Fixed carrying platform for multi-specification wafer film pasting

Abstract

The utility model discloses a fixed platform deck for multi-specification wafer film pasting, which comprises a working platform, a plurality of grooves are arranged on the surface of the working platform in a circumferential array mode, a first air hole is arranged in the center of the working platform, a cross groove is arranged on the surface of the working platform by taking the first air hole as the center, and the first air hole is communicated with the cross groove. The plurality of grooves are communicated through the cross-shaped groove; the suction cup is arranged on one side of the workbench, a plurality of second air holes corresponding to the grooves are formed in the suction cup in a circumferential array mode, and a positioning block used for limiting the position of the wafer is arranged on the suction cup. The wafer film sticking machine can solve the problems of low efficiency and high cost caused by the fact that a corresponding carrying table is usually replaced according to the size of a wafer when an existing wafer film sticking machine carries out film sticking operation.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, in particular to a fixed carrier used for laminating wafers of multiple specifications. Background Art

[0002] In the semiconductor manufacturing process, wafer laminators are widely used to apply protective films or other types of thin films to the surface of wafers. This process is crucial for protecting wafers from damage during subsequent processing, cutting, transportation, and other processes. However, existing wafer laminators have some problems when processing wafers of different sizes. Usually, the corresponding carrier needs to be replaced according to the size of the wafer. For example, different sizes of carriers are required for 2-inch, 3-inch, and 4-inch wafers. This operation method is not only time-consuming, but also increases labor and time costs. In addition, frequent replacement of carriers may also increase the risk of equipment failure. Therefore, setting up a fixed carrier for laminating wafers of multiple specifications meets current usage needs. Utility Model Content

[0003] The utility model provides a fixed carrier for wafer lamination of multiple specifications, which can solve the problem that the existing wafer lamination machine usually needs to replace the corresponding carrier according to the size of the wafer during the lamination operation, resulting in low efficiency and high cost.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a fixed carrier for multi-specification wafer film lamination, comprising a workbench, the surface of the workbench is provided with a plurality of grooves arranged in a circular array, a first air hole is provided in the center of the workbench, a cross groove is provided on the surface of the workbench with the first air hole as the center, and the cross groove connects the plurality of grooves; a suction cup is provided on one side of the workbench, a plurality of second air holes corresponding to the grooves are provided in a circular array on the suction cup, and a positioning block for limiting the position of the wafer is provided on the suction cup, so that there is no need to frequently replace the carrier when processing wafers of different sizes, thereby significantly reducing the operation time and improving the efficiency of the film lamination operation.

[0005] Preferably, the surface of the workbench is provided with a sealing groove surrounding the outer periphery of the groove, and a sealing strip is embedded in the sealing groove to improve the sealing performance of the carrier, and the wafer can be adsorbed by drawing a vacuum.

[0006] Preferably, the suction cup includes a fixing seat connected to the workbench, a wafer carrier is provided on the upper side of the fixing seat, a positioning surface is provided on the side of the wafer carrier, and the fixing seat is connected to the workbench by bolts.

[0007] Preferably, the positioning block is L-shaped and is provided with at least two layers of first steps, the first steps gradually increasing in height from the outside to the inside, the side walls of the outer first steps are in contact with the positioning surface, and the inner first steps are used to abut against the edge of the wafer to be filmed, and are suitable for filming operations on 4-inch wafers.

[0008] Preferably, a second step is provided inside the first step, and the second step is used to abut against the edge of the wafer to be film-laminated. The size of the second step is set as needed and is suitable for film-laminated operations on 2-inch wafers or 3-inch wafers.

[0009] Preferably, the suction cup and the workbench are both made of aluminum.

[0010] Compared with the prior art, the beneficial effects of the present invention are:

[0011] The simple structure and easy operation eliminate the need to frequently change carriers when processing wafers of different sizes during lamination operations, significantly reducing operation time and improving lamination efficiency. Reducing the number of carrier changes not only saves time but also reduces labor costs. Operators can adapt to wafers of different sizes by simply replacing positioning blocks, greatly simplifying the operation process and reducing training requirements. Reducing the frequency of carrier changes helps reduce the risk of equipment failure and improves equipment stability and reliability. This solves the problem of low efficiency and high cost in existing wafer lamination machines, which typically require changing the corresponding carrier according to the size of the wafer during lamination operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0013] Figure 2 This is a three-dimensional structural diagram of the workbench of the utility model;

[0014] Figure 3 It is a cross-sectional view of the workbench of the utility model;

[0015] Figure 4 This is a three-dimensional structural diagram of the suction cup of the present invention;

[0016] Figure 5 This is a schematic diagram of the structure of the positioning block of the utility model including two steps;

[0017] Figure 6 This is a structural diagram of a positioning block of the present invention including three steps.

[0018] Reference numerals:

[0019] 1. Workbench, 11. Groove, 12. First air hole, 13. Cross groove, 14. Sealing groove, 15. Sealing strip, 2. Suction cup, 21. Second air hole, 22. Fixing seat, 23. Wafer carrier, 24. Positioning surface, 3. Positioning block, 31. First step, 32. Second step, 4. Wafer. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0021] like Figure 1-6 As shown, the utility model is to solve the problem that the existing wafer laminating machine usually needs to replace the corresponding carrier according to the size of the wafer during the laminating operation, resulting in low efficiency and high cost, and provides the following technical solutions: a fixed carrier for laminating wafers of multiple specifications, comprising a workbench 1, the surface of the workbench 1 is provided with a plurality of grooves 11 arranged in a circular array, the center of the workbench 1 is provided with a first air hole 12, the surface of the workbench 1 is provided with a cross groove 13 with the first air hole 12 as the center, and the cross groove 13 connects the plurality of grooves 11; a suction cup 2, which is provided on one side of the workbench 1, and the suction cup 2 is provided with a plurality of second air holes 21 corresponding to the grooves 11 in a circular array, and the suction cup 2 is provided with a positioning block 3 for limiting the position of the wafer 4, so that there is no need to frequently replace the carrier when processing wafers of different sizes, thereby significantly reducing the operation time and improving the efficiency of the laminating operation.

[0022] In this embodiment, if Figure 2-3 As shown, the surface of the workbench 1 is provided with a sealing groove 14 surrounding the outer periphery of the groove 11, and a sealing strip 15 is embedded in the sealing groove 14 to improve the sealing performance of the carrier, and the wafer can be adsorbed by drawing a vacuum.

[0023] In this embodiment, if Figure 4 As shown, the suction cup 2 includes a fixing seat 22 connected to the workbench 1, a wafer carrier 23 is provided on the upper side of the fixing seat 22, the fixing seat 22 is connected to the workbench 1 by bolts, and a positioning surface 24 is provided on the side of the wafer carrier 23.

[0024] In this embodiment, if Figure 5 As shown, the positioning block 3 is L-shaped and is provided with at least two layers of first steps 31. The first steps 31 gradually increase in height from the outside to the inside. The side wall of the outer first step 31 is in contact with the positioning surface 24. The inner first step 31 is used to abut against the edge of the wafer 4 to be filmed, and is suitable for filming operations on 4-inch wafers.

[0025] In this embodiment, if Figure 6As shown, a second step 32 is provided inside the first step 31 . The second step 32 is used to abut against the edge of the wafer 4 to be laminated. The size of the second step 32 is set as needed and is suitable for laminating 2-inch wafers or 3-inch wafers.

[0026] In this embodiment, if Figure 1 As shown, the suction cup 2 and the workbench 1 are both made of aluminum.

[0027] In this embodiment, if Figure 1 As shown, prepare the workbench 1 and the suction cup 2, install the sealing strip 15 into the sealing groove 14, place the suction cup 2 on the upper side of the workbench 1, and connect it to the workbench 1 through the fixing seat 22 by bolts, select a suitable positioning block 3 according to the size of the wafer 4, and fix the selected positioning block 3 on the suction cup 2. When performing 4-inch wafer operations, the positioning block 3 has two layers of first steps 31. The L-shaped side walls of the outer first step 31 respectively fit the positioning surface 24 and the edge of the wafer carrier 23. The wafer 4 is placed on the upper surface of the wafer carrier 23, and the L-shaped side walls of the inner first step 31 limit the two directions of the wafer 4. Press the start button to suck the vacuum, so that the second air of the suction cup 2 The hole 21 generates suction, and the wafer is firmly fixed on the workbench 1 through the groove 11 and the first air hole 12. The positioning block 3 is removed and the film laminating operation is carried out. The film laminating machine sticks the protective film or other types of films on the wafer to cover the entire wafer surface. After the film laminating is completed, the film laminating machine is turned off, the suction of the suction cup 2 is released, and the wafer is gently removed to complete the film laminating process. If wafers of different sizes need to be processed, the corresponding positioning block 3 can be replaced; when operating on 2-inch or 3-inch wafers, the positioning block 3 has two layers of first steps 31 and one layer of second step 32. The size of the second step 32 is set as needed, and the L-shaped side wall of the second step 32 is used to limit the two directions of the wafer 4.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0030] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0031] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

Claims

1. A fixed carrier for multi-specification wafer lamination, characterized in that: include: A workbench (1), wherein a plurality of grooves (11) are arranged in a circumferential array on the surface of the workbench (1), a first air hole (12) is provided at the center of the workbench (1), and a cross groove (13) is provided on the surface of the workbench (1) with the first air hole (12) as the center, wherein the cross groove (13) connects the plurality of grooves (11); A suction cup (2) is arranged on one side of the workbench (1), and a plurality of second air holes (21) corresponding to the grooves (11) are arranged on the suction cup (2) in a circumferential array. A positioning block (3) for limiting the position of the wafer (4) is provided on the suction cup (2).

2. The fixed carrier for multi-specification wafer lamination according to claim 1, characterized in that: The surface of the workbench (1) is provided with a sealing groove (14) surrounding the outer periphery of the groove (11), and a sealing strip (15) is embedded in the sealing groove (14).

3. The fixed carrier for multi-specification wafer lamination according to claim 1, characterized in that: The suction cup (2) includes a fixing seat (22) connected to the workbench (1), a wafer carrier (23) is provided on the upper side of the fixing seat (22), and a positioning surface (24) is provided on the side of the wafer carrier (23).

4. The fixed carrier for multi-specification wafer lamination according to claim 3, characterized in that: The positioning block (3) is L-shaped and is provided with at least two layers of first steps (31). The first steps (31) gradually increase in height from the outside to the inside. The side wall of the outer first step (31) is in contact with the positioning surface (24), and the inner first step (31) is used to abut against the edge of the wafer (4) to be filmed.

5. The fixed carrier for multi-specification wafer lamination according to claim 4, characterized in that: A second step (32) is provided on the inner side of the first step (31), and the second step (32) is used to abut against the edge of the wafer (4) to be film-attached.

6. The fixed carrier for multi-specification wafer lamination according to claim 1, characterized in that: The suction cup (2) and the workbench (1) are both made of aluminum.

Images