LED packaging support and LED packaging structure

Abstract

The utility model provides an LED packaging support and an LED packaging structure, and the LED packaging support comprises a heat conduction part which is used for carrying out the heat dissipation of a light-emitting chip; the first conductive piece and the second conductive piece are used for being connected with the positive electrode and the negative electrode of the light-emitting chip respectively; and the first electric conduction piece and the second electric conduction piece are arranged at intervals with the heat conduction piece. According to the arrangement, through a thermoelectric separation mode, the area of a heat dissipation area can be increased, the heat dissipation effect is further improved, the chip is prevented from being broken down and damaged by high voltage, and high integration of the light-emitting chip is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of LED products, and in particular to an LED packaging bracket and an LED packaging structure. Background Art

[0002] Conventional LED products on the market share a common path for both electrical and thermal conductivity, transferring heat to the LED chip via the positive and negative solder pads. However, with the increasing integration of medium- and high-power LED chips, the heat dissipation efficiency of the LEDs has deteriorated. This, in turn, leads to increased LED junction temperature, poor thermal stability, and reduced luminous efficacy and color shift. Furthermore, due to the high power and voltage, high-voltage creepage can damage the LED chip, leading to sparks and compromising the product's withstand voltage performance. Utility Model Content

[0003] In view of this, the present application provides an LED packaging bracket and an LED packaging structure, which have good heat dissipation effect and can prevent high voltage breakdown from damaging the chip.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] An LED packaging bracket, comprising:

[0006] A heat conducting member, used for dissipating heat from the light-emitting chip;

[0007] A first conductive member and a second conductive member are used to connect the positive and negative electrodes of the light-emitting chip respectively;

[0008] Wherein, the first conductive member and the second conductive member are both spaced apart from the heat conductive member.

[0009] Optionally, the heights of the first conductive member and the second conductive member are both greater than the height of the heat conductive member.

[0010] Optionally, the difference between the height of the first conductive member and the second conductive member and the height of the thermal conductive member is 0.2-0.3 mm.

[0011] Optionally, a die-bonding region for accommodating the light-emitting chip is formed above the heat-conducting member, and the first conductive member and the second conductive member are arranged at edges of the die-bonding region.

[0012] Optionally, the interval between the first conductive member and the heat conductive member is set to 0.25-0.45 mm, and the interval between the second conductive member and the heat conductive member is set to 0.25-0.45 mm.

[0013] Optionally, the first conductive member and the second conductive member both extend along the edge of the heat conductive member, and the first conductive member and the second conductive member are arranged around the outer circumference of the heat conductive member.

[0014] Optionally, the first conductive member and the second conductive member are configured as two slot-shaped pads with openings facing each other, and are respectively located on opposite sides of the heat conducting member.

[0015] Optionally, a plurality of light-emitting chips are provided and evenly distributed in a matrix above the heat-conducting member, and each row of light-emitting chips is connected in series between the first conductive member and the second conductive member.

[0016] Optionally, a first avoidance groove and a second avoidance groove are provided on an edge of the heat conducting member, the first conductive member is provided in the first avoidance groove, and the second conductive member is provided in the second avoidance groove.

[0017] Optionally, the first conductive members and the second conductive members are arranged one-to-one in at least two groups, all the first conductive members are adjacently arranged on a first side of the heat conductive member, and all the second conductive members are adjacently arranged on a second side of the heat conductive member.

[0018] Optionally, a plurality of the light-emitting chips are provided and evenly distributed above the heat-conducting member, and a plurality of the light-emitting chips are connected in series between each group of the first conductive member and the second conductive member relative to each other.

[0019] An LED packaging structure comprises the LED packaging bracket as described in any one of the above items.

[0020] The LED packaging bracket and LED packaging structure provided in this application can increase the area of the heat dissipation region through the form of thermal and electrical separation, thereby improving the heat dissipation effect and preventing high voltage breakdown from damaging the chip, which is conducive to achieving high integration of the light-emitting chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0022] Figure 1 This is a schematic structural diagram of an LED packaging structure shown in the first embodiment;

[0023] Figure 2 A schematic diagram showing the positions of the heat-conducting member and the electrical conductor in the first embodiment;

[0024] Figure 3 A cross-sectional view of an LED packaging structure shown in a first embodiment;

[0025] Figure 4This is a cross-sectional view of the LED packaging structure shown in the first embodiment after being packaged using a double-layer dispensing method;

[0026] Figure 5 This is a schematic structural diagram of an LED packaging structure shown in a second embodiment;

[0027] Figure 6 This is a schematic diagram showing the positions of the heat-conducting member and the electrical conductor in the second embodiment.

[0028] In the figure: 1. Plastic body; 2. Heat-conducting part; 3. First conductive part; 4. Second conductive part; 5. Light-emitting chip; 6. Red fluorescent glue; 7. Green fluorescent glue; 8. Die-bonding area. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0030] like Figures 1-6 As shown, an embodiment of the present application provides an LED package bracket, including a plastic body 1, a heat conductor 2, a first conductive member 3 and a second conductive member 4. The heat conductor 2, the first conductive member 3 and the second conductive member 4 are all arranged on the plastic body 1, and the plastic body 1 can support and bear the heat conductor 2 and the first conductive member 3 and the second conductive member 4. During processing, the first conductive member 3, the second conductive member 4 and the heat conductor 2 are all set to a metal copper material. The positions of the heat conductor 2, the first conductive member 3 and the second conductive member 4 can be fixed first, and then the plastic body 1 can be formed by injection molding of plastic material to form an integrated structure. Of course, the plastic body 1 can also be injection molded first, and then the heat conductor 2, the first conductive member 3 and the second conductive member 4 can be glued and installed.

[0031] Specifically, a die-bonding region 8 is formed above the thermal conductive member 2. This region is used to accommodate the light-emitting chip 5, allowing the heat generated by the light-emitting chip 5 to be dissipated through the thermal conductive member 2 below. For example, a cavity is provided above the plastic body 1, with the die-bonding region 8 located within the cavity and the thermal conductive member 2 located at the bottom of the cavity. This placement of the light-emitting chip 5 above the thermal conductive member 2 facilitates improved heat dissipation from the light-emitting chip 5.

[0032] The first conductive member 3 and the second conductive member 4 are spaced apart and constitute the positive electrode and the negative electrode, respectively. The first conductive member 3 and the second conductive member 4 are respectively connected to the two ends of the light-emitting chip 5 so that the light-emitting chip 5 is electrically conductive and emits light. The thermal conductive member 2 is located between the first conductive member 3 and the second conductive member 4. For example, the first conductive member 3 and the second conductive member 4 are respectively located on both sides of the thermal conductive member 2, or a plurality of the first conductive member 3 and the second conductive member 4 are each provided and arranged along the circumference of the thermal conductive member 2. Of course, this solution is not limited to the thermal conductive member 2 being located between the first conductive member 3 and the second conductive member 4. The first conductive member 3 and the second conductive member 4 can also be located on the same side of the thermal conductive member 2.

[0033] Moreover, the first conductive member 3 and the second conductive member 4 are spaced apart from the heat conductive member 2, which increases the area of the solid crystal region 8 and the heat dissipation region through thermoelectric separation, thereby improving the heat dissipation effect and preventing high voltage breakdown from damaging the light emitting chip 5, which is conducive to achieving high integration of the light emitting chip 5.

[0034] In the specific embodiment, the spacing between the thermal conductor 2 and the first conductive member 3 is set to 0.25-0.45 mm, and the spacing between the thermal conductor 2 and the second conductive member 4 is set to 0.25-0.45 mm. When the spacing between the thermal conductor 2 and the first conductive member 3 / the second conductive member 4 is less than 0.25 mm, the creepage distance is too short, and high-voltage arc discharge is likely to damage the light-emitting chip 5. When the spacing between the thermal conductor 2 and the first conductive member 3 / the second conductive member 4 is greater than 0.45 mm, firstly, the area of the die-bonding region 8 is narrowed, the number of light-emitting chips 5 is reduced, and it is not conducive to achieving high integration. Secondly, because the thermal conductor 2 and the first conductive member 3 / the second conductive member 4 are made of plastic material, a spacing greater than 0.45 mm can easily cause the plastic body 1 to break. Thirdly, a spacing greater than 0.45 mm between the thermal conductor 2 and the first conductive member 3 / the second conductive member 4 can cause the wire arc to be too long, resulting in an unstable arc trajectory. Therefore, by reasonably designing the distance between the heat conductor 2 and the first conductive member 3 and the second conductive member 4, high-voltage arc discharge can be avoided from damaging the light-emitting chip 5, and the structural strength and stability can be improved, which is conducive to achieving high integration of the light-emitting chip 5.

[0035] In some embodiments, the height of the first conductive member 3 and the second conductive member 4 is greater than the height of the thermal conductive member 2, so that the upper surfaces of the first conductive member 3 and the second conductive member 4 protrude upward from the upper surface of the thermal conductive member 2. The above-mentioned solid crystal region 8 is located between the first conductive member 3 and the second conductive member 4, that is, the first conductive member 3 and the second conductive member 4 constitute the boundary position of the solid crystal region 8. For example, the first conductive member 3 and the second conductive member 4 are respectively located on both sides of the solid crystal region 8, or the first conductive member 3 and the second conductive member 4 are each provided with multiple and arranged around the periphery of the solid crystal region 8. In this way, when the light-emitting chip 5 is fixed by the solid crystal glue in the solid crystal region 8, the solid crystal glue can be prevented from being thrown onto the upper surface of the first conductive member 3 / the second conductive member 4, thereby ensuring the stability and reliability of the secondary welding of the light-emitting chip 5 and the first conductive member 3 / the second conductive member 4. Moreover, due to the height difference formed by the thermal conductor 2 and the first conductive member 3 / the second conductive member 4, it is convenient to use a double-layer glue dispensing method to perform LED packaging operations, thereby improving the excitation efficiency of the phosphor and the luminous brightness of the product. For example, a layer of red fluorescent glue 6 is applied to the solid crystal area 8 close to the thermal conductor 2. This layer of red fluorescent glue is flush with the light-emitting chip 5, and then a layer of green fluorescent glue 7 is applied to the side of the red fluorescent glue 6 away from the thermal conductor 2, thereby improving the excitation efficiency of the phosphor.

[0036] In a specific embodiment, the height difference between the first conductive member 3 and the second conductive member 4 and the thermal conductive member 2 is set to 0.2-0.3 mm, for example, 0.25 mm. Since the light-emitting chip 5 is generally 0.2-0.3 mm in height, the height difference can be designed based on the desired height of the packaged light-emitting chip 5. If the height difference is too small, the die-bonding adhesive may easily adhere to the upper surfaces of the first conductive member 3 and the second conductive member 4. If the height difference is too large, the structural stability of the plastic body 1 may be affected.

[0037] like Figure 1-4 As shown, in the first embodiment, the first conductive member 3 and the second conductive member 4 both extend along the edge of the thermal conductive member 2, with the two ends of the first conductive member 3 and the second conductive member 4 close to each other, so that the first conductive member 3 and the second conductive member 4 form a ring, and the first conductive member 3 and the second conductive member 4 together surround the entire circumference of the thermal conductive member 2. For example, the first conductive member 3 and the second conductive member 4 have the same extension length, and the first conductive member 3 and the second conductive member 4 each surround the thermal conductive member 2 half a circumference. For another example, the length of the first conductive member 3 is greater than the length of the second conductive member 4, and the first conductive member 3 surrounds the thermal conductive member 2 two-thirds of the circumference, while the second conductive member 4 surrounds the thermal conductive member 2 one-third of the circumference. In addition, two first conductive members 3 and two second conductive members 4 are provided, and each first conductive member 3 surrounds the thermal conductive member 2 half a circumference, and each second conductive member 4 surrounds the thermal conductive member 2 half a circumference.

[0038] It should be noted that there is a gap between the end of the first conductive member 3 and the end of the second conductive member 4 to avoid a short circuit between the positive and negative electrodes.

[0039] In a preferred solution, both the first conductive member 3 and the second conductive member 4 are arranged as groove-shaped pads. The groove-shaped pad has a through groove for partial embedding of the heat conducting member 2. Specifically, the width of the groove-shaped pad in the extending direction remains consistent, that is, the shape of the groove-shaped pad can be set as U-shaped, V-shaped, n-shaped,匚-shaped, semi-circular arc-shaped, C-shaped, etc. Among them, when the heat conducting member 2 is arranged as a square, the first conductive member 3 and the second conductive member 4 can be distributed relative to the midline of the heat conducting member 2, or relative to the diagonal of the heat conducting member 2, that is, the shapes of the first conductive member 3 and the second conductive member 4 can be U-shaped, V-shaped, n-shaped, and匚-shaped, etc.; when the heat conducting member 2 is arranged as a circle, the shapes of the first conductive member 3 and the second conductive member 4 can be semi-circular arc-shaped, C-shaped, etc.

[0040] Moreover, the openings of the first conductive member 3 and the second conductive member 4 face each other and are respectively located on both sides of the heat conducting member 2, and then the first conductive member 3 and the second conductive member 4 surround the outer periphery of the heat conducting member 2. In this way, it is beneficial to simplify the structure and the processing technology. At the same time, the electrical connection positions are widely distributed, which is convenient for realizing the electrical connection of the light-emitting chip 5 and the connection of the external positive and negative circuits.

[0041] In a specific solution, the heat conducting member 2 is arranged as a square, and the first conductive member 3 and the second conductive member 4 can be distributed on both sides relative to the midline of the heat conducting member 2. A plurality of light-emitting chips 5 are provided and are evenly distributed in a matrix in the die bonding area 8 (that is, above the heat conducting member 2), that is, the plurality of light-emitting chips 5 have multiple rows and multiple columns. Among them, the arrangement directions of the plurality of light-emitting chips 5 in the same row are the same as the arrangement directions of the first conductive member 3 and the second conductive member 4. The light-emitting chips 5 in each row are connected in series, and the two ends are respectively electrically connected to the first conductive member 3 and the second conductive member 4, and then the electrical connection of the light-emitting chips 5 in each row and each column is realized. In this way, it is beneficial to realize the high integration of the light-emitting chips 5, and then improve the light-emitting brightness of the product.

[0042] Of course, in other solutions, all the light-emitting chips 5 in the die bonding area 8 can also be connected in series to meet the corresponding design requirements.

[0043] As Figure 5-6 shown, in the second embodiment, a first avoidance groove and a second avoidance groove are provided on the outer periphery of the heat conducting member 2. The first conductive member 3 is arranged in the first avoidance groove, and the second conductive member 4 is arranged in the second avoidance groove. In this way, by making the first conductive member 3 and the second conductive member 4 embedded relative to the heat conducting member 2, thermoelectric separation is realized, and the structure is compact.

[0044] In a preferred embodiment, a first conductive member 3 and a second conductive member 4 form a group, and at least two first conductive members 3 and a second conductive member 4 are provided and the number is the same, that is, at least two groups of first conductive members 3 and second conductive members 4 are provided relative to each other. For example, there are two or three first conductive members 3 and second conductive members 4. Among them, all the first conductive members 3 are arranged adjacent to each other and arranged in sequence along the edge of the thermal conductor 2, and all the second conductive members 4 are arranged adjacent to each other and arranged in sequence along the edge of the thermal conductor 2. All the first conductive members 3 and the second conductive members 4 are respectively located on the first side and the second side of the thermal conductor 2, so that one of the first conductive members 3 is opposite to one of the second conductive members 4. In this way, the first conductive members 3 and the second conductive members 4 of different electrodes are respectively located on both sides of the thermal conductor 2, so as to facilitate the electrical connection of the light-emitting chip 5 and the electrical connection of the external circuit.

[0045] The heat conducting member 2 is circular, and the number of first and second avoidance grooves can be at least two, evenly distributed along the circumference of the heat conducting member 2, and the corresponding central angles between adjacent ones are equal. Each first conductive member 3 is disposed one-to-one within a first avoidance groove, and each second conductive member 4 is disposed one-to-one within a second avoidance groove.

[0046] Here, the specific shape of the heat-conducting member 2 is not limited, and the heat-conducting member 2 can be set to a square or a circle. When the heat-conducting member 2 is set to a circle, all the first conductive members 3 are arranged in a semicircular arc and surround half of the heat-conducting member 2, and all the second conductive members 4 are arranged in a semicircular arc and surround the other half of the heat-conducting member 2. Here, the number of the first conductive members 3 and the second conductive members 4 can be set to two, three or four. For example, there are two first conductive members 3 and two second conductive members 4, and the two first conductive members 3 and the two second conductive members 4 are distributed in a quadrilateral. Moreover, the specific shape of the first conductive member 3 and the second conductive member 4 is preferably and not limited to being set to a square, as long as it can be partially embedded in the avoidance groove. For example, it can also be set to a circle, a quadrilateral, a pentagon, etc.

[0047] In this specific embodiment, multiple light-emitting chips 5 are provided and evenly distributed in the die-bonding area 8. A first conductive member 3 and a second conductive member 4 located on opposite sides of the thermal conductor 2 form a group. Multiple light-emitting chips 5 are disposed between each group of first and second conductive members 3 and 4. These light-emitting chips 5 are connected in series, with their ends electrically connected to the first and second conductive members 3 and 4 of the group, thereby achieving electrical connectivity for all light-emitting chips 5. This facilitates a high degree of integration of the light-emitting chips 5, thereby improving the product's luminance.

[0048] The present embodiment provides an LED package structure including the LED package bracket of the above embodiment. This configuration increases the area of the die-bonding region 8 and the heat dissipation region through thermal and electrical separation, thereby improving the heat dissipation effect and preventing high voltage breakdown from damaging the light-emitting chip 5, thereby facilitating a high degree of integration of the light-emitting chip 5.

[0049] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0050] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0051] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0052] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0053] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly illustrate the technical solutions and cannot be used to limit the scope of protection of the present application.

[0054] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. An LED package bracket, characterized in that: include: A heat conducting member, used for dissipating heat from the light-emitting chip; A first conductive member and a second conductive member are used to connect the positive and negative electrodes of the light-emitting chip respectively; Wherein, the first conductive member and the second conductive member are both spaced apart from the heat conductive member.

2. The LED package bracket according to claim 1, characterized in that: The heights of the first conductive member and the second conductive member are both greater than the height of the heat conductive member.

3. The LED package bracket according to claim 2, characterized in that: The difference between the height of the first conductive member and the second conductive member and the height of the heat conductive member is 0.2-0.3 mm.

4. The LED package bracket according to claim 2, characterized in that: A die-bonding region for accommodating the light-emitting chip is formed above the heat-conducting member, and the first conductive member and the second conductive member are arranged at edges of the die-bonding region.

5. The LED package bracket according to claim 1, characterized in that: The interval between the first conductive member and the heat conductive member is set to 0.25-0.45 mm, and the interval between the second conductive member and the heat conductive member is set to 0.25-0.45 mm.

6. The LED package bracket according to claim 1, characterized in that: The first conductive member and the second conductive member both extend along the edge of the heat conductive member, and the first conductive member and the second conductive member are disposed around the outer periphery of the heat conductive member.

7. The LED package bracket according to claim 6, characterized in that: The first conductive member and the second conductive member are configured as two slot-shaped pads with openings facing each other and are respectively located on opposite sides of the heat conducting member.

8. The LED package bracket according to claim 7, characterized in that: A plurality of light-emitting chips are provided and evenly distributed in a matrix above the heat-conducting member, and each row of light-emitting chips is connected in series between the first conductive member and the second conductive member.

9. The LED package bracket according to claim 1, characterized in that: A first avoidance groove and a second avoidance groove are provided on an edge of the heat conducting member. The first conductive member is provided in the first avoidance groove, and the second conductive member is provided in the second avoidance groove.

10. The LED package bracket according to claim 1, characterized in that: The first conductive members and the second conductive members are arranged in at least two groups one to one, all the first conductive members are adjacently arranged on a first side of the heat conductive member, and all the second conductive members are adjacently arranged on a second side of the heat conductive member.

11. The LED package bracket according to claim 10, characterized in that: A plurality of light-emitting chips are provided and evenly distributed above the heat-conducting member, and a plurality of light-emitting chips are connected in series between each group of the first conductive member and the second conductive member relative to each other.

12. An LED packaging structure, characterized in that: The LED package bracket comprises the LED package bracket according to any one of claims 1 to 11.

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