitting glue layer (3) in the plane where the Y-axis and Z-axis are located is a straight line parallel to the optical axis, or the contour line of the side surface of the light-transmitting glue layer (3) in the plane where the Y-axis and Z-axis are located is an inclined straight line or curve that gradually moves away from the optical axis from the LED light-emitting chip (2) to the lens (4).

6. The LED packaging device according to claim 1, wherein The outer contours of the upper surfaces of the light-transmitting glue layer (3) and the LED light-emitting chip (2) are respectively set to be circular and rectangular.

7. The LED packaging device according to claim 1, characterized in that, The upper optical interface (42) is a plane or a curved surface.

8. The LED packaging device according to claim 1, characterized in that, The lower optical interface (41) is a plane or a curved surface.

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