Wafer cleaning rack

Abstract

A wafer cleaning rack relates to the technical field of semiconductor manufacturing. The wafer cleaning frame comprises two baffles which are oppositely arranged. A lifting handle rod, a connecting rod, a supporting rod, a side stop rod and a pressing rod which are parallel to one another are connected between the two baffles. The handle rod is located at the top of the baffle, the connecting rod and the supporting rod are both located at the bottom of the baffle, the supporting rod is configured to support the bottom of the wafer, the side blocking rod is configured to abut against the side portion of the wafer, and the pressing rod is configured to be connected with the top of the wafer in a pressing mode. The utility model aims to provide the wafer cleaning rack, which can effectively reduce waggling of the wafer in the cleaning process and prevent the wafer from falling off from the wafer cleaning rack, so that the wafer is effectively protected, and the damage probability of the wafer in the cleaning process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning rack. Background Art

[0002] Wafers generally refer to silicon chips used to make silicon semiconductor circuits; existing wafers need to be cleaned during production. The principle of wafer cleaning is to remove all kinds of impurities without damaging the wafer.

[0003] When manually cleaning square wafers, the wafers, especially small-sized wafers, shake greatly during the cleaning process and are prone to floating, which can easily cause the wafers to fall off the cleaning rack, thereby easily causing damage to the wafers. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer cleaning rack, so as to solve, to a certain extent, the technical problem in the prior art that wafers shake greatly and easily float up during the cleaning process.

[0005] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] A wafer cleaning rack is used to carry wafers and includes two baffles arranged opposite to each other;

[0007] A handle rod, a connecting rod, a support rod, a side block rod and a pressure rod are connected between the two baffles; the handle rod is located at the top of the baffle, the connecting rod and the support rod are both located at the bottom of the baffle, and the support rod is configured to support the bottom of the wafer, the side block rod is configured to abut the side of the wafer, and the pressure rod is configured to press the top of the wafer.

[0008] In any of the above technical solutions, optionally, the wafer cleaning rack further includes a nut; both ends of the pressure rod include a pressure rod threaded portion; at least part of the pressure rod threaded portion extends into the baffle and is threadedly connected to the nut; the nut is located on the outside of the baffle.

[0009] In any of the above technical solutions, optionally, the baffle is provided with a pressure rod groove cooperating with the pressure rod; the pressure rod groove extends along the axial direction of the pressure rod and is open at both ends, and the pressure rod groove is open at the top of the baffle and forms a top notch;

[0010] The pressure rod further includes a pressure rod body portion; the pressure rod body portion is connected between the two pressure rod threaded portions, and a portion of the pressure rod body portion is accommodated in the pressure rod groove.

[0011] In any of the above technical solutions, optionally, a nut groove for accommodating at least part of the nut is provided on the outer side of the baffle; the nut groove is communicated with the pressure rod groove;

[0012] At least a portion of the threaded portion of the pressure rod extends into the nut groove and is threadedly connected to the nut.

[0013] In any of the above technical solutions, optionally, the top notch has a chamfer;

[0014] The main body of the pressure rod is interference-fitted with the baffle;

[0015] The nut is loosely matched with the baffle.

[0016] In any of the above technical solutions, optionally, the pressure rod body is a polished rod.

[0017] In any of the above technical solutions, optionally, along an axial direction perpendicular to the side bars, a plurality of the side bars are sequentially spaced apart, and the wafer is configured to be loaded between two adjacent side bars;

[0018] Along an axial direction perpendicular to the side baffles, there is a support rod and a pressure rod between two adjacent side baffles.

[0019] In any of the above technical solutions, optionally, the number of the side guard bars is three, and the number of the support bars and the number of the pressure bars are both two.

[0020] In any of the above technical solutions, optionally, the support rod is provided with a plurality of wafer clamping slots spaced in sequence along its axial direction, and the side blocking rod is provided with a plurality of wafer clamping slots spaced in sequence along its axial direction, and the wafer clamping slots of the support rod correspond to the positions of the wafer clamping slots of the side blocking rod;

[0021] The end of the support rod is plugged into the baffle, and the end of the side baffle is plugged into the baffle.

[0022] In any of the above technical solutions, optionally, the pressure rod is made of plastic;

[0023] The wafer cleaning rack is an axisymmetric structure.

[0024] The beneficial effects of the present invention are mainly:

[0025] The wafer cleaning rack provided by the utility model adopts support rods to support the bottom of the wafer, side blocking rods to abut the sides of the wafer, and pressure rods to press the top of the wafer, so as to firmly fix the wafer in the space formed by the support rods, side blocking rods and pressure rods, effectively reducing the shaking of the wafer during the cleaning process, avoiding the wafer from falling off the wafer cleaning rack, thereby effectively protecting the wafer and reducing the probability of damage to the wafer during cleaning.

[0026] In order to make the above-mentioned objectives, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 A schematic structural diagram of a wafer cleaning rack provided in an embodiment of the present invention;

[0029] Figure 2 A cross-sectional view of a wafer cleaning rack provided by an embodiment of the present utility model;

[0030] Figure 3 A partial enlarged view of a wafer cleaning rack provided in an embodiment of the present utility model;

[0031] Figure 4 A schematic structural diagram of a baffle provided in an embodiment of the present utility model;

[0032] Figure 5 This is a schematic diagram of the assembly of the pressure rod and the baffle provided in an embodiment of the utility model.

[0033] Icons: 110- baffle; 111- pressure rod groove; 112- nut groove; 120- handle rod; 130- connecting rod; 140- support rod; 150- side baffle; 160- pressure rod; 161- pressure rod thread; 162- pressure rod body; 170- nut; 180- wafer slot;

[0034] 200-wafer. DETAILED DESCRIPTION

[0035] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0038] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0039] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0040] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0041] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0042] Example

[0043] This embodiment provides a wafer cleaning rack; please refer to Figure 1-Figure 5 , Figure 1This is a schematic structural diagram of the wafer cleaning rack provided in this embodiment, wherein the nuts are shown in an exploded view; Figure 2 A cross-sectional view of the wafer cleaning rack provided in this embodiment, Figure 3 A partial enlarged view of the wafer cleaning rack provided in this embodiment; Figure 4 A schematic diagram of the structure of the baffle provided in this embodiment; in order to show the structure more clearly, Figure 5 This is a schematic diagram of the assembly of the pressure rod and the baffle provided in this embodiment.

[0044] The wafer cleaning rack provided in this embodiment is used for manual cleaning of wafers, especially for manual cleaning of square wafers. Figure 1-Figure 5 As shown, the wafer cleaning rack is used to carry wafers, especially square wafers. The wafer cleaning rack includes two baffles 110 arranged opposite to each other.

[0045] Connected between the two baffles 110 are parallel handle bars 120, connecting bars 130, support bars 140, side bars 150, and pressure bars 160. Specifically, the axial directions of the handle bars 120, the connecting bars 130, the support bars 140, the side bars 150, and the pressure bars 160 are all parallel to each other. The handle bars 120 are located at the top of the baffles 110, while the connecting bars 130 and the support bars 140 are both located at the bottom of the baffles 110. The support bars 140 are configured to support the bottom of the wafer 200, the side bars 150 are configured to abut the sides of the wafer 200, and the pressure bars 160 are configured to press the top of the wafer 200. For example, the two sides of the wafer 200 abut against the side bars 150, and the wafer 200 is loaded in the space formed by the support bars 140, the side bars 150, and the pressure bars 160, effectively reducing the shaking of the wafer 200 during the cleaning process.

[0046] The wafer cleaning rack described in this embodiment uses a support rod 140 to support the bottom of the wafer 200, a side blocking rod 150 to abut the side of the wafer 200, and a pressure rod 160 to press the top of the wafer 200, so as to firmly fix the wafer 200 in the space formed by the support rod 140, the side blocking rod 150 and the pressure rod 160, effectively reducing the shaking of the wafer 200 during the cleaning process, and preventing the wafer 200 from falling off the wafer cleaning rack, thereby effectively protecting the wafer 200 and reducing the probability of damage to the wafer 200 during cleaning.

[0047] In the prior art, the cleaning rack does not have the pressure rod 160. During the cleaning process, the wafer 200 shakes greatly and easily floats, which can easily cause the wafer 200 to fall off the cleaning rack, thereby easily damaging the wafer 200. The wafer cleaning rack described in this embodiment uses the pressure rod 160 to press the wafer 200, so as to firmly fix the wafer 200 in the space enclosed by the support rod 140, the side bar 150 and the pressure rod 160. When cleaning the wafer 200, the operator holds the handle bar 120 and immerses the wafer 200 in the cleaning tank filled with cleaning liquid for cleaning.

[0048] See also Figure 1-Figure 5 As shown, in an optional solution of this embodiment, the wafer cleaning rack further includes a nut 170; both ends of the pressure rod 160 include a pressure rod threaded portion 161; at least a portion of the pressure rod threaded portion 161 extends into the baffle 110 and is threadedly engaged with the nut 170; the nut 170 is located outside the baffle 110. By threading the nut 170 with the pressure rod threaded portion 161 of the pressure rod 160, the pressure rod 160 can be easily assembled and disassembled, thereby facilitating the placement and removal of the wafers 200.

[0049] In this embodiment, the wafer 200 is carried between two baffles 110 , the side of the baffle 110 away from the wafer 200 is the outer side of the baffle 110 , and the side of the baffle 110 close to the wafer 200 is the inner side of the baffle 110 .

[0050] Optionally, part of the compression rod threaded portion 161 extends out of the baffle 110 to facilitate threaded connection between the compression rod 160 and the nut 170 .

[0051] See also Figure 1-Figure 5 As shown, in an optional scheme of this embodiment, the baffle 110 is provided with a pressure rod groove 111 that cooperates with the pressure rod 160; the pressure rod groove 111 extends along the axial direction of the pressure rod 160 and is open at both ends, and the pressure rod groove 111 is open at the top of the baffle 110 and forms a top notch; the pressure rod groove 111 is opened at the top of the baffle 110, so that the pressure rod 160 can slide down from the upper part of the baffle 110 into the pressure rod groove 111, which improves the convenience of installing the pressure rod 160 on the baffle 110 to a certain extent, thereby facilitating the taking and placing of the wafer 200.

[0052] Optionally, the top notch has a chamfer, which further facilitates the pressure rod 160 to slide downward from the upper part of the baffle 110 into the pressure rod groove 111, thereby improving the convenience of installing the pressure rod 160 on the baffle 110 to a certain extent, thereby facilitating the removal and placement of the wafer 200.

[0053] Optionally, the pressure rod 160 further includes a pressure rod body portion 162 ; the pressure rod body portion 162 is connected between the two pressure rod threaded portions 161 , and a portion of the pressure rod body portion 162 is accommodated in the pressure rod groove 111 .

[0054] Optionally, the pressure rod body 162 and the baffle 110 have an interference fit; that is, along the axis perpendicular to the pressure rod 160, the size of the top notch is slightly smaller than the diameter of the pressure rod body 162. The interference fit between the pressure rod body 162 and the baffle 110 securely secures the pressure rod body 162 to the baffle 110, thereby securely securing the pressure rod 160 to the baffle 110. This helps improve stability during cleaning of the wafer 200 and prevents the wafer 200 from falling during use.

[0055] See also Figure 4 and Figure 5 As shown, in an alternative embodiment of this embodiment, a nut recess 112 is provided on the outer side of the baffle 110 to accommodate at least a portion of the nut 170; the nut recess 112 is connected to the pressure rod recess 111; at least a portion of the pressure rod threaded portion 161 extends into the nut recess 112 and is threadedly engaged with the nut 170. The nut recess 112 improves the connection between the nut 170 and the baffle 110, thereby facilitating increased stability in the threaded connection between the nut 170 and the pressure rod threaded portion 161 of the pressure rod 160, and securely securing the pressure rod 160 to the baffle 110.

[0056] See also Figure 5 As shown, in an alternative embodiment of the present invention, the nut 170 and the baffle 110 have a clearance fit; that is, along the axis perpendicular to the compression rod 160, the diameter of the nut groove 112 is slightly larger than the diameter of the nut 170. The clearance fit between the nut 170 and the baffle 110 facilitates rotation of the nut 170 and facilitates threading of the nut 170 onto the compression rod threaded portion 161 of the compression rod 160.

[0057] In an optional solution of this embodiment, the pressure rod body 162 is a polished rod.

[0058] In an optional solution of this embodiment, the pressure rod 160 is made of plastic material; for example, the pressure rod 160 is made of polytetrafluoroethylene; by making the pressure rod 160 of plastic material, metal chips and metal particles generated during the cleaning process due to material problems of the pressure rod 160 can be avoided.

[0059] See also Figure 1-Figure 3 As shown, in an optional solution of this embodiment, a plurality of side bars 150 are sequentially spaced apart along an axial direction perpendicular to the side bars 150 , and wafers 200 are loaded between two adjacent side bars 150 .

[0060] Along the axial direction perpendicular to the side bars 150 , there is a support bar 140 and a pressure bar 160 between two adjacent side bars 150 . It can be understood that a single wafer 200 is supported by one support bar 140 and pressed by one pressure bar 160 .

[0061] like Figure 1 and Figure 2As shown, in an optional solution of this embodiment, the number of side blocking bars 150 is three, and the number of support bars 140 and the number of pressure bars 160 are both two, so as to be able to load two groups of wafers 200 .

[0062] The wafer cleaning rack of this embodiment can load other groups of wafers 200 by adjusting the number of side blocking bars 150 , support bars 140 and pressure bars 160 .

[0063] See also Figure 1 and Figure 3 As shown, in an optional solution of this embodiment, the support rod 140 is provided with a plurality of wafer retaining grooves 180 at intervals along its axial direction, and the side bars 150 are provided with a plurality of wafer retaining grooves 180 at intervals along its axial direction. The wafer retaining grooves 180 of the support rod 140 correspond to the positions of the wafer retaining grooves 180 of the side bars 150; the wafer retaining grooves 180 are used to retain the wafer 200. By having the wafer retaining grooves 180 of the support rod 140 correspond to the positions of the wafer retaining grooves 180 of the side bars 150, the wafer 200 is retained from the bottom and sides of the wafer 200, which helps to firmly fix the wafer 200 in the space formed by the support rod 140, the side bars 150 and the pressure bar 160, effectively reducing the shaking of the wafer 200 during the cleaning process and reducing the probability of damage to the wafer 200 during cleaning.

[0064] Optionally, the end of the support rod 140 is plugged into the baffle 110 , so that the support rod 140 can be easily installed.

[0065] Optionally, the end of the side barrier rod 150 is plugged into the baffle 110. By plugging the end of the side barrier rod 150 into the baffle 110, the side barrier rod 150 can be easily installed.

[0066] See also Figure 1 and Figure 2 As shown, in the optional scheme of this embodiment, the wafer cleaning rack is an axisymmetric structure; by adopting the axisymmetric structure of the wafer cleaning rack, it is helpful to grasp the balance of the wafer cleaning rack during the manual cleaning of the wafer 200, thereby reducing the risk of damage to the wafer 200 to a certain extent.

[0067] In this embodiment, the two baffles 110 are connected by a connecting rod 130 ; optionally, there are multiple connecting rods 130 to firmly connect the two baffles 110 .

[0068] Optionally, the handle bar 120 cooperates with the connecting bar 130 to firmly connect the two baffles 110 to form a cleaning rack for loading the wafers 200 .

[0069] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer cleaning rack for carrying wafers, characterized in that: comprising two baffles arranged opposite to each other; A handle rod, a connecting rod, a support rod, a side block rod and a pressure rod are connected between the two baffles; the handle rod is located at the top of the baffle, the connecting rod and the support rod are both located at the bottom of the baffle, and the support rod is configured to support the bottom of the wafer, the side block rod is configured to abut the side of the wafer, and the pressure rod is configured to press the top of the wafer.

2. The wafer cleaning rack according to claim 1, characterized in that: It also includes a nut; both ends of the pressure rod include a pressure rod threaded portion; at least part of the pressure rod threaded portion extends into the baffle and is threadedly connected to the nut; the nut is located on the outside of the baffle.

3. The wafer cleaning rack according to claim 2, characterized in that: The baffle is provided with a pressure rod groove that cooperates with the pressure rod; the pressure rod groove extends along the axial direction of the pressure rod and is open at both ends, and the pressure rod groove is open at the top of the baffle to form a top notch; The pressure rod further includes a pressure rod body portion; the pressure rod body portion is connected between the two pressure rod threaded portions, and a portion of the pressure rod body portion is accommodated in the pressure rod groove.

4. The wafer cleaning rack according to claim 3, characterized in that: The outer side of the baffle is provided with a nut groove for accommodating at least a portion of the nut; the nut groove is communicated with the pressure rod groove; At least a portion of the threaded portion of the pressure rod extends into the nut groove and is threadedly connected to the nut.

5. The wafer cleaning rack according to claim 3, characterized in that: The top notch has a chamfered corner; The main body of the pressure rod is interference-fitted with the baffle; The nut is loosely matched with the baffle.

6. The wafer cleaning rack according to claim 3, characterized in that: The main body of the pressure rod is a polished rod.

7. The wafer cleaning rack according to claim 1, characterized in that: Along an axial direction perpendicular to the side blocking bars, a plurality of the side blocking bars are sequentially spaced apart, and the wafer is configured to be loaded between two adjacent side blocking bars; Along an axial direction perpendicular to the side baffles, there is a support rod and a pressure rod between two adjacent side baffles.

8. The wafer cleaning rack according to claim 7, characterized in that: The number of the side guard bars is three, and the number of the support bars and the number of the pressure bars are both two.

9. The wafer cleaning rack according to claim 1, characterized in that: The support rod is provided with a plurality of wafer clamping slots at intervals along its axial direction, and the side blocking rod is provided with a plurality of wafer clamping slots at intervals along its axial direction, and the wafer clamping slots of the support rod correspond to the positions of the wafer clamping slots of the side blocking rod; The end of the support rod is plugged into the baffle, and the end of the side baffle is plugged into the baffle.

10. The wafer cleaning rack according to claim 1, wherein: The pressure rod is made of plastic; The wafer cleaning rack is an axisymmetric structure.

Images