Wet cleaning device

Abstract

The utility model provides a wet cleaning device which comprises a bearing unit, a rotary workbench, a wafer clamping assembly, a flow guiding device, a deionized water nozzle, a deionized water recycling device and a liquid medicine recycling device, the flow guiding device comprises a flow guiding face and a side face baffle, and the flow guiding face comprises a first inclined face and a second inclined face. And the first inclined plane, the second inclined plane and the side baffle form an obtuse angle flow guide channel, and the obtuse angle flow guide channel faces the bottom of the wafer clamping assembly. According to the invention, the flow guiding device is arranged at the bottom of the wafer clamping assembly, so that the deionized water leaked into the gap between the wafer clamping assembly and the wafer can be recycled, the flying path of the deionized water can be changed, and the flying angle of the deionized water leaving the bearing unit can be increased; the deionized water completely falls into the deionized water recovery device, so that the situation that the liquid medicine is polluted is avoided, the cycle service life of the liquid medicine is prolonged, the stability of the subsequent wet etching process is ensured, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wet cleaning device. Background Art

[0002] In existing ACM wafer cleaning equipment, multiple wafer clamping assemblies are usually used to fix the wafer when the carrier unit rotates rapidly to prevent the wafer from shaking and sliding irregularly during the cleaning operation.

[0003] When the wafer clamping assembly fails or experiences aging problems, it will be replaced. However, after the replacement, because the wafer clamping assembly is initially unworn, the wafer fits the wafer well, and there is no gap between the wafer clamping assembly and the wafer. During the high-speed rotation of the rotary table, the deionized water used to clean the wafers is diverted normally under the action of centrifugal force, and the deionized water can be recovered normally into the deionized water recovery container outside the rotary table.

[0004] However, in the middle of the service life of the replaced wafer clamping assembly, the wafer clamping assembly will wear out, the fit will become lower, and a gap will exist between the wafer clamping assembly and the wafer. Deionized water will flow through the gap through the pendulum of the wafer clamping assembly and fall into the liquid recovery container of the liquid recovery layer, causing the water content in the liquid to increase abnormally. Usually, the liquid in the liquid recovery container will be recycled many times for wet etching process. However, if the recycled liquid has an increased water content due to contamination of deionized water, it will further cause subsequent wet etching to be unstable, so that the liquid can no longer be recycled many times, resulting in production waste and increased replacement costs of the liquid and wafer clamping assembly. Utility Model Content

[0005] The purpose of the utility model is to provide a wet cleaning device to solve the problem that when there is a gap between the wafer clamping assembly and the wafer, deionized water contaminates the liquid in the liquid recovery container, resulting in increased production costs.

[0006] In order to solve the above technical problems, the utility model provides a wet cleaning device, comprising: a carrying unit, a rotating worktable, at least six wafer clamping assemblies, at least six flow guide devices, a deionized water nozzle, an annular deionized water recovery device and an annular liquid recovery device, wherein:

[0007] The carrying unit is arranged on the rotating worktable, the wafer clamping assembly is evenly installed on the edge of the carrying unit, a guide device is installed at the bottom of the wafer clamping assembly, the deionized water nozzle is arranged above the carrying unit, the deionized water recovery device and the liquid medicine recovery device are respectively arranged around the rotating worktable, and the liquid medicine recovery device is closer to the rotating worktable than the deionized water recovery device;

[0008] The guide device includes: a guide surface and a side baffle, the side baffle is arranged on the side of the guide surface, the guide surface includes: a first inclined surface and a second inclined surface, the first inclined surface, the second inclined surface and the side baffle constitute an obtuse-angle guide channel, and the obtuse-angle guide channel faces the bottom of the wafer clamping assembly.

[0009] Optionally, in the wet cleaning device, the guide device further includes: a back surface opposite to the guide surface, the angle between the first inclined surface and the back surface is 25° to 35°; the angle between the second inclined surface and the back surface is 5° to 15°.

[0010] Optionally, in the wet cleaning device, the wafer clamping assembly includes: a clamping part, a pendulum base and a fixed bracket, the clamping part is installed on the pendulum base, the pendulum base passes through the carrying unit, the fixed bracket is installed at the edge position of the front of the carrying unit and has an annular through hole in the middle position of the fixed bracket, and the clamping part and the pendulum base are arranged in the annular through hole.

[0011] Optionally, in the wet cleaning device, the fixed bracket is provided with a plurality of first mounting holes, the guide device is provided with a plurality of second mounting holes, and the carrying unit is provided with a plurality of third mounting holes, and the fixed bracket and the guide device are fixed to the carrying unit at the same time by screws through the first mounting holes, the third mounting holes and the second mounting holes.

[0012] Optionally, in the wet cleaning device, the wet cleaning device further includes: a plurality of guide baffles, which are vertically installed on the deionized water recovery device and the liquid medicine recovery device respectively.

[0013] Optionally, in the wet cleaning device, the wet cleaning device also includes: a deionized water delivery pipe, a liquid medicine pipe and a liquid medicine nozzle, the liquid medicine nozzle is arranged above the supporting unit, the liquid medicine pipe is connected to the liquid medicine nozzle, and the deionized water delivery pipe is connected to the deionized water nozzle.

[0014] The technical solution of this application has at least the following advantages:

[0015] The present application sets a guide device at the bottom of the wafer clamping assembly, and the guide device includes: a guide surface and a side baffle. The guide surface includes: a first inclined surface and a second inclined surface. The first inclined surface, the second inclined surface and the side baffle constitute an obtuse-angle guide channel. The obtuse-angle guide channel faces the bottom of the wafer clamping assembly. The guide device can recover deionized water that leaks into the gap between the wafer clamping assembly and the wafer and can change the flying path of the deionized water that leaks into the gap between the wafer clamping assembly and the wafer. It can raise the flying angle of the deionized water leaving the carrying unit so that it falls smoothly into the deionized water recovery device, so that even if the wafer clamping assembly is slightly worn in the middle of its service life, it will not fall into the drug liquid recovery device, thereby avoiding the abnormal increase of water content in the drug liquid affecting subsequent recycling, thereby improving the recycling service life of the drug liquid, ensuring the stability of the subsequent wet etching process, and eliminating the need to replace the wafer clamping assembly that can still be used, thereby reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of a wet cleaning device according to an embodiment of the present invention;

[0017] Figure 2 is a schematic diagram of a flow guide device according to an embodiment of the present utility model;

[0018] Figure 3 1 is a schematic top view of a flow guide device according to an embodiment of the present invention;

[0019] Figure 4 It is a top view schematic diagram of the carrying unit, the deionized water recovery device and the liquid medicine recovery device of an embodiment of the utility model;

[0020] The description of the accompanying drawings is as follows:

[0021] 10-carrying unit, 20-rotating worktable, 30-wafer clamping assembly, 31-clamping part, 32-pendulum base, 33-fixed bracket, 40-flow guide device, 41-first inclined surface, 42-second inclined surface, 43-side baffle, 44-back side of flow guide device, 45-second mounting hole, 46-main bonding surface, 50-deionized water nozzle, 51-deionized water delivery pipeline, 60-deionized water recovery device, 61-deionized water recovery guide baffle, 70-chemical solution recovery device, 71-chemical solution recovery guide baffle. DETAILED DESCRIPTION

[0022] The wet cleaning device proposed by the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer based on the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may need to focus on different aspects and sometimes use different proportions.

[0023] The utility model provides a wet cleaning device, referring to Figure 1 and Figure 4 , Figure 1 This is a schematic diagram of a wet cleaning device according to an embodiment of the present invention. Figure 4 It is a top view schematic diagram of the carrying unit, deionized water recovery device and liquid medicine recovery device of an embodiment of the utility model. The wet cleaning device includes: a carrying unit 10, a rotating worktable 20, at least six wafer clamping assemblies 30, at least six guide devices 40, a deionized water nozzle 50, an annular deionized water recovery device 60 and an annular liquid medicine recovery device 70.

[0024] In this embodiment, the wet cleaning device includes six wafer clamping assemblies 30 and six flow guiding devices 40 .

[0025] The carrying unit 10 is arranged on the rotating workbench 20. Figure 3 , multiple wafer clamping assemblies 30 are evenly installed on the edge of the carrying unit 10, a guide device 40 is installed at the bottom of a wafer clamping assembly 30, the deionized water nozzle 50 is arranged above the carrying unit 10, the deionized water recovery device 60 and the liquid medicine recovery device 70 are respectively arranged around the rotary worktable 20, and the liquid medicine recovery device 70 is closer to the rotary worktable 20 than the deionized water recovery device 60. In this embodiment, the liquid medicine recovery device 70 is arranged around the rotary worktable 20, and the deionized water recovery device 60 is arranged around the liquid medicine recovery device 70. The wafer to be cleaned will be placed on the carrying unit 10 and clamped and fixed by the wafer clamping assembly 30.

[0026] For further reference, Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of a flow guide device according to an embodiment of the present invention. Figure 3It is a top view schematic diagram of the guide device of an embodiment of the utility model, the guide device 40 includes: a guide surface and a side baffle 43, the side baffle 43 is arranged on the side of the guide surface, the guide surface includes: a first inclined surface 41 and a second inclined surface 42, the first inclined surface 41, the second inclined surface 42 and the side baffle 43 constitute an obtuse-angle guide channel, and the obtuse-angle guide channel faces the bottom of the wafer clamping assembly 30.

[0027] Preferably, the diversion device further includes: a back surface 44 opposite to the diversion surface, wherein the angle α between the first inclined surface 41 and the back surface is 25° to 35°; and the angle β between the second inclined surface 42 and the back surface is 5° to 15°. It is worth noting that the angle β between the second inclined surface 42 and the back surface can be adjusted according to the actual distance between the deionized water recovery device 60 and the liquid medicine recovery device 70 and the carrier unit 10, as well as the actual rotation speed of the rotary table. In this application, it is sufficient to ensure that the deionized water in the obtuse-angled diversion channel does not fall into the liquid medicine recovery device 70 and only flies into the deionized water recovery device 60.

[0028] In this embodiment, the included angle α between the first inclined surface 41 and the back surface is 30°; the included angle β between the second inclined surface and the back surface is 10°.

[0029] Furthermore, the flow guiding device further includes: a main contact surface 46 , wherein the main contact surface 46 is connected to the first inclined surface 41 and is away from the second inclined surface 42 .

[0030] It is worth noting that the end of the first inclined surface 41 extends to the position of the upper top angle where the side baffle 43 and the main bonding surface 46 intersect, and the end of the second inclined surface 42 extends to a position close to the upper top angle of the side baffle 43. The end of the second inclined surface does not extend to the top angle of the side baffle 43, that is, the end of the second inclined surface 42 extends below the upper top angle of the side baffle 43. Therefore, when the side baffle 43 and the main bonding surface 46 of the guide device are bonded to the bottom plane of the wafer clamping assembly 30, the obtuse-angled guide channel faces the bottom of the wafer clamping assembly. The guide device can recover the deionized water that leaks into the gap between the wafer clamping assembly and the wafer. The obtuse-angled guide channel between the end of the second inclined surface 42 and the bottom of the wafer clamping assembly 30 has a notch for discharging the collected deionized water. Furthermore, since the upward inclination angle β of the second inclined surface 42 is 5° to 15°, the flying path of the deionized water leaking into the gap between the wafer clamping assembly and the wafer can be changed, and the flying angle of the deionized water leaving the carrying unit can be raised. Therefore, under the action of the centrifugal force of the high-speed rotation of the rotating worktable, the deionized water in the obtuse-angle guide channel can smoothly fall into the deionized water recovery device, so that even if the wafer clamping assembly is slightly worn in the middle of its service life, it will not fall into the liquid recovery device, thereby avoiding the abnormal increase of the water content in the liquid medicine affecting subsequent recycling, thereby improving the recycling service life of the liquid medicine, ensuring the stability of the subsequent wet etching process, and eliminating the need to replace the wafer clamping assembly that can still be used, thereby reducing production costs.

[0031] Preferably, the wafer clamping assembly 30 includes: a clamping portion 31, a pendulum base 32 and a fixed bracket 33, the clamping portion 31 is installed on the pendulum base 32, the pendulum base 32 passes through the carrying unit 10, the fixed bracket 33 is installed at the edge position of the front of the carrying unit 10 and the middle position of the fixed bracket 33 has an annular through hole, the clamping portion 31 and the pendulum base 32 are arranged in the annular through hole.

[0032] Furthermore, the fixing bracket 33 is provided with a plurality of first mounting holes (not shown), the side baffle 43 of the guide device 40 is provided with a plurality of second mounting holes 45, and the carrying unit 10 is provided with a plurality of third mounting holes. The fixing bracket can be fixed to the front edge of the carrying unit and the guide device can be fixed to the back edge of the carrying unit by screws through the first mounting holes, the third mounting holes and the second mounting holes 45.

[0033] In this embodiment, the wet cleaning device may further include: a deionized water recovery guide baffle 61 and a liquid medicine recovery guide baffle 71. The deionized water recovery guide baffle 61 is installed on the deionized water recovery device 60, and the liquid medicine recovery guide baffle 71 is installed on the liquid medicine recovery device 70, further assisting in the recovery of deionized water and the recovery of liquid medicine respectively.

[0034] Furthermore, the wet cleaning device also includes: a deionized water delivery pipe 51, a liquid medicine pipe (not shown) and a liquid medicine nozzle (not shown), the liquid medicine nozzle is also arranged above the carrying unit 10 and maintains a certain distance from the deionized water nozzle, the liquid medicine pipe is connected to the liquid medicine nozzle, and the deionized water delivery pipe 51 is connected to the deionized water nozzle 50.

[0035] During the deionized water rinsing operation in the wet cleaning process, the wafer to be cleaned will be placed on the carrier unit 10. The volume / weight of the clamping part 31 is smaller than the volume / weight of the pendulum base 32. During high-speed rotation, due to the centrifugal force, the heavier pendulum base 32 moves away from the center of the carrier unit, and the lighter clamping part 31 tilts toward the center of the carrier unit. Multiple clamping parts 31 cooperate to clamp the wafer together. The deionized water on the surface of the wafer can be normally thrown off to the deionized water recovery device 60 due to the centrifugal force. In addition, the deionized water that leaks into the gap between the wafer clamping assembly and the wafer will first enter the obtuse-angled guide channel of the guide device, and then, under the action of centrifugal force, will be thrown out from the notch of the obtuse-angled guide channel between the end of the second inclined surface 42 and the bottom of the wafer clamping assembly 30. Since the upward tilt angle β of the second inclined surface 42 is 5° to 15°, the flying angle of the deionized water leaving the carrier unit can be raised, which changes the The flying path of deionized water that leaks into the gap between the wafer clamping assembly and the wafer in the traditional cleaning process. The deionized water in the obtuse-angle guide channel can smoothly fall into the deionized water recovery device farther away than the liquid recovery device after being raised to a certain flying angle, thereby avoiding the deionized water from being thrown into the liquid recovery device, thereby avoiding the abnormal increase in the water content in the liquid that affects subsequent recycling. The cycle life of the liquid is improved, the stability of the subsequent wet etching process is ensured, and there is no need to replace the wafer clamping assembly that can still be used, thereby reducing production costs.

[0036] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A wet cleaning device, characterized in that: include: A carrying unit, a rotating worktable, at least six wafer clamping assemblies, at least six flow guide devices, a deionized water nozzle, an annular deionized water recovery device and an annular liquid recovery device, wherein: The carrying unit is arranged on the rotating worktable, the wafer clamping assembly is evenly installed on the edge of the carrying unit, a guide device is installed at the bottom of the wafer clamping assembly, the deionized water nozzle is arranged above the carrying unit, the deionized water recovery device and the liquid medicine recovery device are respectively arranged around the rotating worktable, and the liquid medicine recovery device is closer to the rotating worktable than the deionized water recovery device; The guide device includes: a guide surface and a side baffle, the side baffle is arranged on the side of the guide surface, the guide surface includes: a first inclined surface and a second inclined surface, the first inclined surface, the second inclined surface and the side baffle constitute an obtuse-angle guide channel, and the obtuse-angle guide channel faces the bottom of the wafer clamping assembly.

2. The wet cleaning device according to claim 1, wherein: The guide device further includes: a back surface opposite to the guide surface, wherein the angle between the first inclined surface and the back surface is 25° to 35°; and the angle between the second inclined surface and the back surface is 5° to 15°.

3. The wet cleaning device according to claim 1, wherein: The wafer clamping assembly includes: a clamping part, a pendulum base and a fixed bracket, the clamping part is installed on the pendulum base, the pendulum base passes through the carrying unit, the fixed bracket is installed at the edge position of the front of the carrying unit and has an annular through hole in the middle position of the fixed bracket, the clamping part and the pendulum base are arranged in the annular through hole.

4. The wet cleaning device according to claim 3, characterized in that: The fixing bracket is provided with a plurality of first mounting holes, the flow guide device is provided with a plurality of second mounting holes, and the carrying unit is provided with a plurality of third mounting holes. The fixing bracket and the flow guide device are fixed to the carrying unit by screws at the same time through the first mounting holes, the third mounting holes and the second mounting holes.

5. The wet cleaning device according to claim 1, wherein: The wet cleaning device further includes: a plurality of guide baffles, which are respectively vertically mounted on the deionized water recovery device and the liquid medicine recovery device.

6. The wet cleaning device according to claim 1, wherein: The wet cleaning device further includes: a deionized water delivery pipe, a liquid medicine pipe and a liquid medicine nozzle. The liquid medicine nozzle is arranged above the carrying unit, the liquid medicine pipe is connected to the liquid medicine nozzle, and the deionized water delivery pipe is connected to the deionized water nozzle.

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