MEMS probe card assembly

Abstract

The utility model discloses an MEMS probe card assembly, which belongs to the technical field of probe cards and comprises a frame. The number of the adjusting pieces is multiple, the multiple adjusting pieces are movably connected with the rack, and the multiple adjusting pieces can selectively move relative to the rack in the height direction; and the probe group is connected with the adjusting sheet. According to the probe card assembly designed by the utility model, each adjusting sheet moves to adjust the position of the corresponding probe group in the height direction, so that the plurality of probe groups can be contacted with the plurality of chips on the wafer at the same time, the test of the whole wafer can be completed at one time, the test efficiency of the wafer is improved, and the test cost is reduced. Therefore, the testing time and labor cost of the wafer are reduced, and the overall testing cost of the wafer is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of probe cards, and particularly relates to a MEMS probe card assembly. Background Art

[0002] In the semiconductor manufacturing process, Wafer Level Chip Scale Package (WLCSP) is an advanced packaging technology that enables chip-level packaging, thereby reducing the packaging volume and improving performance. Burn-In (aging test) conducted during the manufacturing process is a crucial step to ensure product quality and reliability. It typically involves placing the chips in a high-temperature environment and applying operating voltage and current for a period of time to accelerate the manifestation of potential defects.

[0003] For high-density memory chips such as DRAM (Dynamic Random Access Memory) and FLASH memory, traditional testing methods often require testing each chip individually, which is not only time-consuming but also costly. Summary of the Utility Model

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. For this reason, an object of the utility model is to provide a MEMS probe card assembly. According to the MEMS probe card assembly designed by the utility model, each adjusting piece moves to adjust the position of the corresponding probe group in the height direction, so that multiple probe groups can contact multiple chips on the wafer simultaneously, thereby achieving the testing of the entire wafer at one time, improving the testing efficiency of the wafer, reducing the testing time and labor cost of the wafer, and reducing the overall testing cost of the wafer.

[0005] To achieve the above object, the utility model provides the following technical solutions:

[0006] The utility model provides a MEMS probe card assembly, including: a frame; adjusting pieces, the adjusting pieces are configured as multiple, and the multiple adjusting pieces are respectively movably connected to the frame, and the multiple adjusting pieces are respectively selectively movable relative to the frame in the height direction; probe groups, the probe groups are connected to the adjusting pieces.

[0007] According to the MEMS probe card assembly of the utility model, by providing multiple adjusting pieces on the frame, and each adjusting piece can move relative to the frame in the height direction respectively, the adjusting piece moves to adjust the position of the corresponding probe group in the height direction, so that multiple probe groups can contact multiple chips on the wafer simultaneously, thereby achieving the testing of the entire wafer at one time, improving the testing efficiency of the wafer, reducing the testing time and labor cost of the wafer, and reducing the overall testing cost of the wafer.

[0008] Further, multiple said adjusting pieces are respectively located above the wafer, and the projection of the wafer in the height direction is located within multiple said adjusting pieces; wherein the wafer has multiple test areas, multiple said adjusting pieces correspond to multiple said test areas one by one, and the projection of each said test area in the height direction is respectively located within the corresponding said adjusting piece.

[0009] Further, the frame includes: an adjusting plate; a moving rod, and multiple said moving rods are configured to be in one-to-one correspondence with multiple adjusting pieces. The moving rod is movably connected to the adjusting piece, and the moving rod can selectively move relative to the adjusting plate in the height direction, and the moving rod is connected to the corresponding adjusting piece.

[0010] Further, a first threaded hole is provided on the adjusting plate, the moving rod is configured as a first screw rod, the first screw rod is in threaded cooperation with the first threaded hole, and the free end of the first screw rod is rotatably connected to the adjusting piece.

[0011] Further, multiple limiting columns are provided on the adjusting plate, multiple limiting holes are provided on the adjusting piece, multiple said limiting holes are arranged in one-to-one correspondence with multiple said limiting columns, and each said limiting column is respectively movably inserted into the corresponding limiting hole.

[0012] Further, it further includes: a return spring, and multiple said return springs are configured to be in one-to-one correspondence with the first screw rods. The return spring is sleeved on the outer periphery of the corresponding first screw rod.

[0013] Further, multiple second threaded holes are provided on the adjusting plate, the moving rod is configured as multiple second screw rods, multiple said second screw rods are respectively in threaded cooperation with the corresponding second threaded holes, and the free ends of multiple said second screw rods are respectively rotatably connected to the adjusting piece.

[0014] Further, the frame further includes: a fixing plate, one side of the fixing plate in the thickness direction is connected to the testing device, and the adjusting plate is detachably arranged on the other side of the fixing plate in the thickness direction.

[0015] Other advantages, objectives and features of the present utility model will be described in the subsequent description, and are to some extent obvious to those skilled in the art, or those skilled in the art can obtain teachings from the practice of the present utility model. The objectives and other advantages of the present utility model can be achieved and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to make the objectives, technical solutions and beneficial effects of the present utility model clearer, the present utility model provides the following drawings for illustration:

[0017] Figure 1 It is a schematic diagram of the probe card assembly of the present utility model;

[0018] Figure 2 Schematic diagram of the cooperation of the adjusting plate, adjusting piece and the first screw of the present utility model;

[0019] Figure 3 Schematic diagram of the cooperation of the adjusting plate, adjusting piece and the second screw of the present utility model.

[0020] The marks in the attached drawings are as follows:

[0021] 1. Probe card assembly; 2. Wafer;

[0022] 10. Frame; 11. Adjusting plate; 121. First screw; 122. Limit column; 123. Return spring; 13. Second screw; 14. Fixed plate;

[0023] 20. Adjusting piece;

[0024] 30. Probe group; 31. Probe;

[0025] 40. Circuit board. Detailed implementation manners

[0026] In order to make the purpose, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with embodiments and drawings. The illustrative embodiments and descriptions of the present utility model are only used to explain the present utility model and do not limit the present utility model.

[0027] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present utility model. However, it will be apparent to those of ordinary skill in the art that: It is not necessary to employ these specific details to implement the present utility model. In other instances, well-known structures, circuits, materials or methods have not been specifically described in order to avoid obscuring the present utility model.

[0028] Throughout the specification, the reference to "one embodiment", "embodiment", "one example" or "example" means that the specific features, structures or characteristics described in connection with that embodiment or example are included in at least one embodiment of the present utility model. Thus, the phrases "one embodiment", "embodiment", "one example" or "example" appearing throughout the specification do not necessarily all refer to the same embodiment or example. Additionally, the specific features, structures or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art should understand that the diagrams provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0029] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present utility model.

[0030] Embodiment 1: As Figures 1 - 3 shown, the present utility model provides a MEMS probe card assembly 1, including: a frame 10, adjusting pieces 20 and a probe group 30. The adjusting pieces 20 are configured as multiple ones, and the multiple adjusting pieces 20 are respectively movably connected to the frame 10. The multiple adjusting pieces 20 can respectively selectively move relative to the frame 10 in the height direction. The probe group 30 is connected to the adjusting pieces 20.

[0031] In some embodiments, the frame 10 is adapted to be fixedly connected to a testing device. Multiple adjusting pieces 20 are movably arranged on the frame 10. The multiple adjusting pieces 20 can respectively selectively move relative to the frame 10 in the height direction. On one side of each adjusting piece 20 facing away from the frame 10, a probe group 30 is respectively arranged. The probe group 30 includes multiple probes 31, and the multiple probes 31 are respectively adapted to test multiple chips on the wafer 2. A circuit board 40 is also arranged on the frame 10. The probe group 30 is electrically connected to the circuit board 40. Thus, when the probe group 30 contacts the chips on the tested wafer 2, the probe card assembly 1 of the present application can detect whether the tested wafer 2 is qualified.

[0032] It can be understood that the frame 10 serves as the basic structure of the entire probe card assembly 1. The frame 10 provides the functions of support and positioning, ensuring the stability of the probe card assembly 1. The adjusting pieces 20 are movable components. The multiple adjusting pieces 20 can respectively move relative to the frame 10 along the height direction. The number of the adjusting pieces 20 matches the number of test areas on the wafer 2. Each adjusting piece 20 corresponds to one test area on the wafer 2. The probe group 30 is connected to the adjusting pieces 20. The probe group 30 is used to establish an electrical connection with the test points on the surface of the wafer 2. When the adjusting piece 20 moves, the probe group 30 moves accordingly to ensure good contact with the test points on the wafer 2. It is worth mentioning that each adjusting piece 20 can move independently, which means that each adjusting piece 20 can adjust the height independently to adapt to the unevenness of the surface of the wafer 2 and ensure good contact between the probe group 30 and the test points on the wafer 2.

[0033] Thus, by simultaneously contacting and testing multiple test areas on the wafer 2, the probe card assembly 1 can complete the test of the entire wafer 2 at one time, significantly improving the test efficiency. Moreover, the adjusting pieces 20 and the test areas on the wafer 2 correspond one by one, ensuring precise contact at each test point and improving the accuracy of the test results. At the same time, each adjusting piece 20 can be independently adjusted in height, which means that even if the surface of the wafer 2 is uneven, good contact quality can still be ensured.

[0034] Certainly, due to the height adjustment ability of the adjusting pieces 20, the staff can flexibly adjust the height of the adjusting pieces 20 according to different test requirements, improving the applicable range of the probe card assembly 1. At the same time, due to the modular design of the probe card assembly 1, the maintenance and upgrade of the probe card assembly 1 become simpler, reducing the long-term operation cost. In particular, testing the entire wafer 2 at one time instead of testing the chips one by one reduces the test time and labor cost, and lowers the overall test cost.

[0035] According to the MEMS probe card assembly 1 of the present utility model, by providing multiple adjusting pieces 20 on the frame 10, and each adjusting piece 20 can be moved relative to the frame 10 in the height direction respectively, the adjusting piece 20 moves to adjust the position of the corresponding probe group 30 in the height direction, so that multiple probe groups 30 can contact multiple chips on the wafer 2 simultaneously, thereby achieving the test of the entire wafer 2 at one time, improving the test efficiency of the wafer 2, reducing the test time and labor cost of the wafer 2, and lowering the overall test cost of the wafer 2.

[0036] Embodiment 2: On the basis of Embodiment 1, multiple adjusting pieces 20 are respectively located above the wafer 2, and the projection of the wafer 2 in the height direction is located within the multiple adjusting pieces 20; wherein the wafer 2 has multiple test areas, and the multiple adjusting pieces 20 correspond to the multiple test areas one by one, and the projection of each test area in the height direction is respectively located within the corresponding adjusting piece 20.

[0037] It can be understood that multiple adjusting pieces 20 are located above the wafer 2. When observed from the height direction, the wafer 2 is included within the range of the adjusting pieces 20, so as to ensure that the adjusting pieces 20 can cover all the test areas on the wafer 2. The wafer 2 is divided into multiple test areas, and each test area represents a specific area on the wafer 2, and this area contains the chips or circuits to be tested. Each adjusting piece 20 corresponds to one test area on the wafer 2. Thus, each adjusting piece 20 is specifically responsible for contacting the test points in one test area, and the projection of each test area in the height direction is located within the corresponding adjusting piece 20, which ensures that when the adjusting piece 20 moves, the probe group 30 can accurately contact the test points in the test area.

[0038] Thus, by precisely aligning each test area with the corresponding adjusting piece 20, good contact between the probe group 30 and the test points is ensured, improving the accuracy of test results. At the same time, through the above settings, the probe card assembly 1 can flexibly respond to wafers 2 of different sizes and shapes, as well as different types of test requirements, such as testing of chips like WLCSP, DRAM, or Flash.

[0039] It is worth noting that since each adjusting piece 20 corresponds to a specific test area, thus, if it is necessary to replace or maintain the probe group 30 in a certain area, only the corresponding adjusting piece 20 needs to be operated, simplifying the maintenance process.

[0040] According to some embodiments of the present invention, the frame 10 includes: an adjusting plate 11 and moving rods. The moving rods are configured to be multiple ones corresponding one-to-one to the multiple adjusting pieces 20. The moving rods are movably connected to the adjusting pieces. The moving rods can selectively move relative to the adjusting plate 11 in the height direction, and the moving rods are connected to the corresponding adjusting pieces 20.

[0041] It can be understood that the adjusting plate 11 is a part of the frame 10. The adjusting plate 11 is used to support and position the moving rods. The number of moving rods is the same as the number of adjusting pieces 20. Each moving rod is connected to an adjusting piece 20. The moving rods can move relative to the adjusting plate 11 in the height direction, thereby driving the connected adjusting piece 20 to move up and down.

[0042] The moving rods are connected to the adjusting pieces 20. When the moving rods move in the height direction, they will drive the adjusting pieces 20 to move together. In this way, the position adjustment of the adjusting pieces 20 in the height direction can be achieved. Each moving rod can move independently, which means that the height of each adjusting piece 20 can be adjusted separately to adapt to the unevenness of the surface of the wafer 2 or specific test requirements.

[0043] Embodiment Three: Based on Embodiment Two, a first threaded hole is provided on the adjusting plate 11. The moving rod is configured as a first screw rod 121. The first screw rod 121 is in threaded cooperation with the first threaded hole. The free end of the first screw rod 121 is rotatably connected to the adjusting piece 20.

[0044] It can be understood that multiple first threaded holes are provided on the adjusting plate 11. The first threaded holes are used to cooperate with the first screw rod 121 part of the moving rod. The moving rod is designed in the form of the first screw rod 121, enabling the moving rod to be in threaded cooperation with the first threaded holes on the adjusting plate 11. Thus, the moving rod can rotate and move along the direction of the thread, thereby changing the height of the connected adjusting piece 20. It should be noted that the free end of the moving rod is rotatably connected to the adjusting piece 20, which means that when the moving rod rotates, it will drive the adjusting piece 20 to move in the height direction to achieve the position adjustment of the adjusting piece 20, and at the same time, the adjusting piece 20 will not rotate with the first screw rod 121.

[0045] According to some embodiments of the present utility model, a plurality of limiting columns 122 are provided on the adjusting plate 11, and a plurality of limiting holes are provided on the adjusting piece 20. The plurality of limiting holes are arranged in one-to-one correspondence with the plurality of limiting columns 122, and each limiting column 122 is movably inserted into the corresponding limiting hole respectively.

[0046] It can be understood that a plurality of limiting columns 122 are provided on the adjusting plate 11, and a plurality of limiting holes are provided at corresponding positions on the adjusting piece 20. These limiting holes are in one-to-one correspondence with the limiting columns 122, ensuring that each limiting column 122 can penetrate into the corresponding limiting hole. Each limiting column 122 can move within the corresponding limiting hole, but this movement is restricted by the limiting hole, preventing the adjusting piece 20 from rotating during movement, and improving the adjustment stability of the adjusting piece 20. In particular, the cooperation between the limiting column 122 and the limiting hole ensures the stability of the adjusting piece 20 during movement, and at the same time, it can avoid the position deviation caused by the rotation of the adjusting piece 20 due to external interference.

[0047] Preferably, the probe card assembly 1 further includes: a reset spring 123. The reset spring 123 is configured to be a plurality corresponding to the first screw 121 one by one, and the reset spring 123 is sleeved on the outer periphery of the corresponding first screw 121.

[0048] It can be understood that both ends of the reset spring 123 are respectively connected to the adjusting plate 11 and the adjusting piece 20. When the adjusting piece 20 needs to be reset, the reset force of the reset spring 123 can assist in driving the adjusting piece 20 back to the initial position, facilitating the position adjustment of the adjusting piece 20. At the same time, when the adjusting piece 20 moves away from the adjusting plate 11 to a preset position, the reset force of the reset spring 123 will provide a force that makes the adjusting piece 20 tend to move towards the adjusting plate 11. Thus, there will be a certain force between the first screw 121 and the first threaded hole, making the cooperation between the first screw 121 and the first threaded hole more stable, and thus making the position of the adjusting piece 20 relative to the adjusting plate 11 more stable.

[0049] Embodiment 4: On the basis of Embodiment 2, the adjusting plate 11 is provided with a plurality of second threaded holes, and the moving rod is configured as a plurality of second screws 13. The plurality of second screws 13 are respectively in threaded cooperation with the corresponding second threaded holes, and the free ends of the plurality of second screws 13 are respectively rotatably connected to the adjusting piece 20. The second threaded holes on the adjusting plate 11: The adjusting plate 11 is provided with a plurality of second threaded holes, and these threaded holes are used to cooperate with the second screw 13 part of the moving rod.

[0050] It can be understood that the moving rod is designed in the form of the second screw rod 13, and the second screw rod 13 can be in threaded engagement with the second threaded holes on the adjusting plate 11. Thus, the moving rod can rotate and move along the direction of the thread, thereby changing the height of the adjusting piece 20 connected thereto. The free ends of the plurality of second screw rods 13 are respectively rotatably connected to the adjusting piece 20, which means that when the plurality of second screw rods 13 rotate, they will drive the adjusting piece 20 to move in the height direction, realizing the adjustment of the position of the adjusting piece 20.

[0051] It should be noted that the plurality of second screw rods 13 are respectively rotatably connected to the adjusting piece 20. Thus, the plurality of second screw rods 13 can jointly limit the position of the adjusting piece 20, avoiding the rotation of the adjusting piece 20 when the height of the adjusting piece 20 is adjusted, and improving the adjustment stability of the adjusting piece 20.

[0052] According to some embodiments of the present invention, the frame 10 further includes: a fixing plate 14, one side of the fixing plate 14 in the thickness direction is connected to the testing device, and the adjusting plate 11 is detachably arranged on the other side of the fixing plate 14 in the thickness direction.

[0053] It can be understood that one side of the fixing plate 14 in the thickness direction is fixedly connected to the testing device, and the adjusting plate 11 is detachably arranged on the other side of the fixing plate 14 in the thickness direction. Thus, by replacing the adjusting plate 11, the testing of different wafers 2 can be realized, avoiding the replacement of the entire probe card assembly 1, and improving the testing efficiency of different wafers 2.

[0054] In some embodiments, the fixing plate 14 is provided with a plurality of first through holes, and the adjusting plate 11 is provided with a plurality of second through holes. The plurality of first through holes and the plurality of second through holes are respectively arranged in one-to-one correspondence, and fasteners pass through the corresponding first through holes and second through holes to fix the adjusting plate 11 to the fixing plate 14.

[0055] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention and are not restrictive. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A MEMS probe card assembly, characterized in that: include: Rack (10); An adjusting piece (20), wherein the adjusting piece (20) is constructed in a plurality, the plurality of adjusting pieces (20) are respectively movably connected to the frame (10), and the plurality of adjusting pieces (20) are respectively selectively movable relative to the frame (10) in a height direction; A probe group (30), wherein the probe group (30) is connected to the adjustment piece (20).

2. The MEMS probe card assembly according to claim 1, wherein: The plurality of adjustment plates (20) are respectively located above the wafer (2), and the projection of the wafer (2) in the height direction is located within the plurality of adjustment plates (20); wherein The wafer (2) has a plurality of test areas, the plurality of adjustment sheets (20) correspond one-to-one to the plurality of test areas, and the projection of each test area in the height direction is located within the corresponding adjustment sheet (20).

3. The MEMS probe card assembly according to claim 2, wherein: The frame (10) comprises: Adjustment plate (11); A moving rod, wherein the moving rod is constructed to correspond one to one with a plurality of adjusting plates (20), the moving rod is movably connected to the adjusting plates, the moving rod can selectively move in a height direction relative to the adjusting plate (11), and the moving rod is connected to the corresponding adjusting plates (20).

4. The MEMS probe card assembly according to claim 3, wherein: A first threaded hole is provided on the adjustment plate (11), and the moving rod is constructed as a first screw rod (121). The first screw rod (121) is threadedly engaged with the first threaded hole, and the free end of the first screw rod (121) is rotatably connected to the adjustment plate (20).

5. The MEMS probe card assembly according to claim 4, wherein: The adjusting plate (11) is provided with a plurality of limiting posts (122), and the adjusting piece (20) is provided with a plurality of limiting holes. The plurality of limiting holes are provided in a one-to-one correspondence with the plurality of limiting posts (122), and each of the limiting posts (122) is movably inserted into the corresponding limiting hole.

6. The MEMS probe card assembly according to claim 5, wherein: Also includes: A return spring (123), wherein the return spring (123) is constructed as a plurality of return springs corresponding one to one with the first screw rod (121), and the return spring (123) is sleeved on the outer periphery of the corresponding first screw rod (121).

7. The MEMS probe card assembly according to claim 3, wherein: The adjustment plate (11) is provided with a plurality of second threaded holes, and the movable rod is constructed as a plurality of second screw rods (13). The plurality of second screw rods (13) are respectively threadedly engaged with the corresponding second threaded holes, and the free ends of the plurality of second screw rods (13) are respectively rotatably connected to the adjustment plate (20).

8. The MEMS probe card assembly according to claim 3, wherein: The frame (10) further comprises: A fixing plate (14), one side of the fixing plate (14) in the thickness direction is connected to the testing device, and the adjustment plate (11) is detachably arranged on the other side of the fixing plate (14) in the thickness direction.

Images