Device for improving aperture aberration of tin immersion plate in solder mask semi-plug hole process

Abstract

The utility model discloses a device for improving chromatic aberration of an orifice of a tin immersion plate in a solder mask semi-plug hole process. The device comprises a DI water soaking pool, a cold air drying device and a hot air drying device which are sequentially arranged along the conveying direction of a PCB (Printed Circuit Board), a timer is arranged in the DI water soaking pool and is electrically connected with the PCB transfer device; the cold air drying device comprises a first conveying belt and a cold air output fan erected on the first conveying belt, and the cold air output fan conveys cold air towards the PCBs on the first conveying belt and blows away residual liquid on the PCBs; the hot air drying device comprises a second conveying belt and a hot air output fan erected on the second conveying belt, and the hot air output fan is used for outputting hot air to dry the PCB.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board production, in particular to a device for improving the color difference of the hole opening of a tin-immersion plate in a solder resist semi-plug hole process. Background Art

[0002] The immersion tin process requires the PCB to be completely immersed in a solution to allow the copper surface to react with the solution. During this process, if the solder mask plug hole is not full, the solution will be hidden in the hole, making it difficult to clean it during subsequent board washing, resulting in color difference at the plug hole position. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a device for improving the color difference of the hole opening of the tin-immersion board in the solder mask semi-plug hole process, which can effectively prevent the contamination of the hole opening by the solder mask solution and improve the production quality of the PCB board.

[0004] According to an embodiment of the present invention, a device for improving the color difference of the hole of the tin-immersion board in the solder mask semi-plugging process comprises: a DI water immersion tank, a cold air drying device and a hot air drying device arranged in sequence along the conveying direction of the PCB board;

[0005] A timer is provided in the DI water immersion tank, and the timer is electrically connected to the transfer device of the PCB board;

[0006] The cold air drying device includes a first conveyor belt and a cold air output fan mounted on the first conveyor belt. The cold air output fan delivers cold air toward the PCBs on the first conveyor belt and blows away residual liquid on the PCBs.

[0007] The hot air drying device includes a second conveyor belt and a hot air output fan mounted on the second conveyor belt, and the hot air output fan is used to output hot air to dry the PCB board.

[0008] According to an embodiment of the utility model, a device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plugging process is provided. A residual liquid collection mechanism is provided between the first conveyor belt and the second conveyor belt. The residual liquid collection mechanism includes a liquid collecting trough and a liquid collecting box provided at one end of the first conveyor belt close to the second conveyor belt. The liquid collecting trough and the liquid collecting box are connected by a pipeline.

[0009] According to an embodiment of the present invention, a device for improving the color difference of the hole of the tin-immersion board in the solder mask semi-plug hole process is provided. A plurality of cold air output fans are arranged along the conveying direction of the PCB, and the plurality of cold air output fans are arranged at intervals.

[0010] According to an embodiment of the utility model, a device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plug hole process is provided. The hot air drying device also includes a heat insulation box, the heat insulation box is provided with a channel for the second conveyor belt to pass through, and the hot air output fan is arranged in the heat insulation box.

[0011] According to an embodiment of the utility model, a device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plug hole process is provided. The hot air drying device also includes a hot air circulation mechanism. The hot air circulation mechanism has a circulation fan arranged on the heat insulation box. The circulation fan is connected to the hot air output fan through a pipeline.

[0012] According to an embodiment of the utility model, a device for improving the color difference of the hole of the tin-immersion plate in the solder mask semi-plug hole process is provided. A heating net is provided between the circulating fan and the hot air output fan. The heating net is used to dry the hot air with water vapor drawn out from the heat insulation box by the circulating fan.

[0013] According to an embodiment of the utility model, a device for improving the color difference of the hole opening of the tin-immersion board in the solder mask semi-plug hole process is provided. A temperature monitor is provided in the heat insulation box. When the temperature monitor detects that the temperature in the heat insulation box is too high, it sends a command to the hot air output blower to stop outputting hot air to prevent the PCB board from being damaged due to excessive temperature.

[0014] According to an embodiment of the present invention, a device for improving the color difference of the hole opening of a solder mask semi-plugged via process for tinning a PCB has at least the following beneficial effects: After the tinning process is completed, a worker places the PCB into a DI water immersion tank for a predetermined period of time to dissolve the residual tin solution on the PCB. The DI water immersion tank is provided with a timer to remind the worker whether the immersion time has reached a preset value. Specifically, the preset immersion time value for the PCB in this application is 30 seconds. After immersion for 30 seconds, the worker transfers the PCB in the DI water immersion tank to a first conveyor belt using a transfer device. Multiple cold air output fans are arranged in sequence along the conveying direction of the PCB to blow cold air toward the PCB, removing any residual liquid from the PCB surface. Some of the liquid is blown into a liquid collection tank, where it flows through a pipe to a liquid collection box for collection and recovery. After the PCB passes through a cold water drying device to clean the liquid from the board surface, it enters a hot air drying device for drying. The overall structure is simple and practical, which can effectively clean the residual liquid after the PCB is cleaned, avoid the liquid from contaminating the openings of the solder mask plug holes of the PCB, and ensure the quality of the PCB.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic structural diagram of a device for improving the color difference of the hole opening of a tin-immersion plate in a solder mask semi-plug hole process according to an embodiment of the utility model.

[0018] Description of reference numerals:

[0019] DI water soaking tank 100;

[0020] First conveyor belt 200;

[0021] Cold air output fan 300;

[0022] Second conveyor belt 400;

[0023] Hot air output fan 500;

[0024] Liquid collecting tank 600;

[0025] Liquid collection tank 700;

[0026] Thermal insulation box 800; circulating fan 810; heating network 820. DETAILED DESCRIPTION

[0027] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0028] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0029] In utility model descriptions, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0031] Reference Figure 1The embodiment of the present invention provides a device for improving the color difference of the hole opening of the tin-immersion board in the solder mask semi-plug hole process, comprising a DI water immersion tank 100, a cold air drying device and a hot air drying device arranged in sequence along the conveying direction of the PCB board; a timer is provided in the DI water immersion tank 100, and the timer is electrically connected to the transfer device of the PCB board; the cold air drying device comprises a first conveyor belt 200 and a cold air output fan 300 mounted on the first conveyor belt 200, the cold air output fan 300 delivers cold air toward the PCB board on the first conveyor belt 200 and blows away the residual liquid on the PCB; the hot air drying device comprises a second conveyor belt 400 and a hot air output fan 500 mounted on the second conveyor belt 400, the hot air output fan 500 is used to output hot air to dry the PCB board.

[0032] According to some embodiments of the present application, a plurality of cold air output fans 300 are provided along the conveying direction of the PCB, and the plurality of cold air output fans 300 are arranged at intervals.

[0033] According to some embodiments of the present application, the hot air drying device further includes a heat insulation box 800 , the heat insulation box 800 is provided with a channel for the second conveyor belt 400 to pass through, and the hot air output fan 500 is arranged in the heat insulation box 800 .

[0034] According to some embodiments of the present application, the hot air drying device further includes a hot air circulation mechanism, which includes a circulation fan 810 disposed on the heat insulation box 800, and the circulation fan 810 is connected to the hot air output fan 500 through a pipeline.

[0035] According to some embodiments of the present application, a heating net 820 is provided between the circulation fan 810 and the hot air output fan 500. The heating net 820 is used to dry the hot air containing water vapor drawn from the heat insulation box 800 by the circulation fan 810.

[0036] According to some embodiments of the present application, a temperature monitor is provided in the heat insulation box 800. When the temperature monitor detects that the temperature in the heat insulation box 800 is too high, it sends an instruction to the hot air output blower 500 to stop outputting hot air to prevent the PCB board from being damaged due to excessive temperature.

[0037] After the PCBs have completed the tinning process, workers place them in a DI water immersion tank 100 for a predetermined period of time to dissolve the residual tin solution. The DI water immersion tank 100 is equipped with a timer to remind workers whether the immersion time has reached a preset value. Specifically, the preset immersion time for the PCBs in this application is 30 seconds. After 30 seconds of immersion, workers use a transfer device to transfer the PCBs from the DI water immersion tank 100 to a first conveyor belt 200. Multiple cold air output fans 300 are positioned sequentially along the conveying direction of the PCBs, blowing cold air toward the PCBs, removing any remaining liquid from the PCB surface. Some of the liquid is blown into a liquid collection tank 600, where it flows through pipes to a liquid collection box 700 for collection and recovery. After the PCBs have been cleaned of liquid by the cold water drying device, they enter a hot air drying device for drying. The overall structure is simple and practical, which can effectively clean the residual liquid after the PCB is cleaned, avoid the liquid from contaminating the openings of the solder mask plug holes of the PCB, and ensure the quality of the PCB.

[0038] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative use of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0039] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plug hole process, characterized in that: It includes a DI water immersion tank, a cold air drying device and a hot air drying device arranged in sequence along the conveying direction of the PCB board; A timer is provided in the DI water immersion tank, and the timer is electrically connected to the transfer device of the PCB board; The cold air drying device includes a first conveyor belt and a cold air output fan mounted on the first conveyor belt, wherein the cold air output fan delivers cold air toward the PCBs on the first conveyor belt and blows away residual liquid on the PCBs; The hot air drying device includes a second conveyor belt and a hot air output fan mounted on the second conveyor belt, and the hot air output fan is used to output hot air to dry the PCB board.

2. The device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plugging process according to claim 1 is characterized in that: A residual liquid collecting mechanism is provided between the first conveyor belt and the second conveyor belt. The residual liquid collecting mechanism includes a liquid collecting trough and a liquid collecting box provided at one end of the first conveyor belt close to the second conveyor belt. The liquid collecting trough and the liquid collecting box are connected by a pipeline.

3. The device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plugging process according to claim 1 is characterized in that: A plurality of the cold air output fans are arranged along the conveying direction of the PCB, and the plurality of the cold air output fans are arranged at intervals.

4. The device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plugging process according to claim 1 is characterized in that: The hot air drying device further includes a heat insulation box, the heat insulation box is provided with a passage for the second conveyor belt to pass through, and the hot air output blower is arranged in the heat insulation box.

5. The device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plugging process according to claim 4 is characterized in that: The hot air drying device further comprises a hot air circulation mechanism, wherein the hot air circulation mechanism comprises a circulation fan arranged on the heat insulation box, and the circulation fan is connected to the hot air output fan via a pipeline.

6. The device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plugging process according to claim 5 is characterized in that: A heating net is provided between the circulation fan and the hot air output fan, and the heating net is used to dry the hot air with water vapor drawn from the heat insulation box by the circulation fan.

7. The device for improving the color difference of the hole opening of the tin-immersion plate in the solder mask semi-plugging process according to claim 6 is characterized in that: A temperature monitor is provided in the thermal insulation box.

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