Display module and display device

Abstract

The embodiment of the utility model provides a display module and a display device, relates to the technical field of display, and is used for improving the electrostatic discharge capability of the display module. The display module comprises a display panel, a back plate and a frame, the back plate is arranged on the backlight side of the display panel; the frame is arranged around the display panel and the back plate, and at least part of the frame is opposite to the side face of the display panel and the side face of the back plate; wherein the frame comprises a conductive frame body and an insulating layer covering the surface of the frame body, at least part of the surface, facing the side face of the display panel, of the frame body is not covered by the insulating layer, and the surface, not covered by the insulating layer, of the frame body is electrically connected with the side face of the display panel and the side face of the backboard. The display module is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display module and a display device. Background Art

[0002] ESD (Electro-Static Discharge) is one of the main factors affecting the manufacturing yield of electronic products. In electronic products, static electricity can be generated in various ways, such as contact, friction, induction between devices, etc. When the static electricity in an electronic product accumulates to a certain level, electrostatic discharge occurs, resulting in electrostatic damage, making the electronic product have unstable performance and shortened service life.

[0003] How to timely release the static electricity in an electronic product and prevent static electricity accumulation is a technical problem that needs to be solved to improve the reliability and service life of the electronic product. Utility Model Content

[0004] The purpose of the embodiments of the present disclosure is to provide a display module and a display device for improving the electrostatic discharge ability of the display module.

[0005] To achieve the above object, the embodiments of the present disclosure provide the following technical solutions:

[0006] On the one hand, a display module is provided. The display module includes a display panel, a backplane, and a frame. The backplane is disposed on the backlight side of the display panel; the frame surrounds the display panel and the backplane, and at least part of the frame is opposite to the side surface of the display panel and the side surface of the backplane; wherein, the frame includes a conductive frame body and an insulating layer covering the surface of the frame body, at least part of the surface of the side of the frame body facing the display panel is not covered by the insulating layer, and the surface of the frame body not covered by the insulating layer is electrically connected to the side surface of the display panel and the side surface of the backplane.

[0007] In the above display module, since at least part of the surface of the side of the frame body facing the display panel is not covered by the insulating layer, and the surface of the frame body not covered by the insulating layer is electrically connected to the side surface of the display panel and the side surface of the backplane, the static electricity in the display panel can be conducted to the backplane through the conductive frame body for release. The surface of the frame body not covered by the insulating layer increases the conduction path of the static electricity in the display panel, thereby improving the electrostatic discharge ability of the display module, and further improving the reliability and service life of the display module.

[0008] In some embodiments, the display module has opposite first and second sides, the first side being for connecting to a source driver; the border body includes a first sub-border provided on the first side and a second sub-border provided on the second side, at least part of the surface of the side of the first sub-border and / or the second sub-border facing the display panel is not covered by the insulating layer, and the surface of the first sub-border and / or the second sub-border not covered by the insulating layer is electrically connected to the side of the display panel and the side of the backplane.

[0009] In some embodiments, the display module further includes a first conductive connection portion, the first conductive connection portion is electrically connected to the side of the display panel and the backplane, and the first conductive connection portion is also electrically connected to the surface of the first sub-border and / or the second sub-border not covered by the insulating layer.

[0010] In some embodiments, the number of the first conductive connection portions is multiple, and the multiple first conductive connection portions are arranged at intervals along the first sub-border and / or the second sub-border; along the extending direction of the border, the border is provided with multiple first vias, and the first vias are used for arranging connecting members to connect the border and the backplane; the first conductive connection portions are arranged between adjacent first vias.

[0011] In some embodiments, the first conductive connection portion includes an extending portion extending to the side of the backplane away from the display panel; the display module further includes: a protective layer, the protective layer covers the gap between the end of the border away from the display panel and the backplane, and the protective layer also covers the side and the surface away from the display panel of the extending portion of the first conductive connection portion.

[0012] In some embodiments, the display panel includes a color filter substrate and an array substrate arranged opposite to each other; the color filter substrate includes a first conductive gasket, and the side of the first conductive gasket is exposed on the side of the color filter substrate; a second conductive gasket is provided on the surface of the side of the array substrate facing the color filter substrate, and the second conductive gasket is grounded; the display module further includes: a conductive connecting member, at least part of the conductive connecting member is located on the side of the color filter substrate to be electrically connected to the first conductive gasket, and the conductive connecting member is also electrically connected to the second conductive gasket.

[0013] In some embodiments, the array substrate has a first side for connecting to a source driver, and the second conductive gasket is located on at least one side of the two sides of the first side in the extending direction; and / or, the array substrate has a third side for connecting to a gate driver, and the second conductive gasket is located on at least one side of the two sides of the third side in the extending direction.

[0014] In some embodiments, the second conductive gasket is located on the first side and close to one side of the third side, and the shortest distance between the second conductive gasket and the gate driver is 0.35 mm to 0.45 mm; the second conductive gasket is located on the third side and close to one side of the first side, and the shortest distance between the second conductive gasket and the source driver is 0.35 mm to 0.45 mm.

[0015] In some embodiments, the display module further includes: a second conductive connection portion, which covers the conductive connection member and is electrically connected to the surface of the backplane and the frame body that is not covered by the insulating layer.

[0016] In some embodiments, the frame body includes a plurality of sub-frames, and there is a first gap between adjacent sub-frames, and there is a second gap between the sub-frame and the backplane; the display module further includes: a conductive adhesive layer, which is filled in the first gap and the second gap.

[0017] On the other hand, a display device is provided. The display device includes: the display module as described in any of the above embodiments; and a driving circuit board connected to the display module.

[0018] The above display device has the same structure and beneficial technical effects as the display module provided in some of the above embodiments, and will not be described in detail here. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the present disclosure, the drawings required for use in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure, and those of ordinary skill in the art can also obtain other drawings based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual sizes of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0020] Figure 1 Structural diagram of a display module according to some embodiments;

[0021] Figure 2 For Figure 1 Partial cross-sectional view of the frame of the display module in along the AA direction;

[0022] Figure 3 Structural diagram of a frame according to some embodiments;

[0023] Figure 4 For Figure 3 Partial cross-sectional view of the frame in along the BB direction;

[0024] Figure 5 Structural diagram of a display module according to some embodiments of the present disclosure;

[0025] Figure 6 is Figure 5 A cross-sectional view of a partial structure of the display module in along the BB direction;

[0026] Figure 7 Top view of a display module according to some embodiments of the present disclosure;

[0027] Figure 8 is Figure 7 A cross-sectional view of a partial structure of the display module in along the CC direction;

[0028] Figure 9 is Figure 7 Partial structural diagram of the frame in the display module in ;

[0029] Figure 10 is Figure 7 Another cross-sectional view of a partial structure of the display module in along the CC direction;

[0030] Figure 11 is Figure 7 Another cross-sectional view of a partial structure of the display module in along the CC direction;

[0031] Figure 12 is Figure 7 Cross-sectional view of a partial structure of the display module in along the DD direction;

[0032] Figure 13 is Figure 12 Enlarged view of the display module in at the dashed circle S;

[0033] Figure 14 Structural diagram of an array substrate according to some embodiments of the present disclosure;

[0034] Figure 15 Structural diagram of an array substrate according to some other embodiments of the present disclosure;

[0035] Figure 16 Partial structural diagram of the display module of the present disclosure;

[0036] Figure 17 Structural diagram of a display device according to some embodiments of the present disclosure. Detailed implementation manners

[0037] Next, the technical solutions in some embodiments of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0038] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, i.e., "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples", etc., are intended to indicate that the specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0039] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "plural" is two or more.

[0040] When describing some embodiments, the expression "connected" and its derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connected" may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the content herein.

[0041] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0042] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0043] The use of "suitable for" or "configured to" herein means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps.

[0044] Additionally, the use of "based on" implies openness and inclusivity, because a process, step, calculation, or other action "based on" one or more of the stated conditions or values can, in practice, be based on additional conditions or values beyond those stated.

[0045] As used herein, "about," "substantially," or "approximate" includes the stated value and an average within an acceptable deviation range of the specific value, where the acceptable deviation range is determined by a person of ordinary skill in the art in view of the measurement being discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system).

[0046] As used herein, "parallel," "perpendicular," "equal" include the stated situation and situations similar to the stated situation, where the range of the similar situations is within an acceptable deviation range, and the acceptable deviation range is determined by a person of ordinary skill in the art in view of the measurement being discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within a deviation of 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within a deviation of 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal values is less than or equal to 5% of either one.

[0047] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can be that the layer or element is directly on the other layer or substrate, or there can be an intermediate layer between the layer or element and the other layer or substrate.

[0048] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of regions are enlarged for clarity. Thus, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Accordingly, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing. For example, an etched region shown as rectangular will generally have curved features. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0049] During the production process, electronic devices may be threatened by electrostatic discharge, resulting in performance degradation or damage. Therefore, performing ESD tests on display modules can ensure that they are not damaged by electrostatic discharge during normal use and transportation, thereby improving the overall quality of the product. ESD tests on display modules play an important role in ensuring product quality, improving product performance, supporting product R & D, ensuring production safety, and meeting regulatory and standard requirements. Therefore, during the production and R & D process of display modules, performing ESD tests is an essential step.

[0050] The main purpose of performing ESD (electrostatic discharge) tests on display modules is to evaluate the ability of display modules to resist electrostatic discharge interference. By simulating the process of electrostatic discharge, the test equipment can detect the stability and reliability of display modules when they are subjected to electrostatic shocks.

[0051] Embodiments of the present disclosure provide a display module 1000, with reference to Figure 1 and Figure 2 , including: a display panel 101, a backplane 102, a middle frame PC, a printed circuit board (not shown), and a border 103.

[0052] Among them, with reference to Figure 2 , the backplane 102 is disposed on the backlight side of the display panel 101; the middle frame PC is located between the backplane 102 and the display panel 101, and is used to support and fix the display panel 101 and protect devices such as the printed circuit board in the display module 1000; the printed circuit board is disposed on the side of the backplane 102 and is connected to the display panel 101 through a flip chip film (not shown); the border 103 surrounds the display panel 101 and the backplane 102, and at least part of the border 103 is opposite to the side surfaces of the display panel 101 and the backplane 102. Among them, with reference to Figure 3 and Figure 4 , the border 103 includes a conductive border body 1031 and an insulating layer 1032 covering the surface of the border body 1031. The conductive border body 1031 includes a metal material, which can be used to improve the structural strength of the border 103; the insulating layer 1032 on the surface of the border body 1031 helps to prevent leakage of electricity in the display module 1000 and protect user safety; it can also be colored and processed according to design requirements, providing diverse appearance options for the display module 1000, and at the same time, it also helps the display module 1000 to achieve a borderless or ultra-narrow border design to enhance the aesthetics and market competitiveness of the product.

[0053] When performing an ESD test on the above display module 1000, an electrostatic gun can be used to contact the display panel 101. When the number of discharges of the electrostatic gun is 100 and the discharge voltage of the electrostatic gun is +8KV, a charge residue phenomenon occurs on the opposite side of the side where the display panel 101 is connected to the source driver (that is, the DPO side of the display panel 101), and the display panel 101 shows abnormal display. When the number of discharges of the electrostatic gun in the air is 100 and the discharge voltage of the electrostatic gun is +8KV, a charge residue phenomenon occurs on the side where the display panel 101 is connected to the source driver (that is, the DP side of the display panel 101), and the display panel 101 shows abnormal display. Therefore, when performing an ESD test on the display module 1000, it can be found that charge residue phenomena are more likely to occur on the DP side and the DPO side of the display panel 101, resulting in abnormal display of the display panel 101.

[0054] In the above display module 1000, in order to achieve a narrow border, reduce the seam and picture tearing feeling of the display module 1000, and make the display effect of the display module 1000 better, the surrounding space of the display module 1000 is reduced. At the same time, in order to reduce the cost of the display module 1000, the material of the middle frame PC is changed from a metal material to an insulating material. As a result, there is only one conductive path in the display module 1000, that is, from the display panel 101 to the COF film, then to the printed circuit board, and then to the backplane 102. Therefore, when the display module 1000 achieves an extremely narrow seam and cost reduction, it is difficult to increase the electrostatic discharge ability of the display module 1000, and since the middle frame PC uses an insulating material, phenomena such as charge residue in the display panel 101 and burning of the COF film are more likely to occur, failing to meet the quality requirements.

[0055] To solve the above technical problems, an embodiment of the present disclosure provides a display module 1000. With reference to Figure 5 and Figure 6 , at least a part of the surface of the frame body 1031 of the border 103 facing the side of the display panel 101 is not covered by the insulating layer 1032, and the surface of the frame body 1031 not covered by the insulating layer 1032 is electrically connected to the side of the display panel 101 and the side of the backplane 102.

[0056] In the display module 1000 provided in this embodiment, since at least a part of the surface of the frame body 1031 facing the side of the display panel 101 is not covered by the insulating layer 1032, and the surface of the frame body 1031 not covered by the insulating layer 1032 is electrically connected to the side of the display panel 101 and the side of the backplane 102, the static electricity in the display panel 101 can also be conducted to the backplane 102 through the conductive frame body 1031 for release. The surface of the frame body 1031 not covered by the insulating layer 1032 increases the conductive path of the static electricity in the display panel 101, thereby improving the electrostatic discharge ability of the display module 1000.

[0057] It should be noted that "at least part of the surface of the side of the frame body 1031 facing the display panel 101 is not covered by the insulating layer 1032". The formation of this structure of the frame 103 can adopt "spray masking treatment" during the formation process of the frame 103. That is, when forming the insulating layer 1032 on the surface of the frame body 1031, the surface that does not need to be covered by the insulating layer 1032 is covered with a masking material. After forming the insulating film layer on the surface of the frame body 1031, the masking material is removed so that the formed insulating layer 1032 exposes at least part of the surface of the side of the frame body 1031 facing the display panel 101. The above-mentioned masking material can be a masking material such as masking tape, masking paper, plastic film, etc.

[0058] In some embodiments, continue to refer to Figure 5 , the display module 1000 has opposite first side C1 and second side C2. Here, the first side C1 is the DP side mentioned above, and the second side C2 is the DPO side mentioned above. The first side C1 is used to connect the source driver; the frame body 1031 includes a first sub-frame 103A provided on the first side C1 and a second sub-frame 103B provided on the second side C2. Among them, at least part of the surface of the side of the first sub-frame 103A facing the display panel 101 is not covered by the insulating layer 1032, and the surface of the first sub-frame 103A not covered by the insulating layer 1032 is electrically connected to the side of the display panel 101 and the side of the backplane 102. Since the DP side of the display module 1000, that is, the first side C1, is the side with relatively weak electrostatic discharge ability in the peripheral area of the display module 1000, at least part of the surface of the side of the first sub-frame 103A facing the display panel 101 is not covered by the insulating layer 1032. In this way, the static electricity in the display panel 101 can be conducted to the backplane 102 through the conductive first sub-frame 103A for release. The first sub-frame 103A increases the conduction path of the static electricity in the display panel 101, thereby improving the electrostatic discharge ability of the display module 1000.

[0059] In some embodiments, at least part of the surface of the second sub-frame 103B facing the side surface of the display panel 101 is not covered by the insulating layer 1032, and the surface of the second sub-frame 103B not covered by the insulating layer 1032 is electrically connected to the side surface of the display panel 101 and the side surface of the backplane 102. Since the DPO side of the display module 1000, that is, the second side C2, is the side with the weakest electrostatic discharge ability in the peripheral area of the display module 1000, at least part of the surface of the second sub-frame 103B facing the side surface of the display panel 101 is not covered by the insulating layer 1032. In this way, the static electricity in the display panel 101 can be conducted to the backplane 102 through the conductive second sub-frame 103B for release. The second sub-frame 103B increases the conduction path of the static electricity in the display panel 101, thereby improving the electrostatic discharge ability of the display module 1000.

[0060] In some embodiments, at least part of the surfaces of the first sub-frame 103A and the second sub-frame 103B facing the side surface of the display panel 101 are not covered by the insulating layer 1032, and the surfaces of the first sub-frame 103A and the second sub-frame 103B not covered by the insulating layer 1032 are electrically connected to the side surface of the display panel 101 and the side surface of the backplane 102. In this way, the static electricity in the display panel 101 can be conducted to the backplane 102 through the conductive first sub-frame 103A and second sub-frame 103B for release. Both the first sub-frame 103A and the second sub-frame 103B increase the conduction path of the static electricity in the display panel 101, improving the electrostatic discharge ability of the display module 1000.

[0061] In the display module 1000, when at least part of the surfaces of the side faces of the first sub-frame 103A and the second sub-frame 103B facing the display panel 101 are not covered by the insulating layer 1032, for the ESD test of the display module 1000, an electrostatic gun can be used to contact the display panel 101. The discharge voltages of the electrostatic gun are -4KV and +4KV respectively, and the number of discharges of the electrostatic gun is 100 times each. No charge residue phenomenon occurs on the display panel 101, and the display panel 101 displays normally. After that, the electrostatic gun is discharged in the air. The discharge voltages of the electrostatic gun are -8KV and +8KV respectively, and the number of discharges of the electrostatic gun is 100 times each. No charge residue phenomenon occurs on the display panel 101, and the display panel 101 displays normally. When at least part of the surfaces of the side faces of the first sub-frame 103A and the second sub-frame 103B facing the display panel 101 in the display module 1000 are not covered by the insulating layer 1032, only part of the static electricity in the display panel 101 is released. Since when the electrostatic gun contacts the display panel 101, the discharge voltages of the electrostatic gun are -4KV and +4KV respectively; when the electrostatic gun is discharged in the air, the discharge voltages of the electrostatic gun are -8KV and +8KV respectively, the display module 1000 still does not meet the reliability standard. Among them, the conditions of the reliability standard are: when the electrostatic gun contacts the display panel 101, the discharge voltages of the electrostatic gun are -8KV and +8KV respectively, and when the electrostatic gun is discharged in the air, the discharge voltages of the electrostatic gun are -15KV and +15KV respectively.

[0062] In some embodiments, continuing to refer to Figure 5 , the display module 1000 further has opposite third side C3 and fourth side C4. The frame body 1031 further includes a third sub-frame 103C provided on the third side C3 and a fourth sub-frame 103D provided on the fourth side C4. Among them, at least part of the surfaces of the side faces of at least one of the third sub-frame 103C and the fourth sub-frame 103D facing the display panel 101 may also not be covered by the insulating layer 1032, and the surfaces of at least one of the third sub-frame 103C and the fourth sub-frame 103D that are not covered by the insulating layer 1032 are electrically connected to the side faces of the display panel 101 and the side faces of the backplane 102. In this way, the static electricity in the display panel 101 can be conducted to the backplane 102 through at least one of the conductive third sub-frame 103C and the fourth sub-frame 103D for release. In this way, the conduction path of the static electricity in the display panel 101 is increased, and thus the electrostatic discharge ability of the display module 1000 is improved.

[0063] In some embodiments, in combination with reference to Figure 7 and Figure 8, the display module 1000 further includes a first conductive connection portion L1. The first conductive connection portion L1 is electrically connected to the side surface of the display panel 101 and the backplane 102, and the first conductive connection portion L1 is also electrically connected to the surface of the first sub-frame 103A that is not covered by the insulating layer 1032. This can avoid gaps between the display panel 101 and the frame 103, between the frame 103 and the backplane 102, and between the frame 103 and the middle frame PC, which may result in the quality and effect of the conductive path of static electricity in the display panel 101 not being guaranteed. With this setting, since the first conductive connection portion L1 is electrically connected to the side surface of the display panel 101 and the backplane 102, and the first conductive connection portion L1 is also electrically connected to the surface of the first sub-frame 103A that is not covered by the insulating layer 1032, it can ensure that the static electricity in the display panel 101 can be conducted to the backplane 102 through the first conductive connection portion L1 for release at the shortest distance. The first conductive connection portion L1 further improves the static electricity release ability of the display module 1000.

[0064] When setting the first conductive connection portion L1 of the display module 1000, the requirements for manual operation are relatively high, increasing the cost of manually attaching the first conductive connection portion L1.

[0065] Reference Figure 9 , the number of the first conductive connection portions L1 is multiple, and the multiple first conductive connection portions L1 are arranged at intervals along the first sub-frame 103A. The multiple first conductive connection portions L1 can increase the static electricity release paths in the display panel 101, so that the static electricity in the display panel 101 can be evenly and quickly conducted to the backplane 102 for release along the first sub-frame 103A.

[0066] For example, reference Figure 9 , the number of the first conductive connection portions L1 is 3, and the 3 first conductive connection portions L1 are arranged at intervals along the first sub-frame 103A and are evenly arranged at the left, middle, and right positions of the first sub-frame 103A. In other embodiments, the number of the first conductive connection portions L1 can also be 4, 5, or 6, which is not limited herein.

[0067] Continue to refer to Figure 9 , along the extension direction of the frame 103, the frame 103 is provided with multiple first through holes K, and the first through holes K are used to set connectors for connecting the frame 103 and the backplane 102; the first conductive connection portion L1 is arranged between adjacent first through holes K. This can avoid occupying the space for setting the connectors.

[0068] Exemplarily, the first conductive connection portion L1 includes a conductive tape. The first conductive connection portion L1 can also be other materials with conductivity and adhesiveness.

[0069] Exemplarily, the connector includes a screw.

[0070] ReferenceFigure 10 The first conductive connection part L1 is electrically connected to the surface of the second sub-frame 103B that is not covered by the insulating layer 1032. That is, the first conductive connection part L1 is provided on the second side C2. In this way, the first conductive connection part L1 electrically connects the display panel 101 and the backplane 102 located on the second side C2. Thus, the static electricity in the display panel 101 on the second side C2 can be transmitted to the backplane 102 through the first conductive connection part L1 for release, or can be transmitted to the second sub-frame 103B through the first conductive connection part L1 for release.

[0071] When the first conductive connection part L1 is electrically connected to the surface of the second sub-frame 103B that is not covered by the insulating layer 1032, multiple first conductive connection parts L1 are arranged at intervals along the second sub-frame 103B. The multiple first conductive connection parts L1 can increase the static electricity release path in the display panel 101, so that the static electricity in the display panel 101 can be evenly and quickly conducted to the backplane 102 through the second sub-frame 103B for release.

[0072] In the display module 1000, when the first conductive connection part L1 is electrically connected to the surface of the second sub-frame 103B that is not covered by the insulating layer 1032 and the first conductive connection part L1 is arranged at intervals in the left, middle, and right regions of the second sub-frame 103B, for the ESD test of the 3 display modules 1000, an electrostatic gun can be used to contact the display panel 101, the discharge voltages of the electrostatic gun are -8KV and +8KV respectively, and the number of discharges of the electrostatic gun is 100 times each. There is no charge residue phenomenon in the display panels 101 in the 3 display modules, and the display panels 101 display normally. After that, the electrostatic gun is used to discharge in the air, the discharge voltages of the electrostatic gun are -15KV and +15KV respectively, and the number of discharges of the electrostatic gun is 100 times each. There is no charge residue phenomenon in the display panels 101 in the 3 display modules, and the display panels 101 display normally. Therefore, when the first conductive connection part L1 in the display module 1000 is electrically connected to the surface of the second sub-frame 103B that is not covered by the insulating layer 1032 and the first conductive connection part L1 is arranged at intervals in the left, middle, and right regions of the second sub-frame 103B, the display module 1000 can meet the reliability test standard.

[0073] Reference Figure 11 The first conductive connection part L1 is also electrically connected to the surfaces of the first sub-frame 103A and the second sub-frame 103B that are not covered by the insulating layer 1032. That is, the first conductive connection part L1 is provided on the first side C1 and the second side C2. Thus, the static electricity in the display panel 101 on the first side C1 and the second side C2 can be transmitted to the backplane 102 through the first conductive connection part L1 for release, or can be transmitted to the second sub-frame 103B through the first conductive connection part L1 for release.

[0074] When the first conductive connection part L1 is disposed on the first side C1 and the second side C2, the number of the first conductive connection parts L1 is plural, and the plural first conductive connection parts L1 are arranged at intervals along the first sub-frame 103A and the second sub-frame 103B. The plural first conductive connection parts L1 can increase the static electricity release paths in the display panel 101, so that the static electricity in the display panel 101 can be evenly and quickly conducted to the backplane 102 for release on the first side C1 and the second side C2.

[0075] In some embodiments, continuing to refer to Figure 8 , the first conductive connection part L1 includes an extending part L10 extending to the side of the backplane 102 away from the display panel 101; the extending part L10 can not only ensure the reliability of the connection between the first conductive connection part L1 and the backplane 102, but also extend the path for the static electricity in the display panel 101 to be released.

[0076] Continuing to refer to Figure 8 , the display module 1000 further includes: a protective layer 104, the protective layer 104 covers the gap between the end of the frame 103 away from the display panel 101 and the backplane 102, and the protective layer 104 also covers the side surface and the surface away from the display panel 101 of the extending part L10 of the first conductive connection part L1. The protective layer 104 covers the gap between the end of the frame 103 away from the display panel 101 and the backplane 102, which can not only prevent water and oxygen from invading the display panel 101, but also contribute to the aesthetics of the display module 1000. The protective layer 104 covers the side surface and the surface away from the display panel 101 of the extending part L10 of the first conductive connection part L1, so that the protective layer 104 can protect the extending part L10 of the first conductive connection part L1, and also prevent the extending part L10 from being exposed outside the protective layer 104 and affecting the aesthetics of the display module 1000.

[0077] In some embodiments, continuing to refer to Figure 9 , the maximum width of the first conductive connection part L1 is the maximum distance between adjacent first vias K; referring to Figure 8 , the maximum length of the first conductive connection part L1 is the sum of the side thickness of the display module 1000 and the width of the protective layer 104. For example, if the maximum distance between adjacent first vias K is 43.2 mm, and the sum of the width of the side of the display module 1000 and the width of the protective layer 104 is 51.85 mm, then the width of the first conductive connection part L1 can be 42.7 mm, the length of the first conductive connection part L1 can be 51.3 mm, and the thickness of the first conductive connection part L1 can be 0.05 mm.

[0078] It should be noted that the thickness of the first conductive connection portion L1 can be adjusted adaptively according to the gap between the backplane 102 and the frame 103, as well as the gap between the display panel 101 and the frame 103, and there is no limitation thereto.

[0079] In some embodiments, referring to Figure 12 , the display panel 101 includes a color filter substrate 11 and an array substrate 12 that are disposed opposite to each other; the color filter substrate 11 includes a first conductive pad D1, and the side surface of the first conductive pad D1 is exposed on the side surface of the color filter substrate 11; a ground wire (not shown) is provided on the array substrate 12, referring to Figure 13 , on the surface of the array substrate 12 facing the color filter substrate 11, a second conductive pad D2 is provided, and the second conductive pad D2 is grounded, wherein the second conductive pad D2 is grounded by being connected to the ground wire. Referring to Figure 12 and Figure 13 , the display module 1000 further includes: a conductive connection member D, at least a part of the conductive connection member D is located on the side surface of the color filter substrate 11 to be electrically connected to the first conductive pad D1, and the conductive connection member D is also electrically connected to the second conductive pad D2. In this way, the first conductive pad D1 of the color filter substrate 11 and the second conductive pad D2 of the array substrate 12 are electrically connected, and the display module 1000 can add a conduction path: from the first conductive pad D1 of the color filter substrate 11 to the second conductive pad D2 of the array substrate 12, then to the flip chip film, then to the printed circuit board, and then to the backplane 102. Therefore, the added conduction path of the display module 1000 can improve the electrostatic discharge ability of the display module 1000.

[0080] In some embodiments, the conductive connection member D can be formed by a coating process to be formed and connected to the first conductive pad D1 on the side surface of the color filter substrate 11.

[0081] Referring to Figure 13 , the width w1 of the second conductive pad D2 is 0.5 mm to 5.0 mm, such as 0.5 mm, 1.5 mm, 2.5 mm, 3.5 mm or 5.0 mm. The width w1 of the second conductive pad D2 can also be other sizes as long as the second conductive pad D2 can be connected to the ground wire.

[0082] It should be noted that the length and width of the second conductive pad D2 can be reasonably designed according to the size of the array substrate 12, and there is no limitation.

[0083] Referring to Figure 13 , the width w2 of the conductive connection member D is 0.5 mm to 5.0 mm, such as 0.5 mm, 1.5 mm, 2.5 mm, 3.5 mm or 5.0 mm. The width w2 of the conductive connection member D can also be other sizes as long as the first conductive pad D1 and the second conductive pad D2 can be electrically connected.

[0084] Continue to refer to Figure 13 , the length m1 of the conductive connection member D on the surface of the color film substrate 11 away from the array substrate 12 is 0.2 mm to 2.0 mm, such as 0.2 mm, 1.2 mm, 1.5 mm, 1.8 mm or 2.0 mm. The length m2 of the conductive connection member D on the surface of the array substrate 12 away from the color film substrate 11 is 0.2 mm to 2.0 mm, such as 0.2 mm, 1.2 mm, 1.5 mm, 1.8 mm or 2.0 mm. In some embodiments, the thickness of the conductive connection member D is less than 80 μm, such as the thickness of the conductive connection member D is 30 μm, 50 μm, 60 μm, 75 μm or 80 μm.

[0085] Exemplarily, the conductive connection member D includes conductive silver paste.

[0086] In some embodiments, the array substrate 12 has a first side B1 for connecting a source driver, and the second conductive pad D2 is located on at least one side of both sides of the first side B1 in the extending direction. As Figure 14 shown, the second conductive pad D2 is located on one side of both sides of the first side B1 in the extending direction. In this case, the width of the second conductive pad D2 can be determined according to the distance from the signal line L located on the third side B3 and closest to the first side B1 to the edge of the first side B1. The signal line L is used to electrically connect the COF and the array substrate 12.

[0087] The above signal line L includes silver paste dots.

[0088] In some embodiments, the array substrate 12 has a third side B3 for connecting a gate driver, and the second conductive pad D2 is located on at least one side of both sides of the third side B3 in the extending direction. As Figure 15 shown, the second conductive pad D2 is located on one side of both sides of the third side B3 in the extending direction. In this case, the width of the second conductive pad D2 can be determined according to the distance from the signal line L located on the first side B1 and closest to the third side B3 to the edge of the third side B3. The signal line L is used to electrically connect the COF and the array substrate 12.

[0089] In some embodiments, the second conductive pad D2 is located on the side of the first side B1 close to the third side B3, and the shortest distance between the second conductive pad D2 and the gate driver is 0.35 mm to 0.45 mm, such as 0.4 mm. This can avoid short - circuit between the second conductive pad D2 and the gate driver.

[0090] In some embodiments, the second conductive pad D2 is located on the third side B3 and on the side close to the first side B1. The shortest distance between the second conductive pad D2 and the source driver is 0.35 mm to 0.45 mm, for example, 0.4 mm. This can avoid a short circuit between the second conductive pad D2 and the source driver.

[0091] In some embodiments, the second conductive pad D2 is located on one side of the two sides of the first side B1 in the extending direction, and the second conductive pad D2 is located on one side of the two sides of the third side B3 in the extending direction. In this case, the second conductive pad D2 can be 0.4 mm away from the silver paste points of the COF of the first side B1 and the silver paste points of the COF of the third side B3 respectively. The width of the second conductive pad D2 can be 3 mm. On the plane where the array substrate 12 is located, the length of the second conductive pad D2 can be 0.1 mm and the width can be 3 mm; on the side surface of the array substrate 12, the length of the second conductive pad D2 can be 1.4 mm and the width can be 3 mm. In some embodiments, the second conductive pad D2 is located on both sides of the array substrate 12 corresponding to the first side B1, and the second conductive pad D2 is located on both sides of the array substrate 12 corresponding to the third side B3. In this case, the design of the second conductive pad D2 needs to be reasonably designed to avoid the signal lines L provided on the array substrate 12.

[0092] In some embodiments, referring to Figure 12 , the display module 1000 further includes: a second conductive connection portion L2, the second conductive connection portion L2 covers the conductive connection member D, and is connected to the surface of the backplane 102 and the frame body 1031 that is not covered by the insulating layer 1032. Since the second conductive connection portion L2 is connected to the surface of the backplane 102 and the frame body 1031 that is not covered by the insulating layer 1032, the display module 1000 can add another conductive path: from the first conductive pad D1 on the color filter substrate 11 in the display panel 101 to the second conductive connection portion L2, and then to the backplane 102, further improving the electrostatic discharge ability of the display module 1000. Exemplarily, the second conductive connection portion L2 includes a conductive tape.

[0093] In some embodiments, the frame body 1031 includes a plurality of sub-frames 13, referring to Figure 16, there is a first gap F1 between adjacent sub - borders 13, and a second gap F2 between the sub - border 13 and the backplane 102; the display module 1000 further includes: a conductive adhesive layer J, which fills the first gap F1 and the second gap F2. By filling the first gap F1 with the conductive adhesive layer J, the gap between the surface of the display panel 101 and the surface of the frame body 1031 that is not covered by the insulating layer 1032 is filled, for example, completely filled, and at the same time, the display panel 101 and the frame 103 are electrically connected; by filling the second gap F2 with the conductive adhesive layer J, the gap between the backplane 102 and the surface of the frame body 1031 that is not covered by the insulating layer 1032 is filled, and at the same time, the backplane 102 and the frame 103 are electrically connected. Therefore, the static electricity in the display panel 101 can be conducted to the backplane 102 through the conductive adhesive layer J for release. This method effectively eliminates the gaps between the frame 103 and the display panel 101, and between the frame 103 and the backplane 102, and strengthens the connection of the conduction path. The solution provided by this embodiment is simple to operate during implementation and has a certain space for mechanical substitution.

[0094] In the display module 1000, when the conductive adhesive layer J fills the first gap F1 and the second gap F2, for the ESD test of these 3 display modules 1000, the electrostatic gun can be used to contact the display panel 101. The discharge voltages of the electrostatic gun are - 8KV and + 8KV respectively, and the number of discharges of the electrostatic gun is 100 times each. There is no charge residue phenomenon on the display panels 101 in the 3 display modules, and the display panels 101 display normally. Then, the electrostatic gun is discharged in the air. The discharge voltages of the electrostatic gun are - 15KV and + 15KV respectively, and the number of discharges of the electrostatic gun is 100 times each. There is no charge residue phenomenon on the display panels 101 in the 3 display modules, and the display panels 101 display normally.

[0095] An embodiment of the present disclosure also provides a display device 1, refer to Figure 17 , which includes the display module 1000 provided in any of the above embodiments, and a driving circuit board 1001 connected to the display module.

[0096] As described above, only the specific implementation manners of the present disclosure are provided, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure, thinking of changes or substitutions, should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display module, characterized in that: include: Display panel; a back plate, provided on the backlight side of the display panel; a frame, disposed around the display panel and the back plate, with at least a portion of the frame facing a side surface of the display panel and a side surface of the back plate; In which, the frame includes a conductive frame body and an insulating layer covering the surface of the frame body, at least part of the surface of the side of the frame body facing the display panel is not covered by the insulating layer, and the surface of the frame body not covered by the insulating layer is electrically connected to the side of the display panel and the side of the back panel.

2. The display module according to claim 1, wherein: The display module has a first side and a second side opposite to each other, wherein the first side is used for connecting to a source driver; The frame body includes a first sub-frame arranged on the first side, and a second sub-frame arranged on the second side, at least part of the surface of the first sub-frame and / or the second sub-frame facing the side of the display panel is not covered by the insulating layer, and the surface of the first sub-frame and / or the second sub-frame not covered by the insulating layer is electrically connected to the side of the display panel and the side of the back panel.

3. The display module according to claim 2, wherein: The display module also includes a first conductive connecting portion, which is electrically connected to the side of the display panel and the back panel, and the first conductive connecting portion is also electrically connected to the surface of the first sub-frame and / or the second sub-frame that is not covered by the insulating layer.

4. The display module according to claim 3, wherein: There are multiple first conductive connection portions, and the multiple first conductive connection portions are arranged at intervals along the first sub-frame and / or the second sub-frame; Along the extension direction of the frame, the frame is provided with a plurality of first via holes, and the first via holes are used to set connectors to connect the frame and the back plate; The first conductive connection portion is disposed between adjacent first via holes.

5. The display module according to claim 3, wherein: The first conductive connection portion includes an extending portion extending to a side of the back plate away from the display panel; The display module further includes a protective layer, which covers a gap between the end of the frame away from the display panel and the back plate, and also covers the side surface of the extended portion of the first conductive connection portion and a surface away from the display panel.

6. The display module according to any one of claims 1 to 5, characterized in that: The display panel includes a color filter substrate and an array substrate that are arranged opposite to each other; The color filter substrate includes a first conductive pad, and a side surface of the first conductive pad is exposed to a side surface of the color filter substrate; A second conductive pad is provided on a surface of the array substrate facing the color filter substrate, and the second conductive pad is grounded; The display module further includes a conductive connecting member, at least a portion of which is located on a side surface of the color filter substrate to be electrically connected to the first conductive pad, and the conductive connecting member is also electrically connected to the second conductive pad.

7. The display module according to claim 6, wherein: The array substrate has a first side for connecting to a source driver, and the second conductive pad is located on at least one of two sides of the first side in an extending direction; and / or, The array substrate has a third side for connecting to a gate driver, and the second conductive pad is located on at least one of two sides of the third side in an extending direction.

8. The display module according to claim 7, wherein: The second conductive pad is located on a side of the first side close to the third side, and the shortest distance between the second conductive pad and the gate driver is 0.35 mm to 0.45 mm; The second conductive pad is located on the third side and close to the first side, and the shortest distance between the second conductive pad and the source driver is 0.35 mm to 0.45 mm.

9. The display module according to claim 6, wherein: The display module further includes a second conductive connecting portion, which covers the conductive connecting member and is electrically connected to the back plate and a surface of the frame body that is not covered by the insulating layer.

10. The display module according to any one of claims 1 to 5, characterized in that: The frame body includes a plurality of sub-frames, a first gap is formed between adjacent sub-frames, and a second gap is formed between the sub-frames and the back plate; The display module further includes a conductive adhesive layer filled in the first gap and the second gap.

11. A display device, characterized in that: include: The display module according to any one of claims 1 to 10; as well as, A driving circuit board connected to the display module.

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