Integrated circuit wafer coating device

Abstract

The utility model discloses an integrated circuit wafer coating device, and belongs to the technical field of integrated circuit wafer production. The integrated circuit wafer coating device has the advantages that the uniformity of a coating is improved, the production efficiency is improved, and the storage box can be driven to move within the stroke range of the threaded lead screw by controlling the reciprocating motor; the storage box can be driven to move downwards by controlling the linear lead screw module so as to coat a circuit wafer placed on the placement plate, and the placement plate is driven to perform left-right micro-rotation adjustment by controlling the electric push rod, so that photoresist can be more uniformly distributed on the surface of the wafer, and the problem of inconsistent coating thickness of an existing device is solved; the coating uniformity is ensured through micro-adjustment, so that the precision and stability of the subsequent process are improved, compared with a traditional gluing mode, the device can automatically complete gluing operation of large-batch wafers, the gluing time of a single wafer is shortened, the high-yield requirement is met, and the production efficiency is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit wafer production, and particularly relates to an integrated circuit wafer coating device. Background Art

[0002] Integrated circuit wafers are a basic material used to manufacture semiconductor devices. They are usually in the form of thin sheets and are mainly made of high-purity single-crystal silicon. They are the core material for the production of microelectronic devices. Through a series of micro-machining technologies, complex circuit structures can be constructed on the wafer. The surface of the wafer is precisely processed to have extremely high flatness and cleanliness to ensure accuracy and reliability during the manufacturing process. The wafer production process is complex and involves multiple steps such as doping, etching, deposition, etc., which ultimately form a large number of electronic components, which together form the basis of integrated circuits.

[0003] Existing integrated circuit wafer coating systems often suffer from low efficiency and uneven coating coverage during the coating process. First, due to the lack of precise adjustment mechanisms in traditional systems, the photoresist is unevenly distributed on the wafer surface, which easily leads to inconsistent coating thickness and affects the accuracy and stability of subsequent processes. Second, existing systems are relatively slow in coating efficiency, especially in high-volume production scenarios, and are unable to quickly complete the coating operation for large batches of wafers. Therefore, an integrated circuit wafer coating system is proposed to address these issues. Utility Model Content

[0004] In response to one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides an integrated circuit wafer coating device, which has the advantages of improving coating uniformity and increasing production efficiency.

[0005] To achieve the above-mentioned purpose, the utility model provides an integrated circuit wafer coating device, comprising a workbench;

[0006] The upper end surface of the workbench is equipped with two first support plates, and the two first support plates are arranged in parallel, and one side of the upper end of the two first support plates is equipped with a group of transmission components;

[0007] The transmission assembly includes a reciprocating motor, an output end of the reciprocating motor is connected to a threaded screw, the threaded screw is externally meshed and slidably provided with a sliding sleeve, the upper end of the sliding sleeve is equipped with a mounting plate, the upper end surface of the mounting plate is equipped with a group of linear screw modules, and the linear screw modules are vertically arranged, a storage box is equipped on one side of the linear screw module, and a discharge pipe is provided at the lower end of the storage box;

[0008] One of the first support plates is equipped with an electric push rod on one side, and a rack is equipped at one end of the electric push rod. A second support plate is equipped on the upper end surface of the workbench, and the second support plate is located between the two first support plates. A rotating rod is provided between one of the first support plates and the second support plate, and a gear is equipped on the outside of one end of the rotating rod, and the gear is meshed with the rack, and a placement plate is equipped on the outside of the rotating rod.

[0009] As a further improvement of the present invention, the outside of the rotating rod is also equipped with a third limit block and the third limit block is located at the lower end of the placement plate, one side of the first support plate is equipped with a first limit block and a second limit block and the first limit block is located at the upper end of the second limit block, and the first limit block and the second limit block are both located on one side of the third limit block.

[0010] As a further improvement of the present invention, the upper end surface of the workbench is equipped with a collection box and the collection box is located between one of the first support plates and the second support plate, and the lower end of the workbench is equipped with four universal wheels and the four universal wheels are distributed in a rectangular shape.

[0011] As a further improvement of the present invention, two guide rails are commonly assembled on one side of the upper ends of the two first support plates, and two engaging blocks are slidably engaged on the upper ends of the two guide rails, and the upper end surfaces of the four engaging blocks are connected to the mounting plate.

[0012] As a further improvement of the present invention, one side of the first support plates is rotatably connected to a roller via a rotating shaft, and the roller abuts against the lower end surface of the rack.

[0013] As a further improvement of the present invention, two installation grooves are provided on the upper end surface of the placement plate, and a plurality of through holes are provided around the two installation grooves.

[0014] In general, the above technical solutions conceived by the present invention have the following beneficial effects compared with the prior art:

[0015] The integrated circuit wafer coating device of the present invention cooperates with each other through the mutual cooperation between the components in the transmission assembly, and can drive the storage box to move within the stroke range of the threaded screw by controlling the reciprocating motor, and can drive the storage box downward by controlling the linear screw module to coat the circuit wafer placed on the placement plate. The placement plate is driven by controlling the electric push rod to perform micro-rotation adjustment left and right, so that the photoresist can be more evenly distributed on the wafer surface, solving the problem of inconsistent coating thickness of the existing device. Micro-adjustment ensures the uniformity of the coating, thereby improving the accuracy and stability of the subsequent process. Compared with the traditional coating method, the device can automatically complete the coating operation of large quantities of wafers, shortens the coating time of single wafers, thereby meeting high-output requirements and greatly improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall installation structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the overall installation structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the overall installation structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the placement plate structure of the utility model.

[0020] In all the drawings, the same figure marks represent the same technical features, specifically: 1. workbench; 11. first support plate; 111. first limit block; 112. second limit block; 12. second support plate; 13. collection box; 14. universal wheel; 2. transmission assembly; 20. reciprocating motor; 21. threaded screw; 22. sliding sleeve; 23. mounting plate; 24. linear screw module; 25. guide rail; 26. interlocking block; 3. storage box; 31. discharge pipe; 4. electric push rod; 41. rack; 42. roller; 5. rotating rod; 51. gear; 52. placement plate; 53. third limit block. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example

[0023] Depend on Figure 1-4 Provided is an integrated circuit wafer coating device, comprising a workbench 1;

[0024] The upper end surface of the workbench 1 is equipped with two first support plates 11 and the two first support plates 11 are arranged in parallel. A set of transmission components 2 is assembled on one side of the upper end of the two first support plates 11;

[0025] The transmission assembly 2 includes a reciprocating motor 20, the output end of the reciprocating motor 20 is connected to a threaded screw 21, the threaded screw 21 is externally meshed and slidably provided with a sliding sleeve 22, the upper end of the sliding sleeve 22 is equipped with a mounting plate 23, the upper end surface of the mounting plate 23 is equipped with a group of linear screw modules 24, and the linear screw modules 24 are vertically arranged. A storage box 3 is installed on one side of the linear screw module 24, and a discharge pipe 31 is provided at the lower end of the storage box 3;

[0026] An electric push rod 4 is installed on one side of one of the first support plates 11, and a rack 41 is installed at one end of the electric push rod 4. A second support plate 12 is installed on the upper end surface of the workbench 1, and the second support plate 12 is located between the two first support plates 11. A rotating rod 5 is provided between one of the first support plates 11 and the second support plate 12. A gear 51 is installed on the outside of one end of the rotating rod 5, and the gear 51 is meshed with the rack 41. A placement plate 52 is installed on the outside of the rotating rod 5.

[0027] In this embodiment, by cooperating with each other among the components within the transmission assembly 2, the reciprocating motor 20 can be controlled to drive the storage box 3 to move within the stroke range of the threaded screw 21, and the linear screw module 24 can be controlled to drive the storage box 3 downward to coat the circuit wafer placed on the placement plate 52. By controlling the electric push rod 4 to drive the placement plate 52 to perform micro-rotation adjustment left and right, the photoresist can be more evenly distributed on the wafer surface, solving the problem of inconsistent coating thickness of the existing device. Micro-adjustment ensures the uniformity of the coating, thereby improving the accuracy and stability of subsequent processes. Compared with traditional gluing methods, the device can automatically complete the gluing operation of large quantities of wafers, shorten the gluing time of single wafers, thereby meeting high-output requirements and greatly improving production efficiency.

[0028] Specifically, refer to Figure 1-3 The outside of the rotating rod 5 is also equipped with a third limit block 53, and the third limit block 53 is located at the lower end of the placement plate 52. One side of one of the first support plates 11 is equipped with a first limit block 111 and a second limit block 112, and the first limit block 111 is located at the upper end of the second limit block 112. The first limit block 111 and the second limit block 112 are both located on one side of the third limit block 53.

[0029] In this embodiment, when the placement plate 52 rotates, the first limit block 111 set can limit the rotation angle of the placement plate 52, and the electric push rod 4 is controlled to drive the rack 41 to retract inward, thereby driving the placement plate 52 to rotate and tilt to the other side. When the placement plate 52 tilts to the other side, the third limit block 53 set cooperates with the second limit block 112 to limit the rotation angle of the other side of the placement plate 52.

[0030] Specifically, refer to Figure 1-4 The upper end surface of the workbench 1 is equipped with a collection box 13, and the collection box 13 is located between one of the first support plates 11 and the second support plate 12. The lower end of the workbench 1 is equipped with four universal wheels 14, and the four universal wheels 14 are distributed in a rectangular shape. Two mounting grooves are provided on the upper end surface of the placement plate 52, and a number of through holes are provided around the outside of the two mounting grooves.

[0031] In this embodiment, by setting a through hole outside the mounting groove on the placement plate 52, excess photoresist during the coating process can flow out from the through hole. By installing a collection box 13 on the workbench 1, the excess photoresist can be collected. By installing four universal wheels 14 at the lower end of the workbench 1, the overall flexibility of the device can be improved.

[0032] Specifically, refer to Figure 1-2 Two guide rails 25 are commonly assembled on one side of the upper ends of the two first support plates 11. Two engaging blocks 26 are slidably engaged with the upper ends of the two guide rails 25. The upper end surfaces of the four engaging blocks 26 are all connected to the mounting plate 23.

[0033] In this embodiment, the two guide rails 25 are provided in conjunction with the four engaging blocks 26 to limit the mounting plate 23 so that the mounting plate 23 can be more stable when being driven to move.

[0034] Specifically, refer to Figure 1-3 One side of the first support plate 11 is rotatably connected to a roller 42 via a rotating shaft, and the roller 42 abuts against the lower end surface of the rack 41.

[0035] In this embodiment, the roller 42 is used to assist and limit the rack 41, so that the rack 41 can operate and move more stably.

[0036] The integrated circuit wafer coating device of the utility model:

[0037] In actual use, first connect the reciprocating motor 20 and the electric push rod 4 to an external power source, place the circuit wafer in the mounting groove on the placement plate 52, and start and control the reciprocating motor 20 so that the reciprocating motor 20 drives the threaded screw 21 to rotate. When the threaded screw 21 rotates, the sliding sleeve 22 arranged on the outside of the threaded screw 21 engages and drives the upper mounting plate 23 to slide within the stroke range of the threaded screw 21, thereby driving the storage box 3 to move. By controlling the linear screw module 24, the storage box 3 can be driven downward to coat the circuit wafer on the placement plate 52. By starting and controlling the electric push rod 4, the electric push rod 4 pushes the rack 41 to move to one side, thereby driving The gear 51 meshing with the rack 41 rotates, and finally drives the placement plate 52 to rotate and tilt to one side. When the placement plate 52 rotates, the first limit block 111 set can limit the rotation angle of the placement plate 52. By controlling the electric push rod 4 to drive the rack 41 to retract inward, the placement plate 52 is driven to rotate and tilt to the other side. When the placement plate 52 tilts to the other side, the third limit block 53 set cooperates with the second limit block 112 to limit the rotation angle of the other side of the placement plate 52. When the placement plate 52 is driven to perform a slight rotation adjustment left and right, the photoresist on the circuit wafer can be more evenly distributed on the surface of the circuit wafer. After the coating is completed, the circuit wafer can be removed to complete the coating operation.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit wafer coating device, comprising a workbench (1), characterized in that: The upper end surface of the workbench (1) is equipped with two first support plates (11) and the two first support plates (11) are arranged in parallel, and one side of the upper end of the two first support plates (11) is equipped with a group of transmission components (2); The transmission assembly (2) includes a reciprocating motor (20), the output end of the reciprocating motor (20) is connected to a threaded screw (21), the threaded screw (21) is externally engaged and slidably provided with a sliding sleeve (22), the upper end of the sliding sleeve (22) is equipped with a mounting plate (23), the upper end surface of the mounting plate (23) is equipped with a group of linear screw modules (24), and the linear screw modules (24) are vertically arranged, and a storage box (3) is equipped on one side of the linear screw module (24), and a discharge pipe (31) is provided at the lower end of the storage box (3); One side of one of the first support plates (11) is equipped with an electric push rod (4), one end of the electric push rod (4) is equipped with a rack (41), the upper end surface of the workbench (1) is equipped with a second support plate (12), and the second support plate (12) is located between the two first support plates (11), a rotating rod (5) is provided between one of the first support plates (11) and the second support plate (12), one end of the rotating rod (5) is equipped with a gear (51) on the outside, and the gear (51) is meshed with the rack (41), and the rotating rod (5) is equipped with a placement plate (52) on the outside.

2. The integrated circuit wafer coating device according to claim 1, characterized in that: The rotating rod (5) is further provided with a third limiting block (53) on the outside, and the third limiting block (53) is located at the lower end of the placement plate (52); one side of the first supporting plate (11) is provided with a first limiting block (111) and a second limiting block (112), and the first limiting block (111) is located at the upper end of the second limiting block (112); and the first limiting block (111) and the second limiting block (112) are both located on one side of the third limiting block (53).

3. The integrated circuit wafer coating device according to claim 1, characterized in that: The upper end surface of the workbench (1) is equipped with a collection box (13), and the collection box (13) is located between one of the first support plates (11) and the second support plate (12). The lower end of the workbench (1) is equipped with four universal wheels (14), and the four universal wheels (14) are distributed in a rectangular shape.

4. The integrated circuit wafer coating device according to claim 1, characterized in that: Two guide rails (25) are commonly assembled on one side of the upper ends of the two first support plates (11), and two engaging blocks (26) are slidably engaged at the upper ends of the two guide rails (25), and the upper end surfaces of the four engaging blocks (26) are connected to the mounting plate (23).

5. The integrated circuit wafer coating device according to claim 1, characterized in that: One side of one of the first support plates (11) is rotatably connected to a roller (42) via a rotating shaft, and the roller (42) abuts against the lower end surface of the rack (41).

6. The integrated circuit wafer coating device according to claim 1, characterized in that: The upper end surface of the placement plate (52) is provided with two installation grooves, and the outsides of the two installation grooves are surrounded by a plurality of through holes.

Images