Mobile phone camera packaging structure

Abstract

The utility model relates to the field of mobile phone camera packaging, and discloses a mobile phone camera packaging structure which comprises a substrate, the substrate comprises an element area, a CMOS image sensor and a strip-shaped wafer are arranged on the element area, elements in the element area are integrated in the wafer, the wafer is attached to the side face of the CMOS image sensor, and the CMOS image sensor is arranged on the substrate. The length of the wafer is smaller than or equal to the side length of one side, close to the wafer, of the CMOS image sensor. Therefore, the element area size of the substrate is reduced.

Description

Technical Field

[0001] The utility model relates to the field of mobile phone camera packaging, in particular to a mobile phone camera packaging structure. Background Art

[0002] With the rapid growth of mobile phone upgrades, demand for foldable and thin-and-light phones is increasing. The requirements for camera module size are becoming increasingly stringent, with cameras demanding more functions while being smaller. Existing module packaging methods are large and unsuitable for thin-and-light phones like foldable ones.

[0003] Existing camera modules consist of a lens, motor, and substrate. The substrate's component area houses an integrated circuit chip (CMOS image sensor) and several discrete components. The CMOS image sensor is used for optical imaging, while the discrete components include a memory chip (EEPROM), a motor chip, resistors, and capacitors. The EEPROM is used to store debugging and calibration data when the camera is assembled into a mobile phone. The lens and motor can be scaled down proportionally as needed. However, since the motor is mounted in the substrate's component area, the component area needs to be larger than the motor's planar projection. However, due to technical reasons, further reduction in size of the discrete components in the component area is difficult, making it impossible to directly scale down the substrate.

[0004] Therefore, a new packaging method is needed to reduce the size of the component area on the substrate. Utility Model Content

[0005] The utility model aims to provide a mobile phone camera packaging structure to reduce the size of the component area of the substrate.

[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical solution: a mobile phone camera packaging structure, including a substrate, the substrate including a component area, the component area is provided with a CMOS image sensor and a strip-shaped wafer, the components in the component area are integrated in the wafer, the wafer is attached to the side of the CMOS image sensor, and the length of the wafer is less than or equal to the side length of the CMOS image sensor close to the wafer.

[0007] The beneficial effects of this program are:

[0008] 1. This solution integrates the separate components in the prior art into the wafer. There is no need to reserve separate installation spaces for different components. Only the installation space of the wafer needs to be reserved. In general, the total area occupied by the components is reduced, so as to reduce the size of the component area of the substrate.

[0009] 2. CMOS image sensors are typically rectangular. Making the wafer into a strip shape and attaching it to the side of the CMOS image sensor can make the overall outline of the wafer and CMOS image sensor more regular, thereby reducing area waste and maximizing the rational use of the area on the substrate (i.e., reducing the total perimeter).

[0010] Furthermore, the substrate includes a component area and a non-component area. The non-component area is provided with a QR code, which is used to replace the EEPROM memory. The QR code records the corresponding server address, and the server stores debugging and correction data for assembling the camera into the mobile phone.

[0011] Furthermore, it also includes a motor, the outer contour of the component area covers the projection of the motor on the substrate, and the projection of the motor on the substrate covers the CMOS image sensor.

[0012] Furthermore, a first connecting column is provided on the lower surface of the motor, the number of wafers is greater than 2, the side of the CMOS image sensor close to the wafer is attached to at least 2 wafers, a second connecting column is provided between the two wafers, the second connecting column is fixed on the component area, and the second connecting column is used to be welded to the first connecting column.

[0013] Furthermore, the second connecting column is a wedge-shaped structure that is narrow at the top and wide at the bottom.

[0014] Furthermore, a first connecting post is provided on the lower surface of the motor, and two second connecting posts are provided on the component area. The second connecting posts are arranged at two corner positions on one side of the CMOS image sensor adjacent to the wafer.

[0015] Furthermore, the chip driving the motor is integrated into the motor.

[0016] Furthermore, the components in the component area include resistors and capacitors.

[0017] This solution also has the following effects:

[0018] 1. In the prior art, EEPROM memory is set in the component area, occupying the component area; in this solution, a QR code is used to replace the EEPROM memory. The QR code does not need to be connected to the circuit and only needs to be etched in the non-component area, without occupying the component area. The QR code only records the corresponding server address. The actual debugging and calibration data is stored on the server, not on the substrate, thereby saving the component area and meeting the requirements of reducing the size of the lens and motor.

[0019] 2. The substrate's component area is typically equipped with a second connecting post to facilitate soldering to the first connecting post on the motor, completing the package. In this solution, the second connecting post is installed in the gap formed after the wafer is installed, further saving area.

[0020] For example, a gap formed between two wafers, or a gap formed at a corner of a wafer on a CMOS image sensor, can be used to install the second connecting column.

[0021] 3. If the component area of the substrate is directly reduced, the distance between the motor chip and the CMOS image sensor needs to be shortened, which may interfere with the CMOS image sensor and affect the imaging effect of the CMOS image sensor. Therefore, in this solution, the motor chip is integrated into the motor to avoid the impact of the motor chip on the CMOS image sensor, ensure the imaging effect, and further reduce the component area. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is an exploded diagram of the structure of a conventional camera module;

[0023] Figure 2 A schematic plan view of a component area of a conventional substrate;

[0024] Figure 3 3D axonometric view of the substrate of Example 1;

[0025] Figure 4 is a schematic top plan view of the substrate component area of Example 1;

[0026] Figure 5 Schematic top view of the substrate element area of Example 2. DETAILED DESCRIPTION

[0027] The following is further described in detail through specific implementation methods:

[0028] The reference numerals in the drawings of the specification include: lens 1, motor 2, first connecting column 21, component area 3, CMOS image sensor 31, EEPROM memory 32, capacitor 33, second connecting column 34, wafer 35, motor chip 36, non-component area 4, and QR code 41.

[0029] Example 1

[0030] The existing technology is basically as follows Figure 1 、 Figure 2As shown, the camera module includes a lens 1, a motor 2 and a substrate. The substrate includes a component area 3. An integrated circuit chip (CMOS image sensor 31) and several separate components are provided on the component area 3. The CMOS image sensor 31 is used for optical imaging. The several separate components include a storage chip (EEPROM memory 32), a motor chip 36, a resistor and a capacitor 33. A second connecting column 34 is respectively provided at the two corners on one side of the component area 3, and two first connecting columns 21 are provided at the corresponding positions on the lower surface of the motor 2. The first connecting column 21 is used for welding with the second connecting column 34.

[0031] Example 1 is basically as Figure 3 、 Figure 4 As shown: A mobile phone camera packaging structure includes a substrate and a motor 2. The substrate includes a component area 3 and a non-component area 4. A QR code 41 is etched on the non-component area 4 for easy display. Figure 3 The QR code 41 is a schematic diagram. The QR code 41 is used to replace the EEPROM memory 32. The QR code 41 records the corresponding server address. The server stores debugging and calibration data used when the camera is assembled into the mobile phone. The component area 3 is provided with a CMOS image sensor 31 and a strip-shaped wafer 35. The difference between this solution and the prior art is that the components of the component area 3 are directly integrated into the CMOS image sensor 31, or the components of the component area 3 are first integrated into the wafer 35, and then the wafer 35 and CMOS image sensor 31 are packaged and processed.

[0032] In this embodiment, for the convenience of processing, Figure 3 、 Figure 4 As shown, the components are first integrated into the strip-shaped wafer 35. The components in the element area 3 include resistors and capacitors 33 (not specifically shown in the figure). Then, the wafer 35 is attached to the left side of the CMOS image sensor 31. The length of the wafer 35 is smaller than the length of the side of the CMOS image sensor 31 close to the left side of the wafer 35.

[0033] Two second connecting posts 34 are integrally formed on the component area 3, and two first connecting posts 21 are integrally formed at corresponding positions on the lower surface of the motor 2. Figure 4 As shown, the second connecting column 34 is respectively arranged at the two corner positions on the left side of the CMOS image sensor 31; the second connecting column 34 has a wedge-shaped structure that is narrow at the top and wide at the bottom, and the first connecting column 21 has a rectangular structure. The lower surface of the first connecting column 21 and the upper surface of the second connecting column 34 are overlapping long strips. Even if the area of the component area 3 is reduced, the wedge-shaped structure of the second connecting column 34 can increase the contact area between the second connecting column 34 and the component area 3, reduce the pressure on the component area 3 from the motor 2, and thus protect the component area 3.

[0034] The chip 36 driving the motor is integrated into the motor 2 .

[0035] The outer contour of the device region 3 covers the projection of the motor 2 on the substrate, and the projection of the motor 2 on the substrate covers the CMOS image sensor 31 .

[0036] After actual packaging tests, it was found that after adopting the packaging method of this embodiment, the side length of the component area 3 , which originally had a side length of 8.5 mm, could be reduced to 5 mm-6 mm.

[0037] Example 2

[0038] The difference between Example 2 and Example 1 is that: Figure 5 As shown, there are four wafers 35 , which are arranged in groups of two on the left and right sides of the CMOS image sensor 31 , and two second connecting pillars 34 are respectively arranged on the left and right sides of the COMS and located between the two wafers 35 on the corresponding sides.

[0039] The above description is merely an embodiment of the present invention, and the commonly known specific technical solutions and / or features of the solution are not described in detail here. It should be noted that for those skilled in the art, without departing from the technical solution of the present invention, several variations and improvements can be made, which should also be considered as the scope of protection of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection claimed in this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A mobile phone camera packaging structure, characterized by: The device comprises a substrate, which includes a component area, on which a CMOS image sensor and a strip-shaped wafer are arranged. The components in the component area are integrated in the wafer, and the wafer is attached to the side of the CMOS image sensor. The length of the wafer is less than or equal to the length of the side of the CMOS image sensor close to the wafer.

2. The mobile phone camera packaging structure according to claim 1, characterized in that: The substrate includes a component area and a non-component area. The non-component area is provided with a QR code, which is used to replace the EEPROM memory. The QR code records the corresponding server address. The server stores debugging and calibration data for assembling the camera into a mobile phone.

3. The mobile phone camera packaging structure according to claim 1, characterized in that: It also includes a motor, the outer contour of the component area covers the projection of the motor on the substrate, and the projection of the motor on the substrate covers the CMOS image sensor.

4. The mobile phone camera packaging structure according to claim 3, characterized in that: A first connecting column is provided on the lower surface of the motor. The number of wafers is greater than 2. The side of the CMOS image sensor close to the wafer is attached to at least 2 wafers. A second connecting column is provided between the two wafers. The second connecting column is fixed on the component area and is used for welding to the first connecting column.

5. The mobile phone camera packaging structure according to claim 3, characterized in that: A first connecting column is provided on the lower surface of the motor, and two second connecting columns are provided on the component area. The second connecting columns are arranged at two corner positions on one side of the CMOS image sensor adjacent to the wafer.

6. A mobile phone camera packaging structure according to claim 4 or claim 5, characterized in that: The second connecting column is a wedge-shaped structure that is narrow at the top and wide at the bottom.

7. The mobile phone camera packaging structure according to claim 3, characterized in that: The chip that drives the motor is integrated into the motor.

8. The mobile phone camera packaging structure according to claim 1, characterized in that: The components in the component area include resistors and capacitors.

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