Silicon wafer support plate slotting device

Abstract

The utility model provides a silicon wafer support plate slotting device, comprising a base plate, the base plate is provided with two first screw rods arranged at intervals, the first screw rods are provided with first slide blocks and first motors driving the first slide blocks to move along the first screw rods, and the first screw rods are arranged along the Y-axis direction; a Y-direction translation bracket, an X-direction translation bracket and the like; the grooving tool bit is fixedly arranged on the third sliding block; the processing platform is used for clamping the silicon wafer carrier plate and milling the silicon wafer carrier plate through the slotting tool bit; the punching drill bit conducts punching work on the silicon wafer carrier plate in the Y-axis direction, the machining platform fixes a plate material used for machining and forming the silicon wafer carrier plate, then a groove for containing a silicon wafer is formed through machining of the grooving tool bit, and then the side face of the silicon wafer carrier plate is machined through the punching drill bit to form an airflow hole. Automatic machining of the silicon wafer carrier plate is achieved through the silicon wafer carrier plate grooving device.

Description

Technical Field

[0001] The utility model relates to the field of processing equipment for silicon wafer carriers, in particular to a silicon wafer carrier slotting device. Background Art

[0002] PVD (physical vapor deposition) coating is a key step in the manufacturing of solar cells (especially silicon-based solar cells), crucial for improving the photovoltaic conversion efficiency of solar cells. During the PVD coating process, silicon wafers are placed on a wafer carrier, which acts as a support for the wafers. The wafers are then coated with a thin film using a coating device. For example, a wafer carrier is disclosed in Chinese patent document CN214193440U.

[0003] However, the aforementioned silicon wafer carrier is constructed by sequentially assembling and gluing multiple wafer carriers. When the wafer carrier is subjected to external forces, it is prone to breakage at the joints. Therefore, milling the sheet material to form multiple grooves for accommodating the silicon wafers can improve the overall strength of the wafer carrier. Therefore, a wafer carrier slotting device for slotting the sheet material is needed. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a silicon wafer carrier slotting device to solve the problems mentioned in the above background technology section.

[0005] The utility model is achieved through the following technical solutions:

[0006] A silicon wafer carrier slotting device comprises a base plate, the base plate is provided with two first screw rods arranged at intervals, the first screw rods are provided with a first slider, and a first motor driving the first slider to move along the first screw rod, the first screw rod is arranged along the Y-axis direction; a Y-direction translation bracket, the Y-direction translation bracket comprises two vertical plates fixedly provided on the first slider, and a horizontal plate connecting the two vertical plates, the horizontal plate is provided with a second screw rod along the X-axis direction, the second screw rod is provided with a second slider, and the vertical plate is fixed with a second slider for driving the second slider to move along the second screw rod. Two motors; an X-direction translation bracket, the X-direction translation bracket including a translation plate fixedly mounted on the second slider, the translation plate being provided with a third screw along the Z-axis direction, the third screw being provided with a third slider, the translation plate being provided with a third motor for driving the third slider to move along the third screw; a slotting cutter head, the slotting cutter head being fixedly mounted on the third slider; a processing platform, the processing platform being used to clamp the silicon wafer carrier plate and mill it by means of the slotting cutter head; a punching drill bit, the punching drill bit performing punching work on the silicon wafer carrier plate along the Y-axis direction.

[0007] Furthermore, the processing platform is provided with a slot for supplying the silicon wafer carrier plate material, and one side wall of the processing platform is provided with a plurality of supporting members for supporting the silicon wafer carrier plate material.

[0008] Furthermore, the base plate is provided with a slide rail along the X-axis direction, and the punching drill bit is slidably connected along the slide rail.

[0009] Furthermore, the bottom plate is fixed with two support blocks arranged at intervals along the X-axis direction, the processing platform is fixed on the support blocks, and the first sliding block is arranged between the processing platform and the bottom plate.

[0010] Furthermore, the upper end of the vertical plate is bent toward the side away from the punching drill bit, and the horizontal plate is arranged at the end of the side away from the punching drill bit.

[0011] Furthermore, the base plate is fixed with a fourth screw rod along the X-axis direction, the fourth screw rod is provided with a fourth slider, and the base plate is fixed with a fourth motor for driving the fourth slider to move along the fourth screw rod; the fourth slider is fixedly connected to the punching drill bit.

[0012] The beneficial effects of the present utility model are as follows: a silicon wafer carrier slotting device comprises a bottom plate, the bottom plate is provided with two first screw rods arranged at intervals, the first screw rod is provided with a first slider, and a first motor driving the first slider to move along the first screw rod, the first screw rod is arranged along the Y-axis direction; a Y-direction translation bracket, the Y-direction translation bracket comprises two vertical plates fixedly mounted on the first slider, and a horizontal plate connecting the two vertical plates, the horizontal plate is provided with a second screw rod along the X-axis direction, the second screw rod is provided with a second slider, and the vertical plate is fixed with a second motor for driving the second slider to move along the second screw rod; an X-direction translation bracket, the X-direction translation bracket comprises two vertical plates fixedly mounted on the first slider, and a horizontal plate connecting the two vertical plates, the horizontal plate is provided with a second screw rod along the X-axis direction, the second screw rod is provided with a second slider, and the vertical plate is fixed with a second motor for driving the second slider to move along the second screw rod; The translation plate of the second slider is provided with a third screw rod along the Z-axis direction, the third screw rod is provided with a third slider, and the translation plate is fixed with a third motor for driving the third slider to move along the third screw rod; a slotting cutter head, the slotting cutter head is fixed on the third slider; a processing platform, which is used to clamp the silicon wafer carrier plate and mill it through the slotting cutter head; a punching drill bit, the punching drill bit punches the silicon wafer carrier plate along the Y-axis direction, the processing platform fixes the plate used to form the silicon wafer carrier plate, and then forms a groove for placing the silicon wafer through the slotting cutter head, and then forms an air flow hole on the side of the silicon wafer carrier plate through the punching drill bit. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional diagram of the present utility model.

[0014] Figure 2 It is a side view of the present utility model.

[0015] Figure 3 This is a schematic diagram of a silicon wafer carrier plate being processed by the grooving device of the present invention to form a silicon wafer carrier plate.

[0016] The above drawings include the following reference numerals:

[0017] 1. Base plate; 11. First screw rod; 12. First slider; 13. First motor; 14. Slide rail; 15. Fourth screw rod; 16. Fourth slider; 17. Fourth motor; 18. Support block; 2. Y-direction translation bracket; 21. Vertical plate; 22. Horizontal plate; 23. Second screw rod; 24. Second motor; 3. X-direction translation bracket; 31. Translation plate; 32. Third screw rod; 33. Third slider; 34. Third motor; 4. Slotting cutter head; 5. Processing platform; 51. Slot; 52. Top support; 53. Reference plane; 6. Punch drill bit; A1. Silicon wafer carrier plate; A2. Silicon wafer carrier. DETAILED DESCRIPTION

[0018] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0019] Reference Figure 1 and Figure 3As shown, a silicon wafer carrier slotting device includes a base plate 1, the base plate 1 is provided with two first screw rods 11 arranged at intervals, the first screw rod 11 is provided with a first slider 12, and a first motor 13 that drives the first slider 12 to move along the first screw rod 11, and the first screw rod 11 is arranged along the Y-axis direction; a Y-direction translation bracket 2, the Y-direction translation bracket 2 includes two vertical plates 21 fixed to the first slider 12, and a horizontal plate 22 connecting the two vertical plates 21, the horizontal plate 22 is provided with a second screw rod 23 along the X-axis direction, the second screw rod 23 is provided with a second slider, and the vertical plate 21 is fixed with a second motor 2 for driving the second slider to move along the second screw rod 23 4; X-direction translation bracket 3, the X-direction translation bracket 3 includes a translation plate 31 fixed to the second slider, the translation plate 31 is provided with a third screw rod 32 along the Z-axis direction, the third screw rod 32 is provided with a third slider 33, and the translation plate 31 is fixed with a third motor 34 for driving the third slider 33 to move along the third screw rod 32; a slotting cutter head 4, the slotting cutter head 4 is fixed to the third slider 33; a processing platform 5, the processing platform 5 is used to clamp the silicon wafer carrier plate and mill it through the slotting cutter head 4 to form a plurality of grooves for embedding the silicon wafer; a punching drill bit 6, the punching drill bit 6 punches the silicon wafer carrier plate along the Y-axis direction.

[0020] Thus, the first motor 13 drives the slotting cutter head 4 to move along the Y axis, the second motor 24 drives the slotting cutter head 4 to move along the X axis, and the third motor 34 drives the slotting cutter head 4 to move along the Z axis.

[0021] During use, the processing platform 5 secures the sheet material used to form the silicon wafer carrier. The slotting tool 4 then forms grooves for the wafers. The punching drill 6 then forms airflow holes on the sides of the wafer carrier. The function of the airflow holes can be found in the disclosure of Chinese Patent CN117867460A.

[0022] Because the dimensions of the sheet material used to form the silicon wafer carrier may vary, the processing platform 5 is equipped with a slot 51 for the silicon wafer carrier. One sidewall of the processing platform 5 is provided with several supporting members 52 for supporting the silicon wafer carrier. These supporting members 52 may be retractable spring pins. In other embodiments, the supporting members 52 may be screws extending through the sidewall of the processing platform 5 to support the silicon wafer carrier. The other sidewall of the processing platform 5 serves as a reference surface 53 for the sheet material during processing, thereby ensuring the consistency of the dimensions of the grooves in the finished silicon wafer carrier.

[0023] The bottom plate 1 is provided with a slide rail 14 along the X-axis direction, and the punch drill 6 is slidably connected along the slide rail 14. The displacement of the punch drill 6 can be controlled by electronic control, or the position of the punch drill 6 relative to the silicon wafer carrier can be adjusted manually.

[0024] Preferably, the punching drill bit 6 is electrically controlled. Specifically, a fourth screw 15 is fixedly mounted on the base plate 1 along the X-axis, the fourth screw 15 being provided with a fourth slider 16. A fourth motor 17 is fixedly mounted on the base plate 1 for driving the fourth slider 16 to move along the fourth screw 15. The fourth slider 16 is fixedly connected to the punching drill bit 6, and numerical control programming can be used to control the first motor 13 to the fourth motor 17, thereby controlling the working stroke of the slotting cutter head 4 and the punching drill bit 6, thereby ensuring the consistency of the dimensions of the various grooves on the silicon wafer carrier and achieving automated processing.

[0025] Reference Figure 2 As shown, the base plate 1 is fixed with two spaced support blocks 18 along the X-axis, the processing platform 5 is fixed to the support blocks 18, and the first slider 12 is arranged between the processing platform 5 and the base plate 1. Through this structural design, the overall structure of the silicon wafer carrier slotting device of the utility model is compact and the structural layout is reasonable.

[0026] The upper end of the vertical plate 21 is bent toward the side away from the punching drill bit 6, and the horizontal plate 22 is provided at the end of the side away from the punching drill bit 6. Thus, the working area of the slotting cutter head 4 can be increased while maintaining the occupied space in the silicon wafer carrier slotting device of the present invention, making the overall structure of the slotting device compact and the structural layout reasonable.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0028] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, the terms "first" and "second" may explicitly or implicitly include one or more of the features.

[0029] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A silicon wafer carrier slotting device, characterized in that: The invention comprises a base plate (1), the base plate (1) being provided with two first screw rods (11) arranged at intervals, the first screw rod (11) being provided with a first slider (12), and a first motor (13) driving the first slider (12) to move along the first screw rod (11), the first screw rod (11) being arranged along the Y-axis direction; A Y-direction translation bracket (2), the Y-direction translation bracket (2) comprising two vertical plates (21) fixedly mounted on the first slider (12), and a horizontal plate (22) connecting the two vertical plates (21), the horizontal plate (22) being provided with a second screw rod (23) along the X-axis direction, the second screw rod (23) being provided with a second slider, and the vertical plate (21) being provided with a second motor (24) for driving the second slider to move along the second screw rod (23); An X-direction translation bracket (3), the X-direction translation bracket (3) comprising a translation plate (31) fixedly mounted on the second slider, the translation plate (31) being provided with a third screw rod (32) along the Z-axis direction, the third screw rod (32) being provided with a third slider (33), and the translation plate (31) being provided with a third motor (34) for driving the third slider (33) to move along the third screw rod (32); a slotting cutter head (4), the slotting cutter head (4) being fixedly mounted on the third slider (33); A processing platform (5), the processing platform (5) is used to clamp the silicon wafer carrier plate and mill it through the slotting cutter head (4); A punching drill bit (6) is used to punch holes in a silicon wafer carrier plate along the Y-axis direction.

2. The silicon wafer carrier slotting device according to claim 1, characterized in that: The processing platform (5) is provided with a slot (51) for the silicon wafer carrier plate to be embedded, and one side wall of the processing platform (5) is provided with a plurality of supporting members (52) for supporting the silicon wafer carrier plate.

3. The silicon wafer carrier slotting device according to claim 1, characterized in that: The bottom plate (1) is provided with a slide rail (14) along the X-axis direction, and the punching drill bit (6) is slidably connected along the slide rail (14).

4. The silicon wafer carrier slotting device according to claim 1, characterized in that: The base plate (1) is fixedly provided with two spaced support blocks (18) along the X-axis direction, the processing platform (5) is fixedly provided on the support blocks (18), and the first sliding block (12) is provided between the processing platform (5) and the base plate (1).

5. The silicon wafer carrier slotting device according to claim 1, characterized in that: The upper end of the vertical plate (21) is bent toward a side away from the punching drill bit (6), and the horizontal plate (22) is arranged at the end of the side away from the punching drill bit (6).

6. The silicon wafer carrier slotting device according to claim 1, characterized in that: The base plate (1) is fixedly provided with a fourth screw rod (15) along the X-axis direction, the fourth screw rod (15) is provided with a fourth slider (16), and the base plate (1) is fixedly provided with a fourth motor (17) for driving the fourth slider (16) to move along the fourth screw rod (15); the fourth slider (16) is fixedly connected to the punching drill bit (6).

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