Wafer cleaning device and wafer packaging equipment
By introducing a slope water diversion mechanism and overflow tank into the wafer cleaning device, and combining sensors to control the liquid level, the problems of cleaning liquid splash and cleaning tank pollution are solved, efficient cleaning and liquid reuse are achieved, and equipment complexity and cost are reduced.
Patent Information
- Application Number
- CN202422009501.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-08-19
AI Technical Summary
In the prior art, the cleaning liquid is prone to splash during the wafer cleaning process, and the liquid level is difficult to control, resulting in poor cleaning effect and contamination of the cleaning tank, and it is difficult to clean the bottom of the tank after cleaning, which increases the equipment space and cost.
A wafer cleaning device is designed, including a cleaning tank and an overflow tank, which disperses the liquid flow through a slope water diversion mechanism, combines an ultrasonic cleaning mechanism and a sensor to control the liquid level, collects splashed liquid using the overflow tank, and realizes the reuse of the liquid through a circulation device.
Effectively control the cleaning liquid level, avoid the cleaning liquid splashing out and contaminate the device, improve the cleaning effect, reduce liquid waste, simplify the cleaning process of the cleaning tank, and reduce equipment costs.
Smart Images
Figure CN223193764U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer equipment, in particular to a wafer cleaning device and a wafer packaging device. Background Art
[0002] A wafer refers to a substrate for manufacturing semiconductor transistors or integrated circuits, which is a crystal material and is called a wafer because of its circular shape. The basket used for storing wafers in automated wafer processing equipment in the semiconductor industry has a slot multi-layer structure.
[0003] In the wafer packaging process, wafer cleaning is a key link. In the prior art, ultrasonic waves are used to clean wafers. Before cleaning, a cleaning liquid is injected into the cleaning tank. If the injection flow rate is too large, the cleaning liquid is likely to splash out of the cleaning tank. If the injection flow rate is too small, the time required to fill the cleaning tank will be very long, and additional control equipment is required to control the flow rate of the cleaning liquid, increasing the occupied space and equipment cost of the device. During the cleaning process, the vibration of the ultrasonic waves will cause the cleaning liquid to overflow from the upper opening of the cleaning tank, resulting in contamination of the device and loss of liquid in the cleaning tank. It is possible that the liquid used for cleaning the wafers is reduced, and the liquid level cannot cover the wafers, affecting the cleaning effect of the wafers. After the cleaning operation is completed, the bottom of the cleaning tank is still difficult to clean thoroughly. Summary of the Utility Model
[0004] One of the purposes of the utility model is to overcome the deficiencies in the prior art and provide a wafer cleaning device and a wafer packaging device for the problems existing in the prior art.
[0005] To achieve the above purposes, the utility model is realized through the following technical solutions:
[0006] In the first aspect, the utility model provides a wafer cleaning device, including a cleaning tank and an overflow tank. The overflow tank is arranged on one side of the cleaning tank. The top of the cleaning tank has a first opening. The cleaning tank is provided with a water inlet. The top of the overflow tank has a second opening. The overflow tank is provided with a water outlet. The first opening is connected to the second opening. The height of the first opening relative to the water inlet is higher than that of the second opening. The water inlet is used to supplement liquid into the cleaning tank. The water outlet is used to discharge the liquid collected by the overflow tank from the cleaning tank.
[0007] In a preferred embodiment of the present application, the bottom surface of the cleaning tank has a slope water diversion mechanism. The lowest part of the slope water diversion mechanism is connected to the water inlet, and the highest part of the slope water diversion mechanism is connected to the side wall of the cleaning tank.
[0008] In a preferred embodiment of the present application, the slope water diversion mechanism includes a plurality of slopes, and the plurality of slopes extend obliquely upward from the water inlet to the side wall of the cleaning tank.
[0009] In a preferred embodiment of the present application, the slope is linear or arc-shaped.
[0010] In a preferred embodiment of the present application, the water inlet is located at the center of the bottom surface of the cleaning tank.
[0011] In a preferred embodiment of the present application, an ultrasonic cleaning mechanism is provided in the cleaning tank, and the ultrasonic cleaning mechanism is fixed at the highest point of the slope water diversion mechanism.
[0012] In a preferred embodiment of the present application, the cleaning tank has a tank body and a housing, the housing surrounds the tank body and is arranged at an interval from the tank body, the overflow tank is fixedly arranged between the tank body and the housing, and the water outlet is located outside the housing.
[0013] In a preferred embodiment of the present application, it further includes a protective cover, the protective cover is arranged around the periphery of the first opening and the second opening, and the top of the protective cover has a third opening, and the third opening is respectively communicated with the first opening and the second opening.
[0014] In a preferred embodiment of the present application, the cleaning tank is provided with a first sensor for detecting the first liquid level position of the liquid in the cleaning tank. When the first liquid level position is lower than a preset first threshold, liquid is supplemented into the cleaning tank through the water inlet.
[0015] In a preferred embodiment of the present application, the overflow tank is provided with a second sensor for detecting the second liquid level position of the liquid in the overflow tank. When the second liquid level position reaches a preset second threshold, the liquid in the overflow tank is discharged through the water outlet, and liquid is supplemented into the cleaning tank through the water inlet.
[0016] In a preferred embodiment of the present application, a filtering element is arranged in the overflow tank.
[0017] In a preferred embodiment of the present application, the water outlet is located at the lowest point of the bottom of the overflow tank.
[0018] In a second aspect, the present utility model provides a wafer packaging device, including a circulation device and the wafer cleaning device as described in the first aspect. The circulation device is connected to the water inlet and the water outlet of the wafer cleaning device for supplementing liquid into the cleaning tank through the water inlet and discharging the liquid in the overflow tank through the water outlet.
[0019] The wafer cleaning device and wafer packaging equipment disclosed by the present utility model disperse the flow rate of the liquid entering through a slope when injecting liquid into the cleaning tank, so that the local flow rate in the cleaning tank will not be too large. When using the ultrasonic cleaning mechanism to clean the wafer, the liquid splashed out of the cleaning tank due to ultrasonic vibration can be collected in the overflow tank, avoiding pollution of the device and recycling the liquid to avoid waste. When cleaning the cleaning tank after the cleaning is completed, the cleaning tank can be more conveniently cleaned and the waste liquid can be discharged through the slope. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present utility model is described with the aid of the following drawings:
[0021] Figure 1 is a schematic structural diagram of the wafer packaging equipment in the embodiment of the present utility model;
[0022] Figure 2 is a partial perspective view of the wafer cleaning device in the embodiment of the present utility model;
[0023] Figure 3 is a sectional view taken along the line A-A of the wafer cleaning device in the embodiment of the present utility model.
[0024] REFERENCE SIGNS:
[0025] 1 - wafer cleaning device; 2 - circulation device;
[0026] 100 - cleaning tank; 101 - first opening; 102 - water inlet; 103 - ultrasonic cleaning mechanism; 104 - tank body; 105 - outer shell; 106 - first sensor; 110 - slope water diversion mechanism; 111 - slope; 200 - overflow tank; 201 - second opening; 202 - water outlet; 203 - second sensor; 204 - filter element; 300 - protective cover; 301 - third opening. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0027] In order to better understand the technical solution of the present application, the embodiments of the present application will be described in detail below with reference to the drawings.
[0028] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.
[0029] As Figure 1As shown, an embodiment of the present utility model provides a wafer packaging device, including a wafer cleaning device and a circulation device. The circulation device is used to circulate and supply liquid to the wafer cleaning device. When the wafer needs to be cleaned, the cleaning device is filled with cleaning liquid through the circulation device, and the basket loaded with the wafer is immersed in the cleaning liquid. The cleaning mechanism is used to clean the wafer. For example, the wafer is cleaned by ultrasonic cleaning. The vibration generated by the ultrasonic wave will cause the cleaning liquid to splash, thereby causing the liquid level of the cleaning liquid to drop. Therefore, the circulation device needs to inject the lost cleaning liquid into the cleaning tank in real time to ensure that the liquid level of the cleaning liquid can immerse the wafer, so as to ensure that the cleaning effect of the wafer is not affected.
[0030] As Figure 2 shown, the wafer cleaning device of this embodiment includes a cleaning tank, an overflow tank and a protective cover. The overflow tank is arranged on one side of the cleaning tank, and the protective cover surrounds the tops of the cleaning tank and the overflow tank. The top of the cleaning tank has a first opening, and the cleaning tank is provided with a water inlet. The top of the overflow tank has a second opening, and the overflow tank is provided with a water outlet. The first opening is connected to the second opening, and the height of the first opening relative to the water inlet is higher than that of the second opening. The protective cover surrounds the peripheries of the first opening and the second opening. The top of the protective cover has a third opening, and the third opening is respectively connected to the first opening and the second opening. The circulation device is connected to the water inlet and the water outlet, and is used to supplement liquid into the cleaning tank through the water inlet and discharge the liquid collected by the overflow tank from the cleaning tank through the water outlet. Among them, the cleaning tank has a tank body and an outer shell. The outer shell surrounds the tank body and is arranged at an interval from the tank body. The overflow tank is fixedly arranged between the tank body and the outer shell, and the water outlet is located outside the outer shell. That is to say, the cleaning tank is a two-layer structure with a certain thickness. The outer shell seals the side and bottom of the tank body, and only the water inlet penetrates the bottom of the tank body and the bottom of the outer shell and is connected to the circulation device. In Figure 2 it, both the tank body and the outer shell are basically cuboids with open tops. The protective cover covers the cleaning tank from the tops of the tank body, the outer shell and the overflow tank. The bottom and side edges of the protective cover surround the first opening and the second opening, and the part of the upper part of the protective cover located directly above the second opening is a baffle. On the one hand, the baffle and other parts form a third opening through which the basket loaded with the wafer can enter and exit the tank body. On the other hand, the baffle can prevent external foreign objects or garbage from falling into the overflow tank and prevent the splashed liquid in the tank body from splashing out of the cleaning tank.
[0031] As Figure 3As shown, in the wafer cleaning device of this embodiment, the bottom surface of the tank body has a slope water diversion mechanism. The lowest point of the slope water diversion mechanism is connected to the water inlet, and the highest point of the slope water diversion mechanism is connected to the side wall of the tank body. In this embodiment, the function of the slope water diversion mechanism is not only to guide the liquid in the tank body to smoothly fall into the water inlet for drainage. At this time, the function of the water inlet is drainage, but also to provide a slope for the liquid injected from the water inlet to disperse the liquid inflow rate and reduce the local flow rate in the tank body. That is to say, designing the slope water diversion mechanism can optimize the structure and function of the tank body and the water inlet from both aspects of water injection and drainage. The structure of the slope water diversion mechanism can be designed according to actual needs, as long as the final flow direction of the liquid is the water inlet and a slope can be formed between the water inlet and the bottom surface of the tank body. In this embodiment, the water inlet is located at the center of the bottom surface of the tank body. In this embodiment, the slope water diversion mechanism includes multiple slopes. The multiple slopes extend obliquely upward from the water inlet to the side wall of the cleaning tank. The angle between the slope and the water inlet is an obtuse angle, preferably greater than 120°. The shape of the slope can be set according to actual needs. For example, the slope is linear or arc-shaped. The linear slope can facilitate the more thorough drainage of waste liquid when cleaning the cleaning tank, and the arc-shaped slope can facilitate the better dispersion of the liquid inflow rate through the arc when injecting liquid into the cleaning tank, making the local flow rate in the cleaning tank smaller. The shape and inclination angle of each slope can be the same or different. In this embodiment, the shape of each slope is linear and the inclination angles are the same.
[0032] In the wafer cleaning device of this embodiment, an ultrasonic cleaning mechanism is arranged in the cleaning tank. The ultrasonic cleaning mechanism is fixed at the highest point of the slope water diversion mechanism. That is to say, the fixed position of the ultrasonic cleaning mechanism is close to the bottom surface of the tank body.
[0033] In the wafer cleaning device of this embodiment, a first sensor is arranged in the cleaning tank to detect the first liquid level position of the liquid in the cleaning tank. When the first liquid level position is lower than the preset first threshold, liquid is supplemented into the cleaning tank through the water inlet.
[0034] In the wafer cleaning device of this embodiment, a second sensor is arranged in the overflow tank to detect the second liquid level position of the liquid in the overflow tank. When the second liquid level position reaches the preset second threshold, the liquid in the overflow tank is discharged through the water outlet, and liquid is supplemented into the cleaning tank through the water inlet.
[0035] Both the first sensor and the second sensor are sensors for detecting the liquid level height. The first sensor is arranged at the top of the tank body, that is, fixed at the position of the first opening, and the second sensor is arranged at the top of the overflow tank, that is, fixed at the position of the second opening. The number of the first sensors is one, and the number of the second sensors is multiple. They can be arranged at the top of the overflow tank or inside the overflow tank.
[0036] In the wafer cleaning device of this embodiment, a filtering element is arranged in the overflow tank to filter garbage or impurities in the liquid splashed from the tank body, ensuring the cleanliness of the liquid recycled to the circulation device. The filtering element is a mesh filtering frame with a plurality of filtering holes arranged thereon. The size of the filtering holes is designed to be smaller than the size of common garbage or impurities in the wafer cleaning process. There is a certain height interval between the filtering element and the water outlet, which is used to accommodate the clean liquid filtered by the filtering element, ensuring that when the liquid is pumped out from the water outlet, the garbage or impurities attached to the filtering element will not be drawn into the circulation device due to the proximity of the filtering element to the water outlet.
[0037] In the wafer cleaning device of this embodiment, the water outlet is located at the lowest point of the bottom of the overflow tank, facilitating the drainage of the liquid in the overflow tank.
[0038] The wafer cleaning device and wafer packaging equipment disclosed by the present utility model disperse the flow rate of the liquid entering through the slope when injecting the liquid into the cleaning tank, so that the local flow rate in the cleaning tank will not be too large. When using the ultrasonic cleaning mechanism to clean the wafer, the liquid splashed from the cleaning tank due to ultrasonic vibration can be collected in the overflow tank, avoiding pollution of the device and recycling the liquid to avoid waste. When cleaning the cleaning tank after the cleaning is completed, the cleaning tank can be more conveniently cleaned and the waste liquid can be discharged through the slope.
[0039] It should be understood that the above description of the specific embodiments of the present utility model is only for explaining the technical route and characteristics of the present utility model. Its purpose is to enable those skilled in the art to understand the content of the present utility model and implement it accordingly. However, the present utility model is not limited to the above specific embodiments. Any changes or modifications made within the scope of the claims of the present utility model should be covered by the protection scope of the present utility model.
Claims
1. A wafer cleaning device, characterized in that: It includes a cleaning trough and an overflow trough, the overflow trough is arranged on one side of the cleaning trough, the top of the cleaning trough has a first opening, the cleaning trough is provided with a water inlet, the top of the overflow trough has a second opening, the overflow trough is provided with a water outlet, the first opening is connected to the second opening, the height of the first opening relative to the water inlet is higher than the second opening, the water inlet is used to add liquid to the cleaning trough, and the water outlet is used to discharge the liquid collected by the overflow trough from the cleaning trough.
2. The wafer cleaning device according to claim 1, wherein: The bottom surface of the cleaning tank is provided with a sloped water diversion mechanism, the lowest point of the sloped water diversion mechanism is connected to the water inlet, and the highest point of the sloped water diversion mechanism is connected to the side wall of the cleaning tank.
3. The wafer cleaning device according to claim 2, wherein: The slope water diversion mechanism includes a plurality of slopes, and the plurality of slopes extend from the water inlet in an obliquely upward direction to the side wall of the cleaning tank.
4. The wafer cleaning device according to claim 3, characterized in that: The slope is straight or arc-shaped.
5. The wafer cleaning device according to claim 2, wherein: The water inlet is located at the center of the bottom surface of the cleaning tank.
6. The wafer cleaning device according to claim 2, characterized in that: An ultrasonic cleaning mechanism is arranged in the cleaning tank and is fixed at the highest point of the slope water diversion mechanism.
7. The wafer cleaning device according to claim 1, wherein: The cleaning tank comprises a tank body and an outer shell. The outer shell surrounds the tank body and is spaced apart from the tank body. The overflow tank is fixedly arranged between the tank body and the outer shell. The water outlet is located outside the outer shell.
8. The wafer cleaning device according to claim 1, wherein: The invention also includes a protective cover, which is arranged around the first opening and the second opening. The top of the protective cover has a third opening, and the third opening is communicated with the first opening and the second opening respectively.
9. The wafer cleaning device according to claim 1, wherein: The cleaning tank is provided with a first sensor for detecting a first liquid level position of the liquid in the cleaning tank. When the first liquid level position is lower than a preset first threshold value, liquid is added to the cleaning tank through the water inlet.
10. The wafer cleaning device according to claim 1, wherein: The overflow trough is provided with a second sensor for detecting a second liquid level position of the liquid in the overflow trough. When the second liquid level position reaches a preset second threshold value, the liquid in the overflow trough is discharged through the water outlet, and the liquid is replenished into the cleaning tank through the water inlet.
11. The wafer cleaning device according to claim 1, wherein: A filter element is arranged in the overflow tank.
12. The wafer cleaning device according to claim 1, wherein: The water outlet is located at the lowest point of the bottom of the overflow trough.
13. A wafer packaging device, characterized in that: It comprises a circulation device and a wafer cleaning device as described in any one of claims 1 to 12, wherein the circulation device is connected to the water inlet and water outlet of the wafer cleaning device, and is used to add liquid to the cleaning tank through the water inlet and discharge the liquid in the overflow tank through the water outlet.