Intelligent card automatic manufacturing system

Abstract

The utility model discloses an intelligent card automatic manufacturing system, which relates to the technical field of intelligent card processing and manufacturing and comprises a feeding area, a filling area, a wire planting area, a butt-welding area and a receiving area which are sequentially arranged. The device further comprises a first carrying mechanism, a second carrying mechanism, a third carrying mechanism and a fourth carrying mechanism. Wherein the first carrying mechanism is responsible for carrying and moving the substrate between the feeding area and the filling area, and the second carrying mechanism is responsible for carrying and moving the substrate between the filling area and the wire planting area. The third carrying mechanism is responsible for carrying and moving the substrate between the wire planting area and the butt-welding area, and the fourth carrying mechanism is responsible for carrying and moving the substrate between the butt-welding area and the material receiving area. According to the technical scheme provided by the utility model, the automation degree and the production efficiency of intelligent card processing and manufacturing can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of smart card processing and manufacturing, in particular to an automatic smart card manufacturing system. Background Art

[0002] A smart card is a generic term for a plastic substrate embedded with a microchip. The manufacturing process involves several steps: substrate loading, substrate filling, substrate wiring, substrate soldering, and substrate collection. Substrate filling involves inserting the chip into a pre-set location on the substrate; substrate wiring is used to embed an antenna on the substrate; and substrate soldering connects the chip and antenna to each other. In related technologies, these steps require multiple machines to complete in stages, making them difficult to integrate into a single production line. Products must be manually transported between machines, which is time-consuming and labor-intensive, with a low degree of automation, making it difficult to meet the high-speed production needs of enterprises.

[0003] It should be noted that the above content is only used to assist in understanding the technical solution of the present utility model, and does not mean that the above content is admitted to be prior art. Utility Model Content

[0004] The main purpose of this utility model is to propose an automated smart card manufacturing system, which aims to integrate multiple devices into a production line, thereby improving the degree of automation and production efficiency of smart card processing and manufacturing, so that it can meet the high-speed production needs of enterprises.

[0005] To achieve the above-mentioned purpose, the present invention proposes an automated manufacturing system for smart cards, comprising a loading area, a filling area, a wire planting area, a soldering area, and a receiving area, which are sequentially arranged; wherein the loading area is used to place substrates to be processed, the filling area is used to fill the chip slots of the substrates with chips, the wire planting area is used to implant antennas into the substrates, the soldering area is used to solder the chips and the antennas to each other, and the receiving area is used to receive the processed substrates;

[0006] A first buffer area is provided between the filling area and the wire planting area, and a second buffer area is provided between the wire planting area and the welding area. Both the first buffer area and the second buffer area are used for temporarily storing the substrate.

[0007] The intelligent card automated manufacturing system further includes a first handling mechanism, a second handling mechanism, a third handling mechanism, and a fourth handling mechanism for handling and moving the substrate; wherein the first handling mechanism is responsible for handling and moving the substrate between the loading area and the filling area, the second handling mechanism is responsible for handling and moving the substrate between the filling area and the wire planting area, the third handling mechanism is responsible for handling and moving the substrate between the wire planting area and the welding area, and the fourth handling mechanism is responsible for handling and moving the substrate between the welding area and the unloading area.

[0008] In one embodiment, the first handling mechanism, the second handling mechanism, the third handling mechanism, and the fourth handling mechanism have the same structure; wherein the first handling mechanism includes a handling and moving component and a suction component connected to each other, and the handling and moving component is used to drive the suction component to move; the suction component includes a suction frame with a mesh structure and a plurality of suction cups arranged at the bottom of the suction frame, and the suction cups are used to adsorb the substrate.

[0009] In one embodiment, the loading area includes a loading rack and a loading tray slidably connected to the loading rack, and the loading tray is used to place the substrate;

[0010] The placing surface of the loading tray is provided with a plurality of first positioning columns, and the plurality of first positioning columns cooperate with each other to enclose a loading and placing area for placing the substrate; wherein at least one of the first positioning columns is slidably connected to the loading tray in a lockable manner;

[0011] And / or, the loading tray is provided with a horizontally arranged material separating scraper, and the material separating scraper is made of a deformable elastic material; one end of the material separating scraper is fixedly connected to the loading tray, and the other end of the material separating scraper extends to a position above the loading and placing area.

[0012] In one embodiment, the filling area includes a filling platform, a filling mechanism, and a filling moving component, the filling platform is used to place the substrate; the filling moving component is used to drive the filling mechanism to move; the filling mechanism includes a vacuum adsorption component and a dispensing component connected to each other, wherein the dispensing component is used to dispense glue at the chip slot position of the substrate, and the vacuum adsorption component is used to adsorb the chip.

[0013] In one embodiment, the filling area further includes a punching mechanism for punching and separating the chips from the chip tape. Specifically, the punching mechanism includes a tape unwinding assembly, a tape transmission platform, and a tape winding assembly arranged in sequence. A punching die is provided on the tape transmission platform. The punching die includes an upper template and a lower template. The upper template is provided with punching holes, and the lower template is provided with punching blocks. The punching blocks are vertically aligned with the punching holes. When the lower template moves closer to the upper template, the punching blocks punch and separate the chips on the chip tape into the punching holes, so that the vacuum adsorption component can adsorb the chips in the punching holes.

[0014] In one embodiment, the wire implanting area includes a wire implanting platform, a wire implanting mechanism, and a wire implanting moving component. The wire implanting platform is used to place the substrate, and the wire implanting moving component is used to drive the wire implanting mechanism to move. The wire implanting mechanism includes a first wire releasing component and an ultrasonic positioning wire embedding component. The first wire releasing component is used to drive the antenna to release wire to a specified position, and the ultrasonic positioning wire embedding component is used to perform ultrasonic wire embedding along a preset route by ultrasonic technology to complete the implantation of the antenna on the substrate.

[0015] In one embodiment, the welding area includes a welding platform, a welding mechanism, and a welding moving component. The welding platform is used to place the substrate, and the welding moving component is used to drive the welding mechanism to move. The welding mechanism includes a second wire releasing component and a welding component. The second wire releasing component is used to drive the solder wire to release wire to the junction of the chip and the antenna, and the welding component is used to heat the solder wire to weld the chip and the antenna to each other.

[0016] In one embodiment, a detection area is provided between the welding area and the material receiving area. The detection area is used to detect the substrate to determine whether it is a qualified product or a non - qualified product.

[0017] Specifically, the detection area includes a detection platform, a detection mechanism, and a detection moving component. The detection platform is used to place the substrate. Under the driving action of the detection moving component, the detection mechanism can move in the upper area of the detection platform.

[0018] In one embodiment, the material receiving area includes a material receiving rack and two material receiving trays slidably connected to the material receiving rack. One of the two material receiving trays is used to place the qualified substrates detected, and the other is used to place the unqualified substrates detected. The two material receiving trays are arranged vertically, and a preset gap for the movement of the suction component is provided between the two material receiving trays.

[0019] A plurality of second positioning columns are provided on the placement surface of the receiving tray, and the plurality of second positioning columns cooperate with each other to enclose a receiving placement area for placing the substrate; at least one of the second positioning columns is slidably connected to the receiving tray in a lockable manner.

[0020] In one embodiment, the first buffer area and the second buffer area have the same structure; the first buffer area includes a buffer tray and a plurality of third positioning columns, and the buffer tray is used for placing the substrate; the plurality of third positioning columns cooperate with each other to enclose a buffer placement area for placing the substrate; at least one of the third positioning columns is slidably connected to the buffer tray in a lockable manner

[0021] The technical solution of the present utility model combines the first handling mechanism, the second handling mechanism, the third handling mechanism, and the fourth handling mechanism to integrate the loading area, the filling area, the wire implanting area, the bump welding area, and the receiving area into one body. The loading area is used for placing the substrate to be processed, the filling area is used for filling chips in the chip slots of the substrate, the wire implanting area is used for implanting antennas into the substrate, the bump welding area is used for welding the chips and the antennas to each other, and the receiving area is used for receiving the processed substrates. Since multiple handling mechanisms perform effective handling in multiple process segments, multiple devices are integrated into a set of production lines, thereby improving the automation degree and production efficiency of smart card processing and manufacturing, and meeting the high-speed production requirements of enterprises.

[0022] At the same time, considering that a certain amount of time is required in the filling area, the wire implanting area, and the bump welding area, in order to minimize the adverse effects caused by unequal time consumption between the front and back processes, a first buffer area is provided between the filling area and the wire implanting area, and a second buffer area is provided between the wire implanting area and the bump welding area. The first buffer area and the second buffer area are used to temporarily store the substrates, so that the operators have enough time to adjust the processing frequency of the substrates by observing the processing conditions in the filling area, the wire implanting area, and the bump welding area, and avoid the situation of substrate accumulation. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model, and those of ordinary skill in the art can also obtain other drawings without creative efforts based on these drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the smart card automatic manufacturing system provided by the present utility model;

[0025] Figure 2Schematic diagram of the structure of the first handling mechanism in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0026] Figure 3 Schematic diagram of the structure of the loading area and the filling area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0027] Figure 4 Schematic diagram of the structure of the loading area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0028] Figure 5 Schematic diagram of the structure of the filling area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0029] Figure 6 Is Figure 5 Partial enlarged view of the position A in;

[0030] Figure 7 Schematic diagram of the structure of the punching mechanism in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0031] Figure 8 Schematic diagram of the structure of the punching die in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0032] Figure 9 Schematic diagram of the structure of the wire planting area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0033] Figure 10 Schematic diagram of the structure of the wire planting mechanism in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0034] Figure 11 Schematic diagram of the structure of the butt welding area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0035] Figure 12 Schematic diagram of the structure of the butt welding mechanism in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0036] Figure 13 Schematic diagram of the structure of the material receiving area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0037] Figure 14 Schematic diagram of the structure of the detection area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model;

[0038] Figure 15 Schematic diagram of the structure of the first buffer area in an embodiment of the intelligent card automated manufacturing system provided by the present utility model.

[0039] Description of reference numerals:

[0040] 100, loading area; 110, loading rack; 120, loading tray; 130, first positioning column; 140, material separation scraper; 200, filling area; 210, filling platform; 220, filling mechanism; 221, vacuum adsorption component; 222, dispensing component; 230, filling moving component; 240, punching mechanism; 241, material tape unwinding component; 242, material tape transmission platform; 243, material tape rewinding component; 244, punching die; 245, upper template; 246, lower template; 247, punching hole; 248, punching block; 300, wire planting area; 310, wire planting platform; 320, wire planting mechanism; 321, first wire release component; 322, ultrasonic positioning buried wire component; 330, wire planting moving component; 400, welding area; 410, welding Welding platform; 420, touch welding mechanism; 421, second pay-off assembly; 422, welding assembly; 430, touch welding moving assembly; 500, material collecting area; 510, material collecting rack; 520, material collecting tray; 530, preset gap; 540, second positioning post; 600, first buffer area; 610, third positioning post; 620, cache tray; 700, second buffer area; 810, first transport mechanism; 811, transport moving assembly; 812, X-axis module; 813, Z-axis module; 814, suction assembly; 815, suction rack; 816, suction cup; 820, second transport mechanism; 830, third transport mechanism; 840, fourth transport mechanism; 900, inspection area; 910, inspection platform; 920, inspection mechanism; 930, inspection moving assembly;

[0041] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The following is a clear and complete description of the technical solutions of the present invention in conjunction with the accompanying drawings. Obviously, the description is only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0043] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0044] In addition, it should be noted that in the present utility model, the descriptions involving "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. Additionally, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0045] An intelligent card is a general term for a plastic substrate embedded with a microchip. The manufacturing process of an intelligent card involves processes such as substrate loading, substrate filling, substrate wire implantation, substrate soldering, and substrate unloading. Among them, substrate filling is used to fill a chip at a preset position on the substrate, substrate wire implantation is used to implant an antenna on the substrate, and substrate soldering is used to weld the chip and the antenna on the substrate to each other. In the related art, the above processes need to be completed in segments by multiple devices and cannot be integrated into a single production line; the product needs to be manually transported between various devices, which is time-consuming and laborious and has a low degree of automation, making it difficult to meet the high-speed production requirements of enterprises.

[0046] To solve the above technical problems, the present utility model proposes an intelligent card automated manufacturing system.

[0047] Please refer to Figure 1 , in an embodiment of the present utility model, the intelligent card automated manufacturing system includes a loading area 100, a filling area 200, a wire implantation area 300, a soldering area 400, and an unloading area 500 arranged in sequence; among them, the loading area 100 is used to place the substrate to be processed, the filling area 200 is used to fill a chip in the chip slot position of the substrate (not shown in the attached drawings), the wire implantation area 300 is used to implant an antenna (not shown in the attached drawings) on the substrate, the soldering area 400 is used to weld the chip and the antenna to each other, and the unloading area 500 is used to unload the processed substrate; in this embodiment, the loading area 100, the filling area 200, the wire implantation area 300, the soldering area 400, and the unloading area 500 are arranged to extend along the X-axis direction to facilitate the driving and movement arrangement of subsequent moving components;

[0048] Among them, a first buffer area 600 is provided between the filling area 200 and the wire implantation area 300, and a second buffer area 700 is provided between the wire implantation area 300 and the soldering area 400. Both the first buffer area 600 and the second buffer area 700 are used to temporarily store the substrate;

[0049] The smart card automated manufacturing system further includes a first handling mechanism 810, a second handling mechanism 820, a third handling mechanism 830, and a fourth handling mechanism 840 for handling and moving the substrate; wherein the first handling mechanism 810 is responsible for handling and moving the substrate between the loading area 100 and the filling area 200, the second handling mechanism 820 is responsible for handling and moving the substrate between the filling area 200 and the wire implanting area 300, the third handling mechanism 830 is responsible for handling and moving the substrate between the wire implanting area 300 and the welding area 400, and the fourth handling mechanism 840 is responsible for handling and moving the substrate between the welding area 400 and the unloading area 500.

[0050] The technical solution of the present utility model combines the first handling mechanism 810, the second handling mechanism 820, the third handling mechanism 830, and the fourth handling mechanism 840 to integrate the loading area 100, the filling area 200, the wire implanting area 300, the welding area 400, and the unloading area 500 into one body. The loading area 100 is used to place the substrate to be processed, the filling area 200 is used to fill the chip slots of the substrate with chips, the wire implanting area 300 is used to implant antennas on the substrate, the welding area 400 is used to weld the chips and the antennas to each other, and the unloading area 500 is used to perform the unloading operation on the processed substrate. Since multiple handling mechanisms effectively handle in multiple process segments, multiple devices are integrated into a production line, thereby improving the automation degree and production efficiency of smart card processing and manufacturing to meet the high-speed production requirements of enterprises.

[0051] At the same time, considering that a certain amount of time is required in the filling area 200, the wire implanting area 300, and the welding area 400, in order to minimize the adverse effects caused by the unequal time consumption of the front and back processes, a first buffer area 600 is provided between the filling area 200 and the wire implanting area 300, and a second buffer area 700 is provided between the wire implanting area 300 and the welding area 400. The first buffer area 600 and the second buffer area 700 are used to temporarily store the substrate, so that the operator has enough time to adjust the processing frequency of the substrate by observing the processing conditions of the filling area 200, the wire implanting area 300, and the welding area 400, and avoid the situation of substrate accumulation.

[0052] Among them, there are many specific structures of the above-mentioned first handling mechanism 810, second handling mechanism 820, third handling mechanism 830, and fourth handling mechanism 840. In one embodiment, the first handling mechanism 810, second handling mechanism 820, third handling mechanism 830, and fourth handling mechanism 840 have the same structure; taking the first handling mechanism 810 as an example for illustration, refer to the appendix Figure 2, the first handling mechanism 810 includes a handling moving component 811 and a suction component 814 that are connected to each other. The handling moving component 811 is used to drive the suction component 814 to move; the suction component 814 includes a suction frame 815 with a mesh structure and a plurality of suction cups 816 provided at the bottom of the suction frame 815. The suction cups 816 are used to adsorb the substrate. With such a setting, the entire substrate can be covered as much as possible by the suction frame 815 with a mesh structure, so as to firmly adsorb the substrate by its suction cups 816 and prevent the substrate from falling during the movement.

[0053] Specifically, the above-mentioned handling moving component 811 includes an X-axis module 812 and a Z-axis module 813. Through the mutual cooperation of the X-axis module 812 and the Z-axis module 813, the suction component 814 can move along the X-axis direction and the Z-axis direction; since the feeding area 100, the filling area 200, the wire planting area 300, the resistance welding area 400, and the receiving area 500 are arranged to extend along the X-axis direction as mentioned above, when the suction component 814 moves along the X-axis direction, it is the process of the suction component 814 driving the substrate to move from the feeding area 100 to the filling area 200; when the suction component 814 moves along the Z-axis direction, it is the process of the suction component 814 driving the substrate to rise and fall, so as to avoid interference with other devices during the movement of the substrate.

[0054] It should be noted that the above-mentioned X-axis module 812 includes a slide rail extending along the X-axis direction and a first mounting seat slidably connected to the slide rail; the above-mentioned Z-axis module 813 includes a ball screw structure extending along the Z-axis direction (i.e., the direction perpendicular to the ground) and a second mounting seat installed at the driving end of the ball screw structure. The ball screw structure is installed on the first mounting seat, and the suction component 814 or other components with different functions are installed on the second mounting seat.

[0055] It can be understood that since the first handling mechanism 810, the second handling mechanism 820, the third handling mechanism 830, and the fourth handling mechanism 840 have the same structure, the specific structures of the second handling mechanism 820, the third handling mechanism 830, and the fourth handling mechanism 840 will not be described in detail in this application.

[0056] Among them, there are many specific structures of the above-mentioned feeding area 100. In one embodiment, refer to the appendix Figure 3-4, the loading area 100 includes a loading rack 110 and a loading tray 120 slidably connected to the loading rack 110. The loading tray 120 is used to place substrates. With such a setting, since the loading tray 120 is slidably connected to the loading rack 110, when an operator needs to place a substrate to be processed on the loading tray 120, the loading tray 120 is first slid to the outside of the manufacturing system to prevent the operator from interfering with the inside of the manufacturing system and causing dangerous accidents. After the substrate to be processed is placed, the loading tray 120 is then slid to the inside of the manufacturing system to perform the manufacturing operation of the smart card.

[0057] Further, a plurality of first positioning posts 130 are provided on the placement surface of the loading tray 120. The plurality of first positioning posts 130 cooperate with each other to enclose a loading placement area for placing substrates. At least one of the first positioning posts 130 is slidably connected to the loading tray 120 in a lockable manner. With such a setting, the loading placement area is enclosed by the plurality of first positioning posts 130 to place the substrate, thereby ensuring the limitation of the position of the substrate and facilitating the positioning of subsequent process operations. At the same time, considering that there are many types of substrate size specifications, by making the first positioning posts 130 slidably connected to the loading tray 120 in a lockable manner, the area size of the loading placement area enclosed by the plurality of first positioning posts 130 can be adjusted, so that the loading placement area can adapt to substrates of different size specifications and avoid the loading placement area being too large or too small relative to the substrate.

[0058] Further, the loading tray 120 is provided with a horizontally arranged material separating scraper 140, and the material separating scraper 140 is made of a deformable elastic material. One end of the material separating scraper 140 is fixedly connected to the loading tray 120, and the other end of the material separating scraper 140 extends to a position above the loading placement area. With such a setting, since there is a certain electrostatic adsorption force between the stacked substrates, when the suction component 814 adsorbs and moves the upper substrate, the lower substrate may adhere to the upper substrate, thus affecting the subsequent process processing. Based on the above considerations, in this embodiment, a horizontally arranged material separating scraper 140 is installed on the loading tray 120. Since the other end of the material separating scraper 140 extends to a position above the loading placement area, the material separating scraper 140 first contacts the upper substrate. Since the upper substrate is adsorbed by the suction component 814, its adsorption force on the upper substrate is strong, so the material separating scraper 140 cannot scrape off the upper substrate. As the material separating scraper 140 elastically deforms and its other end is located between the upper substrate and the lower substrate, since the lower substrate is adsorbed to the upper substrate by electrostatic adsorption force and its adsorption force on the lower substrate is weak, the material separating scraper 140 can scrape off the lower substrate, thereby achieving the separation between the upper substrate and the lower substrate.

[0059] In one embodiment, three sets of material distribution scrapers 140 are provided, and the three sets of material distribution scrapers 140 respectively correspond to different side positions of the substrate. With this arrangement, by providing multiple sets of material distribution scrapers 140, the success probability of separating the upper substrate from the lower substrate is increased.

[0060] Among them, there are many specific structures of the above filling area 200. In one embodiment, referring to Appendix Figure 3 、 5 -6, the filling area 200 includes a filling platform 210, a filling mechanism 220, and a filling moving component 230. The filling platform 210 is used to place the substrate; the filling moving component 230 is used to drive the filling mechanism 220 to move; the filling mechanism 220 includes a vacuum adsorption component 221 and a dispensing component 222 connected to each other. Among them, the dispensing component 222 is used to dispense glue at the chip slot position of the substrate, and the vacuum adsorption component 221 is used to adsorb the chip.

[0061] Among them, since both the vacuum adsorption component 221 and the dispensing component 222 belong to the prior art, the specific structures thereof will not be described in detail in this application.

[0062] Specifically, the filling moving component 230 includes an X-axis module, a Y-axis module, and a Z-axis module. Through the mutual cooperation of the X-axis module, the Y-axis module, and the Z-axis module, the filling mechanism 220 can move along the X-axis direction, the Y-axis direction, and the Z-axis direction, so as to realize driving the filling mechanism 220 to respectively use the dispensing component 222 to dispense glue at the chip slot position of the substrate, and then use the vacuum adsorption component 221 to vacuum-adsorb the chip to the designated position. Since the above X-axis module, Y-axis module, and Z-axis module all belong to the prior art, the specific structures thereof will not be described in detail in this application.

[0063] Further, referring to Appendix Figure 3 、 7-8, the filling area 200 further includes a punching mechanism 240 for punching and separating the chips from the chip tape. Specifically, the punching mechanism 240 includes a tape unwinding component 241, a tape transmission platform 242, and a tape winding component 243 arranged in sequence. A punching die 244 is provided on the tape transmission platform 242. The punching die 244 includes an upper template 245 and a lower template 246. The upper template 245 is provided with a punching hole 247, and the lower template 246 is provided with a punching block 248. When the lower template 246 moves closer to the upper template 245, the punching block 248 punches and separates the chips on the chip tape into the punching hole 247, so that the vacuum adsorption component 221 can adsorb the chips in the punching hole 247. With this setting, during the process of the lower template 246 moving closer to the lower template 246, the punching block 248 on the lower template 246 has a certain punching force, and uses its punching force to punch and separate the chips located on the chip tape and separate them into the punching hole 247. Subsequently, the filling displacement mechanism drives the vacuum adsorption component 221 to extend into the interior of the punching hole 247 to adsorb the chips located in the punching hole 247. The structure is simple and practical.

[0064] Among them, there are many specific structures of the above wire-implanting area 300. In one embodiment, referring to the appendix Figure 9-10 , the wire-implanting area 300 includes a wire-implanting platform 310, a wire-implanting mechanism 320, and a wire-implanting moving component 330. The wire-implanting platform 310 is used to place the substrate, and the wire-implanting moving component 330 is used to drive the wire-implanting mechanism 320 to move. The wire-implanting mechanism 320 includes a first wire-releasing component 321 and an ultrasonic positioning wire-implanting component 322. The first wire-releasing component 321 is used to drive the antenna to release the wire to a specified position, and the ultrasonic positioning wire-implanting component 322 is used to perform ultrasonic wire-implanting according to a preset route through ultrasonic technology to complete the implantation of the antenna on the substrate.

[0065] Among them, since both the first wire-releasing component 321 and the ultrasonic positioning wire-implanting component 322 are prior arts, the specific structures thereof will not be described in detail in this application.

[0066] Specifically, the wire-implanting moving component 330 includes an X-axis module, a Y-axis module, and a Z-axis module. Through the mutual cooperation of the X-axis module, Y-axis module, and Z-axis module, the wire-implanting mechanism 320 can move along the X-axis direction, Y-axis wire release, and Z-axis direction, so as to realize driving the wire-implanting mechanism 320 to use the first wire-releasing component 321 to drive the antenna to release the wire to a specified position, and then use the ultrasonic positioning wire-implanting component 322 to perform ultrasonic wire-implanting according to a preset route through ultrasonic technology to complete the implantation of the antenna on the substrate.

[0067] Among them, there are many specific structures of the above welding area 400. In one embodiment, referring to the appendix Figure 11-12, the butt welding area 400 includes a butt welding platform 410, a butt welding mechanism 420, and a butt welding moving component 430. The butt welding platform 410 is used to place the substrate, and the butt welding moving component 430 is used to drive the butt welding mechanism 420 to move; among which, the butt welding mechanism 420 includes a second wire feeding component 421 and a welding component 422. The second wire feeding component 421 is used to drive the solder wire to be fed to the junction of the chip and the antenna, and the welding component 422 is used to heat the solder wire to weld the chip and the antenna to each other.

[0068] Among them, since both the second wire feeding component 421 and the welding component 422 belong to the prior art, the specific structures thereof will not be described in detail in this application. For example, in one embodiment, the welding component 422 includes a lifting cylinder and a soldering iron module. The lifting cylinder is used to drive the soldering iron module to move up and down, and the soldering iron module is used to heat and melt the solder wire for welding.

[0069] Specifically, the butt welding moving component 430 includes an X-axis module, a Y-axis module, and a Z-axis module. Through the mutual cooperation of the X-axis module, the Y-axis module, and the Z-axis module, the butt welding mechanism 420 can move along the X-axis direction, the Y-axis direction, and the Z-axis direction, so as to drive the butt welding mechanism 420 to use the second wire feeding component to feed the solder wire to the junction of the chip and the antenna respectively, and then use the welding component to heat the solder wire to weld the chip and the antenna to each other. [[ID=X]]

[0070] In addition, the butt welding mechanism 420 is also equipped with an automatic position detection function, and the butt welding position is automatically obtained through a CCD to improve the butt welding accuracy.

[0071] Among them, there are many specific structures of the above-mentioned material receiving area 500. In one embodiment, referring to the appendix Figure 13 , the material receiving area 500 includes a material receiving rack 510 and two material receiving trays 520 slidably connected to the material receiving rack 510. One of the two material receiving trays 520 is used to place the substrates that pass the inspection, and the other is used to place the substrates that fail the inspection; with such a setting, since both of the two material receiving trays 520 are slidably connected to the material receiving rack 510, when the operator needs to receive and recycle the substrates on the material receiving tray 520, first slide the material receiving tray 520 to the outside of the manufacturing system to avoid interference between the operator and the inside of the manufacturing system and cause dangerous accidents; after the substrates are received and recycled, then slide the material receiving tray 520 to the inside of the manufacturing system to perform the manufacturing operation of the smart card. Preferably, a position inductor (not shown in the drawings) and an alarm (not shown in the drawings) are provided on the material receiving rack 510. When the position inductor detects that the material receiving rack 510 does not slide in place, the alarm is activated to remind the operator to pay attention.

[0072] Meanwhile, considering that there may be defective products in the manufacturing process of smart cards, two receiving trays 520 are provided to separately store the qualified and unqualified substrates, so as to facilitate the subsequent operators to distinguish between the qualified substrate and the unqualified substrate.

[0073] Furthermore, the two receiving trays 520 are arranged vertically, and a preset gap 530 for the movement of the suction component 814 is provided between the two receiving trays 520. With this arrangement, the two receiving trays 520 are arranged vertically to avoid occupying too much space. At the same time, a preset gap 530 for the movement of the suction component 814 is provided between the two receiving trays 520, so that the suction component 814 can place the substrates on the upper receiving tray 520 and the lower receiving tray 520 respectively.

[0074] Furthermore, a plurality of second positioning posts 540 are provided on the placement surface of the receiving tray 520, and the plurality of second positioning posts 540 cooperate with each other to enclose a receiving placement area for placing the substrate. At least one of the second positioning posts 540 is slidably connected to the receiving tray 520 in a lockable manner. With this arrangement, the receiving placement area is enclosed by the plurality of second positioning posts 540 to place the substrate, thereby ensuring the limitation of the position of the substrate. At the same time, considering that there are many types of substrate size specifications, by making the second positioning posts 540 slidably connected to the receiving tray 520 in a lockable manner, the area size of the receiving placement area enclosed by the cooperation of the plurality of second positioning posts 540 can be adjusted, so that the receiving placement area can adapt to different size specifications of substrates, and avoid the receiving placement area being too large or too small relative to the substrate.

[0075] Furthermore, an ion wind generator (not shown in the drawings) is provided inside the receiving tray 520 to generate ion wind to remove static electricity in real time and prevent product defects caused by static electricity.

[0076] As a preferred solution of the above embodiment, a detection area 900 is provided between the butt welding area 400 and the receiving area 500, and the detection area 900 is used to detect the substrate to determine whether it is a qualified product or an unqualified product.

[0077] Specifically, refer to the appendix Figure 14, the detection area 900 includes a detection platform 910, a detection mechanism 920, and a detection moving component 930. The detection platform 910 is used to place the substrate. Under the driving action of the detection moving component 930, the detection mechanism 920 can move in the upper area of the detection platform 910. In this way, the substrate after bump welding is transported and moved to the detection platform 910 by the fourth handling mechanism 840. The detection moving component 930 drives the detection mechanism 920 to move in the upper area of the substrate. While the detection mechanism 920 is moving, the substrate is visually inspected by using the CCD camera inside it, such as detecting whether the chip and the antenna of the substrate are welded completely. According to the visual inspection result, it is determined whether the substrate is a qualified product or a non - qualified product. After the detection is completed, the detection moving component 930 drives the detection mechanism 920 away from the upper area of the substrate to avoid interference with the handling and movement of the substrate by the fourth handling mechanism 840. In this embodiment, the detection moving component 930 adopts a gantry - type moving device to enable the detection mechanism 920 to move along the X - axis direction and the Y - axis direction.

[0078] It should be noted that since the above visual inspection of the substrate using a CCD camera belongs to the prior art, the specific structure thereof will not be described in detail in this application.

[0079] Among them, there are many specific structures for the above - mentioned first buffer area 600 and second buffer area 700. In one embodiment, the structures of the first buffer area 600 and the second buffer area 700 are the same. Taking the first buffer area 600 as an example for illustration, refer to the appendix Figure 15 , the first buffer area 600 includes a buffer disk 620 and several third positioning columns 610. The buffer disk 620 is used to place the substrate. The several third positioning columns 610 cooperate with each other to enclose a buffer placement area for placing the substrate. At least one of the third positioning columns 610 is slidably connected to the buffer disk 620 in a lockable manner. In this way, the buffer placement area is enclosed by several third positioning columns 610 to place the substrate, thereby ensuring the limitation of the position of the substrate. At the same time, considering that there are many kinds of size specifications of the substrate, by making the third positioning columns 610 slidably connected to the buffer disk 620 in a lockable manner, the area size of the buffer placement area enclosed by the cooperation of several third positioning columns 610 can be adjusted, so that the buffer placement area can adapt to substrates of different size specifications, avoiding the buffer placement area being too large or too small relative to the substrate.

[0080] It should be noted that the other contents of the intelligent card automatic manufacturing system disclosed in this utility model are prior art and will not be elaborated here.

[0081] The above are only optional embodiments of the present utility model, and do not limit the patent scope of the present utility model. Any direct or indirect application of the present utility model in other related technical fields is included in the patent protection scope of the present utility model.

Claims

1. A smart card automated manufacturing system, characterized in that: The system comprises a loading area, a filling area, a wire planting area, a soldering area and a receiving area, which are arranged in sequence; wherein the loading area is used to place the substrate to be processed, the filling area is used to fill the chip slot position of the substrate with a chip, the wire planting area is used to implant the antenna into the substrate, the soldering area is used to solder the chip and the antenna to each other, and the receiving area is used to receive the substrate after processing; A first buffer area is provided between the filling area and the wire planting area, and a second buffer area is provided between the wire planting area and the welding area. Both the first buffer area and the second buffer area are used for temporarily storing the substrate. The smart card automated manufacturing system also includes a first conveying mechanism, a second conveying mechanism, a third conveying mechanism and a fourth conveying mechanism for conveying and moving the substrate; wherein the first conveying mechanism is responsible for conveying and moving the substrate between the loading area and the filling area, the second conveying mechanism is responsible for conveying and moving the substrate between the filling area and the wire planting area, the third conveying mechanism is responsible for conveying and moving the substrate between the wire planting area and the welding area, and the fourth conveying mechanism is responsible for conveying and moving the substrate between the welding area and the receiving area.

2. The smart card automated manufacturing system according to claim 1, wherein: The first conveying mechanism, the second conveying mechanism, the third conveying mechanism and the fourth conveying mechanism have the same structure; wherein the first conveying mechanism includes a conveying moving component and a suction component that are interconnected, and the conveying moving component is used to drive the suction component to move; the suction component includes a suction rack with a mesh structure, and a plurality of suction cups arranged at the bottom of the suction rack, and the suction cups are used to adsorb the substrate.

3. The smart card automated manufacturing system according to claim 1, wherein: The loading area includes a loading rack and a loading tray slidably connected to the loading rack, and the loading tray is used to place the substrate; The placement surface of the loading tray is provided with a plurality of first positioning columns, and the plurality of first positioning columns cooperate with each other to form a loading placement area for placing the substrate; At least one of the first positioning posts is lockably and slidably connected to the loading tray; And / or, the loading tray is provided with a horizontally arranged material distribution scraper, and the material distribution scraper is made of a deformable elastic material; one end of the material distribution scraper is fixedly connected to the loading tray, and the other end of the material distribution scraper extends to a position above the loading placement area.

4. The smart card automated manufacturing system according to claim 1, wherein: The filling area includes a filling platform, a filling mechanism and a filling moving component, wherein the filling platform is used to place the substrate; the filling moving component is used to drive the filling mechanism to move; the filling mechanism includes a vacuum adsorption component and a dispensing component that are interconnected, wherein the dispensing component is used to dispense glue on the chip slot position of the substrate, and the vacuum adsorption component is used to adsorb the chip.

5. The smart card automated manufacturing system according to claim 4, wherein: The filling area also includes a punching mechanism, which is used to punch and separate the chip from the chip strip; specifically, the punching mechanism includes a strip unwinding component, a strip conveying platform and a strip winding component arranged in sequence, wherein a punching mold is provided on the strip conveying platform, and the punching mold includes an upper template and a lower template, the upper template is provided with a punching hole, and the lower template is provided with a punching block, and the punching block is aligned with the punching hole up and down; when the lower template moves toward the upper template, the punching block punches and separates the chip on the chip strip into the punching hole, so that the vacuum adsorption component can adsorb the chip in the punching hole.

6. The smart card automated manufacturing system according to claim 1, wherein: The wire planting area includes a wire planting platform, a wire planting mechanism and a wire planting moving component. The wire planting platform is used to place the substrate, and the wire planting moving component is used to drive the wire planting mechanism to move; wherein the wire planting mechanism includes a first wire-releasing component and an ultrasonic positioning wire-burying component. The first wire-releasing component is used to drive the antenna to release the wire to a specified position, and the ultrasonic positioning wire-burying component is used to perform ultrasonic wire burying according to a preset route through ultrasonic technology to complete the implantation of the antenna into the substrate.

7. The smart card automated manufacturing system according to claim 1, wherein: The touch welding area includes a touch welding platform, a touch welding mechanism and a touch welding moving component, the touch welding platform is used to place the substrate, and the touch welding moving component is used to drive the touch welding mechanism to move; wherein the touch welding mechanism includes a second pay-off component and a welding component, the second pay-off component is used to drive the solder wire to pay off the wire to the intersection of the chip and the antenna, and the welding component is used to heat the solder wire to weld the chip and the antenna to each other.

8. The smart card automated manufacturing system according to claim 1, wherein: A testing area is provided between the welding area and the receiving area, and the testing area is used to test the substrate to determine whether it is a qualified product or a failed product; Specifically, the detection area includes a detection platform, a detection mechanism, and a detection moving component, and the detection platform is used to place the substrate; Under the driving action of the detection moving component, the detection mechanism can move with the upper area of the detection platform.

9. The smart card automated manufacturing system according to claim 2, wherein: The receiving area includes a receiving rack and two receiving trays slidably connected to the receiving rack, one of the two receiving trays being used to place the substrates that have passed the inspection, and the other being used to place the substrates that have failed the inspection; the two receiving trays are arranged one above the other, and a preset gap is provided between the two receiving trays for the movement of the suction component; A plurality of second positioning posts are provided on the placement surface of the receiving tray, and the plurality of second positioning posts cooperate with each other to form a receiving placement area for placing the substrate; at least one of the second positioning posts is lockably and slidably connected to the receiving tray.

10. The smart card automated manufacturing system according to claim 1, wherein: The first cache area and the second cache area have the same structure; wherein the first cache area includes a cache disk and a plurality of third positioning posts, the cache disk is used to place the substrate; the plurality of third positioning posts cooperate with each other to form a cache placement area for placing the substrate; At least one of the third positioning posts is lockably and slidably connected to the cache disk.

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