Wafer box
By designing a wafer pallet structure with radial pick-up and U-shaped grooves in the wafer box, the problem of easy shattering when removing wafers in the prior art is solved, safe and fast wafer operation is achieved, and the risk of damage is reduced.
Patent Information
- Application Number
- CN202422487917.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-14
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-10-14
AI Technical Summary
Existing wafer boxes need to be flipped when removing wafers, which can easily lead to wafer breakage and increase production costs.
A wafer box is designed, including a first cover and a second cover, and a plurality of wafer trays are laminated inside. Each tray is equipped with a circular detent. The side wall of the detent is arranged in the radial direction. Through the design of the pick-and-place groove and the U-shaped groove, the independent pick-and-place wafer tray is realized to avoid flip operations.
It effectively reduces the risk of wafer crushing, realizes a safe and fast wafer pick-up and placement process, and reduces the risk of damage.
Smart Images
Figure CN223193779U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of wafer storage technology, and in particular to a wafer box. Background Art
[0002] Wafer boxes are usually used to store wafers, especially for ultra-thin wafers with a thickness of 0.09-0.12mm. Placing the wafers in a wafer box can reduce the risk of wafer breakage. The wafer box provided by the prior art is formed by an upper cover and a lower cover that are fastened together. When loading the wafers, a foam pad is first placed in the lower cover of the wafer box, and then the isolation sheet and the wafers are alternately stacked and placed, and finally the upper cover of the wafer box is closed. What is more troublesome is that when taking out the wafers, the wafer box needs to be turned over as a whole, and then the wafer box needs to be opened and then the wafers need to be clamped with a clamp. This process can easily cause the wafers to break, resulting in increased production costs. Utility Model Content
[0003] The purpose of this application is to provide a wafer box that facilitates the rapid placement and removal of wafers and effectively reduces the risk of wafer breakage.
[0004] The embodiment of the present application is implemented as follows:
[0005] An embodiment of the present application provides a wafer box, including a first cover body and a second cover body; the first cover body and the second cover body are buckled together to form a accommodating cavity; a plurality of wafer trays are stacked in the accommodating cavity, and a circular sinking platform for accommodating wafers is formed on each wafer tray, and a wafer picking and placing groove extending radially is provided on the side wall of the circular sinking platform.
[0006] As an optional embodiment, the first cover body and / or the second cover body is provided with a protrusion extending radially along the wafer; a U-shaped groove is provided in the protrusion with an extension direction perpendicular to the wafer, the opening of the U-shaped groove faces the accommodating cavity and the middle space is connected to the accommodating cavity.
[0007] As an optional embodiment, a tray pick-up and placement portion is provided on the wafer tray, and the tray pick-up and placement portion protrudes radially along the wafer and is inserted into the U-shaped groove.
[0008] As an optional embodiment, the inner walls on both sides of the U-shaped groove form a blocking surface that contacts the tray pick-up and placement portion to generate a force that blocks the wafer tray from rotating along the center of the wafer.
[0009] As an optional embodiment, the inner wall of the first cover and / or the second cover is provided with lateral limiting portions arranged at intervals around the circumference of the wafer tray; the lateral limiting portions abut against the side edges of the wafer tray, generating a force that prevents the wafer tray from moving radially along the wafer.
[0010] As an optional implementation, the extension direction of the lateral limiting portion is perpendicular to the plane where the wafer is located.
[0011] As an optional embodiment, the bottom of the circular sink is provided with first raised portions arranged at intervals, and the first raised portions extend close to the opening of the circular sink; the bottom of the circular sink is provided with second raised portions arranged at intervals, and the second raised portions extend away from the opening of the circular sink; the first raised portions are used to support the wafer placed in the circular sink; the second raised portions on the circular sink located above the wafer are used to press the wafer.
[0012] As an optional embodiment, the distance between the first protrusion on one side of the wafer and the second protrusion on the other side of the wafer is consistent with the thickness of the wafer.
[0013] As an optional embodiment, the wafer tray is provided with a plurality of coordination structures arranged at intervals along the circumference of the circular sink; the coordination structures include coordination protrusions and recessed grooves; the protrusions and recessed portions on adjacent wafer trays correspond to each other.
[0014] As an optional embodiment, lateral blocking portions are arranged at intervals on the inner wall of the circular sink, and the lateral blocking portions abut against the side edges of the wafer.
[0015] The beneficial effects of the embodiments of the present application include:
[0016] The present invention provides a wafer cassette comprising a first cover and a second cover; the first cover and the second cover engage to form a storage chamber; a plurality of wafer trays are stacked within the storage chamber, and each wafer tray is provided with a circular sink for accommodating wafers, with radially extending wafer access slots formed on the sidewalls of the circular sinks. The present invention forms circular sinks on the wafer trays, which are used to store individual wafers. Unlike the prior art, the present invention primarily handles wafer access by focusing on the wafer trays, avoiding the need to tip the entire wafer cassette over. When accessing and placing wafers, the present invention allows wafer trays to be placed sequentially from top to bottom without risk of damaging the wafers, thereby effectively reducing the risk of wafer damage. After the wafer tray is removed from the storage chamber, a relief structure formed in the wafer access slots allows the wafer to be removed from the wafer tray or placed into the circular sink of the wafer tray. Since the wafer tray is separated from the accommodating cavity, it not only has a larger operating space, but also, combined with the setting of the wafer pick-up and placement slot, it can safely and quickly take and place wafers from the circular sink of the wafer tray, thereby avoiding damage to the wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0018] Figure 1 This is one of the structural diagrams of the wafer box according to the embodiment of the present application;
[0019] Figure 2 This is the second structural diagram of the wafer box according to the embodiment of the present application;
[0020] Figure 3 This is the third structural diagram of the wafer box according to the embodiment of the present application;
[0021] Figure 4 This is the fourth structural diagram of the wafer box according to the embodiment of the present application;
[0022] Figure 5 This is the fifth structural diagram of the wafer box according to the embodiment of the present application.
[0023] icon:
[0024] 100-wafer box; 101-first cover; 102-second cover; 103-accommodating cavity; 104-wafer tray; 105-circular sink; 106-wafer loading and unloading groove; 107-U-shaped groove; 108-tray loading and unloading portion; 109-blocking surface; 110-lateral limiting portion; 111-first protruding portion; 112-second protruding portion; 113-coordination structure; 114-protruding portion. DETAILED DESCRIPTION
[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.
[0027] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," "third," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.
[0028] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0029] Wafer boxes 100 are usually used to store wafers, especially for ultra-thin wafers with a thickness of 0.09-0.12 mm. Placing the wafers in the wafer box 100 can reduce the risk of wafer breakage. The wafer box 100 provided by the prior art is formed by an upper cover and a lower cover that are fastened together. When loading the wafers, a foam pad is first placed in the lower cover of the wafer box 100, and then the isolation sheet and the wafers are alternately stacked and placed, and finally the upper cover of the wafer box 100 is closed. What is more troublesome is that when taking out the wafers, the wafer box 100 needs to be turned over as a whole, and then the wafers need to be clamped with a clamp after the wafer box 100 is opened. This process easily causes the wafers to break, resulting in an increase in production costs.
[0030] In order to solve the above technical problems, an embodiment of the present application provides a wafer box 100.
[0031] Reference Figure 1 、 Figure 2 as well as Figure 3 As shown, an embodiment of the present application provides a wafer box 100, including a first cover body 101 and a second cover body 102; the first cover body 101 and the second cover body 102 are buckled together to form a accommodating cavity 103; a plurality of wafer trays 104 are stacked in the accommodating cavity 103, and a circular sink 105 for accommodating wafers is formed on each wafer tray 104, and a wafer placement groove 106 extending radially is provided on the side wall of the circular sink 105.
[0032] It should be noted that the first cover 101 of the embodiment of the present application can be an upper cover, and the second cover 102 can be a lower cover. Alternatively, the first cover 101 can be a lower cover, and the second cover 102 can be an upper cover. This is not particularly limited, and those skilled in the art can make the selection according to their needs.
[0033] The shapes of the first cover 101 and the second cover 102 can be disc-shaped or rectangular. This embodiment of the present application does not specifically limit this, and those skilled in the art can configure it as needed. The purpose is to form a sealed accommodating cavity 103 by snapping the first cover 101 and the second cover 102 together.
[0034] Reference Figure 1 、 Figure 2 as well as Figure 5 As shown, illustratively, the first cover body 101 serves as a lower cover body, a receiving cavity 103 is formed on the first cover body 101 , and the second cover body 102 serves as a cover-like structure for sealing the upper opening of the receiving cavity 103 .
[0035] For example, the first cover 101 serves as the lower cover, forming the lower half of the accommodating cavity 103 on the first cover 101, and the second cover 102 serves as the upper cover, forming the upper half of the accommodating cavity 103 on the second cover 102. The two cover parts are fastened together to form a complete accommodating cavity 103 after partial overlap.
[0036] A snap-fit structure may be provided at the overlapping portion of the two to achieve a stable connection between the first cover 101 and the second cover 102 .
[0037] Preferably, the first cover body 101 and the second cover body 102 are disc-shaped structures, and the first cover body 101 and the second cover body 102 are buckled together to form a cylindrical chamber slightly larger than the diameter of the wafer tray 104. At this time, the wafer tray 104 is also set to a disc-shaped structure. The diameter of the wafer tray 104 is larger than the diameter of the wafer. The diameter of the circular sink 105 can be the same as that of the wafer, or slightly larger than the wafer. By arranging a radial protrusion structure on the inner wall of the circular sink 105 to abut against the side wall of the wafer, the shaking of the wafer in the circular sink 105 is prevented, and stable placement is achieved.
[0038] Reference Figure 5 As shown, an embodiment of the present application provides a wafer box 100, including a first cover body 101 and a second cover body 102; the first cover body 101 and the second cover body 102 are buckled together to form a accommodating cavity 103; a plurality of wafer trays 104 are stacked in the accommodating cavity 103 of the embodiment of the present application, and a circular sink 105 for accommodating wafers is formed on each wafer tray 104 in the embodiment of the present application, and a wafer placement groove 106 extending radially is provided on the side wall of the circular sink 105.
[0039] It should be noted that in the embodiment of the present application, a radially extending wafer access groove 106 is provided on the side wall of the circular sink 105, the purpose of which is to facilitate the access and placement of wafers on the wafer tray 104. The wafer access groove 106 extends radially along the wafer, so that a portion of the side wall of the circular sink 105 extends away from the center of the wafer. The side wall of the wafer, that is, the thickness surface, is exposed in the wafer access groove 106. The operator can contact the wafer at this position and complete the access and placement on the wafer tray 104.
[0040] It should be noted that, in the embodiment of the present application, a circular sink 105 is formed on the wafer tray 104, and a single wafer is stored through the circular sink 105. The wafer placement slot 106 on the circular sink 105 can be one or more.
[0041] Exemplarily, two wafer placement slots 106 are opened on the side wall of the circular sink 105 and are arranged symmetrically about the center of the wafer sink.
[0042] Unlike the prior art, the embodiment of the present application primarily handles wafer placement and access by focusing on the wafer tray 104, avoiding the need to overturn the entire wafer cassette 100 to access the wafers. The embodiment of the present application allows wafer placement and access by sequentially placing the wafer tray 104 from top to bottom without risk of damaging the wafers, thereby effectively reducing the risk of wafer damage.
[0043] After the wafer tray 104 is taken out from the accommodating cavity 103 , the wafer is taken out of the wafer tray 104 or placed into the circular sink 105 of the wafer tray 104 through the avoidance structure formed at the wafer placement groove 106 .
[0044] Since the wafer tray 104 is separated from the accommodating cavity 103, it not only has a larger operating space, but also, combined with the setting of the wafer placement slot 106, it can safely and quickly take and place wafers from the circular sink 105 of the wafer tray 104, thereby achieving the purpose of avoiding damage to the wafers.
[0045] Reference Figure 2 、 Figure 4 As shown, as an optional embodiment, a protrusion 114 extending radially along the wafer is provided on the first cover body 101 and / or the second cover body 102; a U-shaped groove 107 extending in a direction perpendicular to the wafer is provided in the protrusion 114, and the opening of the U-shaped groove 107 faces the accommodating cavity 103 and the middle space is connected to the accommodating cavity 103.
[0046] Furthermore, the first cover 101 of the present embodiment is provided with a raised portion extending radially along the wafer, and a hollow U-shaped groove 107 is formed in the raised portion. The opening of the U-shaped groove 107 faces the accommodating cavity 103 and the space formed by the U-shaped groove 107 is connected to the accommodating cavity 103. The provision of the U-shaped groove 107 allows a worker to quickly remove and place the wafer tray 104 in the accommodating cavity 103.
[0047] It should be noted that the depth of the U-shaped groove 107 is consistent with the depth of the accommodating cavity 103 .
[0048] In addition, when the depth of the accommodating cavity 103 is deep, the U-shaped groove 107 needs to be set to meet the need for the pick-up and placement tool to penetrate into the bottom of the U-shaped groove 107 to pick up and place the wafer tray 104 at the bottom. The size of the space formed in the U-shaped groove 107 can be set by those skilled in the art as needed.
[0049] It should be noted that the embodiment of the present application does not destroy the sealing of the accommodating cavity 103 through the provision of the protrusion and the U-shaped groove 107, and can seal and protect the multiple wafers in the accommodating cavity 103.
[0050] Reference Figure 3 As shown, as an optional embodiment, a tray pick-up and placement portion 108 is provided on the wafer tray 104 , and the tray pick-up and placement portion 108 protrudes radially along the wafer and is inserted into the U-shaped groove 107 .
[0051] Furthermore, in the embodiment of the present application, a tray pick-up and placement portion 108 is provided on the wafer tray 104 , and the tray pick-up and placement portion 108 is inserted into the U-shaped groove 107 , so that the staff can directly pick up the tray pick-up and placement portion 108 in the U-shaped groove 107 .
[0052] In addition, inner walls on both sides of the U-shaped groove 107 form blocking surfaces 109 that contact the tray placement portion 108 to generate a force to block the wafer tray 104 from rotating along the center of the wafer.
[0053] It should be noted that the embodiment of the present application, through the provision of the U-shaped groove 107 and the tray access portion 108, solves the problem of accessing and placing the wafer tray 104 within the accommodating cavity 103, thereby enabling rapid access and placement of the wafer tray 104 even in a relatively deep accommodating cavity 103. Furthermore, the embodiment of the present application, through the contact between the tray access portion 108 and the inner walls of the U-shaped groove 107, enables the wafer tray 104 to rotate within the accommodating cavity 103, thereby limiting the circumferential freedom of the wafer tray 104 and improving the stability of the wafer tray 104.
[0054] Reference Figure 4As shown, as an optional embodiment, the inner wall of the first cover body 101 and / or the second cover body 102 is provided with lateral limiting portions 110 arranged circumferentially around the wafer tray 104; the lateral limiting portions 110 abut against the side edges of the wafer tray 104, generating a force to prevent the wafer tray 104 from moving radially along the wafer.
[0055] Furthermore, in the embodiment of the present application, lateral limiting portions 110 are provided on the inner walls of the first cover body 101 and the second cover body 102. The lateral limiting portions 110 abut against the side edges of the wafer tray 104, generating a force to block the radial movement of the wafer tray 104 along the wafer, thereby limiting the radial movement of the wafer tray 104, which is beneficial to improving the stability of the wafer tray 104.
[0056] Preferably, the extending direction of the lateral limiting portion 110 is perpendicular to the plane where the wafer is located.
[0057] It should be noted that the vertical position limitation of the wafer trays 104 is achieved by the clamping force generated by the upper and lower engagement of the first cover 101 and the second cover 102. Taking the stacked wafer trays 104 in the middle as an example, the clamping force generated by the engagement of the first and second covers 101, 102 is transmitted to the upper and lower adjacent wafer trays 104, enabling the upper and lower adjacent wafer trays 104 to clamp and restrain the middle wafer tray 104, effectively preventing the wafer trays 104 from moving in the upper and lower directions within the wafer cassette 100.
[0058] The above arrangement can achieve a stable arrangement of the wafer tray 104 , which is beneficial to improving the protection performance of the wafers.
[0059] Reference Figure 3 As shown, as an optional embodiment, the bottom of the circular sink 105 is provided with first raised portions 111 arranged at intervals, and the first raised portions 111 extend close to the opening of the circular sink 105; the bottom of the circular sink 105 is provided with second raised portions 112 arranged at intervals, and the second raised portions 112 extend away from the opening of the circular sink 105; the first raised portions 111 are used to support the wafer placed in the circular sink 105; the second raised portions 112 on the circular sink 105 above the wafer are used to press the wafer.
[0060] Furthermore, in the embodiment of the present application, a first protrusion 111 and a second protrusion 112 are formed on the bottom placement surface of the circular sink 105 .
[0061] It should be noted that the first protrusion 111 protrudes upward from the bottom plane of the circular sink 105, and the second protrusion 112 protrudes downward from the bottom plane of the circular sink 105. That is, the first protrusion 111 extends close to the opening of the circular sink 105, and the second protrusion 112 extends away from the opening of the circular sink 105.
[0062] When a wafer is placed on the circular sink 105, the first protrusion 111 is used to support the wafer placed in the circular sink 105; the second protrusion 112 located on the circular sink 105 of another wafer tray 104 above the wafer is used to press the wafer. The first protrusion 111 and the second protrusion 112 achieve upper and lower clamping of the wafer.
[0063] The distance between the first protrusion 111 on one side of the wafer and the second protrusion 112 on the other side of the wafer is consistent with the thickness of the wafer.
[0064] It should be noted that the first protrusions 111 and the second protrusions 112 may be arranged at intervals. The specific arrangement pattern of the first protrusions 111 and the second protrusions 112 can be arranged by those skilled in the art as needed, and is not particularly limited thereto.
[0065] Reference Figure 3 As shown, illustratively, the first protrusions 111 and the second protrusions 112 are alternately arranged along a certain diameter of the wafer, and two or three such strip structures are provided.
[0066] Furthermore, the inner wall of the circular sink 105 is provided with lateral blocking parts at intervals, and the lateral blocking parts abut against the side edges of the wafer. The lateral blocking parts block the side edges of the wafer, so that the wafer can rock in the circular sink 105.
[0067] Reference Figure 3 As shown, as an optional embodiment, the wafer tray 104 is provided with a plurality of coordination structures 113 arranged at intervals along the circumference of the circular sink 105; the coordination structure 113 includes coordination protrusions and recessed grooves; the coordination protrusions and recessed portions on adjacent wafer trays 104 correspond to each other.
[0068] In the embodiment of the present application, the coordination structure 113 formed by the protrusions and the recessed grooves can enable the wafer trays 104 to be stably stacked after being stacked, which is beneficial for better protection of the wafers.
[0069] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
Claims
1. A wafer box (100), characterized in that The invention comprises a first cover body (101) and a second cover body (102); the first cover body (101) and the second cover body (102) are buckled together to form a receiving cavity (103); a plurality of wafer trays (104) are stacked in the receiving cavity (103); a circular sink (105) for accommodating wafers is formed on each of the wafer trays (104); and a wafer placement groove (106) extending radially is provided on the side wall of the circular sink (105).
2. The wafer box (100) according to claim 1, characterized in that The first cover body (101) and / or the second cover body (102) are provided with a protrusion (114) extending radially along the wafer; a U-shaped groove (107) extending in a direction perpendicular to the wafer is provided in the protrusion (114); the opening of the U-shaped groove (107) faces the accommodating cavity (103) and the middle space is connected to the accommodating cavity (103).
3. The wafer box (100) according to claim 2, characterized in that The wafer tray (104) is provided with a tray pick-up and placement portion (108), and the tray pick-up and placement portion (108) protrudes radially along the wafer and is inserted into the U-shaped groove (107).
4. The wafer box (100) according to claim 3, characterized in that The inner walls on both sides of the U-shaped groove (107) form a blocking surface (109) in contact with the tray pick-up and placement portion (108), so as to generate a force to block the wafer tray (104) from rotating along the center of the wafer.
5. The wafer box (100) according to any one of claims 1 to 4, characterized in that: The inner wall of the first cover body (101) and / or the second cover body (102) is provided with lateral limiting portions (110) arranged at intervals around the circumference of the wafer tray (104); the lateral limiting portions (110) abut against the side edges of the wafer tray (104), generating a force that blocks the wafer tray (104) from moving radially along the wafer.
6. The wafer box (100) according to claim 5, characterized in that The extending direction of the lateral limiting portion (110) is perpendicular to the plane where the wafer is located.
7. The wafer box (100) according to any one of claims 1 to 4, characterized in that: The bottom of the circular sink (105) is provided with first raised portions (111) arranged at intervals, and the first raised portions (111) extend close to the opening of the circular sink (105); the bottom of the circular sink (105) is provided with second raised portions (112) arranged at intervals, and the second raised portions (112) extend away from the opening of the circular sink (105); the first raised portions (111) are used to support a wafer placed in the circular sink (105); and the second raised portion (112) on the circular sink (105) above the wafer is used to press the wafer.
8. The wafer box (100) according to claim 7, characterized in that The distance between the first protrusion (111) on one side of the wafer and the second protrusion (112) on the other side of the wafer is consistent with the thickness of the wafer.
9. The wafer box (100) according to any one of claims 1 to 4, characterized in that: The wafer tray (104) is provided with a plurality of coordination structures (113) arranged at intervals along the circumference of the circular sink (105); the coordination structures (113) include coordination protrusions and recessed grooves; the coordination protrusions and recessed grooves on adjacent wafer trays (104) are correspondingly matched.
10. The wafer box (100) according to any one of claims 1 to 4, characterized in that: The inner wall of the circular sink (105) is provided with lateral blocking portions at intervals, and the lateral blocking portions abut against the side edges of the wafer.